Capacitance compensation fling-cut switch using graphene for heat dissipation

Abstract

The utility model relates to a capacitance compensation fling-cut switch using graphene for heat dissipation, and belongs to the technical field of capacitance compensation fling-cut switches, the capacitance compensation fling-cut switch comprises a heat dissipation base, the heat dissipation base comprises a mounting top plate, a connecting support and mounting feet which are sequentially arranged from top to bottom, and the connecting support is provided with a cooling fin assembly; the silicon controlled rectifier module is arranged on the upper end surface of the mounting top plate; the control module is arranged on one side of the heat dissipation base and electrically connected with the silicon controlled rectifier module; and the graphene coating is arranged on the outer surface of the cooling fin assembly. The graphene coating is arranged on the outer surface of the cooling fin assembly, the heat conduction coefficient of graphene is high, and the heat radiation speed of the cooling fin assembly can be increased, so that the heat dissipation performance is further improved.

Description

Technical Field

[0001] The present application relates to the field of capacitor compensation switching switches, and in particular to a capacitor compensation switching switch using graphene for heat dissipation. Background Art

[0002] The application range of capacitor compensation switching switch is very wide. For example, it can be used in low-voltage reactive power compensation devices to quickly switch low-voltage parallel capacitors through zero crossing, which can achieve no inrush current, no sparks, and no noise during operation. The existing capacitor compensation switching switch includes a heat sink, a thyristor module, and three sets of trigger modules. Since the thyristor module and the trigger module are both installed on the mounting plate of the heat sink, there are many parts installed on the mounting plate of the heat sink, which makes it inconvenient to install, occupies a large space, has poor heat dissipation effect, and is prone to overheating and damage of the thyristor. Utility Model Content

[0003] In order to further improve the heat dissipation performance, the present application provides a capacitor compensation switching switch using graphene for heat dissipation.

[0004] The present application provides a capacitor compensation switching switch using graphene heat dissipation, which adopts the following technical solution:

[0005] A capacitor compensation switching switch using graphene heat dissipation, comprising:

[0006] A heat dissipation base, the heat dissipation base comprising a mounting top plate, a connecting bracket and a mounting foot arranged in sequence from top to bottom, and a heat sink assembly is arranged on the connecting bracket;

[0007] A thyristor module is arranged on the upper end surface of the mounting top plate;

[0008] A control module is disposed on one side of the heat dissipation base and is electrically connected to the thyristor module;

[0009] The graphene coating is arranged on the outer surface of the heat sink assembly.

[0010] By adopting the above technical solution, only the thyristor module is installed on the upper end surface of the top plate, with fewer installation parts and convenient installation; and the heat generated by the thyristor module when working is dissipated through the heat sink assembly, reducing the possibility of overheating and damage of the thyristor module; in addition, through the graphene coating arranged on the outer surface of the heat sink assembly, the thermal conductivity coefficient of the graphene is relatively high, and the heat radiation speed of the heat sink assembly can be increased, thereby further improving the heat dissipation performance of the capacitor compensation switching switch.

[0011] Optionally, the heat sink assembly includes heat sink side fins and a heat sink bottom fin, the heat sink side fins are symmetrically arranged on both side walls of the connecting bracket, and the heat sink bottom fin is arranged on the lower side of the connecting bracket.

[0012] By adopting the above technical solution, the heat dissipation base can dissipate heat on three sides simultaneously through the heat dissipation side plates and the heat dissipation bottom plate on both sides, thereby ensuring that the heat dissipation base has good heat dissipation performance.

[0013] Optionally, the connecting bracket is provided with heat dissipation holes penetrating through both ends of the connecting bracket.

[0014] By adopting the above technical solution, the base material of the heat dissipation base can be saved and the production cost can be reduced. At the same time, the gas flow in the heat dissipation through hole can easily take away the heat on the connecting bracket, thereby further improving the heat dissipation effect.

[0015] Optionally, an exhaust and heat dissipation fan is provided at one end of the connecting bracket.

