A high-efficiency heat dissipation component and industrial robot control device

Abstract

The utility model discloses a high-efficiency heat dissipation component and an industrial robot control device, which relates to the field of industrial robot control technology, including a fixed cover and a heat exchange component, wherein four ends of one side of the fixed cover are provided with mounting holes, and the heat exchange component is arranged inside the fixed cover, and the heat exchange component includes a first fan, a semiconductor cooling sheet, a heat conducting sheet, a heat sink, a heat dissipation cover, a second fan and a through slot, wherein one end of the interior of the fixed cover is provided with the first fan, and one side of the interior of the fixed cover is provided with a semiconductor cooling sheet. The high-efficiency heat dissipation component and the industrial robot control device are provided with a heat exchange component, and after the heat dissipation component is arranged at the vent on the industrial robot control device through fasteners and mounting holes, the first fan will form a negative pressure inside the fixed cover, and the outside air will enter the interior of the fixed cover. At this time, since the cold end of the semiconductor cooling sheet is located inside the fixed cover, the air will exchange heat with the semiconductor cooling sheet for cooling.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial robot control, and in particular to a high-efficiency heat dissipation component and an industrial robot control device. Background Art

[0002] Industrial robots are multi-joint manipulators or multi-degree-of-freedom machine devices widely used in industrial fields. They have a certain degree of automation and can rely on their own power and control capabilities to achieve various industrial processing and manufacturing functions. Industrial robots are widely used in various industrial fields such as electronics, logistics, and chemicals. When controlling industrial robots, control devices are required.

[0003] For example, the utility model with application number CN201620850494.7 discloses a multifunctional centralized control robot control device. The utility model mainboard reserves multiple communication interfaces to facilitate function expansion, and is well compatible with most current robot control terminals. The interface is simple and easy to use, and commands of other remote control devices can be learned through simple settings; group control commands are sent uniformly, with extremely low false alarm rate, so that group robots can act in unison; this device can replace single-product controllers and relay equipment to complete the control functions of single and multiple machines, with high control efficiency and strong stability. However, when dissipating heat, this type of robot control device mostly uses heat dissipation holes and fans to dissipate heat inside the device. Therefore, the efficiency of heat dissipation is related to the ambient temperature, resulting in the problem that its overall heat dissipation efficiency is relatively general when used in summer or in a high temperature environment.

[0004] Therefore, in view of this, research and improvement are conducted on the existing structure and deficiencies, and a high-efficiency heat dissipation component and an industrial robot control device are provided. Utility Model Content

[0005] The purpose of the utility model is to provide an efficient heat dissipation component and an industrial robot control device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an efficient heat dissipation component, comprising a fixed cover and a heat exchange component, four ends of one side of the fixed cover are provided with mounting holes, the heat exchange component is arranged inside the fixed cover, the heat exchange component comprises a first fan, a semiconductor refrigeration sheet, a heat conductive sheet, a heat sink, a heat dissipation cover, a second fan and a through slot, the first fan is arranged at one end inside the fixed cover, and a semiconductor refrigeration sheet is arranged on one side inside the fixed cover, a heat conductive sheet is arranged on one side of the semiconductor refrigeration sheet, and a heat sink is arranged on the other side of the semiconductor refrigeration sheet, a heat dissipation cover is arranged on one side of the middle part of the fixed cover, and a second fan is arranged inside the heat dissipation cover, and through slots are arranged on the upper and lower sides of the heat dissipation cover.

[0007] Furthermore, the upper and lower widths of the heat conducting plate are smaller than the upper and lower widths of the inner side of the fixed cover, and the front and rear widths of the heat conducting plate are equal to the inner front and rear widths of the fixed cover.

[0008] Furthermore, the heat conducting plates are equidistantly staggered with respect to the interior of the fixed cover, and serpentine channels are formed between the heat conducting plates.

[0009] Furthermore, the heat sink is equidistantly distributed with respect to the hot end of the semiconductor refrigeration plate, and the upper and lower widths of the heat sink are equal to the upper and lower widths of the semiconductor refrigeration plate.

[0010] Furthermore, a dustproof component is provided at the rear of the fixed cover, and the dustproof component includes a filter plate and a protective cover. The filter plate is arranged inside the other end of the fixed cover, and a protective cover is provided on the top of the other end of the fixed cover.

[0011] Furthermore, the dustproof component also includes a motor and a brush plate. The motor is arranged inside one end of the protective cover, and one end of the motor is connected to the brush plate.

[0012] Furthermore, the protective cover is L-shaped, and the length of the protective cover is greater than the length of the brush plate.

[0013] An industrial robot control and management device is provided, wherein the industrial robot control and management device is equipped with the high-efficiency heat dissipation component as described above.

