Chip negative pressure fixing device

Abstract

The utility model provides a chip negative pressure fixing device, and relates to the field of chip processing equipment. The device comprises a slide glass platform, a negative pressure cavity is formed in the slide glass platform, a plurality of negative pressure holes are formed in the upper end face of the slide glass platform, a connector is arranged at the bottom of the slide glass platform, and the negative pressure cavity is communicated with the negative pressure holes and the connector; in the plurality of negative pressure holes, the positions of at least a part of the negative pressure holes correspond to the positions of chip holes in a substrate used for mounting a chip; during application, after all chips are put into the chip holes in the substrate, air exhaust is carried out through the joint, and negative pressure is formed among the negative pressure cavity, the plurality of negative pressure holes and the chip holes instantly, so that the chips are adsorbed on the chip holes, and the chips and the substrate are firmly fixed on the chip carrying platform; compared with a mode of fixing the chip on the substrate in a gluing mode in the prior art, the device is simple in structure and low in cost, and the processing efficiency can be greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of chip processing equipment, in particular to a chip negative pressure fixing device. Background Art

[0002] Smart cards mainly include contact smart cards and contactless smart cards. The existing chip buried winding and soldering process of contactless smart cards is mainly as follows: a hole is punched on the sheet material at the position where the chip is placed in each winding card unit, glue is applied around the hole by a glue-applying mechanism, the chip is placed in the hole by a chip loading mechanism, the base of the chip contacts the glue, and the chip is glued to the sheet material; then the wire is wound on the sheet material, and the two ends of the formed coil are respectively located directly above the soldering feet of the chip; finally, the chip and the coil are soldered and fixed by a soldering mechanism.

[0003] In the above process, in order to fix the chip, a glue mechanism is used to assist. Although the chip can be fixed, it also has the following shortcomings:

[0004] 1. The use of glue to fix the chip requires an additional set of supply mechanisms and glue spraying mechanisms, which makes the equipment structure more complicated and larger in size, and also increases the equipment cost.

[0005] 2. The gluing process is added, and it is necessary to wait for the gluing mechanism to complete a series of operations such as moving, gluing and resetting. The process is more complicated and will reduce work efficiency.

[0006] 3. Since the glue is a fluid and it takes a certain amount of time to solidify, it is necessary to spend extra time waiting for the glue to solidify and the chip to be fixed before the next step can be performed, further reducing work efficiency. Utility Model Content

[0007] The utility model aims to provide a chip negative pressure fixing device, so as to solve the problems of complicated process and low processing efficiency in the prior art of fixing the chip on the plate by gluing.

[0008] Based on the above purpose, the chip negative pressure fixing device provided by the present application includes a wafer carrier platform, a negative pressure cavity is arranged inside the wafer carrier platform, a plurality of negative pressure holes are arranged on the upper end surface of the wafer carrier platform, a joint is arranged at the bottom of the wafer carrier platform, and the negative pressure cavity is respectively connected with the negative pressure holes and the joint;

[0009] Among the plurality of negative pressure holes, positions of at least some of the negative pressure holes correspond to positions of chip holes on a substrate for mounting chips.

[0010] Furthermore, a plurality of negative pressure holes are evenly distributed on the wafer carrier platform at preset intervals.

[0011] Furthermore, the connector is located in the middle of the slide platform.

[0012] Furthermore, the connector is connected to the negative pressure pump through a pipeline.

[0013] Furthermore, the connector is a quick-insert connector.

[0014] Furthermore, the negative pressure hole is configured as a stepped hole, including a first through hole at the top and a second through hole at the bottom, the diameter of the first through hole is larger than the diameter of the second through hole, and a filter is provided on the stepped surface at the bottom of the first through hole, the diameter of the filter is larger than the diameter of the second through hole.

[0015] By adopting the above technical solution, the chip negative pressure fixing device provided by the present application has the following technical effects compared with the prior art:

[0016] A negative pressure chamber is arranged inside the wafer carrier platform, a plurality of negative pressure holes are arranged on the upper end surface of the wafer carrier platform, a joint is arranged at the bottom of the wafer carrier platform, and the negative pressure chamber is respectively connected with the negative pressure holes and the joint; among the plurality of negative pressure holes, the positions of at least a part of the negative pressure holes correspond to the positions of the chip holes on the substrate for mounting the chip; when in use, after all the chips are placed at the chip hole positions on the substrate, air is evacuated through the joint, and negative pressure is instantly formed between the negative pressure chamber, the plurality of negative pressure holes and the chip hole, thereby adsorbing the chip on the chip hole, so that the chip and the substrate are firmly fixed on the wafer carrier platform. Compared with the method of fixing the chip on the substrate by gluing in the prior art, the device has a simple structure and low cost, and can greatly improve the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a schematic structural diagram of a chip negative pressure fixing device provided in an embodiment of the present application;

[0019] Figure 2 yes Figure 1 The enlarged view of point A in the middle;

[0020] Figure 3 It is a schematic diagram of the assembly of the chip negative pressure fixing device and the substrate provided in an embodiment of the present application.