[0016] By adopting the above technical solution and starting the exhaust cooling fan, the efficiency of high temperature gas being discharged from the heat sink assembly and the heat dissipation through holes can be accelerated, thereby improving the heat dissipation efficiency.

[0017] Optionally, an induced air cooling fan is provided at one end of the connecting bracket away from the exhaust cooling fan.

[0018] By adopting the above technical solution and starting the induced draft cooling fan, it is convenient to introduce the external cold air flow into the heat sink components and the heat dissipation holes, thereby improving the cooling efficiency and thus improving the heat dissipation efficiency.

[0019] Optionally, the control module includes a circuit board and an outer shell, the output end of the circuit board is electrically connected to the control end of the thyristor module, the circuit board is installed in the outer shell, the side of the mounting top plate close to the outer shell is provided with a first convex groove, the side of the mounting foot close to the outer shell is provided with a second convex groove, and the outer shell is fixed to the heat dissipation base by fasteners provided in the first convex groove and the second convex groove.

[0020] By adopting the above technical solution, the outer shell and the circuit board are installed on the side of the heat dissipation base and separated from the thyristor module to avoid interference with the heat dissipation of the thyristor module. The outer shell can protect the circuit board and has the effect of dust and moisture proof.

[0021] Optionally, a thermal conductive silicone grease layer is provided on a side of the mounting top plate close to the thyristor module.

[0022] By adopting the above technical solution, the thermal grease layer fills the gap between the thyristor module and the mounting top plate, thereby increasing the effective heat dissipation area of ​​the thyristor module, further improving the heat dissipation effect, and ensuring the stable operation of the thyristor module.

[0023] Optionally, heat dissipation ribs are provided on the heat dissipation side plates and the heat dissipation bottom plate.

[0024] By adopting the above technical solution, the cross-sectional areas of the heat dissipation side fins and the heat dissipation bottom fins are increased through the heat dissipation ribs, thereby increasing the heat dissipation area of ​​the heat dissipation fin assembly and improving the heat dissipation effect.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. Through the setting of the heat sink assembly and the graphene coating, the heat generated by the thyristor module when working is dissipated through the heat sink assembly, reducing the possibility of overheating and damage to the thyristor module; in addition, through the graphene coating set on the outer surface of the heat sink assembly, the thermal conductivity of the graphene is relatively high, and the heat radiation speed of the heat sink assembly can be increased, thereby further improving the heat dissipation performance of the capacitor compensation switching switch.

[0027] 2. By setting up the exhaust cooling fan and starting the exhaust cooling fan, the efficiency of high temperature gas being discharged from the heat sink assembly and the heat dissipation through-holes can be accelerated, thereby improving the heat dissipation efficiency.

[0028] 3. By setting up the induced draft cooling fan and starting the induced draft cooling fan, it is convenient to introduce the external cold air flow into the heat sink components and the heat dissipation through holes, thereby improving the cooling efficiency and thus improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a cross-sectional view showing the overall structure of the first embodiment of the present application.

[0030] Figure 2 It is a schematic diagram of the structure of the thyristor module in the first embodiment of the present application.

[0031] Figure 3 It is a schematic diagram of the structure of the exhaust cooling fan and the induced cooling fan in the second embodiment of the present application.

[0032] Figure 4 It is a schematic diagram of the structure of the heat dissipation ribs in the third embodiment of the present application.

[0033] Explanation of the reference numerals: 1. thyristor module; 2. heat dissipation base; 21. mounting top plate; 211. thermal grease layer; 212. first convex groove; 22. connecting bracket; 221. heat dissipation through hole; 23. mounting foot; 231. second convex groove; 3. heat sink assembly; 31. heat dissipation side plate; 32. heat dissipation bottom plate; 4. control module; 41. circuit board; 42. outer shell; 5. fastener; 6. exhaust cooling fan; 7. induced draft cooling fan; 8. heat dissipation ribs; 9. graphene coating. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-4 , further details of this application are given.

