An integrated disassembly, detinning, mounting, welding and curing automation equipment

Abstract

The utility model discloses an integrated disassembly, detinning, mounting, welding and curing automation equipment, comprising: a bottom plate, a plate clamp bracket assembly and a preheating table assembly arranged on the bottom plate, a heat dissipation assembly and a lower CCD assembly arranged on both sides of the preheating table assembly, a storage table arranged on the lower CCD assembly, a moving assembly arranged above the preheating table assembly, a desoldering head assembly, an upper CCD assembly, and a detinning assembly arranged on the moving assembly; the plate clamp bracket assembly is used to fix the PCB board to be repaired. The utility model discloses an integrated disassembly, detinning, mounting, welding and curing automation equipment, which adopts upper and lower CCD automatic positioning, red dot laser auxiliary positioning, closed-loop temperature control heating system, hot air heating welding and curing, and can be used without tedious training, thereby ensuring the consistency of the repair quality; multiple processes are integrated into one device, with a high degree of automation, which greatly reduces the manual intervention process, ensures the consistency of the repair quality, and reduces the probability of personnel burns.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical automation, in particular to an integrated disassembly, detinning, mounting, welding and curing automation equipment. Background Art

[0002] With the advancement of science and technology, the electronic information industry has brought more and more convenience to human life, and has promoted the rapid development of all walks of life in the social economy. At the same time, electronic information products are becoming more and more complex and have higher and higher added value. For example, mobile phones, chips, BGA and other products are high value-added products. Improving the utilization rate of products has become a trend, and rework is one of the main means. For the BGA rework industry, the requirements for rework technology are getting higher and higher. The most important thing is to improve the rework yield rate of high value-added products. The traditional rework method is not only cumbersome, but also has low rework efficiency. It cannot guarantee the consistency of rework, and there is a high risk of product damage. The traditional detinning method is to manually clean the pad with an electric soldering iron and a tin-absorbing wire. At present, the pads of many BGAs have reached less than 0.2 mm, which greatly reduces the adhesion of the metal pads on the circuit board. When using a traditional electric soldering iron to clean the solder balls, the surface of the tin-absorbing wire is very rough. If you are not careful, the pads will be taken away together, resulting in product damage and scrapping. The same is true for the traditional BGA disassembly and mounting process. It is difficult to meet the rework requirements of high-value products:

[0003] a. Manual operation cannot guarantee the quality of each process, the quality is unstable, and the probability of scrapping is high;

[0004] b. The rework process is complicated, the consistency is poor, and the rework efficiency is low;

[0005] c. Manual detinning greatly increases the probability of product damage and increases production costs;

[0006] d. Both the detinning and soldering curing processes are performed at high temperatures exceeding 200°C, which increases the risk of burns from manual operation. Utility Model Content

[0007] In view of the problems existing in the prior art, the utility model provides an integrated disassembly, detinning, mounting, welding and curing automation equipment.

[0008] In order to achieve the above-mentioned purpose, the utility model provides an integrated disassembly, detinning, mounting, welding and curing automation equipment, comprising:

[0009] A bottom plate, a plate clamp bracket assembly and a preheating table assembly arranged on the bottom plate, a heat dissipation assembly and a lower CCD assembly arranged on both sides of the preheating table assembly, a storage table arranged on the lower CCD assembly, a moving assembly arranged above the preheating table assembly, a desoldering head assembly, an upper CCD assembly, and a detinning assembly arranged on the moving assembly;

[0010] The board clamp bracket assembly is used to fix the repaired PCB board;

[0011] The preheating table assembly is used to preheat the PCB board fixed on the board clamp bracket assembly;

[0012] The moving assembly is used to drive the desoldering head assembly, the upper CCD assembly, and the detinning assembly to move on the X-axis and the Y-axis;

[0013] The upper CCD component is used to take pictures of the detinning and mounting areas on the PCB board to provide positioning information for the detinning component and the desoldering head component;

[0014] The desoldering head assembly is used to remove the BGA that needs to be removed from the PCB board, and place it on the external NG platform by suction, or to mount the BGA that needs to be re-mounted and soldered on the storage table onto the PCB board;

[0015] The detinning component is used to remove residual tin on the PCB board;

[0016] The lower CCD component is used to locate and take pictures of the BGA that needs to be remounted and soldered;

[0017] The heat dissipation component is used to cool the PCB board after BGA is mounted and soldered.

