Circuit board for ultrasonic transducer

Abstract

The utility model provides a circuit board used for an ultrasonic transducer, comprising a PCB, the top surface of the PCB is provided with a positive electrode area, the positive electrode area is internally provided with a first blind hole, the top surface of the PCB is provided with a first copper-clad layer, and the first copper-clad layer covers all areas except the positive electrode area on the PCB. According to the utility model, the first copper-clad layer is arranged on the top surface of the PCB, and the first copper-clad layer covers all areas except the positive electrode area on the PCB, so that the edge of the shell can be directly pressed on the first copper-clad layer through a flanging process after the shell of the transducer is installed, and the first copper-clad layer and the shell form a metal shielding cover to prevent interference; after the shell of the transducer is installed, the shell of the transducer is a negative electrode, namely, the first copper-clad layer is directly communicated with the negative electrode, and the negative electrode wire can be directly welded on the first copper-clad layer, namely, the welding procedure of the negative electrode wire in the transducer is omitted.

Description

Technical Field

[0001] The utility model relates to the technical field of ultrasonic gas meters, in particular to a circuit board used for an ultrasonic transducer. Background Art

[0002] In the gas industry, accurate flow measurement is of great significance to the production process and energy billing. However, due to the flammable and explosive nature of gas, traditional flow measurement methods often have certain safety hazards. In recent years, ultrasonic flow measurement technology has gradually been widely used due to its non-contact, high-precision, safe and reliable advantages.

[0003] In the traditional process of ultrasonic transducer processing, the front and back sides of the ceramic chip are divided into positive and negative electrodes. Generally, a positive electrode is welded on the positive electrode, that is, the top surface, and the bottom surface, that is, the contact surface with the shell, is the negative electrode. This surface is bonded to the shell with glue, and the place where there is glue is blocked. Therefore, generally a wire is welded on the bottom edge of the chip and then glue is applied. The upper end is welded to the shell and connected to form a resistance between the chip and the shell, which is equivalent to a capacitor. The wire is often relatively thin and basically requires manual operation, which is time-consuming and labor-intensive. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board for an ultrasonic transducer to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A circuit board for an ultrasonic transducer comprises a PCB board, wherein the top surface of the PCB board is provided with an anode region, a first blind hole is provided in the anode region, a first copper clad layer is provided on the top surface of the PCB board, the first copper clad layer covers all regions of the PCB board except the anode region, a chip mounting region is provided on the bottom surface of the PCB board, a second blind hole is provided in the chip mounting region, the first blind hole is connected to the second blind hole, and a second copper clad layer is provided on the chip mounting region.

[0007] Preferably, the thickness of the PCB board is 0.4 mm.

[0008] Preferably, a chip positioning mechanism is also provided on the bottom surface of the PCB board, and the chip positioning mechanism includes a movable seat, a claw, a connecting plate, a pair of guide rods and an elastic member. The movable seat is arranged on the PCB board, and the pair of guide rods are slidably arranged inside the movable seat and are connected to the movable seat through the elastic member. The connecting plate is fixed to one end of the two guide rods, and the claw is fixed to the connecting plate.

[0009] Preferably, the elastic member includes a cavity, a spring, a retaining ring and a limit clamp edge, the cavity is opened inside the movable seat and connected to the outside, the guide rod passes through the cavity, the limit clamp edge is fixed to the inner wall of the cavity, the retaining ring is fixed to the surface of the guide rod, the spring is fixed between the retaining ring and one of the limit clamp edges, and the spring is sleeved on the guide rod.

[0010] Preferably, an adjustment mechanism for adapting to chips of different sizes is provided between the movable seat and the PCB board, the adjustment mechanism comprises a rubber substrate, a lower protrusion, an upper protrusion and a groove, the groove is provided at the bottom of the movable seat, the lower protrusion is provided on the rubber substrate, the rubber substrate is fixed to the PCB board, the upper protrusion is provided at the top of the groove, and the upper protrusion and the lower protrusion are staggered.

