Light source packaging structure

Abstract

The present application relates to the field of light sources, and to a light source packaging structure. The structure includes: a light source substrate, a blue light chipset, and a fluorescent ceramic sheet. The blue light chipset is bonded to the surface of the light source substrate and bound to the light source substrate; the fluorescent ceramic sheet covers the top of the blue light chipset; and the fluorescent ceramic sheet and the light source substrate encapsulate the blue light chipset. Among them, the blue light chipset includes multiple blue light chips and at least one red light chip, and multiple blue light chips and at least one red light chip are connected in series. In the above technical solution, a certain proportion of red light chips are inserted and strung into the blue light chip, and the red light emitted by the red light chip is used to replace the red phosphor. Because the red light chip emits light stably and will not cause color temperature drift due to temperature, the color temperature of the LED light source will not drift during long-term use, and the temperature resistance is stronger, and it can be controlled by software, and the color temperature can be adjusted according to the use time and scene.

Description

Technical Field

[0001] The present application relates to the field of light sources, and in particular, to a light source packaging structure. Background Art

[0002] The existing remote excitation fluorescent LED has a solid-state fluorescent material band of 548-550nm, which is relatively close to the solid-state basic band. When the fluorescent material in this band is packaged into white light lamp beads, the coordinate point will not be on the black body line, and the Y coordinate value will be too high. The existing technical improvement method is to add red phosphor mixed with 620-670nm between the solid-state phosphor and the blue light diode to solve the coordinate fine-tuning problem.

[0003] However, because the red phosphor of the lamp beads will slowly fail when used at a certain temperature, the higher the temperature, the faster the red phosphor will fail, resulting in a color shift of the final LED light source. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a light source packaging structure.

[0005] In a first aspect, the present application provides a light source packaging structure, including:

[0006] light source substrate;

[0007] A blue light chipset; the blue light chipset is bonded to the surface of the light source substrate and is bound to the light source substrate; and

[0008] A fluorescent ceramic sheet is covered on the blue light chipset; and the fluorescent ceramic sheet and the light source substrate encapsulate the blue light chipset;

[0009] The blue light chipset includes a plurality of blue light chips and at least one red light chip, and the plurality of blue light chips and the at least one red light chip are connected in series.

[0010] In the present application, a certain proportion of red light chips are inserted in series with the blue light chip, and the red light emitted by the red light chip is used to replace the red phosphor to effectively adjust the color coordinates and the color temperature of the light source. By adjusting the number and position of the red light chips, the color coordinates and color temperature can be adjusted. In addition, since the red light chip emits stable light and the color temperature will not drift due to temperature, the present application can solve the problem of color temperature drift caused by the failure of the existing phosphor; at the same time, the color temperature of the light source will not drift during long-term use, and the temperature resistance is stronger. Therefore, the light source packaging structure of the present application has broad application prospects in the field of adjustable color coordinate remote excitation phosphor LED packaging.

[0011] In other embodiments of the present application, when the blue light chipset includes multiple groups, the operating voltage of each group of blue light chipsets is the same.

[0012] In other embodiments of the present application, when the blue light chipset includes multiple groups, the number of red light chips in each group of blue light chipset is the same.

[0013] In other embodiments of the present application, when the blue light chipset includes multiple groups, the number of blue light chips in each group of blue light chipsets is the same.

[0014] In other embodiments of the present application, based on the total number of chips in the blue light chipset, the blue light chipset includes 80% to 90% blue light chips and 10% to 20% red light chips.

[0015] In other embodiments of the present application, the red light chips are evenly distributed in the blue light chipset.

[0016] In other embodiments of the present application, the fluorescent ceramic sheet is Ce:YAG fluorescent ceramic.

[0017] In other embodiments of the present application, there is a gap between the fluorescent ceramic sheet and the blue light chipset.

[0018] In other embodiments of the present application, the color temperature value of the light source packaging structure is lower than 6777K.

