Light emitting diode die bonding equipment

Abstract

The present application relates to a light-emitting diode solid crystal device, including: a material taking mechanism, the material taking mechanism includes a support platform, an adsorption device and a driving device, the support platform is used to carry the support to be processed; the adsorption device is connected to the driving device, the adsorption device is provided with an electromagnetic module, the driving device can drive the adsorption device to move to absorb the support on the support platform; a dispensing mechanism, the dispensing mechanism includes a dispensing swing arm and a dispensing needle provided at the end of the dispensing swing arm, a constant temperature heating module is provided on the dispensing swing arm adjacent to the dispensing needle, and the constant temperature heating module transfers heat to the dispensing needle through the dispensing swing arm. The present application solves the problems of material absorption stability of the material taking mechanism of solid crystal equipment and dispensing wire drawing of the dispensing mechanism, thereby improving the yield of products in the solid crystal process.

Description

Technical Field

[0001] The present application relates to the field of die bonding technology, and in particular to a light emitting diode die bonding device. Background Art

[0002] In the LED processing technology, the die bonding process usually uses die bonding equipment for automated operation. In the current die bonding equipment operation process, the material picking mechanism takes the bracket and puts it into the bracket fixture, and the transfer mechanism transfers it to the die bonding position, and then the glue dispensing mechanism dispenses glue at the position on the bracket where the wafer needs to be bonded, and finally the wafer transfer mechanism transfers the wafer to the glue dispensing position of the bracket for bonding.

[0003] In the prior art, the material picking mechanism generally uses magnet adsorption to absorb the bracket. For different types of brackets, the size of the magnet adsorption force cannot be accurately controlled. When absorbing the bracket, it is easy to cause insufficient adsorption force, adsorption of multiple brackets, etc. The adsorption stability of the material picking mechanism is poor, affecting the stability of the whole equipment and the yield of the product. During the dispensing process, when the outside temperature is high, the glue has a good consistency, and the dispensing process is not prone to drawing, tailing, etc.; but when the outside temperature is low, the glue will condense to a certain extent, and the fluidity of the glue will deteriorate, resulting in drawing, tailing, etc. in the dispensing process, causing uneven dispensing, and the chip may have poor contact when fixed, affecting the product yield. Utility Model Content

[0004] In view of the above-mentioned problems, the purpose of the present application is to provide a light-emitting diode die bonding device to solve the problem of the material picking mechanism of the die bonding device adsorbing multiple brackets at a time and the glue dispensing mechanism dispensing and drawing, so as to improve the yield rate of the products in the die bonding process.

[0005] The purpose of this application is achieved through the following technical solutions:

[0006] A light-emitting diode die bonding device comprises: a material taking mechanism, the material taking mechanism comprises a support platform, an adsorption device and a driving device, the support platform is used to carry the support to be processed; the adsorption device is connected to the driving device, the adsorption device is provided with an electromagnetic module, the driving device can drive the adsorption device to move to absorb the support on the support platform; a dispensing mechanism, the dispensing mechanism comprises a dispensing swing arm and a dispensing needle arranged at the end of the dispensing swing arm, a constant temperature heating module is provided on the dispensing swing arm adjacent to the dispensing needle, and the constant temperature heating module transfers heat to the dispensing needle through the dispensing swing arm.

[0007] An electromagnetic module is set on the adsorption device of the material picking mechanism. For different types of brackets, the suction force of the electromagnet is precisely controlled by adjusting the current to ensure that the bracket can be stably absorbed during the material picking process, improve the compatibility and stability of the equipment, and reduce the occurrence of problems that affect the stability of the entire equipment and the yield of the product due to the unstable absorption of the bracket by the adsorption device. A constant temperature heating module is set on the dispensing swing arm. When the outside temperature is low, the dispensing swing arm is heated to make the dispensing needle have a higher temperature, and the solid crystal glue is not easy to condense on the dispensing needle, thereby avoiding the phenomenon of drawing and tailing during the dispensing process, improving the uniformity of dispensing, reducing the phenomenon of poor contact when the chip is fixed, and improving the product yield.

