Temperature control circuit, temperature control equipment and temperature control system
By designing a temperature control circuit including a temperature sensor, an analog-to-digital conversion module, a controller module and a temperature control device, the problem of inefficient temperature control caused by the use of the same target temperature by different temperature adjustable devices in the prior art is solved, and more efficient temperature control is achieved.
Patent Information
- Application Number
- CN202420790072.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-16
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-04-16
AI Technical Summary
When controlling the temperature of different temperature adjustable equipment, existing temperature control devices use the same target temperature, resulting in lower temperature control efficiency.
A temperature control circuit is designed, including a temperature sensor, an analog-to-digital conversion module, a controller module and a temperature control device. The temperature data of the equipment is collected through the temperature sensor, the analog-to-digital conversion module converts the data into a digital signal, the controller module sends control instructions based on the target temperature and the actual temperature, and the temperature control device adjusts the output current to control the temperature of the equipment.
The use of different target temperatures is achieved according to the characteristics of adjustable equipment according to different temperatures, thereby improving the efficiency of temperature control and solving the problem of low temperature control efficiency.
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Figure CN222774774U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of temperature control technology, and in particular to a temperature control circuit, a temperature control device and a temperature control system. Background Art
[0002] During gene sequencing, biochemical incubation, synthesis and other processes are extremely related to temperature, which affects the duration and quality of the final sequencing. Ensuring the stability of the biochemical platform temperature and the timeliness of the temperature rise and fall process are beneficial to effectively shorten the sequencing time and improve the sequencing quality.
[0003] The temperature of temperature-adjustable devices such as biochemical platforms and refrigerators in desktop gene sequencers is a nonlinear, time-varying system. However, in the process of controlling the temperature of temperature-adjustable devices, the temperature control device of the related art uses the same target temperature for different temperature-adjustable devices, resulting in relatively low temperature control efficiency.
[0004] To address the above-mentioned problems, no effective solution has been proposed yet. Utility Model Content
[0005] The embodiments of the present application provide a temperature control circuit, a temperature control device and a temperature control system to at least solve the technical problem of low temperature control efficiency caused by the temperature control device using the same target temperature for different temperature adjustable devices in the process of controlling the temperature of the temperature adjustable device.
[0006] According to one aspect of an embodiment of the present application, a temperature control circuit is provided, comprising: a temperature sensor, an analog-to-digital conversion module, a controller module and a temperature control device, wherein the temperature sensor is respectively connected to a temperature adjustable device and the analog-to-digital conversion module, and is used to collect temperature data of the temperature adjustable device, and send the collected temperature data to the analog-to-digital conversion module; the analog-to-digital conversion module is connected to the controller module, and is used to receive the temperature data sent by the temperature sensor, and convert the temperature data from an analog signal to a digital signal to obtain first temperature data, and send the first temperature data to the controller module; the controller module is connected to the temperature control device, and is used to receive the first temperature data sent by the analog-to-digital conversion module, and send a control instruction to the temperature control device according to the target temperature data to be adjusted of the temperature adjustable device and the first temperature data; the temperature control device is connected to the temperature adjustable device, and is used to receive and respond to the control instruction, and adjust its own output current to control the temperature of the temperature adjustable device.
[0007] Optionally, the first target interface of the controller module is connected to the first channel of the temperature control device; multiple first target pins of the controller module are connected to the second channel of the temperature control device; multiple second target pins of the controller module are connected to the third channel of the temperature control device; and the second target interface of the controller module is connected to the fourth channel of the temperature control device.
[0008] Optionally, the first target interface of the controller module is connected to the first channel of the temperature control device, including: the first pin, the second pin, the third pin, the fourth pin, and the fifth pin in the first target interface are connected to the first channel; multiple first target pins of the controller module are connected to the second channel of the temperature control device, including: the sixth pin, the seventh pin, the eighth pin, the ninth pin, and the tenth pin of the controller module are connected to the second channel; multiple second target pins of the controller module are connected to the third channel of the temperature control device, including: the eleventh pin, the twelfth pin, the thirteenth pin, the fourteenth pin, and the fifteenth pin of the controller module are connected to the third channel; the second target interface of the controller module is connected to the fourth channel of the temperature control device, including: the sixteenth pin, the seventeenth pin, the eighteenth pin, the nineteenth pin, and the twentieth pin in the second target interface are connected to the fourth channel.
