Quick temperature control device for overall system of server

Abstract

The rapid temperature control device for the overall system of the server comprises a shell, a heat dissipation assembly, a refrigeration module and a control system, and the heat dissipation assembly, the refrigeration module and the control system are arranged in the shell. The refrigeration module comprises a TEC refrigeration sheet, the upper surface of the TEC refrigeration sheet is a heating surface, and the lower surface of the TEC refrigeration sheet is a refrigeration surface; wherein the refrigeration surface of the TEC refrigeration sheet is attached to the upper surface of the cold guide plate, and the lower surface of the cold guide plate is attached to the CPU; the heating surface of the TEC refrigeration sheet is connected with the heat dissipation assembly; the heat dissipation assembly comprises a heat dissipation cover plate covering the top of the shell and a heat conduction block in the shell, and the heat dissipation cover plate and the shell form a closed space; and the heat conduction block is connected with the refrigeration module. According to the utility model, the installation space is greatly reduced, and the device has high heat exchange performance; the response speed is high, and the noise pollution is reduced while the system energy consumption is reduced. The refrigeration module comprises a refrigeration sheet and has the advantages of being compact in size, small in power, low in cost, free of vibration and high in environmental adaptability.

Description

Technical Field

[0001] The utility model relates to a server system rapid temperature control device based on PID control and TEC integration. Background Art

[0002] Since the electronic components inside the server will generate a lot of heat when running for a long time and at high load, whether the heat generated can be transferred to the outside in time is directly related to the stability of the server operation. The server's cooling system directly affects the performance, stability and reliability of the server. A good cooling system can ensure that the temperature inside the server is kept within a safe range, thereby protecting the hardware from overheating. Currently, the common server cooling methods are air cooling and liquid cooling. However, traditional air cooling and liquid cooling methods are inefficient and take up space, and the disassembly and assembly steps are complicated. Utility Model Content

[0003] The technical problem to be solved by the utility model is: how to meet the high-efficiency cooling requirements of the CPU (central processing unit) and memory, which are high-power-consuming heating elements inside the server, and provide a rapid temperature control device for the overall server system.

[0004] The technical solution of the utility model is specifically as follows:

[0005] A rapid temperature control device for the overall server system, comprising a housing and a heat dissipation component, a refrigeration module and a control system arranged in the housing; the refrigeration module comprises a TEC refrigeration sheet, the upper surface of the TEC refrigeration sheet is a heating surface, and the lower surface is a cooling surface; wherein the cooling surface of the TEC refrigeration sheet is bonded to the upper surface of the cold conduction plate, and the lower surface of the cold conduction plate is bonded to the CPU; the heating surface of the TEC refrigeration sheet is connected to the heat dissipation component;

[0006] The heat dissipation component comprises a heat dissipation cover plate covering the top of the shell and a heat conduction block in the shell, wherein the heat dissipation cover plate and the shell form a closed space; the heat conduction block is connected to the refrigeration module.

[0007] A thermal insulation board is provided between the heating surface and the cooling surface of the TEC refrigeration plate.

[0008] The refrigeration module is a metal plate.

[0009] The heat dissipation cover plate comprises a base plate, heat dissipation fins are arranged above the base plate, and a pre-buried heat pipe groove is arranged below the base plate.

[0010] The heat conductive block comprises a heat absorbing section and a heat dissipating section, wherein the heat absorbing section and the heat dissipating section are connected via a memory bar heat dissipating heat pipe; and the heat absorbing section, the heat dissipating section and the memory bar heat dissipating heat pipe are all composed of copper-water heat pipes; wherein the heat absorbing section is located at the bottom, and the heat absorbing section is arranged in a heat pipe groove on the heating surface of the refrigeration module; the heat dissipating section of the heat pipe is passed through the heat dissipating cover plate of the heat dissipating assembly; and a memory bar heat dissipating heat pipe is laid on the memory bar.

[0011] The bottom of the heat absorbing section of the heat pipe is a flat surface, and the flat surface is flush with the lower end of the heat pipe groove.

[0012] The heat pipes for dissipating the memory stick are arranged vertically, and the heat pipe heat dissipation sections are arranged horizontally, and the two form an L shape.

