Wafer photoetching device
By designing a transparent lithography stage and setting up a microscope observation, the problems of dislocation and cumbersome debugging in existing lithography technologies are solved, and the synchronous operation of lithography and observation is achieved, improving the convenience and accuracy of use.
Patent Information
- Application Number
- CN202420631592.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-03-29
AI Technical Summary
In the existing semiconductor lithography technology, the alignment points of the laser head and microscope are easily misaligned, and require manual debugging to adjust, and the alignment lines need to be drawn before lithography, which is cumbersome.
A transparent lithography stage is designed, with the lithography laser head arranged on the upper part of the lithography stage, and the microscope is arranged on the lower part of the lithography stage, and the movement and adjustment of the lithography stage are realized through the moving mechanism. The microscope can observe the wafer through the lithography stage.
The photolithography and observation are implemented simultaneously, eliminating the steps of characterizing bit lines, reducing the frequency of manual debugging, and improving the convenience and accuracy of use.
Smart Images
Figure CN222762380U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer photolithography device. Background Art
[0002] Photolithography is a common method in the processing of semiconductor components. In the prior art, semiconductor photolithography is performed by observing the surface of the wafer through a microscope at one side of the photolithography position while the wafer is processed by laser. However, both the laser head and the microscope head are located on the upper part of the wafer, which requires drawing alignment lines on the product before photolithography and then performing photolithography. In addition, there is a misalignment between the alignment points of the microscope and the laser head, which often requires manual adjustment. However, this requires frequent debugging to eliminate the deviation, which is very troublesome. Utility Model Content
[0003] In view of the above problems, the purpose of the utility model is to provide a wafer lithography device which is easy to use.
[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is as follows: a chip lithography device, comprising a lithography table, a lithography laser head is provided above the lithography table, the lithography table is arranged on a moving mechanism, and a microscope lens is provided below, and the lithography table is made of transparent material.
[0005] In the above technical solution, the material of the photolithography table is quartz, and the microscope lens can observe the wafer on the upper part of the photolithography table through the photolithography table.
[0006] In the above technical solution, a main exhaust hole is provided in the middle of the photolithography table, and a plurality of exhaust branch holes are provided on the main exhaust hole, and the exhaust branch holes are communicated with the upper surface of the photolithography table.
[0007] In the above technical solution, the moving mechanism includes a transverse moving component and a longitudinal moving component for driving the photolithography stage to move.
[0008] In the above technical solution, a base is provided at the lower part of the photolithography table, and the microscope head extends into the base.
[0009] To sum up, the technical solution of the utility model has the following beneficial effects compared with traditional technical means: the utility model sets a transparent photolithography table, the photolithography laser head is set on the upper part of the photolithography table, the microscope lens is set on the lower part of the photolithography table and can observe the wafer on the transparent photolithography table, so that the photolithography can be observed at the same time, eliminating the process of drawing alignment lines, and the alignment is carried out at all times, no errors will be generated, and regular manual debugging is not required, which is more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The foregoing and other objects, features and advantages of the present invention will become apparent from the following detailed description in conjunction with the accompanying drawings.
[0011] Figure 1 This is a schematic diagram of the main structure of the utility model;
[0012] Figure 2 It is a schematic diagram of the main view of the photolithography table in the utility model;
[0013] Figure 3 The schematic cross-sectional view of the photolithography platform in the utility model is
[0014] Figure 4 is a schematic diagram of a main view of a wafer;
[0015] The numbers are as follows: 100, photolithography table; 110, main exhaust hole; 120, exhaust branch hole; 130, base; 200, photolithography laser head; 300, moving mechanism; 400, microscope lens; 500, wafer. DETAILED DESCRIPTION
[0016] The following is an ideal embodiment of the utility model. Through the following description, relevant staff can make various changes and modifications without departing from the technical concept of the utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.
[0017] The utility model is further described with reference to the following drawings:
[0018] like Figures 1 to 3 As shown, a wafer lithography device has a lithography stage 100. A lithography laser head 200 is disposed above the lithography stage 100. The lithography stage 100 is arranged on a moving mechanism 300 and a microscope head 400 is disposed below the lithography stage 100. The lithography stage 100 is made of transparent material.
[0019] The photolithography stage 100 is made of quartz, and the microscope lens 400 can observe the wafer 500 on the top of the photolithography stage 100 through the photolithography stage 100 .
[0020] like Figure 2 , 3 As shown, a main exhaust hole 110 is provided in the middle of the photolithography table 100, and a plurality of exhaust branch holes 120 are provided on the main exhaust hole 110. The exhaust branch holes 120 are communicated with the upper surface of the photolithography table 100, and the wafer 500 is adsorbed by exhausting air to prevent the wafer 500 from shifting during movement.
[0021] like Figure 1As shown, the moving mechanism 300 includes a transverse moving component and a longitudinal moving component for driving the photolithography stage 100 to move.
[0022] like Figure 1 As shown, a base 130 is provided at the lower part of the photolithography platform 100 , and the microscope head 400 extends into the base 130 .
[0023] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A wafer lithography apparatus, characterized in that: A photolithography table is provided, a photolithography laser head is arranged above the photolithography table, the photolithography table is arranged on a moving mechanism, and a microscope lens is arranged below the photolithography table. The photolithography table is made of transparent material, a main exhaust hole is arranged in the middle of the photolithography table, a plurality of exhaust branch holes are arranged on the main exhaust hole, and the exhaust branch holes are communicated with the upper surface of the photolithography table.
2. The wafer lithography apparatus according to claim 1, characterized in that: The material of the photolithography table is quartz, and the microscope lens can observe the wafer on the upper part of the photolithography table through the photolithography table.
3. The wafer lithography apparatus according to claim 1, characterized in that: The moving mechanism comprises a transverse moving assembly and a longitudinal moving assembly for driving the photolithography stage to move.
4. The wafer lithography apparatus according to claim 1, wherein: A base is provided at the lower part of the photolithography platform, and the microscope head extends into the base.