LED luminescent device

Abstract

The utility model provides an LED luminescent device, which comprises a support, a bowl-shaped accommodating groove is formed at one end of the support, the bottom of the accommodating groove is a functional area, the functional area comprises a solid crystal area and a plurality of bonding wire areas, the solid crystal area is lower than the bonding wire areas, a plurality of luminescent chips are arranged on the solid crystal area, the bottoms of the luminescent chips are fixedly connected with the solid crystal area, a metal sheet is arranged in the support, and the metal sheet is connected with the bonding wire areas. One end of the metal sheet extends into the accommodating groove to form a bonding wire area, the other end of the metal sheet is bent for multiple times and then extends to one end, far away from the accommodating groove, of the bracket to form a connecting pin, the light-emitting chip is electrically connected with the bonding wire area, the LED light-emitting device is electrically connected with an external power supply through the connecting pin, and packaging glue is fixedly sealed in the accommodating groove. The packaging structure is used for fixing and packaging the light-emitting chip. According to the LED light-emitting device provided by the invention, the die bonding area is lower than the wire bonding area, so that the entry of water vapor and abnormity caused by spin coating of die bonding glue are reduced, and the product effect of the LED light-emitting device is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of LED display, and in particular relates to an LED light-emitting device. Background Art

[0002] With the widespread application of display technology, the application scenarios have also become more diversified, and the application of LED display devices, the key components of display screens, has become more important. Therefore, the reliability performance requirements of lamp beads are getting higher and higher. From the perspective of LED lamp bead technology, packaging technology and product structure have an important impact on its performance and reliability.

[0003] TOP LED light-emitting device is a type of LED light-emitting device. TOP LED device is generally a top-emitting or plane-emitting LED with simple packaging. Existing TOP LED light-emitting devices generally use a stamping injection molding bracket as a bracket. The bracket is divided into two sides, the front side is composed of plastic parts and the metal part after stamping as the functional area of ​​the lamp bead. The light-emitting chip is fixedly connected in the functional area. Finally, the bracket is sealed with glue through a dispensing process, and then the material is blanked into luminous LED lamp beads.

[0004] The existing lamp bead structure can also cause abnormalities such as burning of the lamp bead due to the intrusion of water vapor during use by the client. See attached Figure 1 The existing lamp bead structure is prone to short circuit or poor wire bonding process due to abnormal silver glue and insulating glue bonding glue during the manufacturing process. See attached Figure 2 , affecting the quality of the product. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide an LED light-emitting device to solve the problems existing in the prior art.

[0006] The utility model provides an LED light-emitting device, comprising a bracket, wherein a bowl-shaped receiving groove is formed at one end of the bracket, and the bottom of the receiving groove is a functional area, wherein the functional area comprises a solid crystal area and a plurality of welding wire areas, wherein the plurality of welding wire areas are respectively arranged on both sides of the solid crystal area, and the solid crystal area is lower than the welding wire area so that the solid crystal area and the welding wire area are disconnected, and the plurality of welding wire areas are disconnected from each other by insulating parts, and a plurality of light-emitting chips are arranged on the solid crystal area, and the bottom of the light-emitting chip is fixedly connected to the solid crystal area, and a metal sheet is arranged in the bracket, and one end of the metal sheet extends into the receiving groove to form the welding wire area, and the other end of the metal sheet extends to an end of the bracket away from the receiving groove after being bent for multiple times to form a connecting pin, and the light-emitting chip is electrically connected to the welding wire area, and the LED light-emitting device is electrically connected to an external power supply through the connecting pin, and a packaging glue is fixedly sealed in the receiving groove for fixing and packaging the light-emitting chip.

[0007] The beneficial effects of the utility model are as follows: the LED light-emitting device provided by the utility model has a crystal bonding area arranged in the middle of the functional area, and the wire bonding areas are respectively arranged on both sides of the crystal bonding area. The crystal bonding area and the wire bonding area are highly misaligned, that is, the wire bonding area is higher than the crystal bonding area, and the light-emitting chip is fixedly connected to the crystal bonding area. Since the crystal bonding area forms a low-lying area, it can effectively prevent the problem of short circuit or poor wire bonding process caused by the crystal bonding glue being thrown off during the glue crystal bonding process; in addition, after the lamp bead process is packaged into a finished product, since the wire bonding area is higher than the crystal bonding area, the chip sinks as a whole, and the wire bonding area can play a role in water vapor blocking, effectively improving the moisture-proof performance of the lamp bead; further, since the cup depth remains unchanged and the wire bonding area is raised, a part of glue can be saved in the packaging process, reducing the cost of the lamp bead; one end of the metal sheet arranged in the bracket is arranged in the accommodating groove, the top of the metal sheet is the wire bonding area, and the other end of the metal sheet extends to the bottom of the bracket after multiple bending to form a connecting pin connected to the external power supply, and the packaging glue is sealed in the accommodating groove, and the protection effect of the circuit and device in the functional area is improved by the packaging glue. Suitable for large-scale promotion.

