Infrared transceiver circuit board

Abstract

The utility model discloses an infrared transceiving circuit board, which comprises a circuit board main body, a multiplexing circuit, an infrared transmitting tube and an infrared receiving tube, the infrared transmitting tube is connected with the multiplexing circuit to form an infrared transmitting circuit; the infrared receiving tube is connected with the multiplexing circuit to form an infrared receiving circuit; and the multiplexing circuit, the infrared transmitting tube and the infrared receiving tube are all arranged on the circuit board main body. The beneficial effects of the utility model are that: 1, the application designs an infrared transmit-receive geminate transistor multiplexing circuit, so that an infrared receiving tube and an infrared transmitting tube can share one PCB, which is more beneficial to material preparation of products; and 2, the bonding pad of the infrared tube is arranged on the side surface of the PCB, so that the area of the whole PCB can be reduced, and the receiving and transmitting efficiency of an infrared light signal is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of infrared transceiver, in particular to an infrared transceiver circuit board. Background Art

[0002] Many scenarios require an infrared transceiver pair to perform a switch signal control, but it is hoped that the infrared transceiver pair can be placed inside the cable, which makes installation easier during operation. Since the cable space is relatively small, the volume of the infrared transceiver pair PCBA needs to be compressed as much as possible. Summary of the invention

[0003] According to an embodiment of the utility model, an infrared transceiver circuit board is provided, comprising a circuit board body, and further comprising: a multiplexing circuit, an infrared transmitting tube, and an infrared receiving tube;

[0004] The infrared transmitting tube is connected to the multiplexing circuit to form an infrared transmitting circuit;

[0005] The infrared receiving tube is connected to the multiplexing circuit to form an infrared receiving circuit;

[0006] The multiplexing circuit, the infrared transmitting tube and the infrared receiving tube are all arranged on the circuit board body.

[0007] Furthermore, the multiplexing circuit includes: a first resistor, a second resistor, a MOS tube, a third resistor, a first diode and a second diode;

[0008] One end of the first resistor is connected to one end of the second resistor and a fifth pad on the circuit board, and the other end of the first resistor is grounded;

[0009] The other end of the second resistor is connected to the gate of the MOS tube;

[0010] The source of the MOS tube is grounded, and the drain of the MOS tube is connected to one end of the third resistor and the second pad on the circuit board;

[0011] The other end of the third resistor is connected to one end of the first diode and a fourth pad on the circuit board;

[0012] The other end of the first diode is connected to one end of the second diode and a first pad on the circuit board;

[0013] The other end of the second diode is grounded.

[0014] Furthermore, the first diode is a Schottky diode.

[0015] Furthermore, the second diode is a TVS diode.

[0016] Furthermore, one end of the infrared emitting tube is connected to one end of the first resistor and the fifth pad on the circuit board, and the other end of the infrared emitting tube is connected to the fourth pad on the circuit board and one end of the first diode.

[0017] Furthermore, one end of the infrared receiving tube is connected to one end of the first resistor, the fifth pad on the circuit board, and one end of the second resistor, and the other end of the infrared receiving tube is connected to the fourth pad on the circuit board, one end of the first diode, and the other end of the third resistor.

[0018] Furthermore, the infrared transmitting tube and the infrared receiving tube are both mounted on the fourth soldering pad and the fifth soldering pad of the circuit board body.

[0019] An infrared transceiver circuit board according to an embodiment of the utility model has the following beneficial effects:

[0020] 1. This application designs an infrared transceiver multiplexing circuit so that the infrared receiving tube and the infrared transmitting tube can share a PCB, which is more conducive to product preparation.

[0021] 2. This application can reduce the area of ​​the entire PCB board by placing the soldering pad of the infrared tube on the side of the PCB, and at the same time is more conducive to the efficiency of sending and receiving infrared light signals.

[0022] It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the technology as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The present invention is a structural diagram of an infrared transceiver circuit board according to an embodiment of the present invention.

[0024] Figure 2 The present invention is a circuit diagram of a multiplexing circuit of an infrared transceiver circuit board according to an embodiment of the present utility model.

[0025] Figure 3 The present invention is a circuit diagram of an infrared transmitting circuit of an infrared transceiver circuit board according to an embodiment of the present invention.

[0026] Figure 4 The present invention is a circuit diagram of an infrared receiving circuit of an infrared transceiver circuit board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings to further illustrate the present invention.

[0028] First, combine Figures 1 to 4An infrared transceiver circuit board according to an embodiment of the utility model is described. By designing an infrared transceiver multiplexing circuit and a mini PCB to compress the volume of the infrared transceiver, the application scenario is very wide.

[0029] like Figures 1 to 4 As shown, an infrared transceiver circuit board according to an embodiment of the utility model comprises a circuit board body, a multiplexing circuit, an infrared transmitting tube LED1 and an infrared receiving tube LED2.

[0030] Specifically, Figure 2 As shown, the multiplexing circuit includes: a first resistor R3, a second resistor R2, a MOS transistor Q1, a third resistor R1, a first diode D1 and a second diode D2. One end of the first resistor R3 is connected to one end of the second resistor R2 and a fifth pad P5 on a circuit board, and the other end of the first resistor R3 is grounded; the other end of the second resistor R2 is connected to the gate of the MOS transistor Q1; the source of the MOS transistor Q1 is grounded, and the drain of the MOS transistor Q1 is connected to one end of the third resistor R1 and a second pad P2 on the circuit board; the other end of the third resistor R1 is connected to one end of the first diode D1 and a fourth pad P4 on the circuit board; the other end of the first diode D1 is connected to one end of the second diode D2 and the first pad P1 on the circuit board; the other end of the second diode D2 is grounded.