[0009] Optionally, when there is one temperature control device, the second channel or the third channel of the temperature control device is connected to the temperature control device; when there are multiple temperature control devices, the second channel and the third channel of the temperature control device are respectively connected to each of the multiple temperature control devices.
[0010] Optionally, the temperature control circuit also includes: a pulse width modulation module, wherein the pulse width modulation module is respectively connected to the controller module and the temperature control device, and is used to receive a control instruction sent by the controller module, and send a pulse signal of a target duty cycle corresponding to the control instruction to the temperature control device, wherein the temperature control device is used to receive and respond to the pulse signal of the target duty cycle, and adjust the output current of the temperature adjustable device to control the temperature of the temperature adjustable device.
[0011] Optionally, the temperature control circuit also includes: a power supply module, which is respectively connected to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module, and is used to supply power to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module.
[0012] Optionally, the temperature control circuit also includes: a clock circuit, which is respectively connected to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module, and is used to provide a clock signal for the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module.
[0013] Optionally, the temperature control circuit further includes: an electrically erasable programmable read-only memory connected to the controller module and used for storing data in the controller module when the controller module is powered off.
[0014] Optionally, the temperature control circuit further includes: a reset circuit connected to the controller module, and used to control the reset state of the controller module during power-on or reset of the controller module.
[0015] Optionally, the temperature control circuit further includes: a filtering module, connected to the temperature sensor and the analog-to-digital conversion module respectively, and used to remove high-frequency noise in the temperature data collected by the temperature sensor.
[0016] According to another aspect of the embodiments of the present application, a temperature control device is provided, including: the above-mentioned temperature control circuit and a temperature control board, wherein the temperature control circuit is arranged on the temperature control board.
[0017] According to another aspect of the embodiment of the present application, a temperature control system is also provided, including: the above-mentioned temperature control device and a temperature adjustable device, wherein the temperature control device is connected to the temperature adjustable device for controlling the temperature of the temperature adjustable device; the temperature adjustable device includes at least one of the following: a biochemical platform and a refrigerator corresponding to a desktop gene sequencer.
[0018] In an embodiment of the present application, a temperature sensor, an analog-to-digital conversion module, a controller module and a temperature control device are used, wherein the temperature sensor is connected to the temperature adjustable device and the analog-to-digital conversion module, respectively, for collecting temperature data of the temperature adjustable device, and sending the collected temperature data to the analog-to-digital conversion module; the analog-to-digital conversion module is connected to the controller module, for receiving the temperature data sent by the temperature sensor, and converting the temperature data from an analog signal to a digital signal to obtain first temperature data, and sending the first temperature data to the controller module; the controller module is connected to the temperature control device, for receiving the first temperature data sent by the analog-to-digital conversion module, and sending a control instruction to the temperature control device according to the target temperature data to be adjusted of the temperature adjustable device and the first temperature data; the temperature control device is connected to the temperature adjustable device, for receiving and responding to the control instruction, adjusting its own output current to control the temperature of the temperature adjustable device, achieving the purpose of using different target temperatures for different temperature adjustable devices, thereby achieving the technical effect of improving the temperature control efficiency of the temperature adjustable device, and thus solving the technical problem of low temperature control efficiency caused by the temperature control device using the same target temperature for different temperature adjustable devices in the process of controlling the temperature of the temperature adjustable device. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0020] Figure 1 is a structural diagram of a temperature control circuit according to an embodiment of the present application;
[0021] Figure 2 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0022] Figure 3 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0023] Figure 4 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0024] Figure 5 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0025] Figure 6 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0026] Figure 7 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0027] Figure 8 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0028] Fig. 9 is a structural diagram of another temperature control circuit according to an embodiment of the present application;
[0029] Fig.10 It is a structural diagram of a temperature control system according to an embodiment of the present application. DETAILED DESCRIPTION
[0030] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.
[0031] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0032] According to an embodiment of the present application, a method embodiment of a temperature control circuit is provided. It should be noted that the steps shown in the structural diagram of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the structural diagram, in some cases, the steps shown or described can be executed in an order different from that shown here.
