A furnace fixture for preventing SMT patch reflow furnace from generating tin slag

Abstract

The utility model discloses a furnace jig for preventing the SMT patch reflow furnace from generating tin slag. The printed board is a plate-like structure, and a first positioning groove and a second positioning groove are arranged side by side on the printed board; the first positioning groove and the second positioning groove can be set according to the shape of different SMT patch circuit boards, and the first positioning groove and the second positioning groove on the printed board can directly correspond to the printed components, avoiding the occurrence of post-installation interference. A plurality of first sinking grooves arranged in a linear array are arranged in the first printing groove, and a first printing hole and a second printing hole are arranged in the plurality of first sinking grooves, and at least one circular rib groove is arranged in the first printing hole and the second printing hole; the circular rib groove is mainly arranged for some high columnar short-lead components to prevent dryness, and the circular rib groove only needs to be slightly larger than the short-lead components arranged here.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste printing, and more specifically, to a furnace pass fixture for preventing a SMT patch reflow furnace from generating solder slag. Background Art

[0002] SMT production line, also known as surface assembly technology (Surface Mount Technology, referred to as SMT), is a new generation of electronic assembly technology developed from hybrid integrated circuit technology. It is characterized by the use of component surface mounting technology and reflow soldering technology, and has become a new generation of assembly technology in electronic product manufacturing. The main equipment of SMT production line includes: printer, SMT machine (upper surface electronic components), reflow soldering, plug-in, wave crest furnace, test packaging. The wide application of SMT has promoted the miniaturization and multifunctionality of electronic products, and provided conditions for mass production and low defect rate production.

[0003] The tin slag itself has a high tin content, but because it produces a refractory Sn-Cu alloy, it is difficult to be recycled; the generation of tin slag is inevitable and regular, and it can be minimized by paying attention to various procedures in production operations.

[0004] During the SMT production process, some tin beads, tin slag and other residues may remain on the circuit board due to production technology or operational problems of the processing personnel, causing some problems for the appearance of SMT patch processing and the use of products; these residues may even cause circuit board short circuit and other adverse phenomena.

[0005] However, during the current reflow soldering process, there is no protection process, which may cause the tin slag in the circulating airflow to easily adhere to the SMT patch, resulting in unnecessary tin slag and even more serious defective products. Utility Model Content

[0006] The utility model aims to provide a furnace pass fixture which can prevent the SMT patch reflow furnace from generating tin slag, and a fixture which can print tin paste in batches, regularly and quantitatively.

[0007] The above technical purpose of the utility model is achieved through the following technical scheme: a furnace fixture for preventing SMT patch reflow furnace from generating tin slag, comprising a printed board and a base plate.

[0008] The printing plate is a plate-shaped structure, and a first positioning groove and a second positioning groove are arranged side by side on the printing plate.

[0009] The first positioning groove and the second positioning groove can be set according to the shapes of different SMT circuit boards, and the first positioning groove and the second positioning groove on the printed board can directly correspond to the printed components to avoid post-installation interference.

[0010] A first printing groove is provided in the first positioning groove, a plurality of first sink grooves arranged in a linear array are provided in the first positioning groove, a first printing hole and a second printing hole are provided in each of the plurality of first sink grooves, and at least one circular rib groove is provided in each of the first printing hole and the second printing hole.

[0011] The circular rib groove is mainly set for some tall columnar short-lead components to prevent dryness. The circular rib groove only needs to be slightly larger than the short-lead components set here.

[0012] A second printing groove is formed in the second positioning groove, a second sink groove is formed in the second printing groove, a third printing hole is formed in the second sink groove, and at least one elliptical rib groove is formed in the third printing hole.

[0013] The oval rib groove can accommodate the installation of some special-shaped or larger short-lead components.

[0014] The bottom plate is connected with the printed board in cooperation.

[0015] The printing plate and the base plate can be used in combination to achieve better results, and the printing plate can also be used alone.

[0016] The utility model is further configured as follows: anti-knock grooves are respectively provided at four corners of the first positioning groove and the second positioning groove, and the anti-knock grooves are circular grooves.

[0017] The anti-knock groove can prevent the corners of the PCB board from being damaged due to mold extrusion or installation.