[0031] Further, if Figure 2 As shown, the first diode D1 is a Schottky diode, which plays an anti-reverse role.

[0032] Further, if Figure 2 As shown, the second diode D2 is a TVS tube, which plays a role in preventing static electricity and surge.

[0033] Specifically, Figure 3 As shown, the infrared emitting tube LED1 is connected to the multiplexing circuit to form an infrared emitting circuit. One end of the infrared emitting tube LED1 is connected to one end of the first resistor R3 and the fifth pad P5 on the circuit board, and the other end of the infrared emitting tube LED1 is connected to the fourth pad P4 on the circuit board and one end of the first diode D1. The first resistor R3 is a current limiting resistor to adjust the current size of the infrared emission.

[0034] Specifically, Figure 4 As shown, the infrared receiving tube LED2 is connected to the multiplexing circuit to form an infrared receiving circuit. One end of the infrared receiving tube LED2 is connected to one end of the first resistor R3, the fifth pad P5 on the circuit board, and one end of the second resistor R2, and the other end of the infrared receiving tube LED2 is connected to the fourth pad P4 on the circuit board, one end of the first diode D1, and the other end of the third resistor R1.

[0035] Specifically, Figure 1As shown, the multiplexing circuit, the infrared transmitting tube LED1 and the infrared receiving tube LED2 are all arranged on the main body of the circuit board. The infrared transmitting tube LED1 and the infrared receiving tube LED2 are both mounted on the fourth pad P4 and the fifth pad P5 of the main body of the circuit board. The infrared transmitting and receiving tubes are soldered by adding tin to the fourth pad P4 and the fifth pad P5 of the half hole on the edge of the PCB board. This not only utilizes the area of ​​the side of the PCB to reduce the size of the overall PCB, but also is more conducive to the emission or reception efficiency of infrared light.

[0036] When the infrared receiving tube LED2 receives the infrared light emitted by the infrared emitting tube LED1, it is turned on, and the 1st pin of the first resistor R3 changes from low to high, so that the MOS tube Q1 is turned on, and the signal of the second pad P2 changes from high to ground, and the output signal changes.

[0037] Above, refer to Figures 1 to 4 An infrared transceiver circuit board according to an embodiment of the utility model is described, which has the following beneficial effects:

[0038] 1. This application designs an infrared transceiver multiplexing circuit, so that the infrared receiving tube LED2 and the infrared transmitting tube LED1 can share a PCB, which is more conducive to product preparation.

[0039] 2. This application can reduce the area of ​​the entire PCB board by placing the soldering pad of the infrared tube on the side of the PCB, and at the same time is more conducive to the efficiency of sending and receiving infrared light signals.

[0040] It should be noted that, in this specification, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0041] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. An infrared transceiver circuit board, comprising a circuit board body, characterized in that: It also includes: a multiplexing circuit, an infrared transmitting tube and an infrared receiving tube; The infrared emitting tube is connected to the multiplexing circuit to form an infrared emitting circuit; The infrared receiving tube is connected to the multiplexing circuit to form an infrared receiving circuit; The multiplexing circuit, the infrared transmitting tube and the infrared receiving tube are all arranged on the circuit board body.

2. The infrared transceiver circuit board as claimed in claim 1, characterized in that: The multiplexing circuit comprises: a first resistor, a second resistor, a MOS tube, a third resistor, a first diode and a second diode; One end of the first resistor is connected to one end of the second resistor and a fifth pad on the circuit board, and the other end of the first resistor is grounded; The other end of the second resistor is connected to the gate of the MOS tube; The source of the MOS tube is grounded, and the drain of the MOS tube is connected to one end of the third resistor and the second pad on the circuit board; The other end of the third resistor is connected to one end of the first diode and a fourth pad on the circuit board; The other end of the first diode is connected to one end of the second diode and a first pad on the circuit board; The other end of the second diode is grounded.

3. The infrared transceiver circuit board as claimed in claim 2, characterized in that: The first diode is a Schottky diode.

4. The infrared transceiver circuit board as claimed in claim 2, characterized in that: The second diode is a TVS diode.

5. The infrared transceiver circuit board as claimed in claim 2, characterized in that: One end of the infrared emitting tube is connected to one end of the first resistor and the fifth pad on the circuit board, and the other end of the infrared emitting tube is connected to the fourth pad on the circuit board and one end of the first diode.

6. The infrared transceiver circuit board as claimed in claim 2, characterized in that: One end of the infrared receiving tube is connected to one end of the first resistor, the fifth soldering pad on the circuit board, and one end of the second resistor, and the other end of the infrared receiving tube is connected to the fourth soldering pad on the circuit board, one end of the first diode, and the other end of the third resistor.

7. The infrared transceiver circuit board as claimed in claim 1, characterized in that: The infrared emitting tube and the infrared receiving tube are both mounted on the fourth soldering pad and the fifth soldering pad of the circuit board body.

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