A glue encapsulation device for processing nickel-gold PCB

Abstract

The utility model relates to the technical field of circuit board production, and in particular to a glue coating device for processing nickel-gold-plated circuit boards, comprising an injection molding glue coating device, a first glue coating bubble prevention component and a second glue coating bubble prevention component, the injection molding glue coating device comprising an injection molding body, a lower mold located at the bottom of the injection molding body, and an upper mold located at the top of the injection molding body, the upper mold being used to inject plastic particles inside a material box into a lower mold through a nozzle, and applying pressure thereto to form it, the lower mold being located at the bottom of the injection molding body, and being used to receive the plastic injected by the upper mold, and forming the required glue coating on its surface; the present application adopts low-pressure injection molding to coat the nickel-gold-plated circuit board with glue, protects the electronic components of the nickel-gold-plated circuit board, prevents the nickel-gold-plated circuit board from being damaged by stress and high temperature, greatly improves the yield of the nickel-gold-plated circuit board with glue coating products, the injected sol has good adhesion, protects and seals the electronic components of the nickel-gold-plated circuit board, and has low equipment cost.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a glue encapsulation device for processing nickel-gold-plated circuit boards. Background Art

[0002] Immersion nickel gold is a precious metal, mainly used in the production of electronic circuit boards, electroplating alloys and contact materials. Due to its excellent electrical conductivity, good ductility and chemical stability, it is considered an ideal material for making high-quality electronic components. During the production process of immersion nickel gold circuit boards, encapsulation equipment is used for encapsulation, which is mainly used to protect the circuit boards from pollution, corrosion and scratches.

[0003] As users have higher and higher requirements for product quality, customers now require that the protective glue on components needs to be wrapped in a full-wrap manner. Full-wrap means that the protective glue completely covers the components to play the role of moisture-proof, dust-proof, insulation, heat insulation, confidentiality, corrosion resistance, high temperature resistance and shock resistance, and can improve performance and stability parameters.

[0004] The existing glue coating is to drip thermal protective glue onto the components through equipment and instruments. The high temperature can easily damage the nickel-gold PCB. The fluidity of the protective glue at this time is still relatively strong, which can easily lead to excessive glue accumulation and adhesion on the nickel-gold PCB after glue coating. If the product is delivered without quality inspection at this time, it is easy to be judged as a defective product, which increases the probability of defective circuit boards. If rework is required, the production and manufacturing costs of the circuit boards will increase significantly, thereby reducing the product competitiveness of the circuit boards and failing to meet the company's growing quality requirements. Utility Model Content

[0005] The purpose of the utility model is to provide a coating device for processing nickel-gold-plated circuit boards to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A glue encapsulation device for processing nickel-gold-plated circuit boards, comprising an injection molding glue encapsulation device, a first anti-glue encapsulation bubble component and a second anti-glue encapsulation bubble component, wherein the injection molding glue encapsulation device comprises an injection molding body, a lower mold located at the bottom of the injection molding body and an upper mold located at the top of the injection molding body, a material box is arranged directly above the top of the injection molding body, the upper mold is used to inject plastic particles inside the material box into a lower mold through a nozzle, and apply pressure to the plastic particles to form them, the lower mold is located at the bottom of the injection molding body, and is used to receive the plastic injected by the upper mold and form the required glue encapsulation on its surface; the bottom of the upper mold and the top of the lower mold are provided with glue encapsulation grooves for placing the nickel-gold-plated circuit boards for encapsulation.

[0008] As a preferred solution of the utility model, the first anti-glue bubble component includes a vacuum tube and an air pump, the vacuum tube is located at the top of the upper mold, the air inlet of the vacuum tube passes through the top of the upper mold and is placed at the place where the nickel-gold circuit board is placed in the glue encapsulation groove, the vacuum tube is connected to the air pump through a high-pressure air pipe, and the air pump is connected to the control equipment of the injection molding glue encapsulation device.

[0009] As a preferred solution of the utility model, the second anti-encapsulation bubble component includes a pre-drying box and a conveyor feeder. The plastic particles are transported to the inside of the pre-drying box by a conveyor belt. The conveyor belt located at the outlet end of the pre-drying box is connected to the bottom hopper of the conveyor feeder, and the top outlet of the conveyor feeder is connected to the material box.

[0010] As a preferred solution of the utility model, the upper mold and the lower mold are both provided with cooling water channels for cooling injection molding, one end of the cooling water channel is connected to an external water inlet pipe through a pipeline, and the other end of the cooling water channel is connected to an external water outlet pipe through a pipeline.

[0011] As a preferred solution of the utility model, the injection molding pressure of the glue encapsulation device is 0.15-4 MPa, the temperature is 190-230° C., and the glue encapsulation molding time is 5-50 seconds.

