Heat dissipation case with high heat consumption

Abstract

The utility model relates to the technical field of electronic communication, and discloses a heat dissipation case with high heat consumption, which comprises a case, a cover plate, a power supply module, an optical power amplification module and a comprehensive control circuit box, and the power supply module, the optical power amplification module and the comprehensive control circuit box are all mounted in the case. The optical power amplification module and the comprehensive control circuit box are powered by the power supply module, the optical power amplification module is used for executing electric signals of the comprehensive control circuit box, the TEC refrigeration sheet is tightly pressed in the casing through the optical power amplification module, the voltage and the current of the TEC refrigeration sheet are controlled by the TEC driving box, and the TEC driving box is used for driving the TEC refrigeration sheet to rotate. And the TEC driving box and the comprehensive control circuit box are arranged on one side of the optical power amplification module in parallel. The beneficial effects of the utility model are that the cabinet employs the TEC refrigeration sheet to achieve the temperature control of the optical power amplification module, and compared with a liquid cooling mode which needs a liquid cooling source, the cabinet reduces the equipment cost and the space size demand, and is better in applicability.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic communications, in particular to a heat dissipation chassis with high heat consumption. Background Art

[0002] With the development of optical communication, the communication distance and communication rate requirements are getting higher and higher, which makes the heat consumption power of the optical power amplifier module installed in the front-end chassis also increase. The optical power amplifier module has strict requirements on the working temperature. It can only ensure the output stability and the quality of optical communication within a small temperature range under normal temperature. In order to maintain the optical power amplifier module within a stable working temperature range, a liquid cooling interface is often designed on the front-end chassis, and the optical power amplifier module is cooled by liquid cooling, such as the Chinese utility model patent (authorization announcement number: CN210143205U Name: A chassis for electronic communication), but the liquid cooling method needs to be used with a cooling liquid cooling source, which increases the cost of the equipment, and the installation space required for the cooling liquid cooling source is not small, which is not suitable for highly integrated equipment with requirements for size and space. Utility Model Content

[0003] The utility model aims to provide a heat dissipation chassis with high heat consumption to overcome the shortcomings of the prior art.

[0004] The purpose of the utility model is achieved through the following technical solutions: a heat dissipation chassis with high heat consumption, including a casing, a cover, a power module, an optical power amplifier module and an integrated control circuit box, the cover can be detachably installed on the casing, the power module, the optical power amplifier module and the integrated control circuit box are all installed in the casing, the optical power amplifier module and the integrated control circuit box are powered by the power module, the optical power amplifier module is used to execute the electrical signal of the integrated control circuit box, and also includes a TEC cooling plate and a TEC drive box, the TEC cooling plate is pressed tightly in the casing through the optical power amplifier module, the voltage and current of the TEC cooling plate are controlled by the TEC drive box, and the TEC drive box and the integrated control circuit box are arranged in parallel on one side of the optical power amplifier module.

[0005] Preferably, an air cooling chamber is provided at the bottom of the casing, an installation chamber is provided on the side wall of the casing, the installation chamber is opened and closed by the cover plate, the air cooling chamber is communicated with the installation chamber, an air outlet is provided on the side wall of the installation chamber, and a cross-flow fan is installed in the installation chamber.

[0006] Preferably, a heat insulation board is provided at the bottom of the optical power amplification module, a through slot is formed on the heat insulation board, and the TEC cooling sheet is stuck in the through slot.

[0007] Preferably, a plurality of mutually parallel partition plates are arranged in the air cooling cavity, and the partition plates are used to divide the air cooling cavity into a plurality of air ducts, and the air ducts are connected with the installation cavity.

[0008] Preferably, a thermistor is embedded in the thermal insulation board, and thermal information collected by the thermistor is received by the TEC driving box.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] This chassis uses TEC cooling sheet to realize the temperature control of the optical power amplifier module. Compared with the liquid cooling method, which requires a liquid cooling source, it reduces the equipment cost and space requirement and has better applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the utility model;

[0012] Figure 2 It is an explosion diagram of the utility model;

[0013] Figure 3 This is a schematic diagram of the installation structure of the TEC driver box;

[0014] In the figure, 1-housing, 2-cover plate, 3-optical power amplifier module, 4-integrated control circuit box, 5-TEC cooling sheet, 6-TEC driving box, 7-air cooling cavity, 8-installation cavity, 9-air outlet, 10-cross flow fan, 11-heat insulation board, 12-partition board, 13-thermistor. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0017] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0018] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0019] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, or the positions or positional relationships commonly understood by those skilled in the art, which are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] like Figure 1-3 As shown, a heat dissipation chassis with high heat consumption includes a casing 1, a cover plate 2, a power module, an optical power amplifier module 3 and an integrated control circuit box 4. The cover plate 2 can be detachably installed on the casing 1, and the power module, the optical power amplifier module 3 and the integrated control circuit box 4 are all installed in the casing 1. The optical power amplifier module 3 and the integrated control circuit box 4 are powered by the power module. The optical power amplifier module 3 is used to execute the electrical signal of the integrated control circuit box 4. It also includes a TEC cooling plate 5 and a TEC driving box 6. The TEC cooling plate 5 is tightly pressed in the casing 1 through the optical power amplifier module 3. The voltage and current of the TEC cooling plate 5 are controlled by the TEC driving box 6. The TEC driving box 6 and the integrated control circuit box 4 are arranged in parallel on one side of the optical power amplifier module 3. This chassis adopts the TEC cooling plate 5 to realize the temperature control of the optical power amplifier module 3. Compared with the liquid cooling control which requires a liquid cooling source, the equipment cost and space size requirement are reduced, and it has better applicability.