[0014] The utility model provides a high-efficiency heat dissipation component and an industrial robot control device, which has the following

[0015] Beneficial effects:

[0016] 1. The utility model sets a heat exchange component. After the heat dissipation component is placed at the vent on the industrial robot control device through fasteners and mounting holes, the first fan will form a negative pressure inside the fixed cover, and the outside air will enter the fixed cover. At this time, since the cold end of the semiconductor refrigeration plate is located inside the fixed cover, the air will exchange heat with the semiconductor refrigeration plate for cooling. In this process, the heat conductive plate can increase the area of ​​heat exchange, and at the same time, it can also guide the air and extend the flow path of the air inside the fixed cover, thereby improving the effect of heat exchange, so that the air with a lower heat exchange temperature enters the interior of the industrial robot control device to cool the internal electronic components, thereby effectively improving the heat dissipation performance of the industrial robot control device;

[0017] 2. The utility model provides a dustproof component. When external air enters the fixed cover, the filter plate can block foreign particles in the air, thereby preventing dust from affecting the normal operation of the electronic components inside the industrial robot control device. At the same time, the controller can start the motor at a fixed time to drive the brush plate to swing back and forth, which can automatically clean the impurities on the surface of the filter plate and reduce the occurrence of blockage. When the brush plate is not in use, it can also be moved to the inside of the protective cover for storage and protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of a high-efficiency heat dissipation component of the utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of a heat conducting sheet of a high-efficiency heat dissipation component of the utility model;

[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of a dustproof component of a high-efficiency heat dissipation component of the utility model.

[0021] In the figure: 1. fixed cover; 2. mounting hole; 3. heat exchange component; 301. first fan; 302. semiconductor refrigeration plate; 303. heat conducting plate; 304. heat sink; 305. heat dissipation cover; 306. second fan; 307. through groove; 4. dustproof component; 401. filter plate; 402. protective cover; 403. motor; 404. brush plate. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0023] like Figure 1 and Figure 2As shown, a high-efficiency heat dissipation component includes a fixed cover 1 and a heat exchange component 3. The four ends of one side of the fixed cover 1 are all provided with mounting holes 2. After the fixed cover 1 can be installed at the vent on the industrial robot control device through fasteners and the mounting holes 2, the heat exchange component 3 is arranged inside the fixed cover 1. The heat exchange component 3 includes a first fan 301, a semiconductor cooling sheet 302, a heat conductive sheet 303, a heat sink 304, a heat dissipation cover 305, a second fan 306 and a through groove 307. The first fan 301 is arranged at one end of the interior of the fixed cover 1, and the semiconductor cooling sheet 302 is arranged at one side of the interior of the fixed cover 1. The first fan 301 will form a negative pressure inside the fixed cover 1, and the outside air will enter the interior of the fixed cover 1. Therefore, the air will exchange heat with the cold end of the semiconductor cooling sheet 302 for cooling. A heat conductive sheet 303 is arranged on one side of the semiconductor cooling sheet 302, and a heat sink 304 is arranged on the other side of the semiconductor cooling sheet 302. The upper and lower widths of the heat conductive sheet 303 are smaller than the upper widths of the inner side of the fixed cover 1. The lower width of the heat sink 304 is equidistantly distributed about the interior of the fixed cover 1, and a serpentine channel is formed between the heat sinks 303. The heat sink 303 can increase the area of ​​heat exchange, and can also guide the air, extend the flow path of the air inside the fixed cover 1, thereby improving the effect of heat exchange. The heat sink 304 is equidistantly distributed about the hot end of the semiconductor refrigeration sheet 302, and the upper and lower widths of the heat sink 304 are equal to the upper and lower widths of the semiconductor refrigeration sheet 302. The heat sink 304 can increase the heat dissipation area of ​​the hot end of the semiconductor refrigeration sheet 302. A heat sink 305 is arranged on one side of the middle part of the fixed cover 1, and a second fan 306 is arranged inside the heat sink 305. Through grooves 307 are provided on the upper and lower sides of the heat sink 305. When the second fan 306 is working, external air can enter the heat sink 305 through the through grooves 307 to dissipate the hot end of the semiconductor refrigeration sheet 302.

[0024] like Figure 1 and Figure 3As shown, a dustproof component 4 is provided at the rear of the fixed cover 1, and the dustproof component 4 includes a filter plate 401 and a protective cover 402. The filter plate 401 is placed inside the other end of the fixed cover 1, and the protective cover 402 is provided on the top of the other end of the fixed cover 1. When external air enters the interior of the fixed cover 1, the filter plate 401 can block foreign particles in the air. The dustproof component 4 also includes a motor 403 and a brush plate 404. A motor 403 is provided inside one end of the protective cover 402, and one end of the motor 403 is connected to the brush plate 404. The motor 403 is started regularly by the controller to drive the brush plate 404 to swing back and forth, so that impurities on the surface of the filter plate 401 can be automatically cleaned to reduce the occurrence of blockage. The protective cover 402 is L-shaped, and the length of the protective cover 402 is greater than the length of the brush plate 404. When the brush plate 404 is not in use, it can be moved to the inside of the protective cover 402 for storage and protection.