[0033] Figure 1 is a structural diagram of a temperature control circuit according to an embodiment of the present application, such as Figure 1 As shown, the circuit includes: a temperature sensor 1, an analog-to-digital conversion module 2, a controller module 3 and a temperature control device 4, wherein:
[0034] The temperature sensor 1 is connected to the temperature adjustable device and the analog-to-digital conversion module 2 respectively, and is used for collecting temperature data of the temperature adjustable device and sending the collected temperature data to the analog-to-digital conversion module 2 .
[0035] This embodiment uses a PT100 temperature sensor 1, wherein the PT100 temperature sensor 1 is a resistive temperature detection device with high accuracy, and belongs to a temperature sensor 1 with a positive resistivity. The following are some main technical parameters of the PT100 temperature sensor 1. Technical parameters: PT100 indicates that its resistance value is 100 ohms at 0°C, and its resistance value also increases linearly with the increase of temperature. This relationship can be described by the formula R=R0(1+αT), where R is the resistance value, R0 is the resistance value (100 ohms) at 0°C, α is the temperature coefficient, and T is the temperature. Three-core wire connection method: In order to improve the measurement accuracy and reduce the error caused by the wire resistance, PT100 usually adopts a three-wire connection method. This method can ensure that the voltage drop caused by the wire resistance will not affect the measurement result during long-distance transmission. Tolerance standard: The PT100 temperature sensor 1 has a certain tolerance standard, which means that at a specific temperature, its resistance value will have an allowable error range. Understanding this tolerance is very important for accurately reading the temperature.
[0036] Among them, the temperature sensor 1 is used to collect the temperature of the temperature-adjustable device, such as the biochemical platform and refrigerator corresponding to the desktop gene sequencer. The biochemical platform of the desktop gene sequencer is mainly used for high-throughput gene sequencing. It is the core equipment of gene sequencing and is responsible for reading the information of the DNA sequence. For example, the DNBSEQ E series and the modular digital object laboratory DNBelab D series, these devices are not only small in size and easy to operate, but also can be highly automated, greatly shortening the time from DNA sample to report. The refrigerator of the desktop gene sequencer is used to store and manage samples and reagents. Since biological samples and certain reagents need to be stored under specific temperature conditions to maintain their stability and activity, the refrigerator is an indispensable device in the laboratory. When choosing a refrigerator, it is necessary to consider whether it can provide sufficient storage space and appropriate temperature control.
[0037] In summary, the biochemical platform of the desktop gene sequencer is the key to achieving efficient and accurate gene sequencing, while the refrigerator is an important auxiliary equipment to ensure the stability of samples and reagents. The two together form the basis of gene sequencing, making gene sequencing faster and more convenient, and promoting the development of personalized medicine and life science research. Therefore, it is extremely important to effectively regulate its temperature.
[0038] The analog-to-digital conversion module 2 is connected to the controller module 3 , and is used to receive the temperature data sent by the temperature sensor 1 , and convert the temperature data from an analog signal to a digital signal to obtain first temperature data, and send the first temperature data to the controller module 3 .
[0039] Among them, the analog-to-digital conversion module 2, also known as Analog-to-Digital Converter (ADC), is a device that converts continuous analog signals into discrete digital signals. In detail, the main functions of the analog-to-digital conversion module 2 include the following steps. Sampling: Sampling the analog signal at a certain time interval to obtain a series of discrete signal points in time. Quantization: Mapping the amplitude of each sampling point to the closest digital level, this process will involve a certain quantization error. Encoding: Converting these quantized levels into binary numbers for easy processing and storage by digital systems.
[0040] The analog-to-digital conversion module 2 used in this embodiment can provide highly accurate and stable data conversion functions. The following are some detailed features of the analog-to-digital conversion module 2: Multi-channel input: It has 8 analog input channels and can sample and convert multiple signals at the same time. High resolution: As a 24-bit ADC, it can provide extremely high signal resolution, which means that it can convert analog signals into digital signals with up to 16 million different levels, thereby capturing very small signal changes. Built-in gain: It is equipped with an internal programmable gain amplifier that can provide 8 times gain, which helps to process small signals. Differential input: Supports differential input, that is, receiving signals through two pins (AIN1 and AIN2), which helps to improve the signal's anti-interference ability and reduce noise. Constant current output: Certain pins such as AIN0 and AIN3 provide a constant current output of 250uA for exciting four-wire resistance temperature detectors or other sensors that require constant current drive.