[0018] Preferably, the preheating table assembly includes a preheating box, a heating tube arranged in the preheating box, and a high-temperature glass arranged at the box opening of the preheating box; the preheating box is arranged on the bottom plate; the heat dissipation assembly and the lower CCD assembly are placed on both sides of the preheating box.

[0019] Preferably, the plate clamp bracket assembly includes two movable guide rails arranged side by side, two sliding assemblies arranged on the two movable guide rails, a left plate clamp and a right plate clamp arranged on each sliding assembly, and a support bar arranged on the two movable guide rails and placed between the sliding assemblies; the two movable guide rails are arranged at both ends of the preheating box; each of the sliding assemblies includes a slider arranged on the two movable guide rails, a sliding seat arranged on the slider, an adjustable screw arranged on the sliding seat, and a sliding rail installed on the sliding seat; the left plate clamp and the right plate clamp are both installed on the sliding rails.

[0020] Preferably, the left plate clamp and the right plate clamp each include a plate clamp seat arranged on the movable guide rail, an upper adjustment bolt and a side adjustment bolt arranged on the plate clamp seat.

[0021] Preferably, the moving component is composed of a Y-axis linear module and an X-axis linear module.

[0022] Preferably, the output end of the X-axis linear module is further provided with a sliding plate, on which the desoldering head assembly, the upper CCD assembly, and the detinning assembly are mounted; the upper CCD assembly is placed between the detinning assembly and the desoldering head assembly.

[0023] Preferably, the desoldering head assembly includes a mounting seat, an R-axis motor and a suction rod shaft lifting motor arranged on the mounting seat, a suction rod spline shaft connected to the output end of the R-axis motor, a lower blowing seat, a heater, and a hot air pipe arranged in sequence below the mounting seat; one end of the suction rod spline shaft passes through the hot air pipe, the heater, the lower blowing seat, and the mounting seat in sequence and is connected to the output end of the suction rod shaft lifting motor.

[0024] Preferably, the tin removal component includes a tin removal base plate, a weighing sensor arranged on the tin removal base plate, a tin removal sliding seat slidably connected to the tin removal base plate and in contact with the weighing sensor, a tin removal fixed cavity seat placed at the lower part of the tin sliding seat, a heating tube arranged on the tin removal sliding seat and one end of which is placed in the tin removal fixed cavity seat, an air outlet nozzle arranged at the bottom of the tin removal fixed cavity seat, a vacuum suction nozzle inserted in the air outlet nozzle, a tin slag can arranged on one side of the tin removal fixed cavity seat and connected to the vacuum suction nozzle, and a filter connected to the tin slag can.

[0025] Preferably, the lower CCD assembly includes a lower camera, a lens adapted to the lower camera, a prism box disposed at the end of the lens, and a prism disposed in the prism box. 、 Support plates are placed on both sides of the prism box, and a lower camera light source is arranged on the support plates and above the prism box; the upper CCD component includes an upper camera, an upper lens adapted to the upper camera, an auxiliary laser sensor arranged on the upper lens, and a ring light source opposite to the upper lens.

[0026] Preferably, the heat dissipation component is configured as a cross-flow fan.

