A flexible circuit board with excellent heat dissipation performance

Abstract

The utility model is applicable to the technical field of flexible circuit boards, and provides a flexible circuit board with excellent heat dissipation performance, including two positioning plates, a circuit board body is arranged between the two positioning plates, the circuit board body includes a substrate layer, a support layer is arranged on the surface of the substrate layer, a plurality of positioning holes are provided on the surface of the support layer, the surfaces of the plurality of positioning holes are bonded to a support body by an adhesive, a protective layer is arranged on the surface of the support layer, heat dissipation holes and through holes are provided on the surfaces of the protective layer, the support layer and the substrate layer, and a heat conducting rod is arranged on the surface of the through hole. The utility model can increase the damage resistance of the circuit board body by arranging the support layer and the support body, so that when the circuit board is bent, the supporting capacity of the circuit board body is increased, and the service life is increased, and the arranged heat conducting rod and heat dissipation plate can accelerate the heat dissipation effect and improve the overall practicality of the device.

Description

Technical Field

[0001] The utility model belongs to the technical field of flexible circuit boards, and in particular relates to a flexible circuit board with excellent heat dissipation performance. Background Art

[0002] The names of circuit boards include: circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board, etc. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Printed circuit boards are the basis of almost any electronic product. With the rapid development of the electronics industry, printed circuit boards, as the basic components of electronic products, are becoming more and more widely used. With the continuous enhancement of the functions of electronic products and the expansion of application fields, especially driven by the development of the high-speed information age, the requirements for printed circuit boards used in electronic products are also increasing, especially the requirements for printed circuit boards in terms of signal transmission quality and speed. If a flexible circuit board encounters static electricity or is subject to electromagnetic interference, it is easy to damage the components on the flexible circuit board. The circuit elements on the flexible circuit board are more precise than those on the rigid circuit board, and are not easy to repair after damage.

[0003] In the prior art, flexible circuit boards are relatively soft and are easily damaged when bent. Therefore, we propose a flexible circuit board with excellent heat dissipation performance. Utility Model Content

[0004] The embodiment of the utility model provides a flexible circuit board with excellent heat dissipation performance, aiming to solve the problem that when one or more harness bodies of existing automobile harnesses are damaged, the entire harness body and the wiring terminals at both ends need to be replaced, resulting in excessively high maintenance costs.

[0005] An embodiment of the utility model provides a flexible circuit board with excellent heat dissipation performance, which includes two positioning plates, a circuit board body is arranged between the two positioning plates, the circuit board body includes a substrate layer, a support layer is arranged on the surface of the substrate layer, a plurality of positioning holes are opened on the surface of the support layer, the surfaces of the plurality of positioning holes are bonded to a support body by an adhesive, a protective layer is arranged on the surface of the support layer, heat dissipation holes and through holes are opened on the surfaces of the protective layer, the support layer and the substrate layer, and a heat-conducting rod is arranged on the surface of the through hole.

[0006] Furthermore, a heat sink is provided on the surface of the heat conducting rod, and ventilation holes connected to the heat dissipation holes are opened on the surface of the heat sink. The heat sink can increase the contact surface with the air and improve the heat dissipation effect.

[0007] Furthermore, the protective layer includes an anti-tear layer, and an insulating layer is arranged at the bottom of the anti-tear layer. The protective layer can improve the overall performance of the circuit board.

[0008] Furthermore, the material of the substrate layer is copper foil to form a conductive layer.

[0009] Furthermore, the insulating layer is made of polyester insulating material, and the insulating layer is arranged on the surface of the supporting layer. The arranged insulating layer can effectively improve the insulation of the circuit board body and improve safety.

[0010] Furthermore, the material of the anti-tear layer is a polyester film material, and the anti-tear layer can effectively increase the anti-tear property of the circuit board body.

[0011] Furthermore, the material of the support layer is a polyimide layer, and the material of the support body is a steel plate. The provided support body can improve the supporting capacity of the circuit board body when the circuit board is bent.

[0012] Compared with the prior art, the utility model can increase the damage resistance of the circuit board body by setting a support layer and a support body, so that when the circuit board is bent, the supporting capacity of the circuit board body is increased, the service life is increased, and the heat conducting rod and heat sink are set to accelerate the heat dissipation effect and improve the overall practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a partial cross-sectional schematic diagram of a device with excellent heat dissipation performance provided by an embodiment of the utility model;

[0014] Figure 2 It is a partial internal schematic diagram of a device with excellent heat dissipation performance provided by an embodiment of the utility model;

[0015] Figure 3 It is a three-dimensional schematic diagram of an embodiment of the utility model with excellent heat dissipation performance.

[0016] Among them, 1. positioning plate; 2. circuit board body; 201. substrate layer; 202. support layer; 203. support body; 204. protective layer; 205. heat-conducting rod; 3. heat sink; 4. anti-pulling layer; 5. insulation layer. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0019] When used herein, it should also be understood that the terms "include / comprise" or "have" etc. specify the existence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the existence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the relevant listed items.