[0041] The controller module 3 is connected to the temperature control device 4 and is used to receive the first temperature data sent by the analog-to-digital conversion module 2, and send a control instruction to the temperature control device 4 according to the target temperature data to be adjusted by the temperature adjustable device and the first temperature data. The controller module 3 is used to receive the first temperature data sent by the analog-to-digital conversion module 2, wherein the controller module 3 stores the target temperature data to be adjusted by the temperature adjustable device. Further, the controller module 3 determines the target parameter according to the first temperature data, determines the error data between the first temperature data and the target temperature data, and sends a control instruction to the temperature control device 4 according to the error data and the target parameter.
[0042] The controller module 3 includes but is not limited to: a microcontroller unit (MCU). Among them, temperature control using a microcontroller unit can be achieved through the following process: Select a temperature sensor 1 that is compatible with the microcontroller unit, such as PT100 or NTC thermistor. Ensure that the output of the sensor can be accurately read by the microcontroller. Connect the temperature sensor 1 correctly to the corresponding input pin of the microcontroller unit. If PT100 is used, a three-wire connection may be required to reduce the influence of wire resistance. If the output of the temperature sensor 1 is an analog signal, configure the analog-to-digital converter (ADC) of the microcontroller unit to read the sensor signal. If it is a digital signal, the corresponding digital interface needs to be configured. According to the temperature value read, the control logic is implemented. For example, if the temperature is too high, the heat sink may need to be started; if the temperature is too low, the heater may need to be started.
[0043] The temperature control device 4 is connected to the temperature adjustable device and is used to receive and respond to control instructions and adjust its own output current to control the temperature of the temperature adjustable device.
[0044] Among them, the temperature control device 4 is, for example, a thermoelectric cooler (TEC), also known as a semiconductor cooler. TEC can achieve continuous and high-precision control of cooling capacity and temperature by adjusting the working voltage and current. It has the advantages of precise temperature control, flexible size, diverse structure and local cooling.
[0045] Figure 2 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 2 As shown,
[0046] The first target interface of the controller module 3 is connected to the first channel 41 of the temperature control device 4;
[0047] A plurality of first target pins of the controller module 3 are connected to the second channel 42 of the temperature control device 4;
[0048] A plurality of second target pins of the controller module 3 are connected to the third channel 43 of the temperature control device 4;
[0049] The second target interface of the controller module 3 is connected to the fourth channel 44 of the temperature control device 4 .
[0050] Figure 3 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 3 As shown,
[0051] The first target interface of the controller module 3 is connected to the first channel 41 of the temperature control device 4 , specifically: the first pin 301 , the second pin 302 , the third pin 303 , the fourth pin 304 , and the fifth pin 305 in the first target interface are connected to the first channel 41 .
[0052] The first pin 301 is used to control the driving chip in the first channel 41 to enter the Sleep mode;
[0053] The second pin 302 is used to issue a current exceeding threshold alarm to the first channel 41 (TEC A channel);
[0054] The third pin 303 is used to indicate a fault of the first channel 41;
[0055] The fourth pin 304 is used to control the PH / IN1 pin of the chip in the first channel 41 through Bridge logic;
[0056] The fifth pin 305 is used to control the EN / IN2 pin of the chip in the first channel 41 through Bridge logic.
[0057] The chip of the embodiment of the present application can be a high-performance H-bridge driver chip for driving DC motors and stepper motors. It has a built-in MOSFET power device that can provide an output current of up to 1.7A and has low power consumption and thermal protection functions. The chip uses advanced PWM control technology to achieve fast and accurate motor control and has rich protection functions, including over-current, over-voltage and over-temperature protection.
[0058] Multiple first target pins of the controller module 3 are connected to the second channel 42 of the temperature control device 4 , specifically: the sixth pin 306 , the seventh pin 307 , the eighth pin 308 , the ninth pin 309 , and the tenth pin 310 of the controller module 3 are connected to the second channel 42 .
