Heat dissipation structure of LED lamp bead

Abstract

The utility model provides a heat dissipation structure of an LED lamp bead, which comprises a convex shell, a packaging cavity is arranged at the convex position of the convex shell, a negative electrode pin and a positive electrode pin are respectively packaged on two sides of the convex shell, a part of the negative electrode pin and a part of the positive electrode pin are arranged in the packaging cavity, and a part of the negative electrode pin and a part of the positive electrode pin are arranged below the outside of the convex shell. In the production process, the inverted-T-shaped shell, the heat dissipation capillary and the annular groove can be integrally formed, and therefore machining and manufacturing are convenient; and meanwhile, the heat dissipation capillary can be in full contact with air, so that the whole heat dissipation device has a better heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the field of LED lamp beads, and in particular to a heat dissipation structure of LED lamp beads. Background Art

[0002] The LED lamp is an electroluminescent semiconductor material chip, which is cured to the bracket with silver glue or white glue, and then connected to the chip and circuit board with silver wire or gold wire. It is sealed with epoxy resin on all sides to protect the internal core wire, and finally the outer shell is installed, so the LED lamp has good earthquake resistance.

[0003] After searching, a heat dissipation structure of an LED lamp bead disclosed in Chinese patent No. CN212511037U includes an LED lamp bead body and a light-transmitting cover, a circuit board and a heat dissipation device are arranged inside the LED lamp bead body, the circuit board is electrically connected to an external power supply, the circuit board is provided with an LED chip, 8 LED lamp beads, a positive pole of the circuit board and a negative pole of the circuit board, the circuit board is electrically connected to the LED chip, the LED lamp bead, the positive pole of the circuit board and the negative pole of the circuit board, a first heat dissipation hole is arranged on the outer wall of the LED lamp bead body, the heat dissipation device includes a heat dissipation support plate, 2 heat dissipation rings, 24 heat dissipation fins and a heat-conducting column, a second heat dissipation hole is arranged on the heat dissipation support plate, a heat dissipation device is arranged in the LED lamp, the heat generated during operation can be promptly diffused, the influence of temperature on the performance of the LED lamp is reduced, and the service life of the LED lamp is extended, and the structure of the entire heat dissipation device is simple, the cost is low, and it is convenient and quick to install, which is suitable for mass production.

[0004] However, the heat sink of the above technical solution is fixedly installed inside the LED lamp bead body, which is not convenient for integrated molding during the production process. At the same time, the heat sink cannot be fully in contact with the air, resulting in failure to quickly exchange heat with the air.

[0005] Therefore, it is very necessary to invent a heat dissipation structure of LED lamp beads. Utility Model Content

[0006] In order to solve the above technical problems, the utility model provides a heat dissipation structure of an LED lamp bead adopts a technical solution: a heat dissipation structure of an LED lamp bead, comprising a convex shell, wherein: a packaging cavity is provided at the convex part of the convex shell, and negative electrode pins and positive electrode pins are respectively packaged on both sides of the convex shell, and a part of the negative electrode pin and the positive electrode pin are located in the packaging cavity, and a part of them are located below the outside of the convex shell;

[0007] Preferably, a chip is fixedly installed in the packaging cavity, and the chip is electrically connected to the corresponding negative electrode pin and positive electrode pin through gold wires, and phosphor and packaging glue are encapsulated in the packaging cavity;

[0008] Preferably, a plurality of heat dissipation capillaries are evenly distributed on the bottom of the convex shell, and the heat dissipation capillaries are located between the negative electrode pin and the positive electrode pin.

[0009] Preferably, a positioning notch is provided on one side of the upper surface of the raised portion of the convex shell.

[0010] Preferably, a plurality of annular grooves are evenly distributed on the peripheral surface of the protrusion of the convex character shell.

[0011] Preferably, a heat dissipation support plate is fixedly installed in the convex shell, and the heat dissipation support plate is at the bottom of the packaging cavity; the chip is fixedly mounted on the heat dissipation support plate by thermal conductive adhesive; the negative electrode pin and the positive electrode pin are located in a part of the interior of the packaging cavity, and are fixedly connected to the heat dissipation support plate by thermal conductive adhesive.

[0012] Compared with the prior art, the advantages of the utility model are:

[0013] The overall arrangement of the utility model enables the convex shell, the heat dissipation capillary and the annular groove to be integrally formed during the production process, thereby facilitating production and manufacturing; at the same time, the heat dissipation capillary can be fully in contact with the air, so that the overall heat dissipation effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the internal structure of the packaging cavity of the utility model.

[0015] Figure 2 It is a schematic diagram of the bottom structure of the convex character shell of the utility model.

[0016] Figure 3 It is a schematic diagram of the overall structure of the utility model.

