Positioning installation structure for integrated circuit cover plate

Abstract

The utility model relates to the technical field of integrated circuit cover plates, in particular to a positioning installation structure for an integrated circuit cover plate. The technical problem is that a common positioning and mounting structure is realized by using positioning holes and positioning columns, some positioning holes are pre-designed on a chip, several corresponding positioning columns are pre-processed on a cover plate, and the positioning columns are inserted into the corresponding positioning holes, so that accurate alignment of positions and postures can be realized in this way, and the positioning and mounting efficiency is improved. However, the possibility that the positioning columns are damaged is caused once the positioning columns are vibrated or bumped; according to the technical scheme, the positioning and mounting structure for the integrated circuit cover plate comprises a main body bottom plate, a mounting assembly, a limiting assembly, a protection assembly, a positioning assembly, a fixing assembly and a cover plate assembly, according to the utility model, through the arrangement of the protection structure, when the cover plate is installed and the positioning columns are inserted into the corresponding positioning holes, the protection structure can be used for buffering and damping, so that the vibration or bumping of the integrated circuit is reduced, and the possibility of damage is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit cover plates, in particular to a positioning and mounting structure for integrated circuit cover plates. Background Art

[0002] An integrated circuit cover is a component used to protect and encapsulate integrated circuits. It is a thin sheet, usually made of plastic or ceramic, with a special design that can accommodate one or more integrated circuit chips. The main function of the integrated circuit cover is to provide mechanical protection and environmental isolation to ensure the normal operation and long-term stability of the circuit. The integrated circuit cover is designed to provide electrical insulation, thermal conductivity and mechanical support. It usually has metal pins or pads for connecting the integrated circuit chip and the external circuit. The wires on the cover are for pin connection and signal transmission on the circuit board. For more complex integrated circuits, multiple covers may be required to accommodate multiple chips, which can be interconnected on the cover. The integrated circuit cover can also provide heat dissipation by installing heat sinks or other heat dissipation elements on the cover to effectively dissipate heat to maintain the normal temperature of the circuit. In short, the integrated circuit cover plays an important role in protection and sealing. The positioning and installation structure plays an important role in installing and optimizing integrated circuits, ensuring the reliability and stability of the circuit. The purpose of using a positioning and installation structure for an integrated circuit cover is to ensure that the cover is accurately aligned and fixed on the integrated circuit chip during the installation process. The positioning and installation structure can ensure that the position and posture of the cover relative to the chip are accurate, which is very important for protecting the chip and improving the stability and reliability of the circuit. However, in the prior art, a common positioning and installation structure is achieved by using positioning holes and positioning columns. Some positioning holes are pre-designed on the integrated circuit chip, and several corresponding positioning columns are pre-processed on the cover. During the installation of the cover, the positioning columns are inserted into the corresponding positioning holes. In this way, accurate position and posture alignment can be achieved. This positioning and installation structure is very simple, but once it is vibrated or bumped, the positioning columns may be damaged, which will affect the use of the integrated circuit chip. Utility Model Content

[0003] In order to overcome the problem in the prior art that the common positioning and installation structure is realized by using positioning holes and positioning posts, some positioning holes are pre-designed on the integrated circuit chip, and several corresponding positioning posts are pre-processed on the cover plate. During the installation of the cover plate, the positioning posts are inserted into the corresponding positioning holes. In this way, accurate position and posture alignment can be achieved. This positioning and installation structure is very simple, but once it is vibrated or bumped, the positioning posts may be damaged, which will affect the use of the integrated circuit chip.

[0004] The technical solution of the utility model is: a positioning and mounting structure for an integrated circuit cover plate, comprising a main body bottom plate, a mounting assembly, a limit assembly, a protection assembly, a positioning assembly, a fixing assembly and a cover plate assembly, the top surface of the main body bottom plate is provided with a mounting assembly, the interior of the mounting assembly is provided with a limit assembly, the top surface of the limit assembly is provided with a protection assembly, the top surface of the protection assembly is provided with a positioning assembly, the surface of the mounting assembly is provided with a fixing assembly, and the top surface of the positioning assembly is provided with a cover plate assembly.