[0018] The utility model is further configured as follows: positioning holes are provided at the four corners of the printing plate, positioning posts matching the positioning holes are provided at the four corners of the bottom plate, the positioning posts are inserted into the positioning holes, and the bottom plate abuts against the printing plate.

[0019] The setting of the positioning holes and the positioning columns can ensure that the same model of PCB boards can be used more conveniently during reflow soldering.

[0020] The utility model is further configured as follows: second grabbing grooves communicating with the first positioning groove and the second positioning groove are arranged on both sides of the first positioning groove and the second positioning groove.

[0021] The second grabbing groove can make it easier to put in and take out the PCB board, and it is also easier to remove the PCB board if it is stuck to each other.

[0022] The utility model is further configured as follows: a plurality of the first printing holes and a plurality of the second printing holes are arranged in parallel with each other, and each of the first printing holes and each of the second printing holes are through holes.

[0023] The heat transfer of reflow soldering is mainly through hot air circulation reflow, so the structural setting of the through hole can make it easier for heat flow to enter.

[0024] The utility model is further configured as follows: the first printing hole connects the first sink groove with a side of the printing plate away from the first sink groove.

[0025] The provision of the first sink groove can facilitate the accommodation of the leadless components and avoid the displacement of the leadless components due to improper operation.

[0026] The utility model is further configured as follows: the second printing hole connects the first sink groove with a side of the printing plate away from the first sink groove.

[0027] The first printed hole and the second printed hole have basically the same structure, but the PCB boards in which they are applicable are not the same, mainly due to the number of short-lead components therein.

[0028] The utility model is further configured as follows: the third printing hole connects the second sinking groove with a side of the printing plate away from the second sinking groove.

[0029] The third printing hole is a heat flow hole, and the second sink groove is mainly used to cope with larger or irregular short-lead components and components with large solder paste printing volume.

[0030] In summary, the utility model has the following beneficial effects:

[0031] 1. The first positioning groove and the second positioning groove can be set according to the shapes of different SMT circuit boards, and the first positioning groove and the second positioning groove on the printed board can directly correspond to the printed components to avoid the occurrence of post-installation interference.

[0032] 2. The circular rib groove is mainly set for some tall columnar short-lead components to prevent dryness. The circular rib groove only needs to be slightly larger than the short-lead components set here.

[0033] 3. The elliptical rib groove can accommodate the installation of some special-shaped or larger short-lead components. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a three-dimensional diagram of the fixture in the embodiment of the utility model;

[0035] Figure 2 It is a three-dimensional diagram of the contact surface of the printing plate and the bottom plate in the embodiment of the utility model;

[0036] Figure 3 It is a three-dimensional diagram of the contact surface of the bottom plate and the printing plate in the embodiment of the utility model;

[0037] Figure 4 It is an exploded view of the jig in the embodiment of the utility model;

[0038] Figure 5 In the present utility model embodiment Figure 4 A in the enlarged view;

[0039] Figure 6 In the present utility model embodiment Figure 4 Enlarged view of point B in .

[0040] In the figure:

[0041] 1. Printing plate; 11. First positioning groove; 111. First printing groove; 1111. First printing hole; 1112. Second printing hole; 1113. Second grabbing groove; 1114. First countersunk groove; 1115. Circular rib groove; 12. Second positioning groove; 121. Second printing groove; 1211. Third printing hole; 1222. Second countersunk groove; 1223. Elliptical rib groove; 13. Anti-knock groove; 14. Positioning hole; 2. Bottom plate; 21. Positioning column; 22. First accommodating groove; 23. Second accommodating groove; 24. First grabbing groove. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0043] It should be noted that if the terms "first", "second", etc. are involved in the specification and claims of the utility model and the above-mentioned drawings, they are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the utility model described here. In addition, if the terms "including" and "having" and any of their variations are involved, it is intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0044] In addition, in the present invention, the terms "installation", "setting", "provided with", "connection", "connected", "socketing" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0045] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0046] The following is combined with Figure 1-6 The utility model is described in further detail.

[0047] Example

[0048] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown, a furnace fixture for preventing SMT patch reflow furnace from generating tin slag includes a printed board 1 and a base plate 2.

[0049] The printed board 1 is a plate-shaped structure. A first positioning groove 11 and a second positioning groove 12 are arranged side by side on the printed board 1. The first positioning groove 11 and the second positioning groove 12 can both accommodate a standard PCB board.

