Airflow guide device and chemical vapor deposition furnace

By installing an air guide flow device in the cooling pipe of a chemical vapor deposition furnace, the high-temperature gas is quickly cooled by the flow channel, which solves the problems of low utilization rate of the cooling pipe and blockage of the gas channel, and improves the cooling efficiency and process operation stability.

CN222770948UActive Publication Date: 2025-04-18QINGDAO JINGYI NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202420964910.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-07
Publication Date
2025-04-18
Estimated Expiration
2034-05-07

AI Technical Summary

Technical Problem

In the prior art, the utilization rate of the cooling pipe of the chemical vapor deposition furnace is low, resulting in low cooling efficiency, and high-temperature gases entering the filter canister without effective cooling, resulting in clogging of the filter bag and clogging of the gas passage, affecting the operation of the process.

Method used

An air flow device is designed, including a fluid guide and a support leg. The fluid guide is supported in the cooling tube through the support leg. The fluid guide has a split end and a flow guide end. The split end is close to the air inlet of the cooling tube. A gap is left between the flow guide end and the inner wall of the cooling tube to form a flow guide channel, which improves the cooling efficiency of high-temperature gas.

Benefits of technology

Through the design of the diversion channel, high-temperature gas can quickly cool down, preventing macromolecular substances from condensing in the filter tank to form blockage, improving the cooling efficiency of the cooling tube, and extending the process running time.

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Abstract

The utility model relates to an airflow guide device and a chemical vapor deposition furnace, which comprise a flow guide body and supporting legs fixedly connected with the flow guide body, the flow guide body is supported in a cooling pipe of the chemical vapor deposition furnace through the supporting legs, and the flow guide body comprises a shunting end and a flow guide end which are used for shunting gas entering the cooling pipe. According to the chemical vapor deposition furnace cooling pipe, the technical problem that in the prior art, due to the fact that the utilization rate of a chemical vapor deposition furnace cooling pipe is low, a gas channel is blocked can be solved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of chemical vapor deposition of carbon / carbon composite materials, in particular to an air flow guiding device and a chemical vapor deposition furnace. Background Art

[0002] The carbon-carbon composite gas phase rapid vapor deposition process uses chemical vapor deposition technology to decompose the carbon source material into carbon atoms at high temperature, and then deposit them on the surface of the fiber bundle to finally form a carbon-carbon composite material. Generally, a high-temperature chemical vapor deposition furnace is used to prepare carbon-carbon composite materials. The normal operating temperature of a high-temperature chemical vapor deposition furnace is 1100-1200℃, so during operation, the various parts of the furnace body need to circulate cooling water to maintain heat exchange and cool down.

[0003] In the prior art, the utilization rate of the cooling tubes of the chemical vapor deposition furnace is low and the cooling efficiency is low, which causes the high-temperature gas in the deposition chamber to be drawn to the rear-end filter tank to form large molecular substances, causing the filter bag to be blocked, and then causing the gas channel to be blocked, affecting the overall process operation.

[0004] Based on this, the existing technology needs to be further developed. Utility Model Content

[0005] In view of various deficiencies in the prior art, an air flow guide device and a chemical vapor deposition furnace are proposed to solve the technical problem in the prior art that the utilization rate of the cooling pipe of the chemical vapor deposition furnace is low, thereby causing gas channel blockage.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A gas flow guiding device comprises a guiding body and a supporting leg fixedly connected to the guiding body, wherein the guiding body is supported in a cooling tube of a chemical vapor deposition furnace through the supporting leg, and the guiding body comprises a diversion end and a guiding end for diverting the gas entering the cooling tube, wherein the diversion end is arranged close to the air inlet of the cooling tube, and a gap is left between the guiding end and the inner wall of the cooling tube to form a guiding channel.

[0008] The technical solution is further configured such that the size of the diversion end gradually decreases in a direction away from the guide end.

[0009] The technical solution is further configured such that the flow guide is a hollow structure, and the flow splitting end and the flow guide end are integrally formed.

[0010] The technical solution is further configured such that the distance between the diversion end and the air inlet of the cooling pipe is 350 mm-500 mm.

[0011] The technical solution is further configured such that the distance between the outer wall of the guide end and the inner wall of the cooling pipe is 45 mm-55 mm.

