Monocrystalline silicon wafer carrier drying device
By designing a single crystal silicon wafer carrier drying device including a circular vehicle, a support base plate, a circular movable plate, a sliding assembly, a support frame and a heating ring, the problems of low drying efficiency and inconvenient placement of existing devices when dealing with a large number of single crystal silicon wafers are solved, and efficient single crystal silicon wafer drying treatment is achieved.
Patent Information
- Application Number
- CN202421652209.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-07-12
AI Technical Summary
The existing single crystal silicon wafer drying device has low drying efficiency when processing a large number of single crystal silicon wafers and is not convenient for the placement and acquisition of single crystal silicon wafers.
A single crystal silicon wafer carrier drying device is designed, including a circular carrier, a support base plate, a circular movable plate, a sliding assembly, a support frame and a heating ring. Through the design of sliding components and circular movable plates, multiple sets of arrangement and drying of single crystal silicon wafers are realized, and the support frame and heating ring are used to clamp and heat the single crystal silicon wafers.
It improves the drying efficiency of single crystal silicon wafers, facilitates the placement and acquisition of single crystal silicon wafers, and solves the problem of inefficiency of existing devices when dealing with large amounts of single crystal silicon wafers.
Smart Images
Figure CN222773653U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single crystal silicon slices, in particular to a single crystal silicon slice carrier drying device. Background Art
[0002] Monocrystalline silicon wafer: A single crystal of silicon is a crystal with a basically complete lattice structure. It has different properties in different directions and is a good semiconductor material with a purity requirement of 99.9999% or even above 99.9999999%. It is used to manufacture semiconductor devices, solar cells, etc. It is made of high-purity polycrystalline silicon in a single crystal furnace. After production, processing and cleaning, the monocrystalline silicon wafer needs to be dried by a drying device.
[0003] When drying single crystal silicon wafers, general drying devices can only dry a small amount of single crystal silicon wafers. When the single crystal silicon wafers are overlapped, the drying efficiency is greatly reduced, and it is inconvenient to place and take the single crystal silicon wafers during drying. For this reason, we provide a single crystal silicon wafer carrier drying device for use. Utility Model Content
[0004] The purpose of the utility model is to provide a single crystal silicon wafer carrier drying device to solve the problems raised by the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single crystal silicon wafer carrier drying device, comprising a circular carrier, a supporting bottom plate is installed at the inner bottom end of the circular carrier, two groups of circular movable plates are respectively placed on the top of the supporting bottom plate, and a sliding assembly is installed between the supporting bottom plate and the circular movable plates so that the two groups of circular movable plates can rotate on the top of the supporting bottom plate;
[0006] The interior of the two groups of circular movable plates are respectively provided with multiple groups of placement grooves in an annular manner, the interiors of the four groups of placement grooves are respectively slidably connected with support frames, the interior of each group of support frames is respectively provided with through grooves which are communicated with the placement grooves, and silicon wafer clamps are respectively installed on both sides of each group of through grooves to clamp and support the single crystal silicon wafers.
[0007] Preferably, the sliding assembly includes a slide groove and a slider, the two groups of the slide grooves are respectively opened at the bottom of the two groups of circular movable plates, the four groups of sliders are respectively annularly installed on one side of the supporting base plate and each group of the slide grooves is respectively slidably connected to the outer side of the two groups of sliders.
[0008] Preferably, a circular support plate is installed between the tops of the multiple groups of support frames, and the circular support plate drives the multiple groups of support frames to move synchronously.
[0009] Preferably, a plurality of sets of heating rings are embedded and installed on the inner bottom side of the circular carrier, and the plurality of sets of heating rings heat and dry the single crystal silicon wafers placed on the circular carrier.
[0010] Preferably, a circular cover is hinged on the top of the circular carrier, and the circular cover seals the circular carrier to prevent hot air from escaping.
[0011] Preferably, pull rods are respectively installed in a ring shape on the top of the two groups of circular support plates, and pulling the pull rods drives the circular support plates and the support frame installed at the bottom to move upward.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. The utility model pulls out the support frame from the placement groove provided in the circular movable plate, and places a plurality of single crystal silicon wafers in the through groove provided in the support frame in an arranged manner, and at the same time, the silicon wafer clamps installed on both sides of the through groove firmly clamp the single crystal silicon wafers. After the plurality of single crystal silicon wafers are placed in the support frame, the support frame returns to the inside of the placement groove, and the circular movable plate is rotated. The circular movable plate is rotated by using the sliding assembly installed between the circular movable plate and the support bottom plate so as to continue to place the single crystal silicon wafers on other support frames, so that a plurality of groups of single crystal silicon wafers are suspended in the circular carrier for drying, thereby improving the drying efficiency of the single crystal silicon wafers.