[0035] Embodiment 1:

[0036] Embodiment 1 of the present application discloses a capacitor compensation switching switch using graphene heat dissipation. Figure 1 and Figure 2 A capacitor compensation switching switch using graphene heat dissipation includes a thyristor module 1 and a heat dissipation base 2. The heat dissipation base 2 includes a mounting top plate 21, a connecting bracket 22 and a mounting foot 23 formed integrally from top to bottom. The thyristor module 1 is mounted on the upper end surface of the heat dissipation base 2. A heat sink assembly 3 is provided on the connecting bracket 22, and a graphene coating 9 is coated on the outer surface of the heat sink assembly 3. The thyristor module 1 is electrically connected to a control module 4, which is arranged on one side of the heat dissipation base 2. In this way, the upper end surface of the mounting top plate 21 is only equipped with the thyristor module 1, with fewer mounting parts and convenient installation.

[0037] During the operation of the capacitor compensation switching switch, the heat generated by the thyristor module 1 is dissipated through the heat sink assembly 3, reducing the possibility of overheating and damage to the thyristor module 1; in addition, through the graphene coating 9 arranged on the outer surface of the heat sink assembly 3, the thermal conductivity of the graphene is relatively high, and the heat radiation speed of the heat sink assembly 3 can be increased, thereby further improving the heat dissipation performance of the capacitor compensation switching switch.

[0038] Reference Figure 1 A thermal grease layer 211 is coated on one side of the mounting top plate 21 close to the thyristor module 1. The thermal grease layer 211 fills the gap between the thyristor module 1 and the mounting top plate 21. The thermal grease layer 211 has good thermal conductivity, which facilitates the heat generated by the thyristor module 1 to be transferred to the mounting top plate 21, thereby increasing the effective heat dissipation area of ​​the thyristor module 1, further improving the heat dissipation effect, and ensuring the stable operation of the thyristor module 1.

[0039] Reference Figure 1 The heat sink assembly 3 includes heat sink side pieces 31 and heat sink bottom pieces 32. The heat sink side pieces 31 are symmetrically fixed to the side walls of the connecting bracket 22 and are arranged along the length direction of the connecting bracket 22. The heat sink bottom piece 32 is fixed to the lower side of the connecting bracket 22 and is arranged along the vertical direction. Through the heat sink side pieces 31 and the heat sink bottom piece 32 on both sides, the heat sink base 2 dissipates heat on three sides at the same time, ensuring that the heat sink base 2 has good heat dissipation performance.

[0040] Reference Figure 1 The middle part of the connecting bracket 22 is provided with a heat dissipation through hole 221 penetrating through both ends of the connecting bracket 22 along its length direction. In the first embodiment, the heat dissipation through hole 221 is waist-shaped. In this way, the base material of the heat dissipation base 2 can be saved and the production cost can be reduced. At the same time, the gas in the heat dissipation through hole 221 can be easily taken away from the heat on the connecting bracket 22, thereby further improving the heat dissipation effect.

[0041] Reference Figure 1 The control module 4 includes a circuit board 41 and an outer shell 42. The output end of the circuit board 41 is electrically connected to the control end of the thyristor module 1, and the circuit board 41 is installed in the outer shell 42. A first convex groove 212 is provided on the side of the mounting top plate 21 close to the outer shell 42, and a second convex groove 231 is provided on the side of the mounting foot 23 close to the outer shell 42. The outer shell 42 is fixed to the heat dissipation base 2 by fasteners 5 installed in the first convex groove 212 and the second convex groove 231. In this way, the outer shell 42 and the circuit board 41 are installed on the side of the heat dissipation base 2, separated from the thyristor module 1, to avoid interference with the heat dissipation of the thyristor module 1, and the outer shell 42 can protect the circuit board 41, and has the effect of dustproof and moisture-proof.