[0013] The beneficial effects of the utility model are as follows: the utility model greatly reduces the installation space, and the device has high heat exchange performance; the response speed is fast, and noise pollution is reduced while reducing system energy consumption. The refrigeration module contains a refrigeration plate, which has the characteristics of compact size, low power, low cost, no vibration and strong environmental adaptability. By transmitting the cold energy generated by the refrigeration surface of the semiconductor refrigeration plate to the CPU for heat dissipation, the heat dissipation requirements of high-performance CPU overclocking or long-term high-load work can be met. The utility model ensures the operating temperature of major components such as the CPU and memory, thereby ensuring the stability, reliability and performance of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the appearance diagram of the utility model;

[0015] Figure 2 It is the internal structure diagram of the utility model;

[0016] Figure 3 It is the structural diagram of the heat dissipation cover;

[0017] Figure 4 This is a structural diagram of the heat conductive block. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] like Figure 1 , Figure 2As shown, the server overall system rapid temperature control device includes a housing 2 and a heat dissipation component 1, a refrigeration module 3 and a control system 4 arranged in the housing; the refrigeration module 3 includes a TEC refrigeration plate, the upper surface of the TEC refrigeration plate is a heating surface, and the lower surface is a cooling surface; wherein the cooling surface of the TEC refrigeration plate is attached to the upper surface of the cold conduction plate, and the lower surface of the cold conduction plate is attached to the CPU, and the cold generated by the cooling surface is transmitted to the CPU through the cold conduction plate to dissipate heat for the CPU; the heating surface of the TEC refrigeration plate is connected to the heat dissipation component 1. Furthermore, the cold conduction plate used in the refrigeration module 3 can be a metal plate.

[0020] The heat dissipation assembly 1 includes a heat dissipation cover plate 11 covering the top of the housing 2 and a heat conduction block 12 in the housing 2, wherein the heat dissipation cover plate 11 and the housing 2 form a closed space and place the server inside. The heat conduction block 12 is connected to the refrigeration module 3. A thermal insulation board 13 is provided between the heating surface and the cooling surface of the TEC refrigeration plate, and the thermal insulation board 13 isolates the heat exchange between the cold and hot surfaces to a certain extent.

[0021] like Figure 3 As shown, the heat dissipation cover plate 11 includes a base plate 113 , heat dissipation fins 112 are arranged above the base plate 113 , and a pre-buried heat pipe groove 111 is arranged below the base plate 113 .

[0022] like Figure 4 As shown, the heat conducting block 12 includes a heat pipe heat absorbing section 123 and a heat pipe heat dissipating section 121, and the heat pipe heat absorbing section 123 and the heat pipe heat dissipating section 121 are connected through a memory bar heat dissipating heat pipe 122; and the heat pipe heat absorbing section 123, the heat pipe heat dissipating section 121 and the memory bar heat dissipating heat pipe 122 are all composed of copper water heat pipes. Among them, the heat pipe heat absorbing section 123 is located at the bottom, and the heat pipe heat absorbing section 123 is arranged in the heat pipe groove of the heating surface of the refrigeration module 3; the heat pipe heat dissipating section 121 is penetrated in the heat dissipating cover plate 11 of the heat dissipating component 1, specifically, the heat pipe heat dissipating section 121 is located in the pre-buried heat pipe groove 111 of the heat dissipating cover plate 11 to improve the temperature uniformity. At the same time, a memory bar heat dissipating heat pipe 122 is laid on the memory bar, which is beneficial to the heat dissipation of the memory bar.

[0023] Furthermore, the bottom of the heat pipe heat absorption section 123 is a flat surface, and the flat surface is flush with the lower end of the heat pipe groove, which can increase the contact area between the copper-water heat pipe and the heating surface of the TEC refrigeration plate and reduce thermal resistance.

[0024] Furthermore, the memory bar heat dissipation heat pipe 122 is arranged vertically, and the heat pipe heat dissipation section 121 is arranged horizontally, and the two form an L shape to achieve heat dissipation.

[0025] Furthermore, the heating surface of the TEC refrigeration plate is fitted with the heat pipe absorption section 123 of the heat conductive block 12 in the heat dissipation component 1, and thermal conductive material is applied on the contact surface of the two, and the heat is assisted by the heat dissipation component 1; the cooling surface of the TEC refrigeration plate is fixedly connected to the upper surface of the cold conduction plate, and thermal conductive material is applied on the contact surface of the two.