[0027] The technical solution of the utility model has the following beneficial effects:

[0028] The utility model is an integrated disassembly, detinning, mounting, and soldering curing automation equipment. It adopts upper and lower CCD automatic positioning, red dot laser auxiliary positioning, closed-loop temperature control and heating system, hot air heating and soldering curing. It can be used without tedious training, ensuring the consistency of rework quality. Multiple processes are integrated into one device, non-contact detinning system, automatic tin slag recovery system; upper and lower visual alignment system; upper and lower temperature zone heating; non-contact detinning components. The high-temperature breeze of the detinning component melts the tin slag on the product, and the tin slag is sucked through the tin suction nozzle in the center of the detinning head to achieve the purpose of removing the tin slag. Before detinning, the gravity sensor of the detinning head first contacts the PCB board for height confirmation. During the detinning process, the gravity sensor of the detinning head and the vacuum flow switch of the suction nozzle monitor the state of the detinning suction nozzle in real time to achieve no direct contact between the detinning system and the BGA pad, avoiding damage to the pad under the action of external force. The preheating platform, detinning components, and desoldering head components all adopt closed-loop temperature control. The overall temperature control is stable and accurate, avoiding the situation where the temperature deviation causes unclean detinning or overheating to damage the product. During the operation, the tin slag is automatically collected and discharged into the designated container, which is convenient for handling. Two sets of visual systems ensure the accuracy of tin removal and placement, and improve the rework yield and efficiency. It greatly reduces the manual intervention process, ensures the consistency of rework quality, and reduces the probability of personnel scalding. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the utility model;

[0030] Figure 2 This is a schematic diagram of the structure of the plate clamp bracket assembly of the utility model;

[0031] Figure 3 This is a schematic diagram of the structure of the desoldering head assembly of the utility model;

[0032] Figure 4 This is a schematic diagram of the structure of the tin removal component of the utility model;

[0033] Figure 5 This is a schematic diagram of the structure of the lower CCD component and the storage table of the utility model;

[0034] In the figure: bottom plate 1, plate clamp bracket assembly 3 and preheating table assembly 2, desoldering head assembly 5 on moving assembly 4, detinning assembly 6, upper CCD assembly 7, lower CCD assembly 8, storage table 9, heat dissipation assembly 10, two moving guide rails 301, two moving guide rails 302, left plate clamp and right plate clamp 303, support bar 304, adjustment screw 305, waist hole 3041, limit adjustment block 3042, mounting seat 501, R-axis motor 502 and suction rod shaft lifting motor 503, suction rod spline shaft 504, lower blowing seat 505, heater 506, hot air pipe 507

[0035] , detinning bottom plate 601, weighing sensor 602, detinning sliding seat 603, heating tube 604, detinning fixed cavity seat 605, filter 607, air outlet nozzle 608, vacuum suction nozzle 609. DETAILED DESCRIPTION

[0036] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] Reference Figures 1 to 5 The utility model provides an integrated disassembly, detinning, mounting, welding and curing automation equipment, including:

[0043] A bottom plate 1, a plate clamp bracket assembly 3 and a preheating table assembly 2 arranged on the bottom plate 1, a heat dissipation assembly 10 and a lower CCD assembly 8 arranged on both sides of the preheating table assembly 2, a storage table 9 arranged on the lower CCD assembly 8, a moving assembly 4 arranged above the preheating table assembly 2, a desoldering head assembly 5, an upper CCD assembly 7, and a detinning assembly 6 arranged on the moving assembly 4;

[0044] The board clamp bracket assembly 3 is used to fix the repaired PCB board;

[0045] The preheating table assembly 2 is used to preheat the PCB board fixed on the board clamp bracket assembly 3 to a temperature close to the melting point of the solder ball, so as to facilitate the subsequent removal of the soldering head assembly 5 and the tin removal assembly 6, so that the tin head can be quickly disassembled and tinned;

[0046] The moving assembly 4 is used to drive the desoldering head assembly 5, the upper CCD assembly 7, and the detinning assembly 6 to move on the X-axis and the Y-axis to the required position;

[0047] The upper CCD component 7 is used to take pictures of the detinning and mounting areas on the PCB board to provide positioning information for the detinning component 6 and the desoldering head component 5;

[0048] The desoldering head assembly 5 is used to remove the BGA that needs to be removed from the PCB board and place it on the external NG platform by suction;

[0049] The detinning component 6 is used to remove residual tin on the PCB board;

[0050] The storage table 9 is used to place the BGA that needs to be re-mounted and soldered;

[0051] The lower CCD assembly 8 is used to position and take photos of the BGA that needs to be remounted and soldered;

[0052] The heat dissipation component 10 is used to cool the PCB board after BGA is mounted and soldered. The heat dissipation component 10 is configured as a cross-flow fan to cool the PCB.