[0019] In other embodiments of the present application, the color tolerance value of the light source packaging structure is within 5SDCM. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is the light source design diagram of Example 1;

[0022] Figure 2 This is a diagram of the light source packaging structure of an embodiment of the present application;

[0023] Figure 3 This is the light source design diagram of Comparative Example 1;

[0024] Figure 4 It is the light source spectrum diagram of Example 1;

[0025] Figure 5 It is the light source spectrum diagram of Comparative Example 1;

[0026] Figure 6 is the light source color tolerance diagram of Example 1;

[0027] Figure 7is the light source color tolerance diagram of comparative example 1;

[0028] Figure 8 This is the light source spectrum diagram of Example 2.

[0029] Icon: 110-light source substrate; 120-blue light chip; 130-red light chip; 140-fluorescent ceramic sheet; 150-thermal conductive column; 160-dam glue; 21-aluminum substrate; 22-blue light chip; 23-red light chip; 24-thermal conductive column; 25-fluorescent ceramic sheet; 11-aluminum substrate; 12-blue light chip; 13-thermal conductive column; 14-fluorescent ceramic sheet. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0031] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0032] Reference Figure 2 , an embodiment of the present application provides a light source packaging structure, including: a light source substrate 110, a blue light chipset; and a fluorescent ceramic sheet 140.

[0033] The blue light chipset is adhered to the surface of the light source substrate 110 and is bound to the light source substrate 110 ; the fluorescent ceramic sheet 140 covers the blue light chipset; and the fluorescent ceramic sheet 140 and the light source substrate 110 encapsulate the blue light chipset.

[0034] The blue light chipset includes a plurality of blue light chips 120 and at least one red light chip 130 , and the plurality of blue light chips 120 and the at least one red light chip 130 are connected in series.

[0035] The above technical solution inserts a certain proportion of red light chips 130 into the blue light chip 120, and uses the red light emitted by the red light chip to replace the red phosphor. Since the red light chip emits stable light and will not cause color temperature drift due to temperature, the color temperature of the LED light source will not drift during long-term use, and it has stronger temperature resistance and can be controlled by software. The color temperature can be adjusted according to the usage time and scene.

[0036] Furthermore, in some embodiments of the present application, when the blue light chipset includes multiple groups, the operating voltage of each group of blue light chipsets is the same.

[0037] Further, in some embodiments of the present application,

[0038] When the blue light chipset includes multiple groups, the number of the red light chips 130 in each blue light chipset is the same.

[0039] Furthermore, in some embodiments of the present application, when the blue light chipset includes multiple groups, the number of blue light chips 120 in each blue light chipset is the same.

[0040] For example, in some embodiments of the present application, in the above technical solution, by setting the total number of red light chips and blue light chips in each group of blue light chips to be the same, the operating voltage in each group of chips can be ensured to be the same, thereby improving the luminous stability of the manufactured LED light source.

[0041] In some embodiments of the present application, the above-mentioned blue light chip 120 and red light chip 130 may also be referred to as a blue light LED chip and a red light LED chip; or a blue light diode and a red light diode.

[0042] Furthermore, in some embodiments of the present application, in the above solution, only one set of blue light chips is bonded on the light source substrate 110 .

[0043] Furthermore, in some embodiments of the present application, based on the total number of chips in the blue light chipset, the blue light chipset includes 80% to 90% blue light chips 120 and 10% to 20% red light chips 130 .

[0044] In other words, in the above-mentioned implementation, the light source substrate is mainly composed of blue light chips, and a certain proportion of red light chips are connected in series among the multiple blue light chips.

[0045] Illustratively, in some embodiments of the present application, based on the total number of chips in the blue light chipset, the blue light chipset includes: 80%, 81%, 82%, 83%, 84%, 85%, 86%, 87%, 88%, 89%, 90% or the range between any two of the foregoing values; and red light chips: 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20% or the range between any two of the foregoing values.

[0046] Furthermore, in some embodiments of the present application, multiple chips in the blue light chipset are evenly distributed on the light source substrate.

[0047] In other words, among the multiple blue light chips in the blue light chipset in the above solution, a certain proportion (less than the number of blue light chips) of red light chips are connected in series, and these red light chips are evenly distributed among the multiple blue light chips, which is conducive to obtaining a stable light source.