[0008] Furthermore, the support platform is provided with a support track, and the support track is used to carry the support to be processed.

[0009] The bracket track is not only used to store the bracket to be processed, but also during the movement, the bracket moves along the bracket track to ensure that the bracket position will not be shifted due to special reasons such as accidental collision, thereby ensuring the stability of the equipment.

[0010] Furthermore, it also includes a bracket transfer mechanism, which includes a transfer device and a bracket clamp. The bracket clamp is arranged beside the transfer device, the bracket clamp is used to receive the bracket sucked by the adsorption device, and the transfer device is used to transport the bracket on the bracket clamp.

[0011] After the material picking mechanism absorbs the bracket, it drops it into the bracket fixture, and the bracket is transported to the dispensing and crystal fixing position through the transfer device, so that the dispensing mechanism can perform the dispensing operation.

[0012] Furthermore, the material taking mechanism also includes a blocking component, which is arranged above the bracket clamp and located on both sides of the adsorption device.

[0013] The blocking component is used to limit the position where the adsorption device absorbs the bracket and moves. When the adsorption device absorbs the bracket and moves it above the bracket fixture, the blocking component limits the movement of the bracket. Under the blocking action of the blocking component, the adsorption device releases the bracket and makes it fall into the bracket fixture.

[0014] Furthermore, a glue disc mechanism is provided adjacent to the glue dispensing mechanism, and the glue disc mechanism includes a glue disc, a glue scraper and a rotary drive device, the glue disc is connected to the rotary drive device, the glue scraper is located above the glue disc, the glue disc is concave to form a groove, and the bottom of the glue scraper extends into the groove.

[0015] The adhesive disc contains the solid crystal adhesive, which is kept rotating by a rotary drive device. Under the action of the scraper, the surface of the solid crystal adhesive in the adhesive disc is always kept smooth and at a fixed height, thereby ensuring that the dispensing needle can absorb a fixed amount of solid crystal adhesive each time.

[0016] Furthermore, the glue dispensing mechanism also includes a glue dispensing swing arm driving device, which is connected to the glue dispensing swing arm and is used to drive the glue dispensing needle to swing back and forth and rise and fall.

[0017] The dispensing swing arm drive device includes a rotary drive device and a lifting device. The rotary drive device is used to drive the dispensing needle to swing back and forth between the glue tray and the crystal bonding position. The lifting device is used to drive the dispensing needle to rise and fall at a fixed position to dip the crystal bonding glue in the glue tray and place the crystal bonding glue at the bracket dispensing position.

[0018] Furthermore, it also includes a wafer transfer mechanism, which includes a wafer disk and a welding head device. The wafer disk is located on the side opposite to the bracket transfer mechanism and the glue disk mechanism, and the welding head device is located adjacent to the wafer disk.

[0019] The wafer transfer mechanism sucks and fixes the required wafer to the glue dispensing position of the bracket. After the wafer placed on the wafer tray is expanded, the welding head device sucks the wafer and transfers it to the crystal fixing position and places it on the glue dispensing position of the bracket.

[0020] Furthermore, the welding head device includes a welding head, a welding head swing arm and a welding head swing arm driving device, the welding head is located at the end of the welding head swing arm, and the welding head swing arm driving device is connected to the welding head swing arm for driving the welding head to swing back and forth and rise and fall.

[0021] The welding head of the welding head device has the function of vacuum adsorption, which is used to absorb the wafer on the wafer disk; the welding head swing arm driving device includes a rotating driving device and a lifting device. Under the action of the rotating driving device, the welding head swings back and forth between the wafer disk and the crystal fixing position. Under the action of the lifting device, the welding head rises and falls at a fixed position to absorb the wafer on the wafer disk and bond the wafer at the glue dispensing position of the bracket.