[0053] Furthermore, the preheating table assembly 2 includes a preheating box, a heating tube arranged in the preheating box, and a high-temperature glass arranged at the box opening of the preheating box; the preheating box is arranged on the bottom plate 1, and is placed in the middle of the bottom plate 1; the heat dissipation assembly 10 and the lower CCD assembly 8 are placed on both sides of the preheating box, wherein the preheating box is provided with a heating and temperature control system, and its main function is to preheat the product to a temperature close to the melting point of the solder ball, so as to facilitate the subsequent detinning head to be able to remove the solder well and be quickly disassembled.

[0054] Furthermore, the plate clamp bracket assembly 3 includes two movable guide rails 301 arranged side by side, two sliding assemblies arranged on the two movable guide rails 301, a left plate clamp and a right plate clamp 303 arranged on each sliding assembly, and a support bar 304 arranged on the two movable guide rails 301 and placed between the sliding assemblies; each of the sliding assemblies includes a slider arranged on the two movable guide rails, a sliding seat arranged on the slider, an adjusting screw 305 arranged on the sliding seat, and a sliding rail 302 installed on the sliding seat; the left plate clamp and the right plate clamp 303 are both installed on the sliding rail 302; the two movable guide rails 301 are arranged at both ends of the preheating box body, and the two sliding rails 302 can move along the two movable guide rails 301 The two sliding rails 302 can be adjusted on the two movable guide rails 301 by adjusting the screws 305. When the two sliding rails 302 move to the desired position, the sliding rails 302 can be fixed on the front and rear movable guide rails 301 by rotating the adjusting screws 305. The support bar 304 can be used to support the PCB to be repaired. The support bar 304 is also provided with a waist-shaped hole 3041. The waist-shaped hole 3041 is also provided with a limit adjustment block 3042. The limit adjustment block 3042 can be installed along the waist-shaped hole 3041, so as to limit and fix the installed PCB.

[0055] The left board clamp and the right board clamp 303 both include a board clamp seat arranged on the movable guide rail, an upper adjustment bolt and a side adjustment bolt arranged on the board clamp seat, and the PCB board is fixed by adjusting the tightness of the upper adjustment bolt and the side adjustment bolt.

[0056] Furthermore, the moving component 4 is composed of a Y-axis linear module and an X-axis linear module, and is used to drive the desoldering head component 5, the upper CCD component 7, and the detinning component 6 to move on the X-axis and the Y-axis to the required position. A sliding plate is also provided at the output end of the X-axis linear module, on which the desoldering head component, the upper CCD component, and the detinning component are installed; the upper CCD component is placed between the detinning component and the desoldering head component.

[0057] Furthermore, the desoldering head assembly 5 includes a mounting seat 501, an R-axis motor 502 and a suction rod shaft lifting motor 503 arranged on the mounting seat 501, a suction rod spline shaft 504 connected to the output end of the R-axis motor 502, and a lower blowing seat 505, a heater 506, and a hot air pipe 507 arranged in sequence below the mounting seat 501; one end of the suction rod spline shaft 504 passes through the hot air pipe 507, the heater 506, the lower blowing seat 505, and the mounting seat 501 in sequence and is connected to the output end of the suction rod shaft lifting motor 504. The main function is to perform hot air heating on the disassembled and soldered BGA, absorb and transport the disassembled BGA, and position and correct the mounted BGA and solder it. For specific details and principles, please refer to the heating and transferring device 4 disclosed in the Chinese patent 202321188657.6, a new desktop semi-automatic BGA chip repair equipment, which has been applied for by the applicant, and the applicant will not repeat it again.