[0048] Furthermore, in some embodiments of the present application, the light source substrate mentioned above may be a light source substrate commonly used in the art, such as an aluminum substrate.

[0049] Furthermore, in some embodiments of the present application, the blue light chipset may be bound to the light source substrate by using gold wires.

[0050] Furthermore, the gold wire mentioned above can be selected from common gold wires in the art to achieve gold wire binding.

[0051] Furthermore, in some embodiments of the present application, the blue light chipset is bonded to the surface of the light source substrate, and can be bonded to the light source substrate using a die-bonding adhesive and then baked and cured.

[0052] Furthermore, in some embodiments of the present application, when the blue light chipset is bonded to the light source substrate 110 , the heat conductive pillar 150 is also bonded to the light source substrate.

[0053] It should be noted that the above-mentioned die-bonding adhesive may be glue commonly used in the art that can bond the chip to the light source substrate.

[0054] Furthermore, in some embodiments of the present application, the fluorescent ceramic sheet 140 covers the blue light chipset; and the fluorescent ceramic sheet 140 and the light source substrate 110 encapsulate the blue light chipset. A dam glue 160 can be set around the chip area, and then the fluorescent ceramic sheet 140 is bonded to the blue light chipset, and the blue light chipset is encapsulated with the light source substrate 110 using packaging glue.

[0055] Further, in some embodiments of the present application, the height of the dam glue 160 is 0.5 mm to 1.2 mm. For example, in some embodiments of the present application, the height of the dam is 0.5 mm, 0.6 mm, 0.7 mm, 0.71 mm, 0.72 mm, 0.73 mm, 0.74 mm, 0.75 mm, 0.76 mm, 0.77 mm, 0.78 mm, 0.79 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm or a range between any two of the foregoing values.

[0056] Furthermore, in some embodiments of the present application, the shape formed by the dam glue 160 may be circular, quadrilateral or irregular.

[0057] Further, refer to Figure 2 In some embodiments of the present application, there is a gap between the fluorescent ceramic sheet 140 and the blue light chipset.

[0058] Furthermore, in some embodiments of the present application, the fluorescent ceramic sheet 140 is in contact with the thermally conductive column 150 , and the top of the thermally conductive column 150 protrudes from the blue light chipset.

[0059] Further, refer to Figure 2 In the illustrated embodiment, the upper and lower surfaces of the thermal conductive column 150 are in contact with the fluorescent ceramic sheet 140 and the light source substrate 110 respectively; while only the bottom ends of the red light chip 130 and the blue light chip 120 are in contact with the light source substrate 110; but the tops of the red light chip 130 and the blue light chip 120 are not in contact with the fluorescent ceramic sheet 140, forming a gap.

[0060] As mentioned above, Figure 2 The remote excitation principle diagram of the light source of the present application is shown: the excitation principle of the LED light source of the present application is the remote excitation principle; the color-adjusting red light chip has no direct contact with the luminous body (yellow fluorescent ceramic sheet), and there is a distance between them, such as Figure 2 At present, the conventional method is to bond the luminous body to the chip, while in the solution of the present application, there is a certain distance between the two, which can better disperse the excited light source to the luminous body.

[0061] Furthermore, in the present application, the light source substrate (such as an aluminum substrate) serves to connect to the heat sink to conduct heat; the blue light chip serves to excite the light; the red light chip serves to adjust the color coordinates; the thermal conductive column serves to support and conduct heat; and the fluorescent ceramic sheet can emit light under the excitation of blue light.

[0062] The above technical solution of the present application realizes the control of the color coordinates and color temperature of the light source by adjusting the light emission quantity and position of the blue light chip and the red light chip through designing a combination of two chips, a blue light chip and a red light chip, and matching them with Ce:YAG fluorescent transparent ceramics.

[0063] Furthermore, the above-mentioned technical solution of the present application effectively solves the color drift problem caused by the failure of the phosphor, compared with the conventional solution of adding a red phosphor mixed with 620nm-670nm between the solid-state phosphor and the blue light chip to solve the problem of coordinate fine-tuning. Furthermore, the solution of the present application inserts a certain proportion of red light chips into the original blue light chip, and replaces the red phosphor with the red light emitted by the red light chip. Since the red light chip emits stable light and will not cause color drift due to temperature, the color of the LED light source will not drift during long-term use, and the temperature resistance is stronger.

