Inverter

Abstract

The utility model relates to an inverter. The inverter comprises a main box body, an integrated circuit board and a passive discharge circuit assembly, the integrated circuit board is arranged on the main box body, a control circuit, a driving circuit, a current detection circuit and a low-voltage connector are arranged on the integrated circuit board, and the passive discharge circuit assembly is arranged on the main box body. According to the inverter disclosed by the embodiment of the invention, a high-integration arrangement scheme is formed, hardware function integration and software capability expansion are included, a control circuit, a driving circuit, a current detection circuit and a low-voltage connector are integrally integrated on an integrated circuit board, and a passive discharge circuit assembly is independently arranged on a main box body; the arrangement area and the heat dissipation requirement of the integrated circuit board can be reduced, the integrated circuit board and the passive discharge circuit assembly can be conveniently and independently cooled, and the effects of miniaturization, high integration and high heat dissipation capacity are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of inverters, and in particular to inverters. Background Art

[0002] With the rapid development of new energy vehicles, the requirements for vehicle power, torque, and handling are becoming higher and higher, and the layout requirements for electric drives are becoming more and more diversified. However, the differentiated requirements will lead to a large number of matching inverter models, which is not conducive to management and control, and it is difficult to form scale advantages to further reduce costs. Therefore, it is necessary to miniaturize the inverter and design it with high integration, so that one inverter can cope with multiple layout positions. In addition, the inverter generates a lot of heat when working, and the heat dissipation capacity is poor, which can cause the equipment to fail to work properly in severe cases. Summary of the invention

[0003] Based on this, it is necessary to provide a miniaturized, highly integrated inverter with high heat dissipation capacity to address the above problems.

[0004] An embodiment of the present application provides an inverter, comprising:

[0005] main box;

[0006] An integrated circuit board, the integrated circuit board is arranged on the main box body, and a control circuit, a drive circuit, a current detection circuit and a low-voltage connector are arranged on the integrated circuit board; and

[0007] A passive discharge circuit component is arranged on the main box body.

[0008] In one embodiment, the passive discharge circuit assembly includes an onboard discharge circuit board and a discharge resistor disposed on the onboard discharge circuit board.

[0009] In one embodiment, the inverter further includes:

[0010] A first heat sink is disposed between the onboard discharge circuit board and the main box.

[0011] In one embodiment, the first heat sink is configured as a heat dissipation adhesive or a heat dissipation pad.

[0012] In one embodiment, the inverter further includes:

[0013] A filter capacitor assembly is arranged on the main box, and the filter capacitor assembly includes a bus capacitor and a filter.

[0014] In one of the embodiments, the filter comprises a magnetic ring;

[0015] The bus capacitor comprises a capacitor core, a DC input terminal and a DC output terminal. The DC input terminal passes through the magnetic ring from the middle position of the capacitor core and is connected to the capacitor core.

[0016] In one of the embodiments, the filter capacitor assembly includes a housing, the housing is provided with an installation cavity, and the bus capacitor and the filter are installed in the installation cavity.

[0017] In one embodiment, the housing is provided with a first connection hole, and the first connection hole connects the interior of the housing with the exterior of the housing;

[0018] The discharge resistor comprises a discharge resistor connecting terminal, one end of which is connected to the discharge circuit board, and the other end of which passes through the first connecting hole and is connected to the bus capacitor.

[0019] In one of the embodiments, the inverter further includes:

[0020] A power module, wherein the power module is disposed on the main box and connected to the bus capacitor;

[0021] An AC busbar, which is disposed on the main box and connected to the power module;

[0022] A current sensor magnetic core, wherein the current sensor magnetic core is integrated on the AC busbar;

[0023] A high voltage connector is arranged on the main box body and is connected to the filter capacitor assembly.

[0024] In one embodiment, the inverter further includes:

[0025] A second heat sink, wherein a first heat sink and a second heat sink are respectively provided on two sides of the second heat sink, the power module is provided on the first heat sink, and the filter capacitor assembly is provided on the second heat sink.