[0012] As a preferred solution of the present utility model, the cooling water channel is U-shaped.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] In view of the problems raised in the background technology, the present application adopts low-pressure injection molding to encapsulate the nickel-gold PCB, protect the electronic components of the nickel-gold PCB, prevent the nickel-gold PCB from being damaged by stress and high temperature, greatly improve the yield of the nickel-gold PCB encapsulation products, and the injected sol has good adhesion, which protects and seals the electronic components of the nickel-gold PCB. The equipment cost is low and the mold development cycle is short. Compared with the traditional potting process, it is not only environmentally friendly but also greatly improves the production efficiency and reduces the production cost. The encapsulation has a wide range of application fields;

[0015] By adopting multiple sets of anti-bubble components, including vacuum tubes and pre-drying boxes, it is ensured that air is removed as much as possible during the encapsulation process to prevent bubbles from being generated. This can effectively solve the bubble problem generated during the encapsulation process and improve the quality and efficiency of the encapsulation. In addition, the cooling water channels inside the lower mold and the upper mold can play a role in cooling the temperature during the injection molding process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a side view of the overall injection molding and encapsulation device of the utility model;

[0017] Figure 2 It is a side schematic diagram of the overall pre-drying machine box and the conveyor feeder of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal cooling water channels of the lower and upper grinding tools of the utility model.

[0019] In the figure: 11, injection molding machine body; 12, material box; 13, vacuum tube; 14, pre-drying box; 15, conveyor loader; 16, cooling water channel. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the embodiments of the present invention.

[0021] Example

[0022] Each device in this application document adopts a conventional model in the prior art, and the control method is to control through a controller. The control circuit of the controller can be implemented by simple programming by technicians in this field, which belongs to the common knowledge in this field, so this application document will not explain it in detail.

[0023] See also Figure 1 The utility model provides a technical solution: a glue encapsulation device for processing nickel-gold-plated circuit boards, comprising an injection molding glue encapsulation device, a first anti-glue encapsulation bubble component and a second anti-glue encapsulation bubble component, the injection molding glue encapsulation device comprising an injection molding body 11, a lower mold located at the bottom of the injection molding body 11 and an upper mold located at the top of the injection molding body 11, a material box 12 is arranged just above the top of the injection molding body 11, the upper mold is used to inject plastic particles inside the material box 12 into the lower mold through a nozzle, and apply pressure to it to form it, the lower mold is located at the bottom of the injection molding body 11, and is used to receive the plastic injected by the upper mold and form the required glue encapsulation on its surface; the bottom of the upper mold and the top of the lower mold are provided with a glue encapsulation groove for placing the nickel-gold-plated circuit board for glue encapsulation; the injection molding pressure of the injection molding glue encapsulation device is 0.15-4 MPa, the temperature is 190-230°C, and the glue encapsulation molding time is 5-50 seconds.

[0024] It should be noted that, in this embodiment, the injection molding pressure of the injection molding device is 0.15-4 MPa, the temperature is 190-230°C, the molding time of the molding is 5-50 seconds, and the nickel-gold immersion circuit board is encapsulated by low-pressure injection molding to protect the electronic components of the nickel-gold immersion circuit board, prevent the nickel-gold immersion circuit board from being damaged by stress and high temperature, and greatly improve the yield of the nickel-gold immersion circuit board encapsulation product. The injected sol has good adhesion, and the electronic components of the nickel-gold immersion circuit board are protected and sealed. The equipment cost is low, the mold development cycle is short, and compared with the traditional potting process, it is not only environmentally friendly but also greatly improves production efficiency and reduces production costs, and the encapsulation application field is wide;

[0025] See also Figure 1 , 2 3. The first anti-encapsulation bubble component includes a vacuum tube 13 and an air pump. The vacuum tube 13 is located at the top of the upper mold. The air inlet of the vacuum tube 13 passes through the top of the upper mold and is placed at the place where the nickel-gold circuit board is placed in the encapsulation groove. The vacuum tube 13 is connected to the air pump through a high-pressure air pipe, and the air pump is connected to the control equipment of the injection molding encapsulation device; the second anti-encapsulation bubble component includes a pre-drying box 14 and a conveyor feeder 15. Plastic particles are transported by a conveyor belt inside the pre-drying box 14. The conveyor belt at the outlet end of the pre-drying box 14 is connected to the bottom hopper of the conveyor feeder 15, and the top outlet of the conveyor feeder 15 is connected to the material box 12; a cooling water channel 16 for cooling injection molding is provided inside the upper mold and the lower mold. One end of the cooling water channel 16 is connected to an external water inlet pipe through a pipeline, and the other end of the cooling water channel 16 is connected to an external water outlet pipe through a pipeline; the cooling water channel 16 is U-shaped.

[0026] It should be noted that, in this embodiment, multiple sets of anti-bubble components, including vacuum pipes 13 and pre-drying boxes 14, are used to ensure that air is removed as much as possible during the encapsulation process to prevent the generation of bubbles, which can effectively solve the problem of bubbles generated during the encapsulation process and improve the quality and efficiency of the encapsulation. In addition, the cooling water channels 16 inside the lower mold and the upper mold can play a role in cooling the temperature during the injection molding process;

[0027] Further, when the nickel-plated gold circuit board is placed in the coating tank, the driving device drives the upper mold and the lower mold to press together. At this time, the air pump extracts the air inside the coating tank of the nickel-plated gold circuit board through the vacuum tube 13. The upper mold is used to inject the plastic particles inside the material box 12 into the lower mold through the nozzle, and apply pressure to it to form it. The lower mold is used to receive the plastic injected by the upper mold and form the required coating on its surface, thereby improving the quality and efficiency of the coating and reducing the generation of bubbles.

