Semiconductor integrated circuit packaging structure

Abstract

The utility model relates to the related technical field of semiconductors, and discloses a semiconductor integrated circuit packaging structure, which comprises a substrate and a semiconductor main body, a protective shell is sleeved on the outer side of the semiconductor main body, a sleeve shell is arranged at the lower part of the center of the outer side wall of the protective shell, and four sealing devices are arranged on the upper end surface of the sleeve shell in a rectangular manner. Fixing devices are arranged at the front-back positions of the centers of the two side walls of the sleeve shell and the two sides of the centers of the front end face and the rear end face of the sleeve shell, a first through groove is formed in the lower portion of the center of the interior of the protection shell, a plurality of first through holes are formed in the center of the lower inner wall of the first through groove in a rectangular mode, and a second through groove is formed in the upper portion of the center of the interior of the protection shell. According to the utility model, through the arrangement of the fixing device, the sleeve shell and the substrate can be conveniently and rapidly assembled and disassembled by a worker, the integrated circuit can be easily replaced or upgraded, the downtime of equipment can be reduced, the service life of the equipment can be prolonged, and the convenience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to semiconductors, and in particular to a semiconductor integrated circuit packaging structure. Background Art

[0002] A semiconductor integrated circuit is a tiny electronic device made of semiconductor materials. It integrates a large number of electronic components such as transistors, resistors, capacitors, etc. on a small and unified chip. During the production process, a semiconductor integrated circuit packaging structure is required to package it.

[0003] When using today's semiconductor integrated circuit packaging structures, it is difficult for workers to quickly load and unload the casing, making it difficult to replace or upgrade the integrated circuit, thereby increasing equipment downtime and shortening the service life of the equipment, reducing convenience. During the use of the semiconductor integrated circuit packaging structure, it is easy for local overheating to cause damage or affect the normal operation of the equipment, thereby reducing the heat dissipation performance. Therefore, technical personnel in this field provide a semiconductor integrated circuit packaging structure to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings existing in the prior art, and a semiconductor integrated circuit packaging structure is proposed. Through the setting of a fixing device, it is convenient for the staff to quickly load and unload its shell and substrate, and it can easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving convenience. Then, through the coordinated use of the first through groove and the second through groove, it satisfies the multi-layer packaging structure of its semiconductor body, which can disperse its heat source, reduce local hot spots, and avoid damage caused by local overheating. Then, through the heat conduction plate and the heat dissipation fins, it realizes the heat dissipation effect, thereby improving the heat dissipation performance. Finally, through the setting of the sealing device, it satisfies the sealing between the substrate and the shell, avoiding the existence of a gap so that dust can enter and affect the normal operation of the semiconductor body, thereby improving the sealing effect.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor integrated circuit packaging structure, comprising a substrate and a semiconductor body, the semiconductor body is arranged at the center of the upper end surface of the substrate, a protective shell is provided on the outer side of the semiconductor body, a sleeve shell is provided at the lower center of the outer wall of the protective shell, the upper end surface of the sleeve shell is arranged in a rectangular shape and is provided with four sealing devices, the center of the two side walls of the sleeve shell and the two sides of the center of the front and rear end surfaces are provided with fixing devices, a heat conducting plate is provided at the center of the upper end surface of the protective shell, a heat dissipation fin is provided at the center of the upper end surface of the heat conducting plate, a first through groove is provided at the lower center of the protective shell, a plurality of first through holes are arranged in a rectangular shape at the center of the lower inner wall of the first through groove, a plurality of second through holes are arranged in a rectangular shape at the center of the upper inner wall of the first through groove, and a second through groove is provided at the upper center of the protective shell;

[0006] Through the above technical solution, by setting up the fixing device, it is convenient for the staff to quickly load and unload the casing and the substrate, and it is possible to easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving convenience.

[0007] Further, the sealing device includes two bolts, a first groove, a second groove, a rubber block and a piston, the two bolts are respectively arranged at the front and rear of the upper end surface of the casing, the first groove is arranged at the center of the lower end surface of the casing, the two bolt ends pass through the casing to the inside of the first groove, and are threadedly sleeved with the casing, the second groove is arranged at the upper end surface of the base plate, the rubber block is arranged at the ends of the two bolts, and is rotatably connected with the two bolts through a bearing, the rubber block is sleeved inside the first groove and the second groove, the piston is sleeved on the outer side wall of the rubber block, and the first groove and the second groove are correspondingly arranged;

[0008] Through the above technical solution, the rubber block is driven to move by rotating the bolt, and then the rubber block is connected to the first groove and the second groove through the sleeve, and then the first groove and the second groove are sealed by the piston, so as to avoid the existence of gaps to allow dust to enter and affect the normal operation of the semiconductor body, thereby improving the sealing effect.