[0026] According to the inverter of the embodiment of the present application, a highly integrated layout scheme is formed, which includes hardware function integration and software capability expansion, and the control circuit, drive circuit, current detection circuit, and low-voltage connector are integrated on the integrated circuit board. The passive discharge circuit component is separately arranged on the main box body, which can reduce the layout area of ​​the integrated circuit board and the heat dissipation requirements, and facilitate the separate heat dissipation of the integrated circuit board and the passive discharge circuit component, thereby achieving the effect of miniaturization, high integration and high heat dissipation capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a cross-sectional view of an inverter according to an embodiment of the present application.

[0028] Figure 2 An exploded diagram of an inverter according to an embodiment of the present application.

[0029] Figure 3 The figure is a schematic diagram of the structure of a bus capacitor and a filter in an inverter according to an embodiment of the present application.

[0030] Figure 4 Schematic diagram of the structure of a filter capacitor assembly in an inverter according to an embodiment of the present application.

[0031] Figure 5 It is a schematic structural diagram of a second connection hole in an inverter according to an embodiment of the present application.

[0032] Figure 6 The figure is a schematic diagram of the structure of a high-voltage connector in an inverter according to an embodiment of the present application.

[0033] Reference numerals:

[0034] 1. Main box; 11. Upper box; 12. Middle box; 121. Cooling port; 122. Second connecting hole; 13. Lower box;

[0035] 2. Integrated circuit board; 21. Low voltage connector;

[0036] 3. Passive discharge circuit assembly; 31. Discharge resistor connection terminal;

[0037] 4. Current sensor core;

[0038] 5. filter capacitor assembly; 51. bus capacitor; 511. capacitor core; 512. DC input terminal; 513. DC output terminal; 52. filter; 521. magnetic ring; 53. housing; 531. mounting cavity; 532. first connection hole;

[0039] 6. Power module;

[0040] 7. High voltage connectors;

[0041] 8. Second heat sink; 81. Cooling channel; 82. Heat sink.

[0042] 9. AC busbar. DETAILED DESCRIPTION

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0044] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0045] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0047] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0048] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0049] See also Figure 1 and Figure 2 , Figure 1 It is a cross-sectional view of an inverter according to an embodiment of the present application. Figure 2 1 is an exploded view of an inverter according to an embodiment of the present application. At least one embodiment of the present application provides an inverter, which includes a main box 1, an integrated circuit board 2, and a passive discharge circuit assembly 3. The integrated circuit board 2 is arranged on the main box 1, and a control circuit, a drive circuit, a current detection circuit, and a low-voltage connector 21 are arranged on the integrated circuit board 2. The passive discharge circuit assembly 3 is arranged on the main box 1.

[0050] According to the inverter of the embodiment of the present application, a highly integrated layout scheme is formed, which includes hardware function integration and software capability expansion, and the control circuit, drive circuit, current detection circuit, and low-voltage connector 21 are integrated on the integrated circuit board 2. The passive discharge circuit component 3 is separately arranged on the main box 1, which can reduce the layout area and heat dissipation requirements of the integrated circuit board 2, and facilitate the independent heat dissipation of the integrated circuit board 2 and the passive discharge circuit component 3, thereby achieving the effect of miniaturization, high integration and high heat dissipation capability.

[0051] In some embodiments, the passive discharge circuit assembly 3 includes an onboard discharge circuit board and a discharge resistor disposed on the onboard discharge circuit board. The passive discharge circuit adopts an onboard discharge resistor solution and is separately arranged in the main box 1 of the inverter.

[0052] In some embodiments, the inverter further includes a first heat sink, which is disposed between the onboard discharge circuit board and the main box 1. The passive discharge circuit assembly 3 is separately cooled by the first heat sink, so that the heat of the discharge circuit board can be quickly transferred to the main box 1 through the first heat sink, thereby improving the heat dissipation capacity of the inverter.

[0053] In some embodiments, the first heat sink is configured as heat sink glue or heat sink pad. Heat sink glue and heat sink pad have good thermal conductivity and heat dissipation capabilities. A first heat sink constructed of heat sink glue or heat sink pad is placed between the onboard discharge circuit board and the main box 1 to quickly dissipate the heat of the discharge resistor.

[0054] See also Figure 2In some embodiments, the main box 1 includes an upper box 11, a middle box 12 and a lower box 13, and the main box 1, the middle box 12 and the lower box 13 enclose a main space for constructing the inverter.

