Semiconductor pin bending device

Abstract

A semiconductor pin bending device comprises a bottom plate, and two pairs of guide holes are formed in the bottom plate; a plurality of vertical rods are installed on the bottom plate, an upper plate is installed at the upper ends of the vertical rods, a downward pressing air cylinder is installed on the upper plate, a downward pushing plate is installed at the lower end of the downward pressing air cylinder, a plurality of spring pins are arranged on the downward pushing plate in a penetrating mode, a downward pressing plate is arranged at the lower ends of the spring pins, springs are arranged at the lower ends of the spring pins in a sleeving mode, and the springs are located between the downward pushing plate and the downward pressing plate. According to the utility model, the downward pressing cylinder can drive the downward pressing plate to move downward, so that the downward pressing plate positions the semiconductor, and after positioning, the spring provides an activity space for the downward movement of the downward pushing plate again, and at the same time, the downward pressing plate can be prevented from crushing the semiconductor.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor pin bending device. Background Art

[0002] After the semiconductor processing is completed, the pins need to be bent for convenience so that the lower ends of the pins are in an open state. By bending the pins, the semiconductor welding operation is facilitated. However, when bending the pins, the spacing between the bent pins does not meet the predetermined opening spacing. At the same time, the opening operation is completed by multiple cylinders during bending, and these cylinders are arranged inside the opening device. As the number of cylinders used increases, the difficulty of replacing the cylinders increases, and the energy consumption also increases. Utility Model Content

[0003] The utility model provides a semiconductor pin bending device to solve the above-mentioned deficiencies of the prior art, facilitate the pin bending operation of the semiconductor, and perform the positioning and opening operation of the semiconductor through a single cylinder, thereby reducing the failure rate and having strong practicality.

[0004] In order to achieve the purpose of this utility model, the following technologies are proposed:

[0005] A semiconductor pin bending device comprises a bottom plate, and two pairs of guide holes are formed on the bottom plate;

[0006] A plurality of vertical rods are installed on the bottom plate, an upper plate is installed on the upper end of the vertical rods, a downward pressure cylinder is installed on the upper plate, a downward push plate is installed on the lower end of the downward pressure cylinder, a plurality of spring pins are passed through the downward push plate, a downward pressure plate is provided at the lower end of the spring pin, a spring is sleeved at the lower end of the spring pin, the spring is located between the downward push plate and the downward pressure plate, and the downward pressure cylinder can drive the downward pressure plate to position the semiconductor, and after positioning, the spring provides the downward push plate with space for downward movement again, and at the same time, it can also prevent the downward pressure plate from causing pressure damage to the semiconductor.

[0007] A pair of downward push rods are installed on the lower push plate, and a downward push cross plate is provided at the lower end of the downward push rod. The downward push rod passes through the bottom plate, and a first rack is installed on the downward push cross plate. The first rack is meshed with a gear, and a downward extension plate is installed on the bottom plate. The gear is rotatably arranged at the lower end of the downward extension plate, and a second rack is meshed on the other side of the gear. The second rack is movably arranged on the bottom plate, and a concave seat is installed at the upper end of the second rack. A pair of movable side plates are installed at the upper end of the concave seat, and action rods are provided at both ends of the movable side plates. A fixed through rod is passed through the guide hole, and a movable block is installed at the upper end of the fixed through rod on the same side. Located on the upper side of the bottom plate, the inner side of the movable block is provided with a lower vertical plate, the upper end of the lower vertical plate is provided with an inclined plate, the lower end of the inclined plate extends outwardly, the upper end of the inclined plate is provided with an upper vertical plate, the inner wall of the inclined plate is provided with an inner convex inclined plate, an inclined hole is opened on the inner convex inclined plate, the action rod passes through the inclined hole, the lower end of the inclined hole extends outwardly, a pair of bent outer plates are installed on the bottom plate, the bent outer plates are located on the outer side of the lower vertical plate, the lower section of the bent outer plates is a vertical structure, the middle section of the bent outer plates is an inclined structure, and the middle section of the bent outer plates is consistent with the inclined direction of the inclined plates, and the upper part of the bent outer plates is a vertical structure. A pair of support plates are installed on the bottom plate, the upper end of the support plates is provided with a lower lining plate, and the upper vertical plate is located on the lower side of the lower lining plate. Through the first rack, gear and second rack, when the first rack moves downward, the second rack can be moved upward through the transmission of the gear, and when the second rack moves upward, the action rod will move upward, and the movement of the action rod will act on the inclined hole, so that the inclined plate and the like move outward, thereby completing the bending operation of the pins by bending the outer plate, and before bending, the lower vertical plate is located on the inner side of the lower lining plate, so as to facilitate the insertion of the semiconductor pins on the lower lining plate and the bending operation of the pins.

