Thermoelectric separation PCB substrate

Abstract

The utility model relates to a thermoelectricity separation PCB substrate in the PCB technology field, comprising a support layer, the top surface of the support layer is successively provided with a heat conduction layer, an insulation layer and an electric conduction layer from bottom to top, and the middle of the top surface of the electric conduction layer is provided with a cavity which divides the electric conduction layer and the insulation layer into two parts and extends to the top surface of the heat conduction layer. The cavity is in direct contact with the heat conduction layer, a wire path is arranged on the surface of the electric conduction layer, isolation layers are arranged on the inner side of the cavity and the surface of the wire path, and the electric conduction layer located on the top face of the left end of the heat conduction layer forms a first extraction electrode and a first electrode through the isolation layers. The conductive layer on the top surface of the right end of the thermal conductive layer forms a second extraction electrode and a second electrode through an isolation layer, and the cavity is internally provided with a filling layer or is not provided with a filling layer. According to the utility model, the filling layer can be filled or kept hollow according to the requirements of the installation size, the heat dissipation performance and the surface mounting process of different devices, and the cavity is directly connected with the heat conduction layer, so that the barrier-free heat conduction design is adopted.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB, in particular to a thermoelectric separation PCB substrate. Background Art

[0002] The high thermal conductivity demand of devices has been an inevitable problem since the beginning of the electrical age, especially in the information age. The integrated installation module makes the heat of each device more concentrated, especially in the application field of high-power devices. One device will cause the entire product to be scrapped due to poor thermal conductivity. The PCB boards in the industry now, such as copper, aluminum-glued aluminum substrates, and copper-glued copper substrates, are required to meet the conductivity wiring requirements. The heat generated by the device during operation is blocked by the insulating glue below and cannot be effectively conducted to the substrate below. Ceramic substrates can effectively solve the problem of thermal and electrical separation, but because the preparation area of ​​a single ceramic substrate is limited and the price is very expensive, it cannot be widely used. In order to solve the problem that the price of ceramic composite substrates is expensive and cannot be widely used in various industries with thermal conductivity requirements, Al composite substrates and Cu composite substrates have poor thermal and electrical separation, which affects the life of the device. In order to solve the high thermal conductivity requirements of the device, it is necessary to develop a product with a price comparable to Al composite substrates and thermal conductivity comparable to ceramic substrates. Utility Model Content

[0003] The utility model aims to solve the above defects and provide a thermal and electrical separation PCB substrate.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions: a thermal-electric separation PCB substrate, comprising a supporting layer, wherein a thermal conductive layer, an insulating layer and an electrical conductive layer are sequentially arranged on the top surface of the supporting layer from bottom to top, a cavity is opened in the middle of the top surface of the electrical conductive layer, which divides the electrical conductive layer and the insulating layer into two and extends to the top surface of the thermal conductive layer, and the cavity is in direct contact with the thermal conductive layer, a line path is arranged on the surface of the electrical conductive layer, an isolation layer is arranged on the inner side of the cavity and on the surface of the line path, the electrical conductive layer located on the top surface of the left end of the thermal conductive layer forms a first lead electrode and a first electrode through the isolation layer, and the electrical conductive layer located on the top surface of the right end of the thermal conductive layer forms a second lead electrode and a second electrode through the isolation layer, and a filling layer is arranged in the cavity or no filling layer is arranged.

[0005] Furthermore, the insulating layer is a non-conductor, and is made of an organic polymer or an oxide or a nitride.

[0006] Furthermore, the isolation layer is made of organic polymer or oxide.

[0007] Furthermore, the conductive layer is a conductor, and the conductive layer is made of metal or metal oxide.

[0008] Furthermore, the filling layer is not connected to the conductive layer.

[0009] Furthermore, the filling layer is connected to the heat conducting layer.