[0005] Preferably, the load is borne by the main body bottom plate, the integrated circuit board is installed by the installation assembly, the integrated circuit board is limited and fixed by the limiting assembly, the damage caused by vibration is alleviated by the protection assembly, the integrated circuit cover plate is positioned and installed by the positioning assembly, the integrated circuit cover plate is fixed by the fixing assembly, and the overall circuit chip is protected by the cover plate assembly to prevent dust accumulation on the chip.

[0006] Preferably, the installation component includes a main body mounting block, a chip mounting groove, a mounting column limiting groove and a screw hole. The main body mounting block is provided on the top surface of the main body base plate, a chip mounting groove is provided inside the main body mounting block, mounting column limiting grooves are equidistantly provided at the four corners of the main body mounting block, and screw holes are equidistantly provided on both sides of the main body mounting block. When in use, the chip mounting groove is installed on the surface of the main body base plate through the main body mounting block, the integrated circuit board is installed through the chip mounting groove, the integrated circuit cover plate is installed through the mounting column limiting groove, and the integrated circuit cover plate is fixed through the screw holes.

[0007] Preferably, the limiting assembly includes a chip mounting block, a chip placement groove and a fixing groove. The surface of the chip mounting groove is provided with a chip mounting block, the surface of the chip mounting block is provided with a chip placement groove, and the surface of the chip mounting block is provided with fixing grooves equidistantly. When in use, the chip placement groove is installed on the surface of the chip mounting groove through the chip mounting block, the integrated circuit board is limited by the chip placement groove, and the integrated circuit board is fixed by the fixing groove.

[0008] Preferably, the protection component includes a protective steel plate, a No. 1 heat dissipation slot, a spring gasket and a shock-absorbing spring. The surface of the chip mounting block is provided with a protective steel plate, and the surface of the protective steel plate is provided with a No. 1 heat dissipation slot at equal intervals. Spring gaskets are provided at the four corners of the top surface of the protective steel plate, and the top surface of the spring gasket is provided with a shock-absorbing spring. When in use, the No. 1 heat dissipation slot is installed on the surface of the chip mounting block through the protective steel plate, and the integrated circuit board is cooled through the No. 1 heat dissipation slot. The shock-absorbing spring is installed on the surface of the protective steel plate through the spring gasket, and the damage caused by vibration is alleviated by the shock-absorbing spring.

[0009] Preferably, the positioning assembly includes a fixing plate, a No. 2 heat dissipation slot and a fixing column. The top surface of the shock-absorbing spring is provided with a fixing plate, the surface of the fixing plate is provided with No. 2 heat dissipation slots equidistantly, and the four corners of the bottom of the fixing plate are provided with fixing columns equidistantly. When in use, the No. 2 heat dissipation slot is installed on the top surface of the shock-absorbing spring through the fixing plate, the integrated circuit board is cooled through the No. 2 heat dissipation slot, and the integrated circuit cover is installed and fixed through the fixing column.

[0010] Preferably, the fixing assembly includes a surround, fixing slots and fixing screws. The surround is arranged on the outside of the main mounting block, fixing slots are provided on both sides of the surround, and fixing screws are provided inside the fixing slots. When in use, the integrated circuit cover is covered on the base plate through the surround, and the fixing screws are installed through the fixing slots, and the integrated circuit cover is fixed to the base plate through the fixing screws.

[0011] Preferably, the cover plate assembly includes a protective cover plate and a No. 3 heat dissipation slot hole. The top surface of the enclosure is provided with a protective cover plate, and the top surface of the protective cover plate is provided with a No. 3 heat dissipation slot hole. When in use, the No. 3 heat dissipation slot hole is installed on the top surface of the enclosure through the protective cover plate, and the integrated circuit board is cooled through the No. 3 heat dissipation slot hole.

[0012] Beneficial effects of the utility model:

[0013] 1. In the prior art, a common positioning and mounting structure is realized by using positioning holes and positioning posts. Some positioning holes are pre-designed on the integrated circuit chip, and several corresponding positioning posts are pre-processed on the cover plate. During the installation of the cover plate, the positioning posts are inserted into the corresponding positioning holes. In this way, accurate position and posture alignment can be achieved. This positioning and mounting structure is very simple, but once it is subjected to vibration or bumps, the positioning posts may be damaged, which will affect the use of the integrated circuit chip. The positioning and mounting structure for the integrated circuit cover plate is provided with a protective structure. When the positioning posts are inserted into the corresponding positioning holes during the installation of the cover plate, the protective structure is used for buffering and shock absorption, thereby reducing the vibration or bumps on the integrated circuit and reducing the possibility of damage.