[0011] Preferably, the side surface of the upper end of the clamping claw is arranged as an inclined section, and the lower end of the clamping claw is arranged as a vertical section.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model arranges a first copper clad layer on the top surface of the PCB board, and the first copper clad layer covers all areas of the PCB board except the positive electrode area, so that after the shell of the transducer is installed, the edge of the shell can be directly pressed on the first copper clad layer through the flanging process, so that the first copper clad layer and the shell form a metal shielding cover to prevent interference. After the shell of the transducer is installed, the shell of the transducer is the negative electrode, which is equivalent to the first copper clad layer being directly connected to the negative electrode, and the negative electrode wire can be directly welded on the first copper clad layer, which is equivalent to omitting the welding process of the negative electrode wire inside the transducer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the main structure of the utility model;

[0015] Figure 2 It is a bottom schematic diagram of the utility model;

[0016] Figure 3 This is a schematic diagram of the main structure of the chip positioning mechanism of the utility model;

[0017] Figure 4 This is a schematic diagram of the main structure of the adjustment mechanism of the utility model;

[0018] Figure 5 It is a schematic diagram of the main structure of the elastic member of the utility model.

[0019] In the figure: 1. PCB board; 2. positive electrode area; 3. first blind hole; 4. first copper clad layer; 5. chip mounting area; 6. second blind hole; 7. second copper clad layer; 8. chip positioning mechanism; 81. movable seat; 82. claw; 83. connecting plate; 84. guide rod; 85. elastic member; 851. cavity; 852. spring; 853. retaining ring; 854. limit clamp edge; 9. adjustment mechanism; 91. rubber substrate; 92. lower protrusion; 93. upper protrusion; 94. groove; 821. inclined section; 822. vertical section. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-5 , the utility model provides a circuit board for an ultrasonic transducer, comprising a PCB board 1;

[0022] The top surface of the PCB board 1 is provided with a positive electrode area 2, a first blind hole 3 is provided in the positive electrode area 2, a first copper clad layer 4 is provided on the top surface of the PCB board 1, and the first copper clad layer 4 covers all areas of the PCB board 1 except the positive electrode area 2, a chip mounting area 5 is provided on the bottom surface of the PCB board 1, a second blind hole 6 is provided in the chip mounting area 5, the first blind hole 3 is connected to the second blind hole 6, a second copper clad layer 7 is provided on the chip mounting area 5, and the thickness of the PCB board 1 is 0.4 mm;

[0023] A chip positioning mechanism 8 is also provided on the bottom surface of the PCB board 1. The chip positioning mechanism 8 includes a movable seat 81, a clamping claw 82, a connecting plate 83, a pair of guide rods 84 and an elastic member 85. The movable seat 81 is provided on the PCB board 1. The pair of guide rods 84 are slidably provided inside the movable seat 81 and are connected to the movable seat 81 through the elastic member 85. The connecting plate 83 is fixed to one end of the two guide rods 84. The clamping claw 82 is fixed to the connecting plate 83.

[0024] Specifically, the chip needs to be bonded to the chip mounting area 5. When the chip is lowered, both ends of the chip can push the claws 82 at the same time, so that the two claws 82 move away from each other, and the elastic member 85 applies force to the claws 82 in the opposite direction, so that the chip is gradually fixed on the chip mounting area 5, thereby achieving positioning during chip installation.

[0025] The elastic member 85 includes a cavity 851, a spring 852, a retaining ring 853 and a limiting clamp edge 854. The cavity 851 is opened inside the movable seat 81 and communicates with the outside. The guide rod 84 passes through the cavity 851. The limiting clamp edge 854 is fixed to the inner wall of the cavity 851. The retaining ring 853 is fixed to the surface of the guide rod 84. The spring 852 is fixed between the retaining ring 853 and one of the limiting clamp edges 854, and the spring 852 is sleeved on the guide rod 84.

[0026] Specifically, when the chip squeezes the claw 82, it can drive the connecting plate 83 to move synchronously. When the connecting plate 83 moves, it can drive the guide rod 84 to move inside the cavity 851. At this time, the guide rod 84 drives the retaining ring 853 to move synchronously inside the cavity 851. When moving, the retaining ring 853 squeezes the spring 852 through the limiting clamp edge 854, so that the spring 852 deforms and stores energy. The elastic force of the spring 852 can make the claw 82 press against the chip to position it.

[0027] An adjustment mechanism 9 for adapting to chips of different sizes is arranged between the movable seat 81 and the PCB board 1. The adjustment mechanism 9 includes a rubber substrate 91, a lower protrusion 92, an upper protrusion 93 and a groove 94. The groove 94 is arranged at the bottom of the movable seat 81. The lower protrusion 92 is arranged on the rubber substrate 91. The rubber substrate 91 is fixed on the PCB board 1. The upper protrusion 93 is arranged at the top of the groove 94. The upper protrusion 93 and the lower protrusion 92 are staggered.