[0064] Furthermore, in some embodiments of the present application, the above-mentioned fluorescent ceramic sheet includes Ce:YAG fluorescent ceramic.

[0065] It should be noted that, in some embodiments of the present application, the above-mentioned Ce:YAG fluorescent ceramic can be purchased commercially. Or in some embodiments of the present application, the above-mentioned Ce:YAG fluorescent ceramic can be prepared according to the method disclosed in Chinese Patent 202210177522.3 "A fluorescent conversion composite layer and preparation method and white light emitting device".

[0066] The fluorescent ceramic sheet mentioned above can emit light under the excitation of blue light.

[0067] Furthermore, in some embodiments of the present application, the color temperature value of the above-mentioned light source packaging structure is lower than 6777K.

[0068] Further optionally, in some embodiments of the present application, the color temperature value of the light source package structure is between 6209K and 6703K. Exemplarily, in some embodiments of the present application, the color temperature value of the light source package structure is 6250K, 6300K, 6350K, 6400K, 6450K, 6500K, 6550K, 6600K, 6650K, 6700K, 6703K or a range between any two of the foregoing values.

[0069] Further, in some embodiments of the present application, the color tolerance value of the light source packaging structure is within 5SDCM. Exemplarily, the color tolerance value of the light source packaging structure of the present application is 1SDCM, 1.5SDCM, 2SDCM, 2.5SDCM, 3SDCM, 3.5SDCM, 4SDCM, 4.5SDCM or a range between any two of the foregoing values.

[0070] The technical solution of the present application inserts a certain proportion of red light chips in series with the blue light chip, and uses the red light emitted by the diode to replace the red phosphor (such as 1113 nitride) to effectively adjust the color coordinates and the color temperature of the light source; the color coordinates and color temperature can be adjusted by changing the number and position of the red light chips. In addition, the present application solution can solve the color drift problem caused by the failure of the existing phosphor because the red light chip emits light stably and will not cause color drift due to temperature; at the same time, the color of the LED light source will not drift during long-term use, and the temperature resistance is stronger. Therefore, the LED light source packaging method of the present application has broad application prospects in the field of adjustable color coordinate LED packaging.

[0071] The present application provides a packaging method for a light source packaging structure, comprising: bonding a blue light chipset to a light source substrate; binding the blue light chipset to the light source substrate; damming the blue light chipset to form a chip area; packaging a fluorescent ceramic sheet above the chip area;

[0072] The blue light chipset includes a plurality of blue light chips and at least one red light chip, and the plurality of blue light chips and the at least one red light chip are connected in series.

[0073] The above technical solution inserts a certain proportion of red light chips into the original blue light chip, and uses the red light emitted by the red light chip to replace the red phosphor. Since the red light chip emits stable light and the color temperature will not drift due to temperature, the color temperature of the LED light source will not drift during long-term use, and it has stronger temperature resistance. It can also be controlled by software and the color temperature can be adjusted according to the usage time and scene.

[0074] Furthermore, in some embodiments of the present application, a packaging method of a light source packaging structure comprises the following steps:

[0075] Step S1, preparing a light source substrate.

[0076] Furthermore, in some embodiments of the present application, the light source substrate preparation step includes:

[0077] Take the light source substrate with circuits, clean it to remove impurities from the substrate, and then bake it for dehumidification.

[0078] Since the light source preparation process cannot be polluted, some substances will cause the silicone to be contaminated and unable to solidify. This problem can be effectively avoided by cleaning the light source substrate.

[0079] Furthermore, in some embodiments of the present application, the light source substrate may be cleaned with a special cleaning agent. The light source substrate may be a common light source substrate in the art, such as an aluminum substrate.

[0080] Furthermore, in some embodiments of the present application, the above-mentioned baking and dehumidification can be performed in an oven.