[0008] Furthermore, a plurality of pairs of limiting protrusions are provided on the outer wall of the lower vertical plate. When the pins are inserted, the limiting protrusions can limit the pins, and when they move outward, the limiting protrusions will contact the inner side of the bent outer plate, thereby avoiding bending of the pins.

[0009] Furthermore, a T-shaped groove is provided on the lower wall of the lower lining plate, and a pair of T-shaped blocks are provided on the upper vertical plate. The T-shaped blocks are arranged in the T-shaped groove. Through the arrangement of the T-shaped groove and the T-shaped block, the stability during bending can be ensured.

[0010] The advantages of the above technical solution are:

[0011] The utility model facilitates the bending operation of semiconductor pins, can improve the effect after bending, and reduces the failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model will be further described in detail below with reference to the accompanying drawings.

[0013] Figure 1 The three-dimensional structure of one embodiment is shown Figure 1 .

[0014] Figure 2 The three-dimensional structure of one embodiment is shown Figure 2 . DETAILED DESCRIPTION

[0015] like Figure 1~Figure 2 As shown, a semiconductor pin bending device includes a bottom plate 1, and two pairs of guide holes 10 are opened on the bottom plate 1. A plurality of vertical rods 2 are installed on the bottom plate 1, and an upper plate 20 is installed on the upper end of the vertical rods 2. A downward pressure cylinder 21 is installed on the upper plate 20, and a downward push plate 22 is installed on the lower end of the downward pressure cylinder 21. A plurality of spring pins 23 are passed through the downward push plate 22, and a downward pressure plate is provided at the lower end of the spring pin 23. A spring 24 is sleeved at the lower end of the spring pin 23, and the spring 24 is located between the downward pressure plate 22 and the downward pressure plate. A pair of downward pressure push rods 25 are installed on the downward pressure push rods 25, and the downward pressure push rods 25 have a plurality of spring pins 23. The lower end is provided with a downward pressing horizontal plate 26, the downward pressing push rod 25 passes through the bottom plate 1, the downward pressing horizontal plate 26 is installed with a first rack 27, the first rack 27 is meshed with a gear 28, a downward extending plate 30 is installed on the bottom plate 1, the gear 28 is rotatably arranged at the lower end of the downward extending plate 30, the other side of the gear 28 is meshed with a second rack 29, the second rack 29 is movably arranged on the bottom plate 1, the upper end of the second rack 29 is installed with a concave seat 31, and the upper end of the concave seat 31 is installed with a pair of movable The movable side plate 32 has an action rod 33 at both ends of the movable side plate 32. A fixed through rod is passed through the guide hole 10. A movable block 34 is installed on the upper end of the fixed through rod on the same side. The movable block 34 is located on the upper side of the bottom plate 1. A lower vertical plate 35 is provided on the inner side of the movable block 34. A plurality of pairs of limiting protrusions 41 are provided on the outer wall of the lower vertical plate 35. An inclined plate 36 is provided on the upper end of the lower vertical plate 35. The lower end of the inclined plate 36 extends outwardly at an angle. An upper vertical plate 37 is provided on the upper end of the inclined plate 36. The inner wall of the inclined plate 36 is provided with an inner convex inclined plate 50, and an oblique hole 51 is opened on the inner convex inclined plate 50. The action rod 33 passes through the oblique hole 51, and the lower end of the oblique hole 51 extends outwardly at an angle. A pair of bent outer plates are installed on the bottom plate 1. The bent outer plates are located on the outer side of the lower vertical plate 35. The lower section of the bent outer plate is a vertical structure, and the middle section of the bent outer plate is an inclined structure. The middle section of the bent outer plate is consistent with the inclination direction of the inclined plate 36, and the upper section of the bent outer plate is a vertical structure.

[0016] A pair of support plates 42 are mounted on the bottom plate 1, a lower lining plate 39 is mounted on the upper end of the support plates 42, and the upper vertical plate 37 is located at the lower side of the lower lining plate 39. A T-shaped slot 40 is provided on the lower wall of the lower lining plate 39, and a pair of T-shaped blocks 38 are provided on the upper vertical plate 37, and the T-shaped blocks 38 are arranged in the T-shaped slot 40.