[0059] The sixth pin 306 is used to control the PH / IN1 pin of the chip in the first channel 41 through Bridge logic;
[0060] The seventh pin 307 is used to control the EN / IN2 pin of the chip in the first channel 41 through Bridge logic;
[0061] The eighth pin 308 is used to give an alarm for a current exceeding a threshold value for the second channel 42 (TEC B channel);
[0062] The ninth pin 309 is used to indicate a fault of the second channel 42;
[0063] The tenth pin 310 is used to control the driving chip in the second channel 42 to enter the sleep mode.
[0064] Multiple second target pins of the controller module 3 are connected to the third channel 43 of the temperature control device 4 , specifically: the eleventh pin 311 , the twelfth pin 312 , the thirteenth pin 313 , the fourteenth pin 314 , and the fifteenth pin 315 of the controller module 3 are connected to the third channel 43 .
[0065] The eleventh pin 311 is used to control the PH / IN1 pin of the chip in the third channel 43 through Bridge logic;
[0066] The twelfth pin 312 is used to control the EN / IN2 pin of the chip in the third channel 43 through Bridge logic;
[0067] The thirteenth pin 313 is used to control the driving chip in the third channel 43 to enter the sleep mode;
[0068] The fourteenth pin 314 is used to issue a current exceeding threshold alarm to the third channel 43 (TEC C channel);
[0069] The fifteenth pin 315 is used to indicate a fault of the first channel 41 .
[0070] The second target interface of the controller module 3 is connected to the fourth channel 44 of the temperature control device 4 , specifically: the sixteenth pin 316 , the seventeenth pin 317 , the eighteenth pin 318 , the nineteenth pin 139 , and the twentieth pin 320 in the second target interface are connected to the fourth channel 44 .
[0071] The sixteenth pin 316 is used to control the PH / IN1 pin of the chip in the fourth channel 44 through Bridge logic;
[0072] The seventeenth pin 317 is used to control the EN / IN2 pin of the chip in the fourth channel 44 through Bridge logic;
[0073] The eighteenth pin 318 is used to control the driving chip in the fourth channel 44 to enter the sleep mode;
[0074] The nineteenth pin 139 is used to give a current over-threshold alarm to the fourth channel 44 (TEC D channel);
[0075] The twentieth pin 320 is used to indicate a fault of the fourth channel 44 .
[0076] In some preferred embodiments, when there is only one temperature control device 4 , the second channel 42 or the third channel 43 of the temperature control device 4 is connected to the temperature control device 4 .
[0077] When there are multiple temperature control devices 4 , the second channel 42 and the third channel 43 of the temperature control device 4 are respectively connected to each of the multiple temperature control devices 4 .
[0078] For example, when the temperature control device 4 is a refrigerator, the second channel 42 of the temperature control device 4 is connected to the refrigerator. When the temperature control device 4 is a refrigerator and a biochemical platform, the second channel 42 of the temperature control device 4 is connected to the refrigerator, and the third channel 43 of the temperature control device 4 is connected to the biochemical platform.
[0079] Figure 4 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 4 As shown, the temperature control circuit also includes: a pulse width modulation module 5,
[0080] Among them, the pulse width modulation module 5 is connected to the controller module 3 and the temperature control device 4 respectively, and is used to receive the control instructions sent by the controller module 3, and send a pulse signal of the target duty cycle corresponding to the control instructions to the temperature control device 4, wherein the temperature control device 4 is used to receive and respond to the pulse signal of the target duty cycle, adjust the output current of the temperature adjustable device, so as to control the temperature of the temperature adjustable device.
[0081] The pulse width modulation module (PWM) is used to control the width of the pulse signal in the circuit, thereby realizing the regulation and control of the circuit. The pulse width modulation module 5 can be composed of a pulse generator and a comparator, and can adjust the amplitude and frequency of the output signal by changing the duty cycle of the pulse.
[0082] Figure 5 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 5 As shown, the temperature control circuit also includes: a power supply module 6, wherein:
[0083] The power module 6 is respectively connected to the temperature sensor 1 , the analog-to-digital conversion module 2 , the controller module 3 and the pulse width modulation module 5 , and is used to supply power to the temperature sensor 1 , the analog-to-digital conversion module 2 , the controller module 3 and the pulse width modulation module 5 .