[0026] The control system 4 includes a temperature sensor and a temperature control system, wherein the temperature control system is connected to the TEC refrigeration plate through a power output line and is connected to the temperature sensor through a signal line; the temperature sensor's temperature measurement point is set at the edge of the lower surface of the cooling block, and the temperature sensor mainly realizes the temperature collection function during operation. The temperature sensor is mainly used to collect relevant test signals during the test process and provide data support to the corresponding control system.

[0027] The temperature control system and its control panel realize the start and stop, alarm, equipment operation and equipment data display and collection functions of the server overall system rapid temperature control device complete equipment.

[0028] The utility model is a rapid temperature control device for the entire server system designed based on a semiconductor refrigeration sheet, and the temperature control of the device is achieved through a semiconductor refrigeration sheet. The advantages of the utility model are that the installation space is greatly reduced, and the device has high heat exchange performance; the response speed is fast, and noise pollution is reduced while reducing system energy consumption. The refrigeration module of the product contains a refrigeration sheet, which has the characteristics of compact size, low power, low cost, no vibration and strong environmental adaptability. By transmitting the cold energy generated by the cooling surface of the semiconductor refrigeration sheet to the CPU for heat dissipation, the heat dissipation requirements of high-performance CPU overclocking or long-term high-load work can be met. The utility model ensures the operating temperature of major components such as the CPU and memory, thereby ensuring the stability, reliability and performance of the server.

[0029] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. The server overall system rapid temperature control device is characterized by: A rapid temperature control device for a server overall system comprises a housing (2) and a heat dissipation component (1), a refrigeration module (3) and a control system (4) arranged in the housing; the refrigeration module (3) comprises a TEC refrigeration sheet, the upper surface of the TEC refrigeration sheet being a heating surface and the lower surface being a cooling surface; wherein the cooling surface of the TEC refrigeration sheet is bonded to the upper surface of a cooling plate, and the lower surface of the cooling plate is bonded to a CPU; the heating surface of the TEC refrigeration sheet is connected to the heat dissipation component (1); The heat dissipation assembly (1) comprises a heat dissipation cover plate (11) covering the top of the outer shell (2) and a heat conduction block (12) inside the outer shell (2), wherein the heat dissipation cover plate (11) and the outer shell (2) form a closed space; and the heat conduction block (12) is connected to the refrigeration module (3).

2. The server overall system rapid temperature control device according to claim 1, characterized in that: A thermal insulation plate (13) is provided between the heating surface and the cooling surface of the TEC refrigeration plate.

3. The server overall system rapid temperature control device according to claim 1, characterized in that: The refrigeration module (3) is a metal plate.

4. The server overall system rapid temperature control device according to claim 1, characterized in that: The heat dissipation cover plate (11) comprises a base plate (113), heat dissipation fins (112) are arranged above the base plate (113), and a pre-buried heat pipe groove (111) is arranged below the base plate (113).

5. The server overall system rapid temperature control device according to claim 1, characterized in that: The heat conducting block (12) comprises a heat pipe heat absorbing section (123) and a heat pipe heat dissipating section (121), wherein the heat pipe heat absorbing section (123) and the heat pipe heat dissipating section (121) are connected via a memory bar heat dissipating heat pipe (122); and the heat pipe heat absorbing section (123), the heat pipe heat dissipating section (121) and the memory bar heat dissipating heat pipe (122) are all composed of copper water heat pipes; wherein the heat pipe heat absorbing section (123) is located at the bottom, and the heat pipe heat absorbing section (123) is arranged in a heat pipe groove on the heating surface of the refrigeration module (3); the heat pipe heat dissipating section (121) is arranged in the heat dissipating cover plate (11) of the heat dissipating assembly (1); and a memory bar heat dissipating heat pipe (122) is laid on the memory bar.

6. The server overall system rapid temperature control device according to claim 5, characterized in that: The bottom of the heat pipe heat absorption section (123) is a flat surface, and the flat surface is flush with the lower end of the heat pipe groove.

7. The server overall system rapid temperature control device according to claim 5, characterized in that: The memory bar heat dissipation heat pipe (122) is arranged vertically, and the heat pipe heat dissipation section (121) is arranged horizontally, and the two form an L shape.

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