[0081] Further optionally, in some embodiments of the present application, the oven baking selects a baking temperature of 80°C to 120°C; and a baking time of 30min to 60min. Exemplarily, the baking temperature is 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, or a range between any two of the aforementioned values; the baking time is 30min, 35min, 40min, 45min, 48min, 50min, 55min, 58min, 60min, or a range between any two of the aforementioned values.

[0082] Step S2, bonding the blue light chipset to the light source substrate obtained in step S1.

[0083] Furthermore, in some embodiments of the present application, the blue light chipset is bonded to the light source substrate, including:

[0084] The blue light chipset is bonded to the light source substrate with a bonding adhesive and then baked and cured.

[0085] Furthermore, in some embodiments of the present application, when the blue light chipset is bonded to the light source substrate, the heat conductive column is also bonded to the light source substrate.

[0086] It should be noted that the above-mentioned die-bonding adhesive can be glue commonly used in the art to bond the chip to the light source substrate; the above-mentioned light source substrate can also be a common light source substrate in the art, such as an aluminum substrate.

[0087] Furthermore, in some embodiments of the present application, baking and curing includes a first stage baking and a second stage baking.

[0088] Further, in some embodiments of the present application, optionally, the first stage of baking includes: baking at 80° C. to 100° C. for 30 min to 90 min.

[0089] Exemplarily, the first stage baking includes: at 80°C, 82°C, 85°C, 88°C, 90°C, 92°C, 95°C, 98°C, 99°C, 100°C or a range between any two of the foregoing values;

[0090] The baking time is 30 min, 35 min, 40 min, 45 min, 50 min, 55 min, 60 min, 65 min, 70 min, 75 min, 80 min, 85 min, 90 min or the range between any two of the foregoing values.

[0091] Further, in some embodiments of the present application, optionally, the second stage baking includes: baking at 150° C. to 160° C. for 100 min to 150 min.

[0092] Illustratively, in some embodiments of the present application, the second stage baking includes: baking temperature of 150°C, 151°C, 152°C, 153°C, 154°C, 155°C, 155°C, 156°C, 157°C, 158°C, 159°C, 160°C or a range between any two of the foregoing values.

[0093] The baking time is 100 min, 105 min, 110 min, 115 min, 120 min, 125 min, 130 min, 135 min, 140 min, 150 min or a range between any two of the foregoing values.

[0094] Illustratively, in some embodiments of the present application, after the baking obtained in the aforementioned step S1 is completed, the light source substrate is taken out and fixed in the working area of ​​the equipment with special equipment and tooling, and the auxiliary material required for crystal bonding, namely, crystal bonding primer, is prepared. Then, the blue light chip, red light chip, and thermal conductive column are respectively fixed in corresponding positions according to the positions of the blue light chip, red light chip, and thermal conductive column on the drawing. After the crystal bonding is completed, the material is taken out of the equipment and put into the oven. Two baking temperatures are set according to the characteristics of the crystal bonding primer. The first stage: 80℃-100℃ baking time: 60min; the second stage: 150℃-160℃ baking time: 120min.

[0095] Step S3: Bind the blue light chipset to the light source substrate.

[0096] Furthermore, in some embodiments of the present application, the blue light chipset is bound to the light source substrate, including:

[0097] The blue light chipset is bound to the light source substrate using gold wire.

[0098] The gold wire mentioned above can be selected from the common gold wires in the art and the gold wires are bound.

[0099] Furthermore, in some implementations of the present application, a dedicated binding device commonly used in the art may be used for binding.

[0100] For example, in some embodiments of the present application, a blue light chipset is bound to a light source substrate using gold wires, including:

[0101] Put the light source substrate baked in the above step S1 into the binding device, and use the binding device to write a program according to the designed serial and parallel wire bonding scheme (string the blue light chip and the red chip together in proportion to ensure that the number of blue light chips and red light chips in each blue light chipset is the same).

[0102] Step S3: dam the blue light chipset to form a chip area.

[0103] Furthermore, in some embodiments of the present application, a blue light chipset is dammed to form a chip area, including:

[0104] A dam is formed around the blue light chipset using dam glue and then baked.