[0008] Preferably, the bonding wire area includes a plurality of positive bonding wire areas and a plurality of negative bonding wire areas, the positive electrode of the light emitting chip is electrically connected to the positive bonding wire area, and the negative electrode of the light emitting chip is electrically connected to the negative bonding wire area.

[0009] Preferably, the light-emitting chip includes at least three light-emitting sub-chips, one of which is fixedly connected to the solid crystal area via conductive silver glue, and the other light-emitting sub-chips are fixedly connected to the solid crystal area via insulating glue.

[0010] Preferably, the welding wire area includes three positive welding wire areas and two negative welding wire areas. The positive electrode of the light-emitting sub-chip connected to the solid crystal area through conductive silver glue is electrically connected to one of the positive welding wire areas through a bonding wire, and the negative electrode of the light-emitting sub-chip is electrically connected to the solid crystal area through the conductive silver glue, and the positive and negative electrodes of the remaining two light-emitting sub-chips are electrically connected to the remaining two positive welding wire areas and two negative welding wire areas respectively.

[0011] Preferably, the three light-emitting sub-chips are respectively a red light chip, a green light chip and a blue light chip.

[0012] Preferably, the other end of the metal sheet is bent at least three times and then extends to an end of the bracket away from the receiving groove to form the connecting pin.

[0013] Preferably, a marking area is provided on the top of the bracket.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of a defective structure of a cross section of an LED light emitting device in the prior art;

[0016] Figure 2 for Figure 1 Schematic diagram of defective structure after the chip is installed in the middle bracket;

[0017] Figure 3 A schematic diagram of the cross-sectional structure of an LED light-emitting device provided by the utility model;

[0018] Figure 4 for Figure 3 Schematic diagram of the structure of the middle bracket without chip installed;

[0019] Figure 5 for Figure 4 Schematic diagram of the structure after the chip is installed in the middle bracket;

[0020] Figure 6 for Figure 3 Bottom view of the LED light emitting device provided in.

[0021] Description of main component symbols:

[0022] 10. Bracket; 11. Receiving groove; 12. Crystal fixing area; 13. Wire bonding area; 131. Positive electrode wire bonding area; 132. Negative electrode wire bonding area; 14. Metal sheet; 15. Connecting pins; 16. Packaging glue; 17. Marking area; 20. Light-emitting chip; 21. Red light chip; 22. Green light chip; 23. Blue light chip; 30. Bonding wire.

[0023] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] Example 1

[0028] like Figures 3 to 6 As shown, an LED light-emitting device provided in this embodiment includes a bracket 10, a bowl-shaped receiving groove 11 is formed at one end of the bracket, the bottom of the receiving groove 11 is a functional area, the functional area includes a solid crystal area 12 and a plurality of wire bonding areas 13, the plurality of wire bonding areas 13 are respectively arranged on both sides of the solid crystal area 12, the solid crystal area 12 is lower than the wire bonding area 13, so that the solid crystal area 12 and the wire bonding area 13 are disconnected, and the plurality of wire bonding areas 13 are disconnected from each other by insulating members, and a plurality of light-emitting chips 20 are arranged on the solid crystal area 12, and the light-emitting chips The bottom of 20 is fixedly connected to the solid crystal area 12, and a metal sheet 14 is provided in the bracket 10. One end of the metal sheet 14 extends into the receiving groove to form a wire bonding area 13. The other end of the metal sheet 14 is bent several times and extends to the end of the bracket 10 away from the receiving groove 11 to form a connecting pin 15. The light-emitting chip 20 is electrically connected to the wire bonding area 13, and the LED light-emitting device is electrically connected to the external power supply through the connecting pin 15. The receiving groove 11 is sealed with a packaging glue 16 for fixing and packaging the light-emitting chip 20.

[0029] Specifically, in this embodiment, the bracket can be mainly made of PPA (polyphthalamide) injection molding, and the bracket is divided into a front and a back side. The front side is made of PPA and a stamped and bent metal sheet as a functional area. During the manufacturing process, the metal sheet is stamped and bent in advance, and then the bent metal sheet is injection molded together with the PPA, so that the metal sheet is partially nested in the bracket. The metal sheet has conductive properties, and the front side of the bracket includes an injection-molded bowl-shaped receiving groove 11, which can provide good protection for the functional area; Figure 3 and Figure 5 As shown, the metal sheet 14 is partially nested in the bracket 10, and after being led out from the side of the bracket 10, it is bent multiple times to the bottom of the bracket to form an electrically connected connecting pin 15. It can be understood that the number of bends and the shape of the bent metal sheet in the bracket 10 can be stamped in advance according to actual needs, and no specific restrictions are made here.