[0084] Figure 6 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 6 As shown, the temperature control circuit also includes: a clock circuit 7, wherein:
[0085] The clock circuit 7 is respectively connected to the temperature sensor 1 , the analog-to-digital conversion module 2 , the controller module 3 and the pulse width modulation module 5 , and is used to provide a clock signal for the temperature sensor 1 , the analog-to-digital conversion module 2 , the controller module 3 and the pulse width modulation module 5 .
[0086] It is understood that the clock circuit is a circuit used to generate and control a time signal. The clock circuit 7 can be composed of an oscillator, a frequency divider, a counter, etc., and is used to generate a stable clock signal to synchronize and control the operation of other circuits. The clock circuit can be used to synchronize the operation of processors, memories, interfaces, and other peripheral devices to ensure that they can work in a predetermined time sequence.
[0087] Figure 7 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 7 As shown, the temperature control circuit also includes: an electrically erasable programmable read-only memory 8, wherein:
[0088] The electrically erasable programmable read-only storage is connected to the controller module 3 and is used to store data in the controller module 3 when the controller module 3 is powered off.
[0089] Among them, Electrically Erasable Programmable Read-Only Memory (EEPROM) is a memory that can be erased and reprogrammed by electronic signals. EEPROM is a non-volatile memory, which means it can retain data even when the power is off. EEPROM is used to store device configuration information, firmware updates, and other data that needs to be stored for a long time and can be reprogrammed.
[0090] Figure 8 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Figure 8 As shown, the temperature control circuit also includes: a reset circuit 9, wherein:
[0091] The reset circuit 9 is connected to the controller module 3 and is used to control the reset state of the controller module 3 when the controller module 3 is powered on or reset.
[0092] Among them, the reset circuit is an electronic circuit used to restore a circuit or system to an initial state. The reset circuit 9 can be used to reset a microprocessor, an integrated circuit, or other digital circuits. The reset circuit 9 may include a trigger or a switch, which, when the trigger condition is met, restores the output state of the circuit to a predetermined initial state. The reset circuit 9 plays an important role in digital systems to ensure that the system can operate normally at startup.
[0093] Fig. 9 is a structural diagram of another temperature control circuit according to an embodiment of the present application, such as Fig. 9 As shown, the temperature control circuit further includes: a filter module 10, wherein:
[0094] The filter module 10 is connected to the temperature sensor 1 and the analog-to-digital conversion module 2 respectively, and is used to remove high-frequency noise in the temperature data collected by the temperature sensor 1 .
[0095] The filter module 10 is, for example, a high-frequency filter, which removes the high-frequency part of the signal so that the output signal only contains low-frequency components. The performance indicators of the high-frequency filter include passband width, attenuation characteristics, impedance matching, etc.
[0096] In some optional embodiments of the present application, a temperature control device 1001 is further provided, comprising: Figures 1 to 9 The temperature control circuit and the temperature control board are shown, wherein the temperature control circuit is arranged on the temperature control board.
[0097] Fig.10 1 is a structural diagram of a temperature control system according to an embodiment of the present application, comprising: the above-mentioned temperature control device 1001 and the temperature adjustable device 1002, wherein:
[0098] The temperature control device 1001 is connected to the temperature adjustable device 1002 and is used to control the temperature of the temperature adjustable device 1002;
[0099] The temperature-adjustable device 1002 includes at least one of the following: a biochemical platform and a refrigerator corresponding to a desktop gene sequencer.
[0100] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.
[0101] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.
[0102] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.
[0103] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.
[0104] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.
[0105] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the relevant technology or all or part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk, etc. Various media that can store program codes.