[0105] It should be noted that the dam glue mentioned above can be selected from common dam glues in the art.

[0106] Further, in some embodiments of the present application, the height of the dam is 0.5 mm to 1.2 mm. For example, in some embodiments of the present application, the height of the dam is 0.5 mm, 0.6 mm, 0.7 mm, 0.71 mm, 0.72 mm, 0.73 mm, 0.74 mm, 0.75 mm, 0.76 mm, 0.77 mm, 0.78 mm, 0.79 mm, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, or a range between any two of the foregoing values.

[0107] Furthermore, in some embodiments of the present application, baking includes: baking temperature of 150° C.-160° C. and baking time of 30 min to 90 min.

[0108] Illustratively, in some embodiments of the present application, the baking temperature is 150°C, 151°C, 152°C, 153°C, 154°C, 155°C, 156°C, 157°C, 158°C, 159°C, 160°C or a range between any two of the foregoing values.

[0109] Illustratively, in some embodiments of the present application, the baking time is 30 min, 35 min, 38 min, 40 min, 45 min, 50 min, 55 min, 60 min, 70 min, 80 min, 90 min or a range between any two of the foregoing values.

[0110] Illustratively, in some embodiments of the present application, a blue light chipset is dammed to form a chip area, including: using milky white high-concentration dam glue, using a dam-specific device to obtain the light source area of ​​the bound chip in the aforementioned step S2, controlling the dam diameter and dam height, making a circular dam, and then putting it into an oven at a baking temperature of 150°C-160°C; and a baking time of 30min to 90min.

[0111] Step S4: encapsulate the fluorescent ceramic sheet above the chip area.

[0112] Furthermore, in some embodiments of the present application, the fluorescent ceramic sheet is encapsulated above the chip area, including:

[0113] Inject packaging glue into the chip area, cover the fluorescent ceramic sheet on the chip area, and then bake and cure.

[0114] Furthermore, in some embodiments of the present application, the above-mentioned fluorescent ceramic sheet includes Ce:YAG fluorescent ceramic.

[0115] It should be noted that, in some embodiments of the present application, the above-mentioned Ce:YAG fluorescent ceramic can be purchased commercially. Or in some embodiments of the present application, the above-mentioned Ce:YAG fluorescent ceramic can be prepared according to the method disclosed in Chinese Patent 202210177522.3 "A fluorescent conversion composite layer and preparation method and white light emitting device".

[0116] Furthermore, in some embodiments of the present application, a fluorescent ceramic sheet is covered over the chip area and pressure is applied to remove bubbles.

[0117] Furthermore, in some embodiments of the present application, before injecting the packaging glue into the chip area, the packaging glue is stirred and degassed.

[0118] Further, in some embodiments of the present application, optionally, the stirring time is 10 min to 30 min. Exemplarily, in some embodiments of the present application, the stirring time is 10 min, 12 min, 15 min, 18 min, 20 min, 22 min, 25 min, 28 min, 30 min or a range between any two of the foregoing values.

[0119] Illustratively, in some embodiments of the present application, the light source-specific packaging surface glue is prepared in a 1:1 ratio, and placed in a dedicated device for stirring and degassing; the stirring time is selected to be 10min-30min; it is taken out after degassing is completed; the appropriate amount of glue is controlled by a dispensing device, and after the glue is dispensed, the fluorescent ceramic sheet is placed above the chip area, and a certain pressure is applied to press the fluorescent ceramic sheet to ensure that there are no bubbles in the glue.

[0120] The features and performance of the present application are further described in detail below in conjunction with the embodiments:

[0121] Example 1

[0122] A method for packaging a light source is provided, which is prepared according to the following steps:

[0123] Step 1: Draw the light source plan: Design the light source plan before packaging, as shown in the instruction manual Figure 1 As shown; prepare the required materials: aluminum substrate 21, blue light chip 22, red light chip 23, thermal conductive column 24, fluorescent ceramic sheet 25; and production auxiliary materials such as: solid crystal base glue, special packaging surface glue, bonding gold wire, etc.