[0009] Further, the fixing device comprises an insert block, two sliders, two slide grooves and two semicircular grooves, the insert block is arranged at the outer side wall of the casing, and the end portion sequentially passes through the casing and the base plate to the inside of the base plate, the two slide grooves are respectively arranged at one side of the center of the upper and lower end surfaces of the insert block, the two sliders are respectively slidably connected inside the two slide grooves, and are fixedly connected to the insert block, the two semicircular grooves are respectively arranged at the upper and lower centers of the inner side walls of the two slide grooves, and the two sliders are respectively slidably connected between the two semicircular grooves;

[0010] Through the above technical scheme, the sliding connection between the slider and the slide groove is used to satisfy the connection between the shell and the substrate, and then the slider is driven by the rotating plug block to slide into the semicircular groove, and then the semicircular groove is used to limit the slider, so that the shell and the substrate are fixed, which makes it convenient for the staff to quickly load and unload the shell and the substrate, and can easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving convenience.

[0011] Furthermore, the casing is a frame with a lower opening, and is sleeved on the upper end surface of the substrate;

[0012] Through the above technical solution, the sleeve shell of the lower opening frame is sleeved on the upper end surface of the base plate, making it convenient for the staff to quickly load and unload it.

[0013] Furthermore, the heat conducting plate sequentially passes through the protective shell and the second through groove to the inside of the second through groove;

[0014] Through the above technical solution, the penetration of the heat conducting plate enables the heat conducting plate to better absorb the heat inside the second through groove, and then dissipate the heat through the heat dissipation fins, thereby improving the heat dissipation performance.

[0015] Furthermore, the plurality of first through holes respectively penetrate the protective shell and the end surface of the protective shell, and the plurality of second through holes respectively penetrate the protective shell and the second through groove in sequence to the inside of the second through groove;

[0016] Through the above technical solution, by penetrating the first through hole, it is possible to conduct the heat inside the protective shell to the inside of the first through groove, and then by penetrating the second through hole, it is possible to conduct the heat inside the first through groove to the inside of the second through groove, thereby realizing heat conduction.

[0017] The utility model has the following beneficial effects:

[0018] 1. In the utility model, when the semiconductor integrated circuit packaging structure is used, the setting of the fixing device makes it convenient for the staff to quickly load and unload its casing and substrate, and can easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving convenience.

[0019] 2. In the utility model, the first through groove and the second through groove are used in coordination to meet the multi-layer packaging structure of the semiconductor body, which can disperse the heat source, reduce local hot spots, and avoid damage caused by local overheating. The heat dissipation effect is achieved through the heat conduction plate and the heat dissipation fins, thereby improving the heat dissipation performance.

[0020] 3. In the utility model, the sealing device is provided to meet the sealing between the substrate and the casing, and the gap is prevented from causing dust to enter and affect the normal operation of the semiconductor body, thereby improving the sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of a semiconductor integrated circuit packaging structure proposed by the utility model;

[0022] Figure 2 A front cross-sectional view of a semiconductor integrated circuit packaging structure proposed by the utility model;

[0023] Figure 3 for Figure 2 The enlarged schematic diagram of point A in the middle;

[0024] Figure 4 for Figure 2 A magnified schematic diagram of point B in the middle.

[0025] Legend:

[0026] 1. Substrate; 2. Semiconductor body; 3. Protective shell; 4. Shell; 5. Sealing device; 501. Bolt; 502. First groove; 503. Second groove; 504. Rubber block; 505. Piston; 6. Fixing device; 601. Insert block; 602. Slider; 603. Slide groove; 604. Semicircular groove; 7. Heat conducting plate; 8. Heat dissipating fin; 9. First through groove; 10. First through hole; 11. Second through hole; 12. Second through groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-4The utility model provides an embodiment: a semiconductor integrated circuit packaging structure, including a substrate 1 and a semiconductor body 2, the semiconductor body 2 is arranged at the center of the upper end surface of the substrate 1, a protective shell 3 is provided on the outer side of the semiconductor body 2, a sleeve shell 4 is provided at the lower center of the outer wall of the protective shell 3, and the upper end surface of the sleeve shell 4 is arranged in a rectangular shape and is provided with four sealing devices 5. Through the setting of the sealing device 5, it satisfies the sealing between the substrate 1 and the sleeve shell 4, and avoids the existence of a gap so that dust enters and affects the normal operation of the semiconductor body 2, thereby improving the sealing effect. Fixing devices 6 are provided at the front and rear centers of the two side walls of the sleeve shell 4 and at the two sides of the centers of the front and rear end surfaces. Through the setting of the fixing device 6, it is convenient for the staff to quickly load and unload the sleeve shell 4 and the substrate 1, and it can realize the easy replacement or upgrade of the integrated circuit, which can reduce the downtime of the equipment and extend the service life of the equipment, thereby improving the convenience.