[0030] Optionally, in this embodiment, the solid crystal area 12 is arranged in the middle of the functional area, and the wire bonding area 13 is respectively arranged on both sides of the solid crystal area 12. The solid crystal area 12 and the wire bonding area 13 are highly misaligned, that is, the wire bonding area 13 is higher than the solid crystal area 12, and the light-emitting chip 20 is fixedly connected to the solid crystal area 12. Since the solid crystal area 12 forms a low-lying area, it can effectively prevent the short circuit or poor wire bonding process caused by the solid crystal glue being thrown off during the glue solid crystal process; in addition, after the lamp bead process is packaged into a finished product, since the wire bonding area is higher than the solid crystal area, the chip as a whole is lowered. The soldering wire area can play a role in blocking water vapor and effectively improve the moisture-proof performance of the lamp beads; further, since the cup depth remains unchanged and the soldering wire area is raised, a part of the glue can be saved in the packaging process, reducing the cost of the lamp beads; one end of the metal sheet 14 arranged in the bracket 10 is arranged in the accommodating groove 11, and the top of the metal sheet is the soldering wire area. The other end of the metal sheet extends to the bottom of the bracket 10 after multiple bending to form a connecting pin 15 connected to an external power supply. The accommodating groove 11 is sealed with a packaging glue 16, and the packaging glue 16 is used to improve the protection effect of the circuits and devices in the functional area.

[0031] Optionally, in the present embodiment, the wire bonding area 13 includes a plurality of positive wire bonding areas 131 and a plurality of negative wire bonding areas 132, the positive electrode of the light-emitting chip 20 is electrically connected to the corresponding positive wire bonding area 131 through the bonding wire 30, and the negative electrode of the light-emitting chip 20 is electrically connected to the corresponding negative wire bonding area 132 through the bonding wire 30; the light-emitting chip 20 includes at least three light-emitting sub-chips, one of which is fixedly connected to the solid crystal area through a conductive silver glue, and the remaining light-emitting sub-chips are fixedly connected to the solid crystal area through an insulating glue. Optionally, in the present embodiment, the three light-emitting sub-chips are respectively a red light chip 21, a green light chip 22, and a blue light chip 23, and the red light chip 21, the green light chip 22, and the blue light chip 23 are all fixed to the solid crystal area 12 through a solid crystal glue; the positive wire bonding area 131 and the negative wire bonding area 132 are respectively arranged on both sides of the light-emitting chip 20.

[0032] Optionally, in this embodiment, five metal sheets are provided in the bracket, and one end of the metal sheets extends to the bottom of the accommodating groove 11, respectively, to form three positive electrode welding wire areas 131 and two negative electrode welding wire areas 132 separated from each other, and the other end of the metal sheet is located on the outside of the bracket 10, and contacts with the bottom of the bracket 10 after multiple bending to form a connecting pin 15. An identification area 17 is also provided on the front side of the bracket 10, and the identification area 17 is located at the front corner of the bracket 10. The positioning of the bracket 10 is facilitated by setting the identification area. It can be understood that, in some optional embodiments, five metal sheets are provided in the bracket, one end of which extends to the bottom of the accommodating groove 11, and can also form two positive electrode welding wire areas 131 and three negative electrode welding wire areas 132 separated from each other. The process is similar and will not be repeated here. In addition, in another optional embodiment, six metal sheets can also be provided in the bracket, which can form three positive electrode welding wire areas 131 and three negative electrode welding wire areas 132 separated from each other, and can be connected to the positive and negative electrodes of the three light-emitting sub-chips through bonding wires.

[0033] Optionally, in the present embodiment, the red light chip 21 is fixedly connected to the solid crystal area 12 through a conductive silver glue, and a part of the solid crystal area 12 serves as the negative electrode connection area corresponding to the red light chip 21, and the red light chip 21 is connected to one of the positive electrode welding wire areas 131 through a bonding wire 30, and the green light chip 22 and the blue light chip 23 are fixedly connected to the solid crystal area 12 through an insulating glue, and the green light chip 22 and the blue light chip 23 are respectively connected to the remaining two positive electrode welding wire areas 131 and the two negative electrode welding wire areas 132 through two bonding wires 30, that is, in the present embodiment, the negative electrode of the red light chip 21 is connected to the positive electrode area through the conductive silver glue, and the negative electrode of the red light chip 21 is connected to the positive electrode area through the bonding wire, and the positive / negative electrodes of the green light chip 22 and the blue light chip 23 are electrically connected to the positive electrode area and the negative electrode area through the bonding wires. It can be understood that, in some optional embodiments, the green light chip 22 or the blue light chip 23 can also be electrically connected to the die-bonding area through conductive silver glue, and the connection methods of other chips are similar and will not be repeated here.

