Double-layer heat dissipation circuit board for computer

Abstract

The utility model discloses a double-layer heat dissipation circuit board for a computer, comprising a circuit board main body which is formed by double layers and is applied to the computer; and the heat dissipation structure is arranged below the circuit board main body, and the heat dissipation structure is connected with the circuit board main body through a heat conduction copper pipe. The circuit board main body adopts a double-layer arrangement, has good heat dissipation capability while ensuring compactness and portability, is particularly suitable for computer equipment, and can effectively reduce the temperature of a computer in an operation process.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a double-layer heat dissipation circuit board for a computer. Background Art

[0002] The performance of electronic components continues to improve, bringing great convenience to people's lives and work. However, with the improvement of performance, the power consumption and heat generation of electronic equipment have also increased accordingly, making the heat dissipation problem more and more serious. In the past, the heat dissipation capacity of single-layer circuit boards was limited, and it was difficult to meet the heat dissipation needs of high-performance computers. When designing single-layer circuit boards, electronic components are usually arranged closely, and the heat dissipation channels are limited. In high-performance computers, the high power consumption of a large number of electronic components will cause heat to accumulate rapidly, making it impossible for the circuit board to effectively dissipate heat. In addition, the thermal conductivity of single-layer circuit boards is poor, and it is difficult for heat to be quickly dissipated to the surrounding environment, thus affecting the stability and life of the computer. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a double-layer heat dissipation circuit board for a computer to solve the problems existing in the background technology.

[0004] The utility model of a double-layer heat dissipation circuit board for a computer is realized by the following technical solutions, including:

[0005] A circuit board body, wherein the circuit board body is formed by a double-layer arrangement and is applied to a computer;

[0006] The heat dissipation structure is arranged below the circuit board body, and the heat dissipation structure and the circuit board body are connected through a heat-conducting copper tube.

[0007] As a preferred technical solution, the circuit board body is composed of an upper circuit board and a lower heat sink spliced ​​together, the upper circuit board is provided with a corresponding circuit, and the lower heat sink is connected to the thermal copper tube on the heat dissipation structure.

[0008] As a preferred technical solution, the heat dissipation structure includes a fixed frame and heat dissipation fins;

[0009] The heat dissipation fins are arranged in the fixed frame, and the other end of the heat-conducting copper tube passes through the fixed frame and is connected to the heat dissipation fins; an inlet fan and an outlet fan are respectively arranged on both sides of the fixed frame;

[0010] The air outlet end of the inlet fan corresponds to a position on one side of the heat dissipation fins, and the air inlet end of the outlet fan corresponds to a position on the other side of the heat dissipation fins.

[0011] As a preferred technical solution, connection holes are arranged around the circuit board body, and the connection holes penetrate the upper circuit board and the lower heat sink;

[0012] The connection hole is provided with a fixing ring, through which the upper circuit board and the lower heat sink are spliced ​​together.

[0013] As a preferred technical solution, thermal grease is coated between the upper circuit board and the lower heat sink, and the thermal conductivity of the lower heat sink is increased by the thermal grease.

[0014] As a preferred technical solution, a temperature sensor is bonded to the upper circuit board of the circuit board body, and the detection end of the temperature sensor is in contact with the upper circuit board, used to detect the temperature of the upper circuit board, and connected to the temperature control module;

[0015] The temperature control module is connected to the inlet fan and the outlet fan, and controls the rotation speed of the inlet fan and the outlet fan to stabilize the temperature of the circuit board body.

[0016] As a preferred technical solution, mounting positions are provided on the fixed frame, and the inlet fan and the outlet fan are respectively fixed on the mounting positions on both sides.

[0017] The beneficial effects of the utility model are:

[0018] 1. The main body of the circuit board of the utility model adopts a double-layer setting, which ensures compactness and lightness while having good heat dissipation capabilities. It is particularly suitable for computer equipment and can effectively reduce the temperature during computer operation.

[0019] 2. The circuit board body of the utility model is composed of an upper circuit board and a lower heat sink, and the heat is quickly transferred to the heat dissipation structure through a heat-conducting copper tube; the heat dissipation structure includes a fixed frame and heat dissipation fins, and cooperates with the inlet fan and the outlet fan to dissipate the heat quickly and improve the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 This is a schematic diagram of the main structure of the circuit board of the utility model;

[0023] Figure 3 It is a schematic diagram of the heat dissipation structure of the utility model.

[0024] Description of reference numerals:

[0025] 1. Circuit board body; 2. Heat dissipation structure; 3. Thermal copper tube; 4. Upper circuit board; 5. Lower heat sink; 6. Fixed frame; 7. Heat dissipation fins; 8. Inlet fan; 9. Outlet fan; 10. Fixed ring; 11. Temperature sensor; 12. Installation position. DETAILED DESCRIPTION

[0026] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0027] like Figure 1 As shown, the utility model is a double-layer heat dissipation circuit board for a computer, comprising:

[0028] The circuit board body 1 is formed by a double-layer arrangement, so that the circuit board has good heat dissipation capability while ensuring compactness and lightness, and the circuit board body 1 is applied to a computer, which can effectively reduce the temperature rise during the operation of the computer;

[0029] The heat dissipation structure 2 is arranged below the circuit board body 1, and the heat dissipation structure 2 and the circuit board body 1 are connected via a heat-conducting copper tube 3, which is beneficial to rapid heat transfer and accelerates the heat dissipation speed.