[0012] The technical solution is further configured that the guide body is made of stainless steel, and the wall thickness of the guide body is ≥10 mm.

[0013] The technical solution is further configured such that a plurality of support legs are symmetrically arranged, and the support legs abut against the inner wall of the cooling tube.

[0014] A chemical vapor deposition furnace comprises a cooling pipe and an air flow guiding device. A water cooling jacket is provided on the cooling pipe, and the air flow guiding device is movably placed in the cooling pipe.

[0015] The beneficial effects of the utility model are:

[0016] Through the cooperation of the diversion end and the guide end, the high-temperature gas entering the cooling pipe is diverted by the diversion end of the guide body and then enters the guide channel. Since the guide channel is close to the inner wall of the cooling pipe, the high-temperature gas flowing through the guide channel can be quickly cooled down, and the high-temperature cooled macromolecular substances are deposited in the condensation tank of the chemical vapor deposition furnace, thereby improving the cooling efficiency of the cooling pipe and preventing the high-temperature gas from entering the filter tank without effective cooling, cooling in the filter tank to form macromolecular substances and causing blockage of the filter bag, thereby causing blockage of the gas channel and premature shutdown of the furnace. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a chemical vapor deposition furnace according to an embodiment of the utility model;

[0018] Figure 2 This is a schematic diagram of an airflow guide device according to an embodiment of the utility model;

[0019] In the attached figure: 1. flow guide; 2. diversion end; 3. flow guide end; 4. support leg; 5. chemical vapor deposition furnace; 51. deposition chamber; 52. cooling pipe; 53. condenser; 54. filter tank; 55. filter bag; 56. vacuum pump; 57. water-cooling jacket. DETAILED DESCRIPTION

[0020] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is clearly and completely described below in conjunction with the drawings of the present invention. Based on the embodiments in this application, other similar embodiments obtained by ordinary technicians in this field without making creative work should all fall within the scope of protection of this application. In addition, the directional words mentioned in the following embodiments, such as "up", "down", "left", "right", etc., are only referenced to the directions of the drawings. Therefore, the directional words used are used to illustrate rather than limit the invention.

[0021] The utility model is further described below in conjunction with the accompanying drawings and preferred embodiments.

[0022] According to an embodiment of the present invention, an air flow guiding device is provided. Figure 1 to Figure 2 , including a guide body 1 and a supporting leg 4 fixedly connected to the guide body 1, the guide body 1 is supported in a cooling tube 52 of a chemical vapor deposition furnace 5 by the supporting leg 4, the guide body 1 includes a diversion end 2 and a guide end 3 for diverting the gas entering the cooling tube 52, the diversion end 2 is arranged close to the air inlet of the cooling tube 52, and a gap is left between the guide end 3 and the inner wall of the cooling tube 52 to form a guide channel.

[0023] It should be noted that, through the cooperation of the diversion end 2 and the guide end 3, the high-temperature gas entering the cooling pipe 52 is diverted by the diversion end 2 of the guide body 1 and then enters the guide channel. Since the guide channel is close to the inner wall of the cooling pipe 52, the high-temperature gas flowing through the guide channel can be quickly cooled down, and the high-temperature cooled macromolecular substances are deposited in the condensation tank 53 of the chemical vapor deposition furnace 5, thereby improving the cooling efficiency of the cooling pipe 52 and preventing the high-temperature gas from entering the filter tank 54 without effective cooling, cooling in the filter tank 54 to form macromolecular substances and causing blockage of the filter bag 55, thereby causing blockage of the gas channel and causing premature shutdown of the furnace.

[0024] Specifically, a plurality of support legs 4 are provided, and the support legs 4 abut against the inner wall of the cooling tube 52 , and the plurality of support legs 4 are symmetrically arranged to provide stable support for the guide body 1 .

[0025] In the air flow guide device of this embodiment, the size of the diverter end 2 gradually decreases in the direction away from the guide end 3, that is, the diverter end 2 is a conical structure. The setting of the conical structure can effectively realize diversion, allowing the high-temperature gas to smoothly enter the diversion channel and prevent the air flow from being turbulent during diversion and causing the gas to swirl and produce carbon black.