[0022] Compared with the prior art, the beneficial effects of this application are:

[0023] An electromagnetic module is set on the adsorption device of the material picking mechanism. For different types of brackets, the suction force of the electromagnet is changed by adjusting the current to ensure that only one bracket is adsorbed at a time during the material picking process, thereby improving the compatibility and stability of the equipment and reducing the occurrence of problems that affect the use of the equipment and the yield of the product due to the adsorption of multiple brackets at a time. A constant temperature heating module is set on the dispensing swing arm. When the outside temperature is low, the dispensing swing arm is heated to make the dispensing needle have a higher temperature, and the solid crystal glue is not easy to condense on the dispensing needle, thereby avoiding the phenomenon of drawing and tailing during the dispensing process, improving the uniformity of dispensing, reducing the phenomenon of poor contact when the chip is fixed, and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a structural diagram of a light emitting diode die bonding device according to an embodiment of the present application.

[0025] Figure 2 This is a structural diagram of the material taking mechanism according to an embodiment of the present application.

[0026] Figure 3 This is a structural diagram of the glue disc mechanism and the glue dispensing mechanism according to one embodiment of the present application.

[0027] Figure 4 This is a structural diagram of a wafer transfer mechanism according to an embodiment of the present application.

[0028] Illustrations: 1- material picking mechanism, 2- glue disc mechanism, 3- glue dispensing mechanism, 4- bracket moving mechanism, 5- wafer moving mechanism, 11- bracket carrier, 12- adsorption device, 13- driving device, 14- blocking component, 21- glue disc, 22- glue scraper, 23- rotating driving device, 31- glue dispensing needle, 32- constant temperature heating module, 33- glue dispensing swing arm, 34- glue dispensing swing arm driving device, 41- moving device, 42- bracket fixture, 51- wafer disc, 52- welding head device, 111- bracket track, 121- electromagnetic module, 211- groove, 521- welding head, 522- welding head swing arm, 523- welding head swing arm driving device. DETAILED DESCRIPTION

[0029] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The drawings provide preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein.

[0030] like Figures 1 to 4As shown, in a preferred embodiment, a light-emitting diode die bonding device comprises: a material taking mechanism 1, the material taking mechanism 1 comprises a support carrier 11, an adsorption device 12 and a driving device 13. The support carrier 11 is used to carry the support to be processed; a connecting block is provided at the output end of the driving device 13, and the adsorption device 12 is installed on the connecting block. When the adsorption device 12 needs to be replaced, the adsorption device 12 can be removed from the connecting block; electromagnetic modules 121 are installed at both ends of the adsorption device 12, and the driving device 13 can drive the adsorption device 12 to move to absorb the support on the support carrier 11. A dispensing mechanism 3, the dispensing mechanism 3 comprises a dispensing swing arm 33 and a dispensing needle 31 arranged at the end of the dispensing swing arm 33, and a constant temperature heating module 32 is provided on the dispensing swing arm 33 adjacent to the dispensing needle 31, and the constant temperature heating module 32 transfers heat to the dispensing needle 31 through the dispensing swing arm 33.

[0031] An electromagnetic module 121 is provided on the adsorption device 12 of the material-retrieving mechanism 1. By adjusting the current size, the suction force of the electromagnet is changed for different types of brackets, so as to ensure that only one bracket is adsorbed at a time during the material-retrieving process, thereby improving the compatibility and stability of the equipment and reducing the occurrence of problems that affect the use of the equipment and the yield of the product due to the adsorption of multiple brackets at a time. A constant temperature heating module 32 is provided on the dispensing arm 33. When the outside temperature is low, the dispensing arm 33 is heated to make the dispensing needle 31 have a higher temperature, and the solid crystal glue is not easy to condense on the dispensing needle 31, thereby avoiding the phenomenon of drawing and tailing during the dispensing process, improving the uniformity of dispensing, reducing the phenomenon of poor contact when the chip is fixed, and improving the product yield.