[0010] The beneficial effects of the utility model are as follows:

[0011] Compared with the prior art, the utility model can fill or keep the filling layer hollow according to the installation size, heat dissipation performance and mounting process requirements of different devices. The cavity provided in the utility model is directly connected to the thermal conductive layer, which is a barrier-free thermal conductive design. The thermal conductive performance is excellent, so that a smaller area and thinner thickness can be achieved, which is beneficial to the industrial design of the product end. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a thermoelectric separation PCB substrate of the utility model;

[0013] Figure 2 This is a schematic diagram of the circuit arrangement and cavity opening of a thermoelectric separation PCB substrate of the utility model;

[0014] In the figure: 10 - supporting layer, 11 - thermal conductive layer, 12 - electrically conductive layer, 13 - cavity, 14 - insulating layer, 15 - line path, 16 - isolation layer, 17 - first lead electrode, 18 - first electrode, 19 - second electrode, 20 - second lead electrode, 21 - filling layer. DETAILED DESCRIPTION

[0015] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0016] See also Figure 1-Figure 2 , a thermoelectric separation PCB substrate specifically implemented, comprising a support layer 10, the top surface of the support layer 10 is sequentially provided with a thermal conductive layer 11, an insulating layer 14 and an electric conductive layer 12 from bottom to top, a cavity 13 is provided in the middle of the top surface of the electric conductive layer 12, which divides the electric conductive layer 12 and the insulating layer 14 into two and extends to the top surface of the thermal conductive layer 11, and the cavity 13 is in direct contact with the thermal conductive layer 11, a line path 15 is provided on the surface of the electric conductive layer 12, an isolation layer 16 is provided on the inner side of the cavity 13 and on the surface of the line path 15, the electric conductive layer 12 located on the top surface of the left end of the thermal conductive layer 11 forms a first extraction electrode 17 and a first electrode 18 through the isolation layer 16, and the electric conductive layer 12 located on the top surface of the right end of the thermal conductive layer 11 forms a second extraction electrode 20 and a second electrode 19 through the isolation layer 16, and a filling layer 21 is provided in the cavity 13 or not. The filling layer 21 is not connected to the electric conductive layer 12. The filling layer 21 is connected to the heat conducting layer.

[0017] The insulating layer 14 is a non-conductor, and is made of an organic polymer, an oxide, or a nitride. The isolation layer 16 is made of an organic polymer or an oxide. The conductive layer 12 is a conductor, and is made of a metal or a metal oxide.

[0018] The utility model can fill or keep the filling layer 21 hollow according to the installation size, heat dissipation performance and mounting process requirements of different devices. The cavity 13 provided in the utility model is directly connected to the thermal conductive layer 11, which is a barrier-free thermal conductive design. The thermal conductive performance is excellent, so that a smaller area and thinner thickness can be achieved, which is beneficial to the industrial design of the product end.

[0019] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.

Claims

1. A thermoelectric separation PCB substrate, comprising a support layer, characterized in that: The top surface of the support layer is provided with a thermal conductive layer, an insulating layer and an electrical conductive layer in sequence from bottom to top; a cavity is provided in the middle of the top surface of the electrical conductive layer, which divides the electrical conductive layer and the insulating layer into two and extends to the top surface of the thermal conductive layer, and the cavity is in direct contact with the thermal conductive layer; a line path is provided on the surface of the electrical conductive layer; an isolation layer is provided on the inner side of the cavity and on the surface of the line path; the electrical conductive layer located on the top surface of the left end of the thermal conductive layer forms a first lead-out electrode and a first electrode through the isolation layer; the electrical conductive layer located on the top surface of the right end of the thermal conductive layer forms a second lead-out electrode and a second electrode through the isolation layer; a filling layer is provided in the cavity or no filling layer is provided.

2. A thermoelectric separation PCB substrate according to claim 1, characterized in that: The insulating layer is a non-conductor and is made of organic polymer or oxide or nitride.

3. The thermoelectric separation PCB substrate according to claim 1, characterized in that: The isolation layer is made of an organic polymer or an oxide.

4. The thermoelectric separation PCB substrate according to claim 1, characterized in that: The conductive layer is a conductor and is made of metal or metal oxide.

5. The thermoelectric separation PCB substrate according to claim 1, characterized in that: The filling layer is not connected to the electrically conductive layer.

6. The thermoelectric separation PCB substrate according to claim 1, characterized in that: The filling layer is connected to the heat conducting layer.

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