[0026] In the air flow guiding device of this embodiment, in order to ensure the reliability of the guiding body 1, the guiding body 1 is made of stainless steel with a temperature resistance of ≥800°C, and the wall thickness of the guiding body 1 is ≥10mm. Specifically, the stainless steel model is 316S stainless steel.

[0027] In the air flow guiding device of the present embodiment, the flow guiding body 1 is a hollow structure, and the flow splitting end 2 and the flow guiding end 3 are integrally formed.

[0028] It should be noted that the hollow structure can reduce the weight of the guide body 1 , making it convenient for the staff to take out the guide body 1 from the cooling pipe 52 for cleaning or replacement.

[0029] In the air flow guiding device of the present embodiment, the distance between the diversion end 2 and the air inlet of the cooling tube 52 is 350mm-500mm. On the one hand, a gas buffer distance is reserved to prevent the gas flow from deviating from the predetermined trajectory; on the other hand, the length of the guide channel is increased as much as possible, thereby increasing the contact area between the high-temperature gas and the inner wall of the cooling tube 52 and improving the cooling rate.

[0030] In the air flow guiding device of this embodiment, the distance between the outer wall of the guide end 3 and the inner wall of the cooling tube 52 is 45mm-55mm. According to the flow velocity and residence time of the high-temperature gas in the cooling tube 52, the cooling efficiency of the high-temperature gas is highest within this numerical range.

[0031] According to an embodiment of the present invention, a chemical vapor deposition furnace is provided. Figure 1 to Figure 2 , including a deposition chamber 51, a cooling pipe 52, a condensation tank 53, a filter tank 54, a vacuum pump 56 and the above-mentioned air flow guiding device. The deposition chamber 51 is connected with the condensation tank 53 through the cooling pipe 52. The air inlet of the filter tank 54 is connected with the condensation tank 53. The air outlet of the filter tank 54 is connected with the vacuum pump 56. A filter bag 55 is provided inside the filter tank 54. A water cooling jacket 57 is provided on the cooling pipe 52. The water cooling jacket 57 is used to cool the high-temperature gas in the cooling pipe 52. The air flow guiding device can be movably placed in the straight section of the cooling pipe 52.

[0032] The high-temperature gas is cooled from the deposition chamber 51 through the cooling pipe 52 and then enters the condensation tank 53. When flowing through the straight section of the cooling pipe 52, the high-temperature gas flows along the guide channel close to the inner wall of the cooling pipe 52 under the guidance of the guide device. The high-temperature gas is cooled in contact with the cooling pipe 52 to form macromolecular substances that are deposited at the bottom of the condensation tank 53. The cooled gas is filtered by the filter bag 55 in the filter tank 54 and then extracted by the vacuum pump 56.

[0033] The present invention has been described in detail above. The above description is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made within the scope of this application should still fall within the scope of the present invention.

Claims

1. An air flow guiding device, characterized in that: It includes a guide body and support legs fixedly connected to the guide body, the guide body is supported in a cooling tube of a chemical vapor deposition furnace through the support legs, the guide body includes a diversion end and a guide end for diverting the gas entering the cooling tube, the diversion end is arranged close to the air inlet of the cooling tube, and a gap is left between the guide end and the inner wall of the cooling tube to form a guide channel.

2. The air flow guiding device according to claim 1, characterized in that: The size of the diversion end gradually decreases in a direction away from the guide end.

3. The air flow guiding device according to claim 1, characterized in that: The flow guide body is a hollow structure, and the flow splitting end and the flow guide end are integrally formed.

4. The air flow guiding device according to claim 2, characterized in that: The distance between the split end and the air inlet of the cooling pipe is 350mm-500mm.

5. The air flow guiding device according to claim 4, characterized in that: The distance between the outer wall of the guide end and the inner wall of the cooling pipe is 45mm-55mm.

6. The air flow guiding device according to claim 3, characterized in that: The flow guide is made of stainless steel, and the wall thickness of the flow guide is ≥10 mm.

7. The air flow guiding device according to any one of claims 1 to 6, characterized in that: A plurality of supporting legs are symmetrically arranged, and the supporting legs abut against the inner wall of the cooling pipe.

8. A chemical vapor deposition furnace, characterized in that: It comprises a cooling pipe and the air flow guiding device according to any one of claims 1 to 7, wherein the cooling pipe is provided with a water cooling jacket, and the air flow guiding device can be movably placed in the cooling pipe.