[0032] like Figure 2 As shown. The bracket carrier 11 is provided with a bracket rail 111 for carrying the bracket to be processed. The number of the bracket rails 111 is at least 2, which can ensure that the bracket is placed on the bracket rails 111 in a balanced manner. At the same time, the spacing between the bracket rails 111 needs to be greater than the width of the adsorption device 12 to ensure that the adsorption device 12 can extend into the bracket rail 111 to absorb the bracket. The bracket rail 111 is not only provided to store the bracket to be processed, but also during the movement, the bracket moves along the bracket rail 111 to ensure that the bracket position will not be offset due to special reasons such as accidental collision, thereby ensuring the stability of the equipment.

[0033] like Figure 1As shown, the bracket transfer mechanism 4 includes a transfer device 41 and a bracket clamp 42. The bracket clamp 42 is arranged beside the transfer device 41. The clamp mouth of the bracket clamp 42 is arranged below the position where the adsorption device 12 releases the bracket. After the adsorption device 12 releases the bracket, the bracket clamp 42 receives the fallen bracket. The transfer device 41 is used to transfer the bracket on the bracket clamp 42. The bracket to be processed is transported to the crystal fixing position for crystal fixing, and the processed bracket is transported out of the equipment. In this embodiment, the transfer device is a prior art, which adopts a structural form of a combination of a drag chain and an adsorption mechanism. After the adsorption mechanism adsorbs the bracket, it is transported under the action of the drag chain mechanism. The transfer device can also adopt other prior art technologies, and this application does not make specific restrictions.

[0034] like Figure 2 As shown, the material taking mechanism 1 further includes a blocking component 14, which is disposed above the bracket fixture 42 and is located on both sides of the adsorption device 12. The blocking component 14 is used to limit the position where the adsorption device 12 absorbs the bracket to move. When the adsorption device 12 absorbs the bracket to move above the bracket fixture 42, the blocking component 14 limits the movement of the bracket. Under the blocking effect of the blocking component 14, the adsorption device 12 releases the bracket to make it fall into the bracket fixture 42.

[0035] like Figure 3 As shown, a glue disc mechanism 2 is provided adjacent to the glue dispensing mechanism 3, and the glue disc mechanism 2 includes a glue disc 21, a glue scraper 22, and a rotary drive device 23. The glue disc 21 is connected to the rotary drive device 23, and the glue scraper 22 is located above the glue disc 21. The glue disc 21 is concave to form a groove 211, and the bottom of the glue scraper 22 extends into the groove 211. The glue disc 21 contains the solid crystal glue, and the glue disc 21 is kept rotating by the rotary drive device 23. Under the action of the glue scraper 22, the surface of the solid crystal glue in the glue disc 21 is always kept smooth and at a fixed height, thereby ensuring that the glue dispensing needle 31 can dip a fixed amount of solid crystal glue each time.

[0036] like Figure 3 As shown, the glue dispensing mechanism 3 also includes a glue dispensing swing arm driving device 34, which is connected to the glue dispensing swing arm 33 and is used to drive the glue dispensing needle 31 to swing back and forth and rise and fall. In this embodiment, the glue dispensing swing arm driving device 34 is a prior art, including a rotary driving device and a lifting device. The rotary driving device is used to drive the glue dispensing needle to swing back and forth between the glue tray and the crystal bonding position, and the lifting device is used to drive the glue dispensing needle to rise and fall at a fixed position to dip the crystal bonding glue in the glue tray and place the crystal bonding glue at the support glue dispensing position. The present application does not specifically limit the structure of the glue dispensing swing arm driving device 34.