[0042] Embodiment 2:

[0043] Embodiment 2 of the present application discloses a capacitor compensation switching switch using graphene heat dissipation. Figure 1 and Figure 3 , the difference between the second embodiment and the first embodiment is that: an exhaust cooling fan 6 is installed on one side of the connecting bracket 22, and the exhaust cooling fan 6 covers one end of the cooling side plate 31, the cooling bottom plate 32 and the cooling through hole 221; an induced draft cooling fan 7 is installed on the end of the connecting bracket 22 away from the exhaust cooling fan 6, and the induced draft cooling fan 7 covers the other end of the cooling side plate 31, the cooling bottom plate 32 and the cooling through hole 221. When the operating temperature of the thyristor module 1 is too high, starting the exhaust cooling fan 6 can speed up the efficiency of high-temperature gas being discharged from the heat sink assembly 3 and the heat dissipation through hole 221, thereby improving the heat dissipation efficiency; starting the induced draft cooling fan 7 facilitates the introduction of external cold airflow between the heat sink assembly 3 and the heat dissipation through hole 221, thereby improving the cooling efficiency and thus improving the heat dissipation efficiency.

[0044] Embodiment three:

[0045] Embodiment 2 of the present application discloses a capacitor compensation switching switch using graphene heat dissipation. Figure 1 and Figure 4 The difference between the second embodiment and the first embodiment is that heat dissipation ribs 8 are uniformly and integrally formed on both sides of the heat dissipation side plate 31 and the heat dissipation bottom plate 32, and the cross-sectional areas of the heat dissipation side plate 31 and the heat dissipation bottom plate 32 are increased by the heat dissipation ribs 8, thereby increasing the heat dissipation area of ​​the heat dissipation fin assembly 3 and improving the heat dissipation effect.

[0046] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A capacitor compensation switching switch using graphene heat dissipation, characterized in that: include: A heat dissipation base (2), the heat dissipation base (2) comprising a mounting top plate (21), a connecting bracket (22) and a mounting foot (23) which are arranged in sequence from top to bottom, and a heat sink assembly (3) is provided on the connecting bracket (22); A thyristor module (1) is arranged on the upper end surface of the mounting top plate (21); A control module (4) is arranged on one side of the heat dissipation base (2) and is electrically connected to the thyristor module (1); A graphene coating (9) is provided on the outer surface of the heat sink assembly (3); The connecting bracket (22) is provided with a heat dissipation through hole (221) penetrating through both ends of the connecting bracket (22); an exhaust heat dissipation fan (6) is provided at one end of the connecting bracket (22), and the exhaust heat dissipation fan (6) covers one end of the heat dissipation through hole (221); an induced air heat dissipation fan (7) is provided at one end of the connecting bracket (22) away from the exhaust heat dissipation fan (6), and the induced air heat dissipation fan (7) covers the other end of the heat dissipation through hole (221).

2. A capacitor compensation switching switch using graphene heat dissipation according to claim 1, characterized in that: The heat sink assembly (3) comprises heat sink side fins (31) and a heat sink bottom fin (32); the heat sink side fins (31) are symmetrically arranged on two side walls of the connecting bracket (22); and the heat sink bottom fin (32) is arranged on the lower side of the connecting bracket (22).

3. The capacitor compensation switching switch using graphene heat dissipation according to claim 1, characterized in that: The control module (4) comprises a circuit board (41) and an outer shell (42); the output end of the circuit board (41) is electrically connected to the control end of the thyristor module (1); the circuit board (41) is installed in the outer shell (42); a first convex groove (212) is provided on a side of the mounting top plate (21) close to the outer shell (42); a second convex groove (231) is provided on a side of the mounting foot (23) close to the outer shell (42); and the outer shell (42) is fixed to the heat dissipation base (2) by fasteners (5) provided in the first convex groove (212) and the second convex groove (231).

4. The capacitor compensation switching switch using graphene heat dissipation according to claim 1, characterized in that: A thermal conductive silicone grease layer (211) is provided on one side of the mounting top plate (21) close to the thyristor module (1).

5. The capacitor compensation switching switch using graphene heat dissipation according to claim 2, characterized in that: The heat dissipation side plates (31) and the heat dissipation bottom plate (32) are provided with heat dissipation ribs (8).

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