[0124] Light source solution ratio: 1pc of aluminum substrate 21, 436pcs of blue light chip 22, 109pcs of red light chip 23, and 1pc of fluorescent ceramic sheet 25. (ie, the number of red light chips accounts for 20% of the total number of chips).

[0125] Step 2, cleaning: The aluminum substrate in step 1 is cleaned with a cleaning agent, and then placed in an oven for baking, with a baking temperature of 100° C. and a baking time of 50 min.

[0126] Step 3: Solid crystal:

[0127] Fix the aluminum substrate taken out after baking in step 2 in the working area of ​​the die bonding equipment, prepare the auxiliary material required for die bonding - die bonding glue, and then place the blue light chip, red light chip and thermal conductive column in the position shown in the drawing in step 1 (as shown in the figure below). Figure 1 ) and bond them to the corresponding positions to complete the solid crystal. Then take the material substrate out of the equipment and put it into the oven for baking. The first stage of baking temperature: 80℃~100℃; baking time: 60min; the second stage: 150℃~160℃; baking time: 120min.

[0128] Step 4: Binding:

[0129] Put the baked substrate obtained in step 3 into the binding device, write a program using the binding device according to the designed series-parallel welding wire scheme, and bind the blue light chipset to the substrate (connect the blue light chip and the red chip in series in proportion to ensure that the amount of blue light chip and red light chip in each group is the same).

[0130] Step 5: Dam:

[0131] Use milky white high-concentration dam glue and dam-specific equipment to apply a circular dam around the bound chip obtained in step 4 to form a chip area. Then put it into the oven at a baking temperature of 150℃~160℃ for 60 minutes. The dam height is 0.75mm.

[0132] Step 6: Apply glue and cover the fluorescent ceramic sheet Ce: YAG fluorescent ceramic (light source):

[0133] Mix the special packaging surface glue for the light source in a ratio of 1:1, put it into a special device for stirring and degassing; select the stirring time of 10min-30min; after degassing, take it out and control the appropriate amount of glue with the glue dispensing equipment, and then place the fluorescent ceramic sheet on the chip area obtained in step 5 after the glue is dispensed; apply a certain pressure on the fluorescent ceramic sheet, press the fluorescent ceramic sheet tightly to ensure that there are no bubbles in the glue.

[0134] Example 2

[0135] The difference from Example 1 is that the proportion of red light chips is 10%.

[0136] Comparative Example 1

[0137] A packaging method for an LED light source is provided, which differs from Example 1 in that the light source scheme designed in step 1 is different, and the red light chip in step 1 is replaced by a blue light chip, and the rest is the same as Example 1. The light source scheme is detailed in the specification. Figure 3 The LED light source of comparative example 1 includes an aluminum substrate 11, a blue light chip 12, a thermal conductive column 13, and a fluorescent ceramic sheet 14.

[0138] Experimental example

[0139] (1) The spectrum of the LED light source test light source was obtained for the above-mentioned Example 1, Example 2 and Comparative Example 1.

[0140] The test method is as follows: place the light source with a heat sink in an integrating sphere, use the DC power of the integrating device to energize the light source, adjust the voltage and current according to the power of the light source, press the start button of the device after adjustment, wait for the test to be completed and automatically generate test data; get the color temperature value.

[0141] Test results see Figure 4 , Figure 8 and Figure 5 .

[0142] Figure 4 It is the light source spectrum diagram of Example 1; Figure 8 It is the light source spectrum diagram of Example 2; Figure 5 This is the spectrum of the light source of comparative example 1. The color temperature value of embodiment 1 is 6209k; the color temperature value of embodiment 2 is 6703k; the color temperature value of comparative example 1 is 6777k. It can be seen that the color temperature value of the solution of the present application is significantly reduced; the color temperature value of the solution of the present application is between 6209k and 6703k.

[0143] from Figure 4 , Figure 8 and Figure 5 It can be seen from the comparison that Example 1 ( Figure 4 )、Example 2( Figure 8 )Compare Figure 5 (Comparative Example 1) The spectrum diagram has an additional red peak, that is, compared with Comparative Example 1, the LED light source of Example 1 has more red light components, the color temperature of the light source is more correct, closer to warm white light, more comfortable to the human eye, and beneficial to the health of the human eye.