[0014] 2. The utility model installs a circular support plate on the top of multiple groups of support frames, pulls the circular support plate, and the circular support plate drives the multiple groups of support frames to move upward at the same time, so as to place the single crystal silicon wafer into the support frame or move the dried single crystal silicon wafer out of the support frame, which is convenient for placing and taking the single crystal silicon wafer when drying. The heating ring embedded at the bottom of the circular carrier is turned on, and the heater increases the temperature inside the circular carrier and dries the single crystal silicon wafer placed inside the circular carrier. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the main structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the bottom structure of the circular carrier of the utility model;
[0017] Figure 3 For this utility model Figure 1 A magnified schematic diagram of point A;
[0018] Figure 4 For this utility model Figure 2 An enlarged schematic diagram of point B.
[0019] In the figure: 1. circular carrier, 2. supporting bottom plate, 3. circular movable plate, 4. slide groove, 5. slider, 6. placement groove, 7. supporting frame, 8. through groove, 9. silicon wafer clamping plate, 10. circular supporting plate, 11. pull rod, 12. heating ring, 13. circular cover plate. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-4 As shown, the utility model is a single crystal silicon wafer carrier drying device, comprising a circular carrier 1, a supporting base plate 2 is installed at the inner bottom end of the circular carrier 1, two groups of circular movable plates 3 are placed on the top of the supporting base plate 2, and a sliding assembly is installed between the supporting base plate 2 and the circular movable plates 3 so that the two groups of circular movable plates 3 can rotate on the top of the supporting base plate 2;
[0022] The interior of the two groups of circular movable plates 3 are respectively provided with multiple groups of placement grooves 6 in an annular manner, and the interiors of the four groups of placement grooves 6 are respectively slidably connected with support frames 7. The interior of each group of support frames 7 is respectively provided with through grooves 8, and the through grooves 8 are communicated with the placement grooves 6. Silicon wafer clamps 9 are respectively installed on both sides of each group of through grooves 8 to clamp and support the single crystal silicon wafer.
[0023] In this embodiment, the support frame 7 is pulled out from the placement groove 6 opened inside the circular movable plate 3, and multiple single crystal silicon wafers are arranged and placed in the through groove 8 opened inside the support frame 7. At the same time, the silicon wafer clamps 9 installed on both sides of the through groove 8 firmly clamp the single crystal silicon wafers. After multiple single crystal silicon wafers are placed in the support frame 7, the support frame 7 returns to the inside of the placement groove 6, and the circular movable plate 3 is rotated. The circular movable plate 3 is rotated using the sliding assembly installed between the circular movable plate 3 and the supporting base plate 2 so as to continue to place single crystal silicon wafers on other support frames 7. The placement groove 6 and the through groove 8 are connected to the inside of the circular carrier 1 to facilitate air flow.
[0024] See also Figure 4 As shown, the sliding assembly includes a slide groove 4 and a slider 5, two groups of slide grooves 4 are respectively opened at the bottom of two groups of circular movable plates 3, four groups of sliders 5 are respectively annularly installed on one side of the supporting base plate 2 and each group of slide grooves 4 is respectively slidably connected to the outer side of the two groups of sliders 5.
[0025] In this embodiment, the circular movable plate 3 is supported by four groups of sliders 5 installed in a ring on the top of the supporting base plate 2, and the slide groove 4 opened at the bottom of the circular movable plate 3 slides on the top of the two groups of sliders 5, so that the circular movable plate 3 rotates on the top of the supporting base plate 2.
[0026] See also Figure 3As shown, a circular support plate 10 is installed between the tops of the multiple groups of support frames 7, and the circular support plate 10 drives the multiple groups of support frames 7 to move synchronously.
[0027] In this embodiment, by installing a circular support plate 10 on the top of multiple groups of support frames 7, the circular support plate 10 is pulled, and the circular support plate 10 simultaneously drives the multiple groups of support frames 7 to move upward, so as to place the single crystal silicon wafer into the interior of the support frame 7 or remove the dried single crystal silicon wafer from the support frame 7.
[0028] See also Figure 3 As shown, a plurality of heating coils 12 are embedded and installed on the inner bottom side of the circular carrier 1 , and the plurality of heating coils 12 heat and dry the single crystal silicon wafers placed on the circular carrier 1 .