[0014] 2. When using the positioning and mounting structure for the integrated circuit cover, the No. 1 heat dissipation slot is installed on the surface of the chip mounting block through the protective steel plate, the integrated circuit board is cooled through the No. 1 heat dissipation slot, and the shock absorbing spring is installed on the surface of the protective steel plate through the spring gasket, and the shock absorbing spring is used to alleviate the damage caused by vibration;

[0015] 3. Install the No. 2 heat dissipation slot on the top surface of the shock-absorbing spring through the fixing plate, dissipate the heat of the integrated circuit board through the No. 2 heat dissipation slot, install and fix the integrated circuit cover through the fixing column, cover the integrated circuit cover on the bottom plate through the enclosure, install the fixing screws through the fixing slot, and fix the integrated circuit cover and the bottom plate through the fixing screws. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 What is shown is a first three-dimensional structural schematic diagram of a positioning and mounting structure for an integrated circuit cover plate of the utility model;

[0017] Figure 2 The second three-dimensional structure schematic diagram of a positioning and mounting structure for an integrated circuit cover plate of the utility model is shown;

[0018] Figure 3 The following is a schematic diagram of a three-dimensional structure of a positioning and mounting structure for an integrated circuit cover plate of the utility model;

[0019] Figure 4 What is shown is a partial three-dimensional structural schematic diagram of a positioning and mounting structure for an integrated circuit cover plate of the utility model;

[0020] Explanation of the reference numerals: 1. main body bottom plate; 2. mounting assembly; 3. limiting assembly; 4. protection assembly; 5. positioning assembly; 6. fixing assembly; 7. cover assembly; 201. main body mounting block; 202. chip mounting slot; 203. mounting column limiting slot; 204. screw hole; 301. chip mounting block; 302. chip placement slot; 303. fixing slot; 401. protection steel plate; 402. heat dissipation slot hole No. 1; 403. spring gasket; 404. shock-absorbing spring; 501. fixing plate; 502. heat dissipation slot hole No. 2; 503. fixing column; 601. enclosure; 602. fixing slot hole; 603. fixing screw; 701. protection cover plate; 702. heat dissipation slot hole No. 3. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1 The utility model provides an embodiment: a positioning and mounting structure for an integrated circuit cover plate, comprising a main body bottom plate 1, a mounting component 2, a limiting component 3, a protective component 4, a positioning component 5, a fixing component 6 and a cover plate component 7, the top surface of the main body bottom plate 1 is provided with the mounting component 2, the interior of the mounting component 2 is provided with the limiting component 3, the top surface of the limiting component 3 is provided with the protective component 4, the top surface of the protective component 4 is provided with the positioning component 5, the surface of the mounting component 2 is provided with the fixing component 6, and the top surface of the positioning component 5 is provided with the cover plate component 7.