[0034] In summary, in the LED light-emitting device provided by the present application, the solid crystal area 12 is arranged in the middle of the functional area, and the wire bonding areas 13 are respectively arranged on both sides of the solid crystal area 12. The solid crystal area 12 and the wire bonding area 13 are highly misaligned, that is, the wire bonding area 13 is higher than the solid crystal area 12. The red light chip 21, the green light chip 22, and the blue light chip 23 are respectively fixedly connected to the solid crystal area 12. Since the solid crystal area 12 forms a low-lying area, it can effectively prevent the short circuit or poor wire bonding process caused by the solid crystal glue being thrown off during the glue solid crystal process; in addition, after the lamp bead process is packaged as a finished product, since the wire bonding area is higher than The solid crystal area is higher, the chip is sunken as a whole, and the welding wire area can play a role in blocking water vapor, effectively improving the moisture-proof performance of the lamp beads; further, since the cup depth remains unchanged and the welding wire area is raised, a part of the glue can be saved during the packaging process, reducing the cost of the lamp beads; one end of the metal sheet 14 arranged in the bracket 10 is arranged in the accommodating groove 11, and the top of the metal sheet is the welding wire area. The other end of the metal sheet extends to the bottom of the bracket 10 after multiple bending to form a connecting pin 15 connected to the external power supply. The accommodating groove 11 is sealed with packaging glue 16, and the packaging glue 16 is used to improve the protection effect of the circuits and devices in the functional area.

[0035] It should be noted that the above implementation process is only to illustrate the feasibility of the present application, but this does not mean that the LED light-emitting device of the present application is only implemented as described above. On the contrary, as long as the LED light-emitting device of the present application can be implemented, it can be included in the feasible implementation plan of the present application.

[0036] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0037] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED light-emitting device, characterized in that: It includes a bracket, one end of which is formed with a bowl-shaped receiving groove, the bottom of which is a functional area, the functional area including a solid crystal area and a plurality of welding wire areas, the plurality of welding wire areas are respectively arranged on both sides of the solid crystal area, the solid crystal area is lower than the welding wire area, so that the solid crystal area and the welding wire area are disconnected, and the plurality of welding wire areas are disconnected from each other by insulating parts, a plurality of light-emitting chips are arranged on the solid crystal area, the bottom of the light-emitting chip is fixedly connected to the solid crystal area, a metal sheet is arranged in the bracket, one end of the metal sheet extends into the receiving groove to form the welding wire area, the other end of the metal sheet is bent and extends to the end of the bracket away from the receiving groove to form a connecting pin, the light-emitting chip is electrically connected to the welding wire area, the LED light-emitting device is electrically connected to an external power supply through the connecting pin, and packaging glue is sealed in the receiving groove to fix and package the light-emitting chip.

2. The LED light emitting device according to claim 1, characterized in that: The bonding wire area includes a plurality of positive bonding wire areas and a plurality of negative bonding wire areas. The positive electrode of the light emitting chip is electrically connected to the positive bonding wire area, and the negative electrode of the light emitting chip is electrically connected to the negative bonding wire area.

3. The LED light emitting device according to claim 2, characterized in that: The light-emitting chip comprises at least three light-emitting sub-chips, one of which is fixedly connected to the solid crystal area via conductive silver glue, and the other light-emitting sub-chips are fixedly connected to the solid crystal area via insulating glue.

4. The LED light emitting device according to claim 3, characterized in that: The bonding wire area includes three positive bonding wire areas and two negative bonding wire areas. The positive electrode of the light-emitting sub-chip connected to the solid crystal area through conductive silver glue is electrically connected to one of the positive bonding wire areas through a bonding wire, and the negative electrode of the light-emitting sub-chip is electrically connected to the solid crystal area through the conductive silver glue. The positive and negative electrodes of the remaining two light-emitting sub-chips are electrically connected to the remaining two positive bonding wire areas and the two negative bonding wire areas respectively.

5. The LED light emitting device according to claim 3, characterized in that: The three light-emitting sub-chips are respectively a red light chip, a green light chip and a blue light chip.

6. The LED light emitting device according to claim 1, characterized in that: The other end of the metal sheet is bent at least three times and then extends to an end of the bracket away from the receiving groove to form the connecting pin.

7. The LED light emitting device according to claim 1, characterized in that: A marking area is provided on the top of the bracket.

Images