[0029] A heat conducting plate 7 is provided at the center of the upper end surface of the protective shell 3, a heat dissipation fin 8 is provided at the center of the upper end surface of the heat conducting plate 7, a first through groove 9 is provided at the lower center of the interior of the protective shell 3, a plurality of first through holes 10 are arranged in a rectangular manner at the center of the lower inner wall of the first through groove 9, a plurality of second through holes 11 are arranged in a rectangular manner at the center of the upper inner wall of the first through groove 9, and a second through groove 12 is provided at the upper center of the interior of the protective shell 3. Through the coordinated use of the first through groove 9 and the second through groove 12, the multi-layer packaging structure of the semiconductor body 2 is satisfied, the heat source can be dispersed, the local hot spots can be reduced, and damage caused by local overheating can be avoided. The heat dissipation effect is achieved through the heat conducting plate 7 and the heat dissipation fins 8, thereby improving the heat dissipation performance.

[0030] The sealing device 5 includes two bolts 501, a first groove 502, a second groove 503, a rubber block 504 and a piston 505. The two bolts 501 are respectively arranged at the front and rear of the upper end surface of the casing 4, the first groove 502 is arranged at the center of the lower end surface of the casing 4, the ends of the two bolts 501 pass through the casing 4 to the inside of the first groove 502, and are threadedly sleeved with the casing 4, the second groove 503 is arranged at the upper end surface of the substrate 1, the rubber block 504 is arranged at the ends of the two bolts 501, and is rotatably connected with the two bolts 501 through a bearing, and the rubber block 50 4 is sleeved inside the first groove 502 and the second groove 503, and the piston 505 is sleeved on the outer wall of the rubber block 504. The first groove 502 and the second groove 503 are correspondingly arranged. The rubber block 504 is driven to move by rotating the bolt 501, and then the rubber block 504 is sleeved and connected with the first groove 502 and the second groove 503, and then the first groove 502 and the second groove 503 are sealed by the piston 505 to avoid the existence of a gap so that dust can enter and affect the normal operation of the semiconductor body 2, thereby improving the sealing effect.

[0031] The fixing device 6 includes an insert block 601, two sliders 602, two slide grooves 603 and two semicircular grooves 604. The insert block 601 is arranged at the outer wall of the casing 4, and the end portion sequentially passes through the casing 4 and the base plate 1 to the inside of the base plate 1. The two slide grooves 603 are respectively arranged at one side of the center of the upper and lower end surfaces of the insert block 601. The two sliders 602 are respectively slidably connected to the inside of the two slide grooves 603 and are fixedly connected to the insert block 601. The two semicircular grooves 604 are respectively arranged at the upper and lower centers of the inner walls of the two slide grooves 603. The two sliders 602 are respectively connected to the two semicircular grooves 604 is slidingly connected, and the sliding connection between the slider 602 and the slide groove 603 is slidingly connected to satisfy the connection between its shell 4 and the substrate 1, and then the slider 602 is driven by the rotating plug block 601 to slide into the semicircular groove 604, and then the semicircular groove 604 is used to limit it, so that the shell 4 and the substrate 1 are fixed, making it convenient for the staff to quickly load and unload the shell 4 and the substrate 1, and it can easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving convenience.

[0032] The sleeve 4 is a lower opening frame, and is sleeved on the upper end surface of the substrate 1. The sleeve 4 through the lower opening frame is sleeved on the upper end surface of the substrate 1, which makes it convenient for the staff to quickly load and unload it. The heat conducting plate 7 sequentially penetrates the protective shell 3 and the second through groove 12 to the inside of the second through groove 12. Through the penetration of the heat conducting plate 7, the heat conducting plate 7 can better absorb the heat inside the second through groove 12, and then dissipate the heat through the heat dissipation fins 8, thereby improving the heat dissipation performance. A plurality of first through holes 10 respectively penetrate the protective shell 3 and the end surface of the protective shell 3, and a plurality of second through holes 11 respectively penetrate the protective shell 3 and the second through groove 12 to the inside of the second through groove 12. Through the penetration of the first through hole 10, it can satisfy the ability to conduct the heat inside the protective shell 3 to the inside of the first through groove 9, and then through the penetration of the second through hole 11, it can satisfy the ability to conduct the heat inside the first through groove 9 to the inside of the second through groove 12, thereby realizing heat conduction.