[0037] like Figure 4As shown, the wafer transfer mechanism 5 includes a wafer disk 51 and a welding head device 52. The wafer disk 51 is located on the side opposite to the support transfer mechanism 4 and the glue disk mechanism 2, and the welding head device 52 is located adjacent to the wafer disk 51. The welding head device 52 includes a welding head 521, a welding head swing arm 522 and a welding head swing arm driving device 523. The welding head 521 is located at the end of the welding head swing arm 522. The welding head swing arm driving device 523 is connected to the welding head swing arm 522 and is used to drive the welding head 521 to swing back and forth and rise and fall. After the wafer placed on the wafer disk 51 is expanded, the welding head device 52 absorbs the wafer and transfers it to the crystal fixing position and places it on the support glue dispensing position. The welding head 521 of the welding head device 52 has a vacuum adsorption function and is used to absorb the wafer on the wafer disk 51. In this embodiment, the welding head swing arm driving device 523 is a prior art, including a rotating driving device and a lifting device. Under the action of the rotating driving device, the welding head 521 swings back and forth between the chip disk 51 and the crystal bonding position. Under the action of the lifting device, the welding head 521 is lifted and lowered at a fixed position to absorb the chip on the chip disk 51 and bond the chip at the glue dosing position of the bracket. This application does not specifically limit the structure of the welding head swing arm driving device 523.

[0038] In the description of the present application, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the definition of "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A light emitting diode die bonding device, characterized in that: include: A material taking mechanism, the material taking mechanism comprising a support platform, an adsorption device and a driving device, the support platform is used to carry the support to be processed; The adsorption device is connected to the driving device, and an electromagnetic module is provided on the adsorption device. The driving device can drive the adsorption device to move so as to absorb the bracket on the bracket carrier; The dispensing mechanism comprises a dispensing swing arm and a dispensing needle arranged at the end of the dispensing swing arm. A constant temperature heating module is provided at a position adjacent to the dispensing swing arm and the dispensing needle. The constant temperature heating module transfers heat to the dispensing needle through the dispensing swing arm.

2. The light emitting diode die bonding equipment according to claim 1, characterized in that: The support platform is provided with a support track, and the support track is used to carry the support to be processed.

3. The light emitting diode die bonding equipment according to claim 1, characterized in that: The glue dispensing mechanism also includes a glue dispensing swing arm driving device, which is connected to the glue dispensing swing arm and is used to drive the glue dispensing needle to swing back and forth and rise and fall.

4. The light emitting diode die bonding equipment according to claim 1, characterized in that: It also includes a bracket transfer mechanism, which includes a transfer device and a bracket clamp. The bracket clamp is arranged beside the transfer device. The bracket clamp is used to receive the bracket sucked by the adsorption device. The transfer device is used to transport the bracket on the bracket clamp.

5. The light emitting diode die bonding equipment according to claim 4, characterized in that: The material taking mechanism further comprises a blocking component, wherein the blocking component is arranged above the bracket clamp and the blocking component is located at both sides of the adsorption device.

6. The light emitting diode die bonding equipment according to claim 4, characterized in that: A glue disc mechanism is provided adjacent to the glue dispensing mechanism, and the glue disc mechanism includes a glue disc, a glue scraper and a rotary drive device. The glue disc is connected to the rotary drive device, the glue scraper is located above the glue disc, the glue disc is concave to form a groove, and the bottom of the glue scraper extends into the groove.

7. The light emitting diode die bonding equipment according to claim 6, characterized in that: It also includes a wafer transfer mechanism, which includes a wafer plate and a welding head device. The wafer plate is located on the side opposite to the support transfer mechanism and the glue plate mechanism, and the welding head device is located adjacent to the wafer plate.

8. The light emitting diode die bonding equipment according to claim 7, characterized in that: The welding head device includes a welding head, a welding head swing arm and a welding head swing arm driving device. The welding head is located at the end of the welding head swing arm. The welding head swing arm driving device is connected to the welding head swing arm and is used to drive the welding head to swing back and forth and rise and fall.

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