[0055] See also Figure 3 and Figure 4 , Figure 3 It is a schematic diagram of the structure of a bus capacitor 51 and a filter 52 in an inverter according to an embodiment of the present application. Figure 4 The schematic diagram of the structure of the filter capacitor assembly 5 in the inverter of an embodiment of the present application. In some embodiments, the inverter also includes a filter capacitor assembly 5, which is arranged on the main box 1, and the filter capacitor assembly 5 includes a bus capacitor 51 and a filter 52. The magnetic ring 521 and the Y capacitor included in the filter 52 in the prior art are relatively independent in packaging relative to other capacitors electrically connected thereto, and generally require a separate shielding treatment for the filter 52, which leads to a complex structural design and assembly process of the entire device. In addition, due to the relatively independent packaging of the magnetic ring 521 and the Y capacitor, a certain assembly gap needs to be reserved, resulting in an increase in the volume of the inverter brick, affecting the overall power density, and complex assembly and connection will also lead to a decrease in shielding performance. In the embodiment of the present application, the bus capacitor 51 and the filter 52 are integrated to form a filter capacitor assembly 5, and under the premise of ensuring high electromagnetic compatibility, the integration of the highly integrated inverter brick is further improved, the number of samples is reduced, and the length of the copper bar connecting the filter 52 and the bus capacitor 51 is reduced.

[0056] In some embodiments, the filter 52 includes a magnetic ring 521. The bus capacitor 51 includes a capacitor core 511, a DC input terminal 512 and a DC output terminal 513. The DC input terminal 512 passes through the magnetic ring 521 from the middle position of the capacitor core 511 and is connected to the capacitor core 511. Through the above configuration, the current loop area is reduced as much as possible, and the generation of electromagnetic interference is reduced.

[0057] In some embodiments, the filter capacitor assembly 5 includes a housing 53 , the housing 53 is provided with an installation cavity 531 , and the bus capacitor 51 and the filter 52 are installed in the installation cavity 531 .

[0058] See also Figure 4 and Figure 5 , Figure 5This is a schematic diagram of the structure of the second connection hole 122 in the inverter of one embodiment of the present application. In some embodiments, the housing 53 is provided with a first connection hole 532, and the first connection hole 532 connects the inside of the housing 53 with the outside of the housing 53. The discharge resistor includes a discharge resistor connection terminal 31, one end of the discharge resistor connection terminal 31 is connected to the on-board discharge circuit board, and the other end is connected to the bus capacitor 51 through the connection hole. Specifically, the discharge resistor DC terminal is integrated with the bus capacitor 51, and the discharge resistor connection terminal 31 is welded through the shell and connected to the on-board discharge circuit board. A second connection hole 122 for the discharge resistor connection terminal 31 to pass through is also provided on the middle box 12.

[0059] See also Figure 1 and Figure 2 In some embodiments, the inverter further includes a power module 6, an AC busbar 9 and a current sensor core 4. The power module 6 is disposed on the main box 1, the power module 6 is connected to the bus capacitor 51, the AC busbar 9 is disposed on the main box 1 and connected to the power module 6, and the current sensor core 4 is integrated on the AC busbar 9. The current sensor core 4 is integrated with the AC busbar 9 to realize wireless connection inside the highly integrated inverter brick, which is convenient for automated assembly.

[0060] See also Figure 6 , Figure 6 This is a schematic diagram of the structure of the high-voltage connector 7 in the inverter of one embodiment of the present application. In some embodiments, the inverter further includes a high-voltage connector 7, which is disposed on the main box 1 and connected to the filter capacitor assembly 5 to improve the integration of the high-integration inverter brick.

[0061] In some embodiments, the inverter further includes a second heat sink 8 , a first heat sink surface and a second heat sink surface are respectively disposed on both sides of the second heat sink 8 , the power module 6 is disposed on the first heat sink surface, and the filter capacitor assembly 5 is disposed on the second heat sink surface.

[0062] See also Figure 1 and Figure 2 In some embodiments, the second heat sink 8 is provided with a cooling channel 81, and a cooling medium is provided in the cooling channel 81. The first heat sink surface and the second heat sink surface are respectively provided on both sides of the second heat sink 8. Specifically, a cooling port 121 connected to the cooling channel 81 is provided on the middle box body 12 of the main box body 1 for the circulation of the cooling medium. The first heat sink surface is on the upper surface of the second heat sink 8, and the second heat sink surface is on the lower surface of the second heat sink 8, so that the power module 6 and the filter capacitor assembly 5 are respectively placed on the upper and lower sides of the second heat sink 8.