[0022] In this embodiment, if Figure 2As shown, a heat insulation board 11 is provided at the bottom of the optical power amplification module 3, and a through groove is opened on the heat insulation board 11, and the TEC cooling plate 5 is stuck in the through groove. Since the side of the TEC cooling plate 5 that is in contact with the optical power amplification module 3 is a cold side, and the side that is in contact with the bottom of the casing 1 is a hot side, the cold and hot sides of the TEC cooling plate 5 can be isolated by the heat insulation board 11 to prevent heat from being reversely conducted to the optical power amplification module 3.

[0023] In this embodiment, if Figure 2 and 3 As shown, an air cooling chamber 7 is provided at the bottom of the casing 1, and an installation chamber 8 is provided on the side wall of the casing 1. The installation chamber 8 is opened and closed by a cover plate 2, and the air cooling chamber 7 is connected with the installation chamber 8. An air outlet 9 is provided on the side wall of the installation chamber 8. A cross-flow fan 10 is installed in the installation chamber 8 to force heat dissipation at the bottom of the casing 1 and quickly take away the absorbed heat, thereby avoiding the bottom temperature rising, causing the internal temperature of the casing to rise, thereby affecting the operation of the optical power amplifier module 3.

[0024] In this embodiment, if Figure 2 and 3 As shown, a plurality of mutually parallel partition plates 12 are arranged in the air cooling chamber 7, and the partition plates 12 are used to divide the air cooling chamber 7 into a plurality of air ducts, and the air ducts are connected with the installation chamber 8. The scientific layout design can realize efficient heat dissipation under the same fan static pressure.

[0025] In this embodiment, if Figure 2 As shown, a thermistor 13 is embedded in the thermal insulation board 11. The thermal information collected by the thermistor 13 is received by the TEC driver box 6 to monitor the temperature of the optical power amplifier module 3 in real time, so that the TEC driver box 6 can adjust the voltage and current of the output TEC cooling plate 5 in real time, thereby achieving the purpose of controlling the TEC cooling capacity.

[0026] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipation chassis for high heat consumption, comprising a housing (1), a cover plate (2), a power module, an optical power amplifier module (3) and an integrated control circuit box (4), wherein the cover plate (2) is detachably mounted on the housing (1), the power module, the optical power amplifier module (3) and the integrated control circuit box (4) are all mounted in the housing (1), the optical power amplifier module (3) and the integrated control circuit box (4) are powered by the power module, and the optical power amplifier module (3) is used to execute an electrical signal of the integrated control circuit box (4), characterized in that: It also comprises a TEC cooling sheet (5) and a TEC driving box (6); the TEC cooling sheet (5) is pressed tightly into the housing (1) through the optical power amplification module (3); the voltage and current of the TEC cooling sheet (5) are controlled by the TEC driving box (6); the TEC driving box (6) and the integrated control circuit box (4) are arranged in parallel on one side of the optical power amplification module (3).

2. A high heat dissipation heat dissipation chassis according to claim 1, characterized in that: An air cooling chamber (7) is provided at the bottom of the casing (1), an installation chamber (8) is provided on the side wall of the casing (1), the installation chamber (8) is opened and closed by the cover plate (2), the air cooling chamber (7) is communicated with the installation chamber (8), an air outlet (9) is provided on the side wall of the installation chamber (8), and a cross-flow fan (10) is installed in the installation chamber (8).

3. A high heat dissipation heat dissipation chassis according to claim 1, characterized in that: A heat insulation board (11) is provided at the bottom of the optical power amplification module (3), a through slot is provided on the heat insulation board (11), and the TEC cooling sheet (5) is stuck in the through slot.

4. A high heat dissipation heat dissipation chassis according to claim 2, characterized in that: A plurality of mutually parallel partition plates (12) are arranged in the air cooling chamber (7), and the partition plates (12) are used to divide the air cooling chamber (7) into a plurality of air ducts, and the air ducts are connected to the installation chamber (8).

5. A high heat dissipation heat dissipation chassis according to claim 3, characterized in that: A thermistor (13) is embedded in the heat insulation board (11), and thermal information collected by the thermistor (13) is received by the TEC drive box (6).

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