Touch display panel

Abstract

The embodiment of the utility model provides a touch display panel. The touch display panel comprises a touch display area and a binding area, the binding area comprises a touch binding bonding pad group, a display driving chip and a display binding bonding pad group; the touch binding pad group is connected with a touch signal line in the touch display area, the display driving chip is connected with a display signal line in the touch display area, and the display binding pad group is connected with the display driving chip; and at least two of the touch binding pad group, the display driving chip and the display binding pad group are arranged in a staggered manner in the long edge direction of the binding area. According to the touch display panel provided by the embodiment of the invention, the arrangement positions of the touch binding bonding pad group, the display driving chip and the display binding bonding pad group are improved, the frame width is relatively narrow, and the packaging cost is not increased.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a touch display panel. Background Art

[0002] As OLED (Organic light-emitting diodes) displays are increasingly used, users are increasingly pursuing extremely narrow bezels for aesthetics and a larger screen-to-body ratio. Currently, there are three common packaging solutions for OLED displays: COF (chip on film), COP (chip on plastic), and COG (chip on glass). Among them, the COP solution has the narrowest bezel, while the COG solution has the widest bezel but the lowest cost.

[0003] As market competition becomes increasingly fierce, many customers are pursuing narrow bezels while also pursuing low costs, so the original solutions can no longer support customer needs. Utility Model Content

[0004] The purpose of the embodiment of the present application is to provide a touch display panel to reduce the border width of the touch display panel without increasing the packaging cost. The specific technical solution is as follows:

[0005] In a first aspect, an embodiment of the present application provides a touch display panel, comprising:

[0006] A touch display area and a binding area; the binding area includes: a touch binding pad group, a display driver chip and a display binding pad group;

[0007] The touch binding pad group is connected to the touch signal line in the touch display area, the display driver chip is connected to the display signal line in the touch display area, and the display binding pad group is connected to the display driver chip;

[0008] At least two of the touch binding pad group, the display driving chip and the display binding pad group are staggered in the long side direction of the binding area.

[0009] Optionally, the touch binding pad group includes at least one first non-electrical connection pad, which is close to the outside of the touch binding pad group, and / or the display binding pad group includes at least one second non-electrical connection pad, which is close to the outside of the display binding pad group.

[0010] Optionally, the touch binding pad group and the display driver chip are staggered in the long side direction of the binding area, and the touch binding pad group is located at a corner of the touch display panel.

[0011] Optionally, the touch display panel includes a group of touch binding pads;

[0012] The touch binding pad group is located at any corner of the touch display panel in the binding area.

[0013] Optionally, the touch display panel includes a first touch binding pad group and a second touch binding pad group;

[0014] The first touch binding pad group is located at a first corner, and the second touch binding pad group is located at a second corner. The first corner and the second corner are different corners of the touch display panel in the binding area.

[0015] Optionally, the first touch binding pad group and the second touch binding pad group have different numbers of touch binding pads.

[0016] Optionally, the column-direction touch signal lines are connected to the touch binding pads of the first touch binding pad group, and the row-direction touch signal lines are connected to the touch binding pads of the second touch binding pad group.

[0017] Optionally, the number of touch binding pads in the first touch binding pad group and the number of touch binding pads in the second touch binding pad group are the same.

[0018] Optionally, the first to N / 2th column direction touch signal lines are connected to the touch binding pads of the first touch binding pad group, and the N / 2+1th to Nth column direction touch signal lines are connected to the touch binding pads of the second touch binding pad group, where N is the total number of column direction touch signal lines.

[0019] Optionally, the row-direction touch signal lines of odd-numbered rows are connected to the touch binding pads of the first touch binding pad group, and the row-direction touch signal lines of even-numbered rows are connected to the touch binding pads of the second touch binding pad group.

[0020] Optionally, the display driving chip and the display binding pad group are staggered in a long side direction of the binding area.