[0028] Specifically, first, the movable seat 81 can slide through the slide groove of the side wall of the rubber base, and the inner wall of the groove 94 is provided with a corresponding slider which is connected with the slide groove, so that the movable seat 81 can slide freely on the rubber base, and the movable seat 81 can drive the upper protrusion 93 to move synchronously when sliding, and the upper protrusion 93 will be squeezed and deformed with the lower protrusion 92 when moving. After the movable seat 81 finishes moving, it can be positioned by the elastic force of the upper protrusion 93 and the lower protrusion 92, so as to adapt to chips of different sizes. The upper protrusion 93 and the lower protrusion 92 are both made of rubber, and the side surface of the upper end of the claw 82 is set as an inclined section 821, and the lower end of the claw 82 is set as a vertical section 822. The inclined section 821 can adapt to the extrusion of the two ends of the chip, so that the claw 82 moves gradually, and the vertical section 822 can realize the positioning function of the chip.

[0029] Structural principle of PCB board 1: Insulation protection of key circuit areas of PCB board 1. Due to the conduction between the first blind hole 3 and the second blind hole 6, after the shell of the transducer is installed, the edge of the shell can be directly pressed on the first copper clad layer 4 through the flanging process, so that the first copper clad layer 4 and the shell of the transducer form a metal shielding cover to prevent interference. After the shell of the transducer is installed, the shell of the transducer is the negative electrode, which is equivalent to the first copper clad layer 4 being directly connected to the negative electrode. The negative electrode wire can be directly welded to the first copper clad layer 4. As for the positive electrode, the positive electrode of the chip is welded in the first blind hole 3, and the first blind hole 3 can be directly connected to the positive electrode of the chip through the conductive second blind hole 6.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board for an ultrasonic transducer, comprising a PCB board (1), characterized in that: The top surface of the PCB board (1) is provided with a positive electrode region (2), a first blind hole (3) is provided in the positive electrode region (2), the top surface of the PCB board (1) is provided with a first copper cladding layer (4), the first copper cladding layer (4) covers all regions on the PCB board (1) except the positive electrode region (2), the bottom surface of the PCB board (1) is provided with a chip mounting region (5), a second blind hole (6) is provided in the chip mounting region (5), the first blind hole (3) and the second blind hole (6) are connected to each other, and a second copper cladding layer (7) is provided on the chip mounting region (5).

2. A circuit board for an ultrasonic transducer according to claim 1, characterized in that: The thickness of the PCB board (1) is 0.4 mm.

3. A circuit board for an ultrasonic transducer according to claim 2, characterized in that: A chip positioning mechanism (8) is also provided on the bottom surface of the PCB board (1), and the chip positioning mechanism (8) comprises a movable seat (81), a clamping claw (82), a connecting plate (83), a pair of guide rods (84) and an elastic member (85). The movable seat (81) is provided on the PCB board (1), the pair of guide rods (84) are slidably provided inside the movable seat (81) and are connected to the movable seat (81) through the elastic member (85), the connecting plate (83) is fixed to one end of the two guide rods (84), and the clamping claw (82) is fixed to the connecting plate (83).

4. A circuit board for an ultrasonic transducer according to claim 3, characterized in that: The elastic member (85) comprises a cavity (851), a spring (852), a retaining ring (853) and a position-limiting clamping edge (854); the cavity (851) is opened inside the movable seat (81) and communicates with the outside; the guide rod (84) passes through the cavity (851); the position-limiting clamping edge (854) is fixed to the inner wall of the cavity (851); the retaining ring (853) is fixed to the surface of the guide rod (84); the spring (852) is fixed between the retaining ring (853) and one of the position-limiting clamping edges (854); and the spring (852) is sleeved on the guide rod (84).

5. A circuit board for an ultrasonic transducer according to claim 4, characterized in that: An adjustment mechanism (9) for adapting to chips of different sizes is arranged between the movable seat (81) and the PCB board (1), the adjustment mechanism (9) comprising a rubber substrate (91), a lower protrusion (92), an upper protrusion (93) and a groove (94), the groove (94) being arranged at the bottom of the movable seat (81), the lower protrusion (92) being arranged on the rubber substrate (91), the rubber substrate (91) being fixed on the PCB board (1), the upper protrusion (93) being arranged at the top of the groove (94), and the upper protrusion (93) and the lower protrusion (92) being arranged in a staggered manner.

6. The circuit board for ultrasonic transducer according to claim 3, characterized in that: The side surface of the upper end of the clamping claw (82) is configured as an inclined section (821), and the lower end of the clamping claw (82) is configured as a vertical section (822).

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