[0033] Working principle: When the semiconductor integrated circuit packaging structure is used, the housing 4 of the lower opening frame is sleeved on the upper end surface of the substrate 1, which makes it convenient for the staff to quickly load and unload it, and then the sliding connection between the slider 602 and the slide groove 603 satisfies the connection between the housing 4 and the substrate 1, and then the insert block 601 is rotated to drive the slider 602 to slide into the semicircular groove 604, and then the semicircular groove 604 is used to limit it, so that the housing 4 and the substrate 1 are fixed, which makes it convenient for the staff to quickly load and unload the housing 4 and the substrate 1, and can easily replace or upgrade the integrated circuit, which can reduce the equipment downtime and extend the service life of the equipment, thereby improving the convenience, and then the bolt 501 is rotated to drive the rubber block 504 to move, and then the rubber block 504 is sleeved and connected with the first groove 502 and the second groove 503, and then the piston 505 is used to seal the first groove 502 and the second groove 503, so as to avoid the existence of a gap so that dust can enter and affect the normal operation of the semiconductor body 2, thereby improving the sealing effect.

[0034] During the use of the semiconductor integrated circuit packaging structure, the first through hole 10 is penetrated to enable the heat dissipated from the semiconductor body 2 inside the protective shell 3 to be conducted to the first through groove 9, and then the second through hole 11 is penetrated to enable the heat inside the first through groove 9 to be conducted to the inside of the second through groove 12, thereby achieving heat conduction, satisfying the multi-layer packaging structure of the semiconductor body 2, dispersing the heat source, reducing local hot spots, and avoiding damage caused by local overheating. Finally, the penetration of the heat conducting plate 7 enables the heat conducting plate 7 to better absorb the heat inside the second through groove 12, and then dissipate the heat through the heat dissipation fins 8, thereby improving the heat dissipation performance.

[0035] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor integrated circuit packaging structure, comprising a substrate (1) and a semiconductor body (2), wherein the semiconductor body (2) is arranged at the center of the upper end surface of the substrate (1), characterized in that: The semiconductor body (2) is sleeved with a protective shell (3) on the outside, a sleeve shell (4) is provided at the lower center of the outer wall of the protective shell (3), the upper end surface of the sleeve shell (4) is arranged in a rectangular shape and is provided with four sealing devices (5), the center of the two side walls of the sleeve shell (4) and the center of the two end surfaces are arranged on both sides, a fixing device (6) is provided at the center of the upper end surface of the protective shell (3) and a heat conduction plate (7) is provided at the center of the upper end surface of the heat conduction plate (7), a heat dissipation fin (8) is provided at the center of the upper end surface of the heat conduction plate (7), a first through groove (9) is provided at the lower center of the protective shell (3), a plurality of first through holes (10) are arranged in a rectangular shape at the center of the lower inner wall of the first through groove (9), a plurality of second through holes (11) are arranged in a rectangular shape at the center of the upper inner wall of the first through groove (9), and a second through groove (12) is provided at the upper center of the protective shell (3).

2. A semiconductor integrated circuit package structure according to claim 1, characterized in that: The sealing device (5) comprises two bolts (501), a first groove (502), a second groove (503), a rubber block (504) and a piston (505). The two bolts (501) are respectively arranged at the front and rear of the upper end surface of the casing (4). The first groove (502) is arranged at the center of the lower end surface of the casing (4). The ends of the two bolts (501) pass through the casing (4) and are connected to the inside of the first groove (502) and are threadedly sleeved with the casing (4). The second groove (503) is arranged at the upper end surface of the base plate (1). The rubber block (504) is arranged at the ends of the two bolts (501) and is rotatably connected with the two bolts (501) through a bearing. The rubber block (504) is sleeved inside the first groove (502) and the second groove (503). The piston (505) is sleeved on the outer wall of the rubber block (504). The first groove (502) and the second groove (503) are correspondingly arranged.

3. The semiconductor integrated circuit package structure according to claim 1, characterized in that: The fixing device (6) comprises an insert block (601), two sliders (602), two slide grooves (603) and two semicircular grooves (604); the insert block (601) is arranged at the outer wall of the casing (4), and the end portion thereof sequentially passes through the casing (4) and the base plate (1) to the inside of the base plate (1); the two slide grooves (603) are respectively arranged at one side of the center of the upper and lower end surfaces of the insert block (601); the two sliders (602) are respectively slidably connected inside the two slide grooves (603) and fixedly connected to the insert block (601); the two semicircular grooves (604) are respectively arranged at the upper and lower centers of the inner walls of the two slide grooves (603); and the two sliders (602) are respectively slidably connected to the two semicircular grooves (604).

4. The semiconductor integrated circuit package structure according to claim 1, characterized in that: The sleeve (4) is a frame with a lower opening and is sleeved on the upper end surface of the base plate (1).

5. The semiconductor integrated circuit package structure according to claim 1, characterized in that: The heat conducting plate (7) sequentially penetrates the protective shell (3) and the second through groove (12) to the interior of the second through groove (12).

6. The semiconductor integrated circuit package structure according to claim 1, characterized in that: The plurality of first through holes (10) respectively penetrate the protective shell (3) and the end surface of the protective shell (3), and the plurality of second through holes (11) respectively penetrate the protective shell (3) and the second through groove (12) in sequence to the interior of the second through groove (12).

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