[0021] Optionally, the touch display panel includes a group of display binding pads;

[0022] The display binding pad group is located at one side of the display driving chip in the long side direction of the binding area.

[0023] Optionally, the touch display panel includes a first display binding pad group and a second display binding pad group;

[0024] The first display binding pad group and the second display binding pad group are respectively located at two sides of the display driving chip in the long side direction of the binding area.

[0025] Optionally, the arrangement direction of the touch binding pads in the touch binding pad group is perpendicular to the frame direction of the touch display panel, and / or there is an acute angle between the arrangement direction of the touch binding pads in the touch binding pad group and the frame direction of the touch display panel.

[0026] Optionally, the display driver chip has a first bump group and a second bump group, and a first signal line of the display driver chip extends from a spacing area between the first bump group and the second bump group and is connected to the display binding pad group.

[0027] Optionally, the touch signal line includes a row direction touch signal line, and the row direction touch signal line extends from a side of the touch display area close to the touch binding pad group and is connected to the touch binding pad group.

[0028] Optionally, the border width of the touch display panel is no more than 2.4 mm.

[0029] Beneficial effects of the embodiments of the present application:

[0030] The touch display panel provided in the embodiment of the present application follows the design concept of the COG solution, and optimizes the arrangement of the touch binding pad group, the display driver chip and the display binding pad group in the binding area, and limits the staggered arrangement of at least two of the touch binding pad group, the display driver chip and the display binding pad group in the long side direction of the binding area, so that the non-central area of ​​the binding area can be utilized, so that the touch binding pad group, the display driver chip and the display binding pad group can be arranged within a more limited border width, and the border width required for the touch display panel can be reduced without increasing the packaging cost.

[0031] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0033] Figure 1 A schematic diagram of the distribution of a display area and a binding area of ​​a display device;

[0034] Figure 2 is a schematic diagram of a touch display panel as a comparative example;

[0035] Figure 3 A first schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0036] Figure 4 A second schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0037] Figure 5 A third schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0038] Figure 6 A fourth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0039] Figure 7 A schematic diagram of the connection between the display driver chip and the display binding pad group in the touch display panel provided in an embodiment of the present application;

[0040] Figure 8 A first schematic diagram of a touch display panel provided in an embodiment of the present application;

[0041] Fig. 9 A second schematic diagram of a touch display panel provided in an embodiment of the present application;

[0042] Fig.10 A third schematic diagram of a touch display panel provided in an embodiment of the present application;

[0043] Fig.11 A fourth schematic diagram of a touch display panel provided in an embodiment of the present application;

[0044] Fig.12 A fifth schematic diagram of a touch display panel provided in an embodiment of the present application;

[0045] Fig.13 A fifth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0046] Fig.14 A sixth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0047] Fig.15 A seventh schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0048] Fig.16An eighth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0049] Fig.17 A sixth schematic diagram of a touch display panel provided in an embodiment of the present application;

[0050] Fig.18 A ninth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0051] Fig.19 A tenth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0052] Fig. 20 An eleventh schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0053] Fig.21 A twelfth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0054] Fig. 22 A thirteenth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0055] Fig.23 This is a fourteenth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0056] Fig.24 A fifteenth schematic diagram of a binding area in a touch display panel provided in an embodiment of the present application;

[0057] Reference numerals:

[0058] 1: touch display area, 2: non-display area;

[0059] 11: row direction touch control electrode, 12: column direction touch control electrode, 13: row direction touch control signal line, 14: column direction touch control signal line;

[0060] 200: binding area, 210: touch binding pad group, 210-1: first touch binding pad group, 210-2: second touch binding pad group, 211: touch binding pad, 212: first non-electrical connection pad, 220: display driver chip, 221: first bump group, 222: second bump group, 230: display binding pad group, 230-1: first display binding pad group, 230-2: second display binding pad group, 231: display binding pad, 232: second non-electrical connection pad, 240-signal line. DETAILED DESCRIPTION