[0063] See also Figure 1 and Figure 4In some embodiments, a heat sink 82 is provided between the filter capacitor assembly 5 and the second heat sink surface. The heat sink 82 can be a heat sink metal plate with high thermal conductivity.

[0064] Since most of the current mass-produced capacitor cores 511 are only resistant to temperatures of 105°C, an efficient heat dissipation solution can optimize the capacitor design, reduce the capacitance redundancy, and further reduce the capacitor volume. The heat dissipation component of this application adopts an efficient cooling channel 81 utilization heat dissipation design. The filter capacitor component 5 is arranged opposite to the power module 6, and a heat dissipation metal plate is arranged on one side of the filter capacitor component 5 to achieve efficient heat dissipation of the power module 6, capacitor, and filter component by the cooling water channel. The other side is in contact with the bottom cover of the inverter brick through heat dissipation glue or heat dissipation pads, and heat is transferred through the bottom cover to further reduce the heat of the capacitor and filter components, ensuring efficient operation of the inverter brick.

[0065] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An inverter, characterized in that: include: Main box(1); An integrated circuit board (2), the integrated circuit board (2) being arranged on the main housing (1), and the integrated circuit board (2) being provided with a control circuit, a drive circuit, a current detection circuit and a low-voltage connector (21); as well as A passive discharge circuit component (3), wherein the passive discharge circuit component (3) is arranged on the main box body (1).

2. The inverter according to claim 1, characterized in that: The passive discharge circuit component (3) comprises an onboard discharge circuit board and a discharge resistor arranged on the onboard discharge circuit board.

3. The inverter according to claim 2, characterized in that: The inverter further comprises: A first heat sink is arranged between the onboard discharge circuit board and the main box (1).

4. The inverter according to claim 3, characterized in that: The first heat sink is configured as heat dissipation glue or a heat dissipation pad.

5. The inverter according to claim 2, characterized in that: The inverter further comprises: A filter capacitor assembly (5), wherein the filter capacitor assembly (5) is arranged on the main box (1), and the filter capacitor assembly (5) comprises a bus capacitor (51) and a filter (52).

6. The inverter according to claim 5, characterized in that: The filter (52) comprises a magnetic ring (521); The bus capacitor (51) comprises a capacitor core (511), a DC input terminal (512) and a DC output terminal (513); the DC input terminal (512) passes through the magnetic ring (521) from the middle position of the capacitor core (511) and is connected to the capacitor core (511).

7. The inverter according to claim 6, characterized in that: The filter capacitor assembly (5) comprises a housing (53), the housing (53) being provided with a mounting cavity (531), and the busbar capacitor (51) and the filter (52) being mounted in the mounting cavity (531).

8. The inverter according to claim 7, characterized in that: The housing (53) is provided with a first connection hole (532), and the first connection hole (532) connects the inside of the housing (53) with the outside of the housing (53); The discharge resistor comprises a discharge resistor connection terminal (31), one end of the discharge resistor connection terminal (31) is connected to the discharge-carrying circuit board, and the other end passes through the first connection hole (532) and is connected to the bus capacitor (51).

9. The inverter according to claim 5, characterized in that: The inverter also includes: A power module (6), the power module (6) being arranged on the main box (1), and the power module (6) being connected to the bus capacitor (51); An AC busbar (9), the AC busbar (9) being arranged on the main box (1) and connected to the power module (6); A current sensor magnetic core (4), wherein the current sensor magnetic core (4) is integrated on the AC busbar (9); A high-voltage connector (7), wherein the high-voltage connector (7) is arranged on the main box (1), and the high-voltage connector (7) is connected to the filter capacitor assembly (5).

10. The inverter according to claim 9, characterized in that: The inverter further comprises: A second heat sink (8), wherein a first heat sink surface and a second heat sink surface are respectively arranged on two sides of the second heat sink (8), the power module (6) is arranged on the first heat sink surface, and the filter capacitor component (5) is arranged on the second heat sink surface.

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