[0023] See also Figure 2-4 In this embodiment, the mounting assembly 2 includes a main body mounting block 201, a chip mounting groove 202, a mounting column limiting groove 203 and a screw hole 204. The main body bottom plate 1 is provided with a main body mounting block 201 on the top surface, the main body mounting block 201 is provided with a chip mounting groove 202 inside, the four corners of the main body mounting block 201 are provided with mounting column limiting grooves 203 at equal intervals, and the two sides of the main body mounting block 201 are provided with screw holes 204 at equal intervals. When in use, the chip mounting groove 202 is mounted on the surface of the main body bottom plate 1 through the main body mounting block 201, the integrated circuit board is mounted through the chip mounting groove 202, the integrated circuit cover is mounted through the mounting column limiting groove 203, and the integrated circuit cover is fixed through the screw hole 204. The limiting assembly 3 includes a chip mounting block 301, a chip placement groove 302 and a fixing notch 303. The surface of the chip mounting groove 202 is provided with a chip mounting block 301, the surface of the chip mounting block 301 is provided with a chip placement groove 302, and the surface of the chip mounting block 301 is provided with a fixing notch 303 at equal intervals. The notch 303 is used to install the chip placement slot 302 on the surface of the chip installation slot 202 through the chip installation block 301, and the integrated circuit board is limited by the chip placement slot 302, and the integrated circuit board is fixed by the fixing notch 303. The protection component 4 includes a protection steel plate 401, a No. 1 heat dissipation slot hole 402, a spring gasket 403 and a shock absorbing spring 404. The surface of the chip installation block 301 is provided with a protection steel plate 401, and the surface of the protection steel plate 401 is equidistantly provided with The first heat dissipation slot 402 and the four corners of the top surface of the protective steel plate 401 are all provided with spring washers 403, and the top surface of the spring washers 403 is provided with shock-absorbing springs 404. When in use, the first heat dissipation slot 402 is installed on the surface of the chip mounting block 301 through the protective steel plate 401, and the integrated circuit board is cooled through the first heat dissipation slot 402. The shock-absorbing springs 404 are installed on the surface of the protective steel plate 401 through the spring washers 403, and the damage caused by vibration is alleviated by the shock-absorbing springs 404;

[0024] The positioning component 5 includes a fixing plate 501, a No. 2 heat dissipation slot hole 502 and a fixing column 503. The top surface of the shock-absorbing spring 404 is provided with a fixing plate 501. The surface of the fixing plate 501 is provided with No. 2 heat dissipation slot holes 502 at equal intervals. The bottom four corners of the fixing plate 501 are provided with fixing columns 503 at equal intervals. When in use, the No. 2 heat dissipation slot hole 502 is installed on the top surface of the shock-absorbing spring 404 through the fixing plate 501, and the integrated circuit board is cooled through the No. 2 heat dissipation slot hole 502. The integrated circuit cover plate is installed and fixed through the fixing column 503. The fixing component 6 includes a surrounding plate 601, a fixing slot hole 602 and a fixing screw 603. The outside of the main mounting block 201 is provided with a surrounding plate 601. The surrounding plate Fixing slots 602 are provided on both sides of 601, and fixing screws 603 are provided inside the fixing slots 602. When in use, the integrated circuit cover is covered on the base plate through the enclosure 601, and the fixing screws 603 are installed through the fixing slots 602. The integrated circuit cover is fixed to the base plate through the fixing screws 603. The cover assembly 7 includes a protective cover 701 and a No. 3 heat dissipation slot 702. The top surface of the enclosure 601 is provided with a protective cover 701, and the top surface of the protective cover 701 is provided with a No. 3 heat dissipation slot 702. When in use, the No. 3 heat dissipation slot 702 is installed on the top surface of the enclosure 601 through the protective cover 701, and the integrated circuit board is cooled by the No. 3 heat dissipation slot 702.

[0025] When working, first, the chip mounting slot 202 is mounted on the surface of the main body bottom plate 1 through the main body mounting block 201, the integrated circuit board is mounted through the chip mounting slot 202, the integrated circuit cover is mounted through the mounting column limiting slot 203, the integrated circuit cover is fixed through the screw hole 204, the chip placement slot 302 is mounted on the surface of the chip mounting slot 202 through the chip mounting block 301, the integrated circuit board is limited through the chip placement slot 302, the integrated circuit board is fixed through the fixing notch 303, the No. 1 heat dissipation slot hole 402 is mounted on the surface of the chip mounting block 301 through the protective steel plate 401, the integrated circuit board is cooled through the No. 1 heat dissipation slot hole 402, the shock absorbing spring 404 is mounted on the surface of the protective steel plate 401 through the spring gasket 403, and the shock absorbing spring 404 is used to alleviate the damage caused by vibration;

[0026] Then, the No. 2 heat dissipation slot 502 is installed on the top surface of the shock-absorbing spring 404 through the fixing plate 501, the integrated circuit board is cooled through the No. 2 heat dissipation slot 502, the integrated circuit cover is installed and fixed through the fixing column 503, the integrated circuit cover is covered on the bottom plate through the enclosure 601, the fixing screws 603 are installed through the fixing slot 602, the integrated circuit cover and the bottom plate are fixed through the fixing screws 603, the No. 3 heat dissipation slot 702 is installed on the top surface of the enclosure 601 through the protective cover 701, and the integrated circuit board is cooled through the No. 3 heat dissipation slot 702.