[0025] An industrial robot control device is provided, which is equipped with a high-efficiency heat dissipation component as described above. The high-efficiency heat dissipation component can improve the overall heat dissipation performance of the industrial robot control device, thereby preventing the device from working in an excessively high temperature environment for a long time and thus reducing the service life of the device.

[0026] In summary, when using the high-efficiency heat dissipation component and industrial robot control device, firstly according to Figure 1 , Figure 2 and Figure 3 In the structure shown in the figure, the fixed cover 1 is first installed at the vent on the industrial robot control device through the fasteners and the mounting holes 2, and then the first fan 301 is started by the controller to form a negative pressure inside the fixed cover 1, and the outside air will enter the fixed cover 1 under the filtration of the filter plate 401. Secondly, the air will exchange heat and cool down with the cold end of the semiconductor refrigeration plate 302. In this process, the heat conducting plate 303 can be used to increase the area of ​​heat exchange, and at the same time, the air can be guided to extend the air inside the fixed cover 1. The heat sink 304 can increase the heat dissipation area of ​​the hot end of the semiconductor refrigeration plate 302. Therefore, when the second fan 306 is working, the external air can enter the heat dissipation cover 305 through the through groove 307 to dissipate the heat of the hot end of the semiconductor refrigeration plate 302. Finally, the motor 403 is started by the controller at a fixed time to drive the brush plate 404 to swing back and forth, which can automatically clean the impurities on the surface of the filter plate 401, and when the brush plate 404 is not in use, it can also be moved to the inside of the protective cover 402 for storage.

[0027] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. An efficient heat dissipation component, comprising a fixed cover (1) and a heat exchange component (3), characterized in that: The four ends of one side of the fixed cover (1) are all provided with mounting holes (2); the heat exchange component (3) is arranged inside the fixed cover (1); the heat exchange component (3) comprises a first fan (301), a semiconductor cooling fin (302), a heat conducting fin (303), a heat sink (304), a heat dissipation cover (305), a second fan (306) and a through slot (307); the first fan (301) is arranged at one end inside the fixed cover (1); the semiconductor cooling fin (302) is arranged at one side inside the fixed cover (1); the heat conducting fin (303) is arranged at one side of the semiconductor cooling fin (302); and the heat sink (304) is arranged at the other side of the semiconductor cooling fin (302); the heat dissipation cover (305) is arranged at one side of the middle part of the fixed cover (1); the second fan (306) is arranged inside the heat dissipation cover (305); and the through slots (307) are arranged at the upper and lower sides of the heat dissipation cover (305).

2. The high-efficiency heat dissipation component according to claim 1, characterized in that: The upper and lower widths of the heat conducting plate (303) are smaller than the upper and lower widths of the inner side of the fixed cover (1), and the front and rear widths of the heat conducting plate (303) are equal to the inner front and rear widths of the fixed cover (1).

3. The high-efficiency heat dissipation component according to claim 1, characterized in that: The heat conducting sheets (303) are distributed in an equidistant and staggered manner with respect to the interior of the fixed cover (1), and serpentine channels are formed between the heat conducting sheets (303).

4. The high-efficiency heat dissipation component according to claim 1, characterized in that: The heat sink (304) is equidistantly distributed with respect to the hot end of the semiconductor cooling plate (302), and the upper and lower widths of the heat sink (304) are equal to the upper and lower widths of the semiconductor cooling plate (302).

5. The high-efficiency heat dissipation component according to claim 1, characterized in that: A dustproof component (4) is arranged at the rear of the fixed cover (1), and the dustproof component (4) comprises a filter plate (401) and a protective cover (402); the filter plate (401) is arranged inside the other end of the fixed cover (1), and the protective cover (402) is arranged on the top of the other end of the fixed cover (1).

6. The high-efficiency heat dissipation component according to claim 5, characterized in that: The dustproof component (4) further comprises a motor (403) and a brush plate (404); the motor (403) is disposed inside one end of the protective cover (402), and one end of the motor (403) is connected to the brush plate (404).

7. The high-efficiency heat dissipation component according to claim 6, characterized in that: The protective cover (402) is L-shaped, and the length of the protective cover (402) is greater than the length of the brush plate (404).

8. An industrial robot control device, characterized in that: The industrial robot control device is installed with a high-efficiency heat dissipation component as described in any one of claims 1-7.

Images