[0030] like Figure 2-Figure 3 As shown, the circuit board body 1 is composed of an upper circuit board 4 and a lower heat sink 5 which are spliced ​​together. The upper circuit board 4 is provided with a corresponding circuit. The lower heat sink 5 is connected to the thermal copper tube 3 on the heat dissipation structure 2, which not only ensures the heat dissipation effect of the circuit board, but also reduces the overall thickness of the circuit board.

[0031] The heat dissipation structure 2 includes a fixing frame 6 and heat dissipation fins 7;

[0032] The heat dissipation fin 7 is arranged in the fixed frame 6, and the other end of the heat-conducting copper tube 3 passes through the fixed frame 6 and is connected to the heat dissipation fin 7; an inlet fan 8 and an outlet fan 9 are respectively arranged on both sides of the fixed frame 6;

[0033] The air outlet end of the inlet fan 8 corresponds to one side of the heat dissipation fin 7, and the air outlet end of the outlet fan 9 corresponds to the other side of the heat dissipation fin 7, so as to ensure smooth air flow and improve the heat dissipation effect.

[0034] In addition, connection holes are arranged around the circuit board body 1, and the connection holes penetrate the upper circuit board 4 and the lower heat sink 5;

[0035] A fixing ring 10 is provided on the connection hole, and the upper circuit board 4 and the lower heat sink 5 are spliced ​​together through the fixing ring 10 .

[0036] In addition, thermal conductive silicone grease is applied between the upper circuit board 4 and the lower heat sink 5 to increase the thermal conductivity of the lower heat sink 5 and further improve the heat dissipation effect.

[0037] In this embodiment, a temperature sensor 11 is bonded to the upper circuit board 4 of the circuit board body 1, and the detection end of the temperature sensor 11 is in contact with the upper circuit board 4, for detecting the temperature of the upper circuit board 4, and is connected to the temperature control module;

[0038] The temperature control module is connected to the inlet fan 8 and the outlet fan 9, and controls the rotation speeds of the inlet fan 8 and the outlet fan 9 to stabilize the temperature of the circuit board body 1.

[0039] In addition, mounting positions 12 are provided on the fixing frame 6 , and the inlet fan 8 and the outlet fan 9 are respectively fixed on the mounting positions 12 on both sides.

[0040] Here’s how it works:

[0041] The double-layer heat dissipation circuit board of the utility model effectively improves the heat dissipation performance while ensuring the functionality of the circuit board, which helps to extend the service life of the computer, reduce the temperature during the operation of the equipment, and improve the stability and reliability of the equipment.

[0042] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims

1. A double-layer heat dissipation circuit board for a computer, characterized in that: include: A circuit board main body (1), the circuit board main body (1) being formed by a double-layer arrangement, and the circuit board main body (1) being applied to a computer; A heat dissipation structure (2), wherein the heat dissipation structure (2) is arranged below the circuit board body (1), and the heat dissipation structure (2) and the circuit board body (1) are connected via a heat-conducting copper tube (3).

2. The double-layer heat dissipation circuit board for computers according to claim 1, characterized in that: The circuit board body (1) is formed by splicing an upper circuit board (4) and a lower heat sink (5) together; the upper circuit board (4) is provided with a corresponding circuit; and the lower heat sink (5) is connected to a heat-conducting copper tube (3) on the heat dissipation structure (2).

3. The double-layer heat dissipation circuit board for computers according to claim 1, characterized in that: The heat dissipation structure (2) comprises a fixed frame (6) and heat dissipation fins (7); The heat dissipation fin (7) is arranged in the fixed frame (6), and the other end of the heat-conducting copper tube (3) passes through the fixed frame (6) and is connected to the heat dissipation fin (7); an inlet fan (8) and an outlet fan (9) are respectively arranged on both sides of the fixed frame (6); The air outlet end of the inlet fan (8) corresponds to a position on one side of the heat dissipation fin (7), and the air outlet end of the outlet fan (9) corresponds to a position on the other side of the heat dissipation fin (7).

4. The double-layer heat dissipation circuit board for computers according to claim 1, characterized in that: The circuit board body (1) is provided with connection holes on all sides, and the connection holes penetrate the upper circuit board (4) and the lower heat sink (5); A fixing ring (10) is provided on the connection hole, and the upper circuit board (4) and the lower heat sink (5) are spliced ​​together via the fixing ring (10).

5. The double-layer heat dissipation circuit board for computers according to claim 2, characterized in that: Thermally conductive silicone grease is applied between the upper circuit board (4) and the lower heat sink (5), and the thermal conductivity of the lower heat sink (5) is increased by the thermally conductive silicone grease.

6. The double-layer heat dissipation circuit board for computers according to claim 1, characterized in that: A temperature sensor (11) is bonded to the upper circuit board (4) of the circuit board body (1), and a detection end of the temperature sensor (11) is in contact with the upper circuit board (4) for detecting the temperature of the upper circuit board (4) and connected to a temperature control module; The temperature control module is connected to the inlet fan (8) and the outlet fan (9), and controls the rotation speed of the inlet fan (8) and the outlet fan (9) to stabilize the temperature of the circuit board body (1).

7. The double-layer heat dissipation circuit board for computers according to claim 3, characterized in that: The fixed frame (6) is provided with a mounting position (12), and the inlet fan (8) and the outlet fan (9) are respectively fixed on the mounting positions (12) on both sides.

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