[0027] Through the above steps, the main body bottom plate 1 bears the weight, the integrated circuit board is installed through the installation component 2, the integrated circuit board is limited and fixed through the limiting component 3, the damage caused by vibration is alleviated through the protection component 4, the integrated circuit cover plate is positioned and installed through the positioning component 5, the integrated circuit cover plate is fixed through the fixing component 6, and the overall circuit chip is protected by the cover plate component 7 to prevent dust accumulation on the chip.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A positioning and mounting structure for an integrated circuit cover, comprising a main body bottom plate (1); characterized in that: The invention also comprises a mounting assembly (2), a limiting assembly (3), a protection assembly (4), a positioning assembly (5), a fixing assembly (6) and a cover assembly (7); the top surface of the main body bottom plate (1) is provided with the mounting assembly (2); the interior of the mounting assembly (2) is provided with the limiting assembly (3); the top surface of the limiting assembly (3) is provided with the protection assembly (4); the top surface of the protection assembly (4) is provided with the positioning assembly (5); the surface of the mounting assembly (2) is provided with the fixing assembly (6); and the top surface of the positioning assembly (5) is provided with the cover assembly (7).

2. The positioning and mounting structure for an integrated circuit cover according to claim 1, characterized in that: The mounting assembly (2) comprises a main body mounting block (201), a chip mounting groove (202), a mounting column limiting groove (203) and a screw hole (204); the main body mounting block (201) is arranged on the top surface of the main body bottom plate (1); the chip mounting groove (202) is provided inside the main body mounting block (201); the mounting column limiting grooves (203) are equidistantly provided at four corners of the main body mounting block (201); and screw holes (204) are equidistantly provided on both sides of the main body mounting block (201).

3. The positioning and mounting structure for an integrated circuit cover according to claim 2, characterized in that: The limiting component (3) comprises a chip mounting block (301), a chip placement groove (302) and a fixing groove (303); the surface of the chip mounting groove (202) is provided with the chip mounting block (301); the surface of the chip mounting block (301) is provided with the chip placement groove (302); and the surface of the chip mounting block (301) is provided with fixing grooves (303) at equal intervals.

4. The positioning and mounting structure for an integrated circuit cover according to claim 3, characterized in that: The protection component (4) comprises a protection steel plate (401), a No. 1 heat dissipation slot hole (402), a spring gasket (403) and a shock absorbing spring (404); the surface of the chip mounting block (301) is provided with the protection steel plate (401); the No. 1 heat dissipation slot holes (402) are equidistantly arranged on the surface of the protection steel plate (401); spring gaskets (403) are arranged at four corners of the top surface of the protection steel plate (401); and the top surface of the spring gasket (403) is provided with a shock absorbing spring (404).

5. The positioning and mounting structure for an integrated circuit cover according to claim 4, characterized in that: The positioning assembly (5) comprises a fixing plate (501), a second heat dissipation slot hole (502) and a fixing column (503); the fixing plate (501) is arranged on the top surface of the shock absorbing spring (404); the second heat dissipation slot holes (502) are equidistantly provided on the surface of the fixing plate (501); and the fixing columns (503) are equidistantly provided at the four corners of the bottom of the fixing plate (501).

6. The positioning and mounting structure for an integrated circuit cover according to claim 4, characterized in that: The fixing assembly (6) comprises a panel (601), a fixing slot hole (602) and a fixing screw (603); the panel (601) is arranged outside the main body mounting block (201); the fixing slot holes (602) are provided on both sides of the panel (601); and the fixing screws (603) are arranged inside the fixing slot holes (602).

7. The positioning and mounting structure for an integrated circuit cover according to claim 6, characterized in that: The cover plate assembly (7) comprises a protective cover plate (701) and a number three heat dissipation slot hole (702); the top surface of the enclosure plate (601) is provided with the protective cover plate (701), and the top surface of the protective cover plate (701) is provided with a number three heat dissipation slot hole (702).

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