[0017] In the figure:

[0018] Embossed shell 1, packaging cavity 2, chip 3, negative electrode pin 4, positive electrode pin 5, gold wire 6, packaging glue 7, heat dissipation capillary 8, ring groove 9, positioning notch 10, heat dissipation support plate 11. DETAILED DESCRIPTION

[0019] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be described clearly and completely below. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0020] In the description of the embodiments, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0021] The utility model is further described below in conjunction with the accompanying drawings: Embodiment 1

[0022] Reference Figure 1-3 A heat dissipation structure of an LED lamp bead includes a convex shell 1, wherein: a packaging cavity 2 is arranged at the convex part of the convex shell 1, and the material of the packaging shell can be reduced by the arrangement of the convex shell 1, and a negative electrode pin 4 and a positive electrode pin 5 are respectively encapsulated on both sides of the convex shell 1, and a part of the negative electrode pin 4 and the positive electrode pin 5 are located in the packaging cavity 2, and a part of them are located outside and below the convex shell 1;

[0023] A chip 3 is fixedly installed in the packaging cavity 2, and the chip 3 is electrically connected to the corresponding negative electrode pin 4 and positive electrode pin 5 through a gold wire 6. The packaging cavity 2 is encapsulated with phosphor and packaging glue 7;

[0024] A plurality of heat dissipation capillaries 8 are evenly distributed on the bottom of the embossed shell 1. The arrangement of the heat dissipation capillaries 8 can not only reduce the overall material usage of the embossed shell 1, but also enable sufficient contact with the air to achieve better heat conduction and heat dissipation effects. The heat dissipation capillaries 8 are located between the negative electrode pin 4 and the positive electrode pin 5.

[0025] A positioning notch 10 is provided on one side of the upper surface of the raised portion of the convex housing 1 to facilitate positioning and installation.

[0026] A plurality of annular grooves 9 are evenly distributed on the circumferential surface of the raised part of the embossed shell 1. The provision of the annular grooves 9 can reduce the material used for the embossed shell 1 and increase the contact area between the embossed shell 1 and the air, so that the whole has better heat exchange capacity.

[0027] A heat dissipation support plate 11 is fixedly installed in the embossed shell 1. Through the setting of the heat dissipation support plate 11, the heat generated by the chip 3 and the negative pin 4 and the positive pin 5 during operation can be transferred to the embossed shell 1 and the heat dissipation capillary 8, and the heat dissipation support plate 11 is at the bottom of the packaging cavity 2; the chip 3 is fixedly installed on the heat dissipation support plate 11 by thermal conductive glue; a part of the negative pin 4 and the positive pin 5 inside the packaging cavity 2 is fixedly connected to the heat dissipation support plate 11 by thermal conductive glue.

[0028] Utilizing the technical solution described in the utility model, or those skilled in the art designing similar technical solutions inspired by the technical solution of the utility model to achieve the above-mentioned technical effects, all fall within the protection scope of the utility model.

Claims

1. A heat dissipation structure of an LED lamp bead, characterized in that: It comprises a convex shell (1), wherein: a packaging cavity (2) is provided at a convex portion of the convex shell (1), and negative electrode pins (4) and positive electrode pins (5) are respectively packaged on both sides of the convex shell (1), and a portion of the negative electrode pin (4) and the positive electrode pin (5) are located in the packaging cavity (2), and a portion of the negative electrode pin (4) and the positive electrode pin (5) are located outside and below the convex shell (1); A chip (3) is fixedly mounted in the packaging cavity (2), and the chip (3) is electrically connected to the corresponding negative electrode pin (4) and positive electrode pin (5) via a gold wire (6), and phosphor and packaging glue (7) are encapsulated in the packaging cavity (2); A plurality of heat dissipation capillaries (8) are evenly distributed on the bottom of the embossed housing (1), and the heat dissipation capillaries (8) are located between the negative electrode pin (4) and the positive electrode pin (5).

2. The heat dissipation structure of an LED lamp bead according to claim 1, characterized in that: A positioning notch (10) is provided on one side of the upper surface of the raised portion of the embossed housing (1).

3. The heat dissipation structure of an LED lamp bead as claimed in claim 2, characterized in that: A plurality of annular grooves (9) are evenly distributed on the circumferential surface of the raised portion of the embossed housing (1).

4. The heat dissipation structure of an LED lamp bead according to claim 1, characterized in that: A heat dissipation support plate (11) is fixedly mounted in the embossed housing (1), and the heat dissipation support plate (11) is located at the bottom of the packaging cavity (2); the chip (3) is fixedly mounted on the heat dissipation support plate (11) via thermal conductive adhesive; the negative electrode pin (4) and the positive electrode pin (5) are located in a part of the packaging cavity (2), and are fixedly connected to the heat dissipation support plate (11) via the thermal conductive adhesive.

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