[0058] Furthermore, the detinning component 6 includes a detinning bottom plate 601, a weighing sensor 602 arranged on the detinning bottom plate 601, a detinning sliding seat 603 slidably connected to the detinning bottom plate 601 and in contact with the weighing sensor 602, a detinning fixed cavity seat 605 placed at the lower part of the tin sliding seat 603, a heating tube 604 arranged on the detinning sliding seat 603 and one end of which is placed in the detinning fixed cavity seat 605, an air outlet nozzle 608 arranged at the bottom of the detinning fixed cavity seat 605, a vacuum nozzle 609 inserted in the air outlet nozzle 605, and a vacuum nozzle 609 arranged on one side of the detinning fixed cavity seat 605 and connected to the vacuum nozzle 609. The tin slag tank 607 and the filter 607 connected to the tin slag tank 607 can heat and melt the residual tin slag. The vacuum suction nozzle 609 sucks the melted tin slag and collects it into the tin slag tank 607. The detection function of the weighing sensor 602 can protect the vacuum suction nozzle 609 from damaging the soldering pad. The top of the heating tube 604 is set as a ventilation interface for an external air source. After the external air is blown into the heating tube 604, hot air is blown out through the air outlet nozzle 608. After the residual tin is melted, it can be sucked into the tin slag tank 607 through the vacuum suction nozzle 609 for storage, and can be collected after filtering through the filter 607 later.

[0059] Furthermore, the lower CCD assembly 8 includes a lower camera 801, a lens 802 adapted to the lower camera 801, a prism box 803 disposed at the end of the lens 802, and a prism disposed in the prism box 803.、 The support plates 804 are placed on both sides of the prism box 803, and the lower camera light source 805 is arranged on the support plates 804 and above the prism box 803. The lens 802 is arranged at 90 degrees to the lower camera light source 805. The upper CCD component 7 includes an upper camera, an upper lens adapted to the upper camera, an auxiliary laser sensor arranged on the upper lens, and an annular light source opposite to the upper lens, which mainly provides positioning information for the desoldering head and the desoldering head.

[0060] Working principle of this utility model:

[0061] The infrared temperature zone preheating method is adopted. The PCB board is first preheated to about 180°C through the preheating table component 2, and then the hot air is used to heat the desoldering head component 5 to heat the BGA that needs to be removed. The high temperature breeze on the desoldering head component 5 is used to melt the solder on the BGA, and the product is sucked by the suction rod spline shaft 504 in the center of the desoldering head, and is transported by the moving component 4. The removed BGA is placed on the external NG storage table. After the disassembly is completed, the upper CCD component 7 is moved to take pictures of the area on the PCB that needs to be detinned. After the pictures are taken, the detinning path is manually planned, and then the detinning component 6 goes to the position where the detinning is required. The detinning component 6 uses the high temperature breeze formed by the hot air pipe to melt the residual tin on the PCB, and then passes through the vacuum suction nozzle 609. After absorbing the tin slag and removing the tin, the BGA that needs to be re-mounted and soldered is placed on the storage table 9, and the upper CCD component 7 is moved by the moving component 4 to take pictures of the area on the PCB board that needs to be mounted. After completion, the desoldering head component 5 automatically moves to the material picking position, and the BGU product on the storage table 9 is sucked and moved to the lower CCD component 8 for photo positioning through the suction rod spline shaft 504. After the lower CCD component 8 takes pictures, the desoldering head component 5 corrects the posture according to the visual results, and moves to the final mounting position to mount the BGA product on the PCB board. After completion, the desoldering head component 5 turns on the hot air heating to start curing and soldering the newly mounted BGA product. After curing is completed, the cross-flow fan of the heat dissipation component 10 starts to cool the product.