[0050] The first positioning groove 11 and the second positioning groove 12 can be set according to the shapes of different SMT circuit boards, and the first positioning groove 11 and the second positioning groove 12 on the printed board 1 can directly correspond to the printed components to avoid post-installation interference.

[0051] Preferably, the first positioning groove 11 and the second positioning groove 12 are both rectangular structures.

[0052] Preferably, the first positioning groove 11 and the second positioning groove 12 can be other structures.

[0053] A first printing groove 111 is provided in the first positioning groove 11, and a plurality of first sink grooves 1114 arranged in a linear array are provided in the first printing groove 1111, and a first printing hole 1111 and a second printing hole 1112 are provided in each of the plurality of first sink grooves 1114, and at least one circular rib groove 1115 is provided in each of the first printing hole 1111 and the second printing hole 1112.

[0054] The first depression groove 1114 can accommodate some smaller regular flat leadless components.

[0055] The circular rib groove 1115 is mainly provided for some high columnar short lead components to prevent dryness. The circular rib groove 1115 only needs to be slightly larger than the short lead components provided here.

[0056] Preferably, the first printing hole 1111 and the second printing hole 1112 have the same opening structure, so as to improve space utilization on the same printing board 1 .

[0057] A second printing groove 121 is defined in the second positioning groove 12 , a second depression groove 1222 is defined in the second depression groove 1222 , a third printing hole 1211 is defined in the second depression groove 1222 , and at least one elliptical rib groove 1223 is defined in the third printing hole 1211 .

[0058] Preferably, in order to improve the space utilization rate on the same printing plate 1 , a plurality of rows of third printing holes 1211 arranged side by side may be provided on the second printing groove 121 .

[0059] The elliptical rib groove 1223 can accommodate the installation of some special-shaped or larger short-lead components.

[0060] The printed board 1 and the base plate 2 can be used in combination to achieve better effects, and the printed board 1 can also be used alone.

[0061] Anti-knock grooves 13 are respectively formed at four corners of the first positioning groove 11 and the second positioning groove 12 , and the anti-knock grooves 13 are circular grooves.

[0062] The provision of the anti-knock groove 13 can prevent the corner of the PCB board from being damaged due to the extrusion of the mold or the installation.

[0063] Positioning holes 14 are provided at the four corners of the printed board 1 , and positioning posts 21 cooperating with the positioning holes 14 are provided at the four corners of the bottom plate 2 . The positioning posts 21 are inserted into the positioning holes 14 , and the bottom plate 2 abuts against the printed board 1 .

[0064] The arrangement of the positioning holes 14 and the positioning posts 21 can ensure that PCB boards of the same model can be used more conveniently during reflow soldering.

[0065] Second grabbing grooves 1113 communicating with the first positioning groove 11 and the second positioning groove 12 are provided on both sides of the first positioning groove 11 and the second positioning groove 12 .

[0066] The second grabbing groove 1113 can be arranged to facilitate the placement and removal of the PCB board, and can also facilitate the removal of the PCB board if it is stuck to each other.

[0067] The plurality of first printing holes 1111 and the plurality of second printing holes 1112 are arranged in parallel with each other, and each of the first printing holes 1111 and each of the second printing holes 1112 is a through hole.

[0068] The heat transfer of reflow soldering is mainly through hot air circulation reflow, so the structural setting of the through hole can make it easier for heat flow to enter.

[0069] The first printing hole 1111 connects the first depression groove 1114 with a side of the printing board 1 away from the first depression groove 1114 .

[0070] The provision of the first depression groove 1114 can facilitate the accommodation of the leadless components and avoid the displacement of the leadless components due to improper operation.

[0071] The second printing hole 1112 connects the first depression groove 1114 with a side of the printing board 1 away from the first depression groove 1114 .

[0072] The first printing hole 1111 and the second printing hole 1112 have basically the same structure, but the PCB boards in which they are applicable are not the same, mainly due to the number of short-lead components therein.

[0073] The third printing hole 1211 connects the second depression groove 1222 with a side of the printing board 1 away from the second depression groove 1222 .