[0144] (2) The color coordinates, color tolerance and color temperature of the LED light source obtained in the above-mentioned Example 1 and Comparative Example 1 are tested:

[0145] The test method is as follows: The test results are obtained by using an integrating sphere test device, and the color coordinates and color tolerance are calculated according to the device's built-in algorithm.

[0146] Test results see Figure 6 and Figure 7 .

[0147] Figure 6 is the light source color tolerance diagram of Example 1; Figure 7 This is the light source color tolerance diagram of comparative example 1.

[0148] Figure 6 , Figure 7 The black cross in the middle is the relative color temperature standard coordinate point 0. According to the national standard, the color tolerance must be within the ellipse range, and the color tolerance value within the ellipse range is within 5SDCM; the closer the color tolerance value is to 0, the more positive the color. Figure 6 and Figure 7 It can be seen from the comparison that the color tolerance value of the LED light source of Example 1 is within the ellipse range, while the color tolerance value of the LED light source of Comparative Example 1 is not within the ellipse range. The color tolerance value of the LED light source of Example 1 is close to the standard coordinate point 0, indicating that the color of Example 1 is more correct.

[0149] Further, in combination with the above Figure 4-Figure 7 The comparison shows that:

[0150] Example 1 can effectively adjust the color coordinate area, and the color temperature is reduced from 6777k in comparative example 1 to 6209k~6703k. Figure 4 , Figure 5 The color coordinate tolerance is within the standard area, such as Figure 6 , Figure 7 shown.

[0151] By comparing the above-mentioned Example 1 with the comparative example 1, it can be seen that inserting a certain proportion of red light chips in series in the original blue light chip and replacing the red phosphor (such as 1113 nitride) with the red light emitted by the diode can effectively adjust the color coordinates and the color temperature of the light source; the color coordinates and color temperature can be adjusted by changing the number and position of the red light chips. In addition, the present application solution can solve the color drift problem caused by the failure of the existing phosphor because the red light chip emits light stably and will not cause color drift due to temperature; at the same time, the color of the LED light source will not drift during long-term use, and the temperature resistance is stronger. Therefore, the LED light source packaging method of the present application has broad application prospects in the field of adjustable color coordinate LED packaging.

[0152] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A light source packaging structure, characterized in that: include: light source substrate; Blu-ray chipset; The blue light chipset is adhered to the surface of the light source substrate and bound to the light source substrate; as well as A fluorescent ceramic sheet, the fluorescent ceramic sheet covers the blue light chipset; and the fluorescent ceramic sheet and the light source substrate encapsulate the blue light chipset; The blue light chipset includes a plurality of blue light chips and at least one red light chip, and the plurality of blue light chips and the at least one red light chip are connected in series.

2. The light source packaging structure according to claim 1, characterized in that: When the blue light chipset includes a plurality of groups, the operating voltage of each group of the blue light chipset is the same.

3. The light source packaging structure according to claim 1, characterized in that: When the blue light chipset includes a plurality of groups, the number of the red light chips in each group of the blue light chipset is the same.

4. The light source packaging structure according to any one of claims 1 to 3, characterized in that: When the blue light chipset includes a plurality of groups, the number of the blue light chips in each group of the blue light chipset is the same.

5. The light source packaging structure according to claim 4, characterized in that: Based on the total number of chips in the blue light chipset, the blue light chipset includes 80% to 90% blue light chips and 10% to 20% red light chips.

6. The light source packaging structure according to claim 4, characterized in that: The red light chips are evenly distributed in the blue light chipset.

7. The light source packaging structure according to claim 1, characterized in that: The fluorescent ceramic sheet is Ce:YAG fluorescent ceramic.

8. The light source packaging structure according to claim 1, characterized in that: There is a gap between the fluorescent ceramic sheet and the blue light chipset.

9. The light source packaging structure according to claim 1, characterized in that: The color temperature value of the light source packaging structure is lower than 6777K.

10. The light source packaging structure according to claim 1, characterized in that: The color tolerance value of the light source packaging structure is within 5SDCM.

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