[0062] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. An integrated disassembly, detinning, mounting, welding and curing automation equipment, characterized in that: include: A bottom plate, a plate clamp bracket assembly and a preheating table assembly arranged on the bottom plate, a heat dissipation assembly and a lower CCD assembly arranged on both sides of the preheating table assembly, a storage table arranged on the lower CCD assembly, a moving assembly arranged above the preheating table assembly, a desoldering head assembly, an upper CCD assembly, and a detinning assembly arranged on the moving assembly; The board clamp bracket assembly is used to fix the repaired PCB board; The preheating table assembly is used to preheat the PCB board fixed on the board clamp bracket assembly; The moving assembly is used to drive the desoldering head assembly, the upper CCD assembly, and the detinning assembly to move on the X-axis and the Y-axis; The upper CCD component is used to take pictures of the detinning and mounting areas on the PCB board to provide positioning information for the detinning component and the desoldering head component; The desoldering head assembly is used to remove the BGA that needs to be removed from the PCB board, and place it on the external NG platform by suction, or to mount the BGA that needs to be re-mounted and soldered on the storage table onto the PCB board; The detinning component is used to remove residual tin on the PCB board; The lower CCD component is used to locate and take pictures of the BGA that needs to be remounted and soldered; The heat dissipation component is used to cool the PCB board after BGA is mounted and soldered.

2. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 1 is characterized in that: The preheating table assembly comprises a preheating box, a heating tube arranged in the preheating box, and a high-temperature glass arranged at the box opening of the preheating box; the preheating box is arranged on the bottom plate; the heat dissipation assembly and the lower CCD assembly are arranged on both sides of the preheating box.

3. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 2 is characterized in that: The plate clamp bracket assembly includes two movable guide rails arranged side by side, two sliding assemblies arranged on the two movable guide rails, a left plate clamp and a right plate clamp arranged on each sliding assembly, and a support bar arranged on the two movable guide rails and placed between the sliding assemblies; the two movable guide rails are arranged at both ends of the preheating box; each of the sliding assemblies includes a slider arranged on the two movable guide rails, a sliding seat arranged on the slider, an adjustable screw arranged on the sliding seat, and a sliding rail installed on the sliding seat; the left plate clamp and the right plate clamp are both installed on the sliding rails.

4. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 3 is characterized in that: The left plate clamp and the right plate clamp both include a plate clamp seat arranged on the movable guide rail, an upper adjustment bolt and a side adjustment bolt arranged on the plate clamp seat.

5. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 1 is characterized in that: The moving component is composed of a Y-axis linear module and an X-axis linear module.

6. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 5 is characterized in that: The output end of the X-axis linear module is also provided with a sliding plate, on which the desoldering head assembly, the upper CCD assembly, and the detinning assembly are installed; the upper CCD assembly is placed between the detinning assembly and the desoldering head assembly.

7. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 1 is characterized in that: The desoldering head assembly includes a mounting seat, an R-axis motor and a suction rod shaft lifting motor arranged on the mounting seat, a suction rod spline shaft connected to the output end of the R-axis motor, a lower blowing seat, a heater, and a hot air pipe arranged in sequence below the mounting seat; one end of the suction rod spline shaft passes through the hot air pipe, the heater, the lower blowing seat, and the mounting seat in sequence and is connected to the output end of the suction rod shaft lifting motor.

8. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 1 is characterized in that: The tin removal component includes a tin removal base plate, a weighing sensor arranged on the tin removal base plate, a tin removal sliding seat slidably connected to the tin removal base plate and in contact with the weighing sensor, a tin removal fixed cavity seat placed at the lower part of the tin sliding seat, a heating tube arranged on the tin removal sliding seat and one end of which is placed in the tin removal fixed cavity seat, an air outlet nozzle arranged at the bottom of the tin removal fixed cavity seat, a vacuum suction nozzle inserted in the air outlet nozzle, a tin slag can arranged on one side of the tin removal fixed cavity seat and connected to the vacuum suction nozzle, and a filter connected to the tin slag can.

9. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 2 is characterized in that: The lower CCD assembly includes a lower camera, a lens adapted to the lower camera, a prism box placed at the end of the lens, a prism placed in the prism box, support plates placed on both sides of the prism box, and a lower camera light source arranged on the support plates and above the prism box; the upper CCD assembly includes an upper camera, an upper lens adapted to the upper camera, an auxiliary laser sensor arranged on the upper lens, and a ring-shaped light source opposite to the upper lens.

10. The integrated disassembly, detinning, mounting, welding and curing automation equipment according to claim 2 is characterized in that: The heat dissipation component is configured as a cross-flow fan.

Images