[0029] In this embodiment, by turning on the heating ring 12 embedded at the bottom of the circular carrier 1 , the heater 12 raises the temperature inside the circular carrier 1 and dries the single crystal silicon wafer placed inside the circular carrier 1 .
[0030] See also Figure 2 As shown, a circular cover plate 13 is hinged on the top of the circular carrier 1, and the circular cover plate 13 seals the circular carrier 1 to prevent hot air from escaping.
[0031] In this embodiment, through the circular cover plate 13 hinged on the top of the circular carrier 1, after a plurality of single crystal silicon wafers are placed in the circular carrier 1, the circular cover plate 13 is turned over to seal the top of the circular carrier 1 to prevent hot gas from flowing out.
[0032] See also Figure 1 As shown, pull rods 11 are respectively installed in a ring shape on the top of the two groups of circular support plates 10. Pulling the pull rods 11 drives the circular support plates 10 and the support frame 7 installed at the bottom to move upward.
[0033] In this embodiment, by pulling the pull rod 11, the pull rod 11 can easily drive the circular support plate 10 and the multiple groups of support frames 7 at the bottom of the circular support plate 10 to move upward synchronously, so as to facilitate the storage and access of single crystal silicon wafers.
[0034] Working principle: The utility model is a single crystal silicon wafer carrier drying device. During use, the pull rod 11 is pulled, and the pull rod 11 is convenient for driving the circular support plate 10 and the multiple groups of support frames 7 at the bottom of the circular support plate 10 to move upward synchronously, and the multiple groups of single crystal silicon wafers are arranged in a row in the through grooves 8 opened inside each group of support frames 7. At the same time, the silicon wafer clamps 9 installed on both sides of the through grooves 8 clamp the single crystal silicon wafers firmly, and the support frame 7 returns to the placement groove 6 so that the multiple groups of single crystal silicon wafers are suspended in the circular carrier 1. The heating ring 12 is turned on and the circular cover 13 is flipped to seal the top of the circular carrier 1 to prevent the hot air emitted by the heating ring 12 from flowing out and to dry the single crystal silicon wafers. The contents not described in detail in this description belong to the existing technology known to professional and technical personnel in this field.
[0035] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A single crystal silicon wafer carrier drying device, comprising a circular carrier (1), characterized in that: A supporting base plate (2) is installed at the inner bottom end of the circular carrier (1), two groups of circular movable plates (3) are placed on the top of the supporting base plate (2), and sliding components are installed between the supporting base plate (2) and the circular movable plates (3) so that the two groups of circular movable plates (3) can rotate on the top of the supporting base plate (2); The inside of the two groups of circular movable plates (3) are respectively provided with a plurality of groups of placement grooves (6) in an annular manner, the inside of the four groups of placement grooves (6) are respectively slidably connected with support frames (7), the inside of each group of support frames (7) is respectively provided with through grooves (8) and the through grooves (8) are communicated with the placement grooves (6), and silicon wafer clamping plates (9) are respectively installed on both sides of each group of through grooves (8) to clamp and support the single crystal silicon wafer.
2. The single crystal silicon wafer carrier drying device according to claim 1, characterized in that: The sliding assembly comprises a slide groove (4) and a slider (5), two groups of the slide grooves (4) are respectively opened at the bottom of two groups of circular movable plates (3), four groups of sliders (5) are respectively annularly installed on one side of the supporting base plate (2), and each group of the slide grooves (4) is respectively slidably connected to the outer sides of the two groups of sliders (5).
3. The single crystal silicon wafer carrier drying device according to claim 2, characterized in that: A circular support plate (10) is installed between the tops of the multiple groups of support frames (7), and the circular support plate (10) drives the multiple groups of support frames (7) to move synchronously.
4. The single crystal silicon wafer carrier drying device according to claim 1, characterized in that: A plurality of sets of heating rings (12) are embedded and installed on the inner bottom side of the circular carrier (1), and the plurality of sets of heating rings (12) heat and dry the single crystal silicon wafers placed on the circular carrier (1).
5. The single crystal silicon wafer carrier drying device according to claim 4, characterized in that: A circular cover plate (13) is hingedly connected to the top of the circular carrier (1), and the circular cover plate (13) seals the circular carrier (1) to prevent hot air from escaping.
6. The single crystal silicon wafer carrier drying device according to claim 3, characterized in that: Pull rods (11) are respectively installed in an annular shape on the tops of the two groups of circular support plates (10). Pulling the pull rods (11) drives the circular support plates (10) and the support frame (7) installed at the bottom to move upwards.