[0021] Icon: 100 - wafer carrier platform; 110 - negative pressure chamber; 120 - negative pressure hole; 121 - first through hole; 122 - second through hole; 200 - connector; 300 - substrate; 310 - chip hole; 400 - filter. DETAILED DESCRIPTION

[0022] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] The chip negative pressure fixing device provided in the embodiment of the present application can realize rapid fixing of the substrate and the chip, is stable and reliable, and has the characteristics of simple structure and low cost.

[0026] like Figure 1 , Figure 2 and Figure 3 As shown, the chip negative pressure fixing device provided in the embodiment of the present application includes a wafer carrier platform 100, and the wafer carrier platform 100 can be rectangular, square, circular or other shapes, and is adapted according to the use scenario;

[0027] A negative pressure chamber 110 is disposed inside the wafer carrier platform 100, a plurality of negative pressure holes 120 are disposed on the upper end surface of the wafer carrier platform 100, a joint 200 is disposed at the bottom of the wafer carrier platform 100, and the negative pressure chamber 110 is connected to the negative pressure holes 120 and the joint 200 respectively;

[0028] Among the plurality of negative pressure holes 120 , positions of at least a portion of the negative pressure holes 120 correspond to positions of chip holes 310 on the substrate 300 for mounting chips.

[0029] When used, a hole is punched on the substrate 300 to form a chip hole 310 for placing a chip, and the chip hole 310 runs through the substrate 300;

[0030] After all the chips are placed at the chip hole 310 on the substrate 300, air is evacuated through the joint 200, and negative pressure is instantly formed between the negative pressure chamber 110, the multiple negative pressure holes 120 and the chip hole 310, so that the chip is adsorbed on the chip hole 310, and the chip and the substrate 300 are firmly fixed on the carrier platform 100. Compared with the method of fixing the chip on the substrate 300 by gluing in the prior art, the device has a simple structure and low cost, and can greatly improve the processing efficiency.

[0031] As a preferred embodiment, a plurality of negative pressure holes 120 are evenly distributed on the wafer carrier platform 100 at a preset interval, so that a uniform adsorption force can be applied to the substrate 300 to ensure the stability of the position of the substrate 300 in subsequent processes.

[0032] As a preferred embodiment, the connector 200 is located in the middle of the wafer carrier platform 100 , that is, the connector 200 is located in the middle of the negative pressure chamber 110 to provide a better negative pressure effect and ensure a certain balance of the negative pressure of each negative pressure hole 120 .

[0033] As a preferred embodiment, the connector 200 is connected to a negative pressure pump through a pipeline so as to provide negative pressure by drawing air through the negative pressure pump.

[0034] As a preferred embodiment, the connector 200 is a quick-connect connector 200, which is convenient for plugging and installing with the pipeline.

[0035] As a preferred embodiment, the negative pressure hole 120 is set as a stepped hole, which includes a first through hole 121 at the top and a second through hole 122 at the bottom, the diameter of the first through hole 121 is larger than the diameter of the second through hole 122, and a filter 400 is set on the stepped surface at the bottom of the first through hole 121, and the diameter of the filter 400 is larger than the diameter of the second through hole 122. In this solution, the purpose of setting the filter 400 is to prevent the upper end surface of the wafer carrier platform 100 and the debris carried on the substrate 300 from being sucked into the second through hole 122 and the negative pressure chamber 110, causing the second through hole 122 and the negative pressure chamber 110 to be blocked.

[0036] In summary, the chip negative pressure fixing device provided in the embodiment of the present application has at least the following advantages:

[0037] 1. The substrate 300 and the chip are fixed by synchronous negative pressure, which has a simpler structure and low production cost.

[0038] 2. After the chip is placed into the chip hole 310 of the substrate 300, the chip is instantly adsorbed on the chip hole 310 by negative pressure, so that the chip is fixed very quickly and the work efficiency is effectively improved.

[0039] 3. The synchronous negative pressure fixing method is adopted, and the chip can be fixed directly without waiting time, which further improves the work efficiency.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A chip negative pressure fixing device, characterized in that: The slide platform comprises a negative pressure chamber provided inside the slide platform, a plurality of negative pressure holes are provided on the upper end surface of the slide platform, a joint is provided at the bottom of the slide platform, and the negative pressure chamber is connected with the negative pressure holes and the joint respectively; Among the plurality of negative pressure holes, positions of at least some of the negative pressure holes correspond to positions of chip holes on a substrate for mounting chips.

2. The chip negative pressure fixing device according to claim 1, characterized in that: A plurality of negative pressure holes are evenly distributed on the wafer carrier platform according to preset intervals.

3. The chip negative pressure fixing device according to claim 1, characterized in that: The connector is located in the middle of the wafer carrier platform.

4. The chip negative pressure fixing device according to claim 1, characterized in that: The joint is connected to the negative pressure pump through a pipeline.

5. The chip negative pressure fixing device according to claim 1, characterized in that: The connector is a quick-insert connector.

6. The chip negative pressure fixing device according to claim 1, characterized in that: The negative pressure hole is configured as a stepped hole, including a first through hole at the top and a second through hole at the bottom, the diameter of the first through hole is larger than the diameter of the second through hole, and a filter is provided on the stepped surface at the bottom of the first through hole, the diameter of the filter is larger than the diameter of the second through hole.

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