[0017] During operation of this embodiment, the operator places the semiconductor on the lower lining plate 39, and during placement, the pins on the semiconductor need to be inserted between the limiting protrusions 41, and the pins are located on the inner side of the bent outer plate. After placement, the pressing cylinder 21 is started, and the pressing plate 22 is driven by the pressing cylinder 21 to act on the upper end of the semiconductor, thereby positioning the semiconductor, and then the pushing plate 22 continues to move downward under the drive of the pressing cylinder 21, and the spring 24 is compressed. When the pushing plate 22 moves downward, it will drive the first rack 27 to move downward, and the second rack 27 is moved downward. The movement of a rack 27 will drive the gear 28 to rotate, and the rotation of the gear 28 will drive the second rack 29 to move upward, and the upward movement of the second rack 29 will drive the movable side plate 32 and the action rod 33 to move upward, and the upward movement of the action rod 33 will act on the inclined hole 51, thereby causing the lower vertical plate 35, the inclined plate 36 and the upper vertical plate 37 to move outward, and the bending operation of the pin is completed by the lower vertical plate 35, the inclined plate 36, the upper vertical plate 37 and the bending outer plate. After the bending is completed, the downward pressure cylinder 21 drives the lower push plate 22 to move upward, and the semiconductor is taken out.

[0018] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Obviously, those skilled in the art can make various changes and modifications to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the claims of the utility model and their equivalents, the utility model is also intended to include these modifications and variations.

Claims

1. A semiconductor pin bending device, characterized in that: It comprises a bottom plate (1), and two pairs of guide holes (10) are formed on the bottom plate (1); A plurality of vertical rods (2) are mounted on the bottom plate (1), an upper plate (20) is mounted on the upper end of the vertical rods (2), a downward pressure cylinder (21) is mounted on the upper plate (20), a downward push plate (22) is mounted on the lower end of the downward pressure cylinder (21), a plurality of spring pins (23) are passed through the downward push plate (22), a downward pressure plate is provided at the lower end of the spring pins (23), a spring (24) is sleeved at the lower end of the spring pins (23), and the spring (24) is located between the downward push plate (22) and the downward pressure plate; A pair of push rods (25) are mounted on the push plate (22), a push rod (25) having a push plate (26) at its lower end, the push rod (25) passing through the bottom plate (1), a first rack (27) being mounted on the push plate (26), the first rack (27) being meshed with a gear (28), a lower extension plate (30) being mounted on the bottom plate (1), the gear (28) being rotatably mounted on the lower end of the lower extension plate (30), the other side of the gear (28) being meshed with a second rack (29), the second rack (29) being movably mounted on the bottom plate (1), a concave seat (31) being mounted on the upper end of the second rack (29), a pair of movable side plates (32) being mounted on the upper end of the concave seat (31), both ends of the movable side plates (32) being provided with action rods (33), a fixed through rod being mounted on the guide hole (10), the upper end of the fixed through rod being located on the same side A movable block (34) is installed, the movable block (34) is located on the upper side of the bottom plate (1), a lower vertical plate (35) is provided on the inner side of the movable block (34), an inclined plate (36) is provided on the upper end of the lower vertical plate (35), the lower end of the inclined plate (36) extends outwardly at an angle, an upper vertical plate (37) is provided on the upper end of the inclined plate (36), an inner convex inclined plate (50) is provided on the inner wall of the inclined plate (36), an inclined hole (51) is opened on the inner convex inclined plate (50), an action rod (33) passes through the inclined hole (51), the lower end of the inclined hole (51) extends outwardly at an angle, a pair of bent outer plates are installed on the bottom plate (1), the bent outer plates are located on the outer side of the lower vertical plate (35), the lower section of the bent outer plates is a vertical structure, the middle section of the bent outer plates is an inclined structure, the middle section of the bent outer plates is in the same inclination direction as the inclined plate (36), and the upper section of the bent outer plates is a vertical structure; A pair of support plates (42) are mounted on the bottom plate (1), a lower lining plate (39) is mounted on the upper end of the support plate (42), and the upper vertical plate (37) is located on the lower side of the lower lining plate (39).

2. The semiconductor lead bending device according to claim 1, characterized in that: A plurality of pairs of limiting protrusions (41) are provided on the outer wall of the lower vertical plate (35).

3. The semiconductor lead bending device according to claim 1, characterized in that: A T-shaped groove (40) is formed on the lower wall of the lower lining plate (39), and a pair of T-shaped blocks (38) are formed on the upper vertical plate (37), wherein the T-shaped blocks (38) are arranged in the T-shaped groove (40).

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