[0020] The utility model provides a flexible circuit board with excellent heat dissipation performance. Figure 1 , Figure 2 and Figure 3 As shown, it includes two positioning plates 1, a circuit board body 2 is arranged between the two positioning plates 1, the circuit board body 2 includes a substrate layer 201, a support layer 202 is arranged on the surface of the substrate layer 201, a plurality of positioning holes are opened on the surface of the support layer 202, a support body 203 is bonded to the surface of the plurality of positioning holes by an adhesive, a protective layer 204 is arranged on the surface of the support layer 202, heat dissipation holes and through holes are opened on the surfaces of the protective layer 204, the support layer 202 and the substrate layer 201, and a heat conducting rod 205 is arranged on the surface of the through hole.

[0021] Specifically, by opening a positioning hole on the surface of the support layer 202 and gluing the support body 203 into the positioning hole, the supporting effect of the circuit board body 2 can be improved, reducing the breakage phenomenon during bending, and improving the overall damage resistance of the circuit board. The circuit board body 2 is provided with a heat dissipation hole to increase the ventilation effect, and the heat-conducting rod 205 is provided to improve the heat conduction effect. The entire device can greatly improve the service life of the circuit board.

[0022] In this embodiment, a heat sink 3 is provided on the surface of the heat conducting rod 205, and ventilation holes connected to the heat dissipation holes are opened on the surface of the heat sink 3. The protective layer 204 includes an anti-tear layer 4, and an insulating layer 5 is provided at the bottom of the anti-tear layer 4. The material of the base material layer 201 is copper foil to form a conductive layer, and the material of the insulating layer 5 is polyester insulating material. The insulating layer 5 is arranged on the surface of the supporting layer 202, the material of the anti-tear layer 4 is polyester film material, the material of the supporting layer 202 is a polyimide layer, and the material of the supporting body 203 is a steel plate.

[0023] Specifically, the heat sink 3 can increase the contact area with the air and improve the heat dissipation effect. The protective layer 204 can improve the overall performance of the circuit board. The base material layer 201 forms a conductive layer. The insulating layer 5 can effectively improve the insulation of the circuit board body 2 and improve safety. The anti-tear layer 4 can effectively increase the anti-tear property of the circuit board body 2. The support body 203 can improve the supporting capacity of the circuit board body 2 when the circuit board is bent.

[0024] Working principle: when the circuit board is bent, a support body 203 is arranged inside the support layer 202, which can support the circuit board body 2 so that it is not easy to break when bending, thereby improving the bearing capacity of the circuit board; a heat-conducting rod 205 is arranged on the surface of the circuit board body 2, which can conduct heat to the circuit board, so that the heat generated by the circuit board can be transferred to the heat-conducting rod 205 and dissipated through the heat dissipation plate 3; at the same time, heat dissipation holes are opened on the surface of the circuit board body 2, which can facilitate airflow to pass through and improve the heat dissipation effect; the anti-tear layer 4 material is set to be a polyester film material, which has high tear strength and can withstand welding temperature, reducing the possibility of damage; the insulating layer 5 material is set to be a polyester insulating material, which improves the insulation effect and improves the safety of the device; the supporting layer material is set to be a polyimide layer, which can effectively improve the toughness of the circuit board body 2 and improve the service life of the device.

[0025] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0026] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0027] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A flexible circuit board with excellent heat dissipation performance, comprising two positioning plates, characterized in that: A circuit board body is arranged between the two positioning plates, and the circuit board body includes a substrate layer, a support layer is arranged on the surface of the substrate layer, a plurality of positioning holes are opened on the surface of the support layer, and the surfaces of the plurality of positioning holes are bonded to a support body by an adhesive, a protective layer is arranged on the surface of the support layer, and heat dissipation holes and through holes are opened on the surfaces of the protective layer, the support layer and the substrate layer, and a heat-conducting rod is arranged on the surface of the through hole.

2. The flexible circuit board with excellent heat dissipation performance as claimed in claim 1, characterized in that: A heat dissipation plate is arranged on the surface of the heat-conducting rod, and a ventilation hole connected with the heat dissipation hole is opened on the surface of the heat dissipation plate.

3. The flexible circuit board with excellent heat dissipation performance as claimed in claim 1, characterized in that: The protective layer comprises an anti-tear layer, and an insulating layer is arranged at the bottom of the anti-tear layer.

4. The flexible circuit board with excellent heat dissipation performance as claimed in claim 1, characterized in that: The material of the substrate layer is copper foil.

5. The flexible circuit board with excellent heat dissipation performance as claimed in claim 3, characterized in that: The insulating layer is made of polyester insulating material and is arranged on the surface of the supporting layer.

6. The flexible circuit board with excellent heat dissipation performance as claimed in claim 3, characterized in that: The material of the anti-tearing layer is polyester film material.

7. The flexible circuit board with excellent heat dissipation performance as claimed in claim 1, characterized in that: The material of the support layer is a polyimide layer, and the material of the support body is a steel plate.

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