[0106] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A temperature control circuit, characterized in that: include: A temperature sensor, an analog-to-digital conversion module, a controller module, and a temperature control device, wherein: The temperature sensor is connected to the temperature adjustable device and the analog-to-digital conversion module respectively, and is used to collect temperature data of the temperature adjustable device and send the collected temperature data to the analog-to-digital conversion module; The analog-to-digital conversion module is connected to the controller module, and is used to receive the temperature data sent by the temperature sensor, and convert the temperature data from an analog signal to a digital signal to obtain first temperature data, and send the first temperature data to the controller module; The controller module is connected to the temperature control device and is used to receive the first temperature data sent by the analog-to-digital conversion module, and send a control instruction to the temperature control device according to the target temperature data to be adjusted by the temperature adjustable device and the first temperature data; The temperature control device is connected to the temperature adjustable device and is used to receive and respond to the control instruction and adjust its own output current to control the temperature of the temperature adjustable device; Among them, the first target interface of the controller module is connected to the first channel of the temperature control device; the multiple first target pins of the controller module are connected to the second channel of the temperature control device; the multiple second target pins of the controller module are connected to the third channel of the temperature control device; the second target interface of the controller module is connected to the fourth channel of the temperature control device.
2. The temperature control circuit according to claim 1, characterized in that: The first target interface of the controller module is connected to the first channel of the temperature control device, including: A first pin, a second pin, a third pin, a fourth pin, and a fifth pin in the first target interface are connected to the first channel; A plurality of first target pins of the controller module are connected to a second channel of the temperature control device, including: The sixth pin, the seventh pin, the eighth pin, the ninth pin and the tenth pin of the controller module are connected to the second channel; The plurality of second target pins of the controller module are connected to the third channel of the temperature control device, including: The eleventh pin, the twelfth pin, the thirteenth pin, the fourteenth pin and the fifteenth pin of the controller module are connected to the third channel; The second target interface of the controller module is connected to the fourth channel of the temperature control device, including: The sixteenth pin, the seventeenth pin, the eighteenth pin, the nineteenth pin, and the twentieth pin in the second target interface are connected to the fourth channel.
3. The temperature control circuit according to claim 2, characterized in that: include: In the case where there is only one temperature control device, the second channel or the third channel of the temperature control device is connected to the temperature control device; In the case that there are a plurality of the temperature control devices, the second channel and the third channel of the temperature control device are respectively connected to each of the plurality of the temperature control devices.
4. The temperature control circuit according to claim 1, characterized in that: The temperature control circuit also includes: a pulse width modulation module, wherein the pulse width modulation module is connected to the controller module and the temperature control device respectively, and is used to receive the control instruction sent by the controller module, and send a pulse signal of a target duty cycle corresponding to the control instruction to the temperature control device, wherein the temperature control device is used to receive and respond to the pulse signal of the target duty cycle, and adjust the output current of the temperature adjustable device to control the temperature of the temperature adjustable device.
5. The temperature control circuit according to claim 4, characterized in that: The temperature control circuit also includes: a power supply module, which is respectively connected to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module, and is used to supply power to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module.
6. The temperature control circuit according to claim 4, characterized in that: The temperature control circuit also includes: a clock circuit, which is respectively connected to the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module, and is used to provide a clock signal for the temperature sensor, the analog-to-digital conversion module, the controller module and the pulse width modulation module.
7. The temperature control circuit according to claim 1, characterized in that: The temperature control circuit further comprises: an electrically erasable programmable read-only memory connected to the controller module and used for storing data in the controller module when the controller module is powered off.
8. The temperature control circuit according to claim 1, characterized in that: The temperature control circuit further includes: a reset circuit connected to the controller module, and configured to control the reset state of the controller module during power-on or reset of the controller module.
9. The temperature control circuit according to any one of claims 1 to 8, characterized in that: The temperature control circuit further includes: a filtering module, which is connected to the temperature sensor and the analog-to-digital conversion module respectively, and is used to remove high-frequency noise in the temperature data collected by the temperature sensor.
10. A temperature control device, characterized in that: include: The temperature control circuit and temperature control board according to any one of claims 1 to 9, wherein the temperature control circuit is arranged on the temperature control board.
11. A temperature control system, characterized in that: include: The temperature control device and the temperature adjustable device according to claim 10, wherein: The temperature control device is connected to the temperature adjustable device and is used to control the temperature of the temperature adjustable device; The temperature-adjustable device includes at least one of the following: a biochemical platform and a refrigerator corresponding to a desktop gene sequencer.
Citation Information
Cited By
Temperature control system and method
CN120993996A