[0028] Furthermore, before encapsulation, the conveyor belt sequentially conveys the encapsulated plastic particles into the pre-drying box 14 for conveying drying, and the dried encapsulated plastic particles enter the bottom hopper of the conveyor loader 15, and are conveyed to the feed box 12 through the circuitous conveyor plate on the conveyor loader 15 to ensure that air is removed as much as possible during the encapsulation process to prevent the generation of bubbles, which can effectively solve the problem of bubbles generated during the encapsulation process and improve the encapsulation yield rate.

[0029] The utility model workflow:

[0030] When in use, start the drying conveyor belt, which conveys the encapsulated plastic particles into the pre-drying box 14 for conveying drying in turn. The dried encapsulated plastic particles enter the bottom hopper of the conveying feeder 15, and are conveyed to the inside of the feed box 12 through the circuitous conveying plate on the conveying feeder 15. The driving device drives the upper mold and the lower mold to be pressed together. At this time, the air pump extracts the air inside the encapsulation groove where the nickel-gold-plated circuit board is placed through the vacuum pipe 13. The upper mold is used to inject the plastic particles inside the material box 12 into the lower mold through the nozzle, and apply pressure to it to shape it. The lower mold is used to receive the plastic injected by the upper mold and press it on its surface The required encapsulation is formed on the surface, the quality and efficiency of the encapsulation are improved, and the generation of bubbles is reduced. The injection molding pressure of the encapsulation device is 0.15-4 MPa, the temperature is 190-230℃, and the encapsulation molding time is 5-50 seconds. Low-pressure injection molding is used to encapsulate the nickel-gold PCB to protect the electronic components of the nickel-gold PCB to prevent the nickel-gold PCB from being damaged by stress and high temperature, and greatly improve the yield of the encapsulated products of the nickel-gold PCB. The injected sol has good adhesion, which protects and seals the electronic components of the nickel-gold PCB. The equipment cost is low and the mold development cycle is short. Compared with the traditional potting process, it is not only environmentally friendly but also greatly improves the production efficiency and reduces the production cost. The encapsulation has a wide range of applications.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A glue encapsulation device for processing nickel-gold immersion circuit boards, comprising an injection molding glue encapsulation device, a first glue encapsulation bubble prevention component and a second glue encapsulation bubble prevention component, characterized in that: The injection molding and encapsulation device comprises an injection molding body (11), a lower mold located at the bottom of the injection molding body (11), and an upper mold located at the top of the injection molding body (11); a material box (12) is arranged directly above the top of the injection molding body (11); the upper mold is used to inject plastic particles in the material box (12) into the lower mold through a nozzle and apply pressure to the plastic particles to form the plastic particles; the lower mold is located at the bottom of the injection molding body (11) and is used to receive the plastic injected by the upper mold and form the required encapsulation on its surface; The bottom of the upper mold and the top of the lower mold are provided with encapsulation grooves for placing the nickel-gold-plated circuit board encapsulated with the encapsulation.

2. The encapsulation device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The first anti-glue encapsulation bubble component comprises a vacuum tube (13) and an air pump, wherein the vacuum tube (13) is located at the top of the upper mold, and the air inlet of the vacuum tube (13) passes through the top of the upper mold and is placed at the place where the nickel-gold-plated circuit board is placed in the glue encapsulation groove, and the vacuum tube (13) is connected to the air pump through a high-pressure air pipe, and the air pump is connected to the control equipment of the injection molding glue encapsulation device.

3. The encapsulation device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The second anti-encapsulation bubble component comprises a pre-drying box (14) and a conveyor loader (15); the plastic particles are transported to the interior of the pre-drying box (14) by a conveyor belt; the conveyor belt at the outlet end of the pre-drying box (14) is connected to the bottom hopper of the conveyor loader (15); and the top outlet of the conveyor loader (15) is connected to the material box (12).

4. The encapsulation device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The upper mold and the lower mold are both provided with cooling water channels (16) for cooling the injection molding, one end of the cooling water channel (16) is connected to an external water inlet pipe through a pipeline, and the other end of the cooling water channel (16) is connected to an external water outlet pipe through a pipeline.

5. The encapsulation device for processing nickel-gold-plated circuit boards according to claim 1, characterized in that: The injection molding device has an injection pressure of 0.15-4 MPa, a temperature of 190-230° C., and an overmolding time of 5-50 seconds.

6. The encapsulation device for processing nickel-gold-plated circuit boards according to claim 4, characterized in that: The cooling water channel (16) is U-shaped.

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