[0074] The third printing hole 1211 is a heat flow hole, and the second sink groove 1222 is mainly used to cope with larger or irregular short-lead components and components with a large amount of solder paste printing.

[0075] The bottom plate 2 is connected with the printed board 1 in cooperation.

[0076] In addition to the positioning column 21 , a first receiving groove 22 corresponding to the first positioning groove 11 and a second receiving groove 23 corresponding to the second positioning groove 12 are also provided on the side of the bottom plate 2 close to the printed board 1 .

[0077] The groove shape of the first receiving groove 22 is completely identical to that of the first positioning groove 11 , and the groove shape of the second receiving groove 23 is completely identical to that of the second positioning groove 12 .

[0078] Anti-knock grooves 13 are also correspondingly provided at the four corners of the first accommodating groove 22 and the second accommodating groove 23 .

[0079] A first grabbing groove 24 is further provided on the same side of the bottom plate 2 as the printing board 1 , which can facilitate the separation of the bottom plate 2 from the printing board 1 . Two first grabbing grooves 24 are symmetrically provided on both sides.

[0080] In addition, the above specific embodiments are exemplary, and those skilled in the art can come up with various solutions inspired by the disclosure of the utility model, and these solutions also belong to the disclosure scope of the utility model and fall within the protection scope of the utility model. Those skilled in the art should understand that the utility model specification and its drawings are illustrative and do not constitute a limitation of the claims. The protection scope of the utility model is defined by the claims and their equivalents.

Claims

1. A furnace fixture for preventing SMT patch reflow furnace from generating tin slag, characterized in that: include: A printing plate (1) is a plate-shaped structure, wherein a first positioning groove (11) and a second positioning groove (12) are arranged side by side on the printing plate (1). A first printing groove (111) is provided in the first positioning groove (11), a plurality of first sink grooves (1114) arranged in a linear array are provided in the first positioning groove (1111), a first printing hole (1111) and a second printing hole (1112) are provided in each of the plurality of first sink grooves (1114), and at least one circular rib groove (1115) is provided in each of the first printing hole (1111) and the second printing hole (1112); A second printing groove (121) is provided in the second positioning groove (12), a second sink groove (1222) is provided in the second printing groove (121), a third printing hole (1211) is provided in the second sink groove (1222), and at least one elliptical rib groove (1223) is provided in the third printing hole (1211); A base plate (2) is connected to the printed board (1).

2. A furnace fixture for preventing the generation of tin slag in a SMT patch reflow furnace according to claim 1, characterized in that: Anti-knock grooves (13) are respectively provided at the four corners of the first positioning groove (11) and the second positioning groove (12), and the anti-knock grooves (13) are circular grooves.

3. The furnace jig for preventing the SMT patch reflow furnace from generating tin slag according to claim 1, characterized in that: Positioning holes (14) are provided at the four corners of the printing plate (1), and positioning posts (21) cooperating with the positioning holes (14) are provided at the four corners of the base plate (2); the positioning posts (21) are inserted into the positioning holes (14), and the base plate (2) abuts against the printing plate (1).

4. The furnace jig for preventing the SMT patch reflow furnace from generating tin slag according to claim 1, characterized in that: Second grabbing grooves (1113) communicating with the first positioning groove (11) and the second positioning groove (12) are provided on both sides of the first positioning groove (11) and the second positioning groove (12).

5. The furnace jig for preventing the SMT patch reflow furnace from generating tin slag according to claim 1, characterized in that: A plurality of the first printing holes (1111) and a plurality of the second printing holes (1112) are arranged in parallel with each other, and each of the first printing holes (1111) and each of the second printing holes (1112) is a through hole.

6. A furnace jig for preventing the generation of tin slag in a SMT patch reflow furnace according to claim 5, characterized in that: The first printing hole (1111) connects the first sink groove (1114) with a side of the printing plate (1) away from the first sink groove (1114).

7. The furnace jig for preventing the SMT patch reflow furnace from generating tin slag according to claim 5, characterized in that: The second printing hole (1112) connects the first sink groove (1114) with a side of the printing plate (1) away from the first sink groove (1114).

8. The furnace jig for preventing the SMT patch reflow furnace from generating tin slag according to claim 1, characterized in that: The third printing hole (1211) connects the second sink groove (1222) with a side of the printing plate (1) away from the second sink groove (1222).

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