[0061] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0062] like Figure 1 As shown, in addition to the display area, the display device usually has a frame surrounding the display area. Specifically, when packaging the display screen, the circuits and chips (integrated circuit, IC) of the display screen need to be concentrated and arranged under the display screen in order to connect the display screen to the driving circuit. The area below the display area for deploying the wiring and chips is often called the binding area. Since the wiring and chips need to occupy a large area, the width of the frame of the display device is mainly reflected on one side of the binding area. To achieve a narrow frame of the display device and ensure that the display has a large screen-to-body ratio, it is necessary to optimize the design of the binding area.

[0063] There are three main display packaging solutions: COF, COP and COG. Among them, the COG solution integrates the cable and chip directly on the glass backplane, and the border on one side of the binding area is wider; the COF solution and the COG solution require the use of bendable flexible materials to complete the packaging of the display, and bend part of the binding area or the entire binding area to the back of the screen, which can greatly reduce the width of the border, but also leads to higher costs.

[0064] Taking the above problems into consideration, this application follows the idea of ​​the COG solution and optimizes the design of the placement of cables and chips in the binding area in the conventional COG solution, providing a touch display substrate that can reduce the border width and increase the screen-to-body ratio of the product while ensuring the low cost of the packaging process.

[0065] The following is an explanation of the design of the wiring and chip position in the conventional COG solution. Figure 2 , wherein the touch display panel shown includes a touch display area 1 and a non-display area 2 surrounding the touch display area 1, wherein the portion of the non-display area 2 located on one side of the touch display area 1 is the binding area 200. In order to facilitate routing and simplify the bonding process, conventional solutions usually set the touch bonding pad group 210, the display driver chip 220 and the display bonding pad group 230 in the middle of the binding area 200.

[0066] Specifically, the binding pad is a banding pad that can be directly bound to a flexible printed circuit (FPC). Figure 2 In the schematic diagram, the touch binding pad group 210 includes a plurality of touch binding pads 211, and the touch electrodes in the touch display area 1 are connected to the touch binding pads 211 through touch signal lines (not shown in the figure). By binding the touch FPC to the touch binding pad group 210, the conduction between the touch FPC and the touch electrodes can be achieved. The display binding pad group 230 includes a plurality of display binding pads 231, and these display binding pads 231 are connected to the display driver chip 220, and the display driver chip 220 is connected to the pixel electrodes in the touch display area 1 through display signal lines, so that by binding the display FPC to the display binding pad group 230, the connection path between the display FPC-display driver chip-pixel electrode can be realized.

[0067] However, Figure 2 The illustrated design will result in a frame that is too wide. Specifically, the frame width w1 occupied by the touch binding pad group 210 is generally 0.69 mm (millimeter), and the frame width w2 occupied by the display driver chip 220 and the display binding pad group 230 is generally 2.21 mm. The total frame width is about 2.9 mm, which cannot meet the narrow frame requirements of most customers.

[0068] The touch display panel provided in the present application is described below. Specifically, the touch display panel includes a touch display area 1 and a binding area 200 . The binding area 200 includes: a touch binding pad group 210 , a display driver chip 220 and a display binding pad group 230 .

[0069] In practical applications, the touch display panel is usually prepared with a TFT (Thin Film Transistor) array substrate as the substrate. In this case, the area where the pixel electrodes and the touch electrodes are arranged is the touch display area 1, and the area around the touch display area 1 constitutes the non-display area 2. At this time, the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 are specifically arranged on the array substrate in the non-display area 2.

[0070] The touch bonding pad group 210 is connected to the touch signal line in the touch display area 1, the display driver chip 220 is connected to the display signal line in the touch display area 1, and the display bonding pad group 230 is connected to the display driver chip 220. As described above, the touch signal line can be specifically led out from the touch electrode in the touch display area 1, and the display signal line can be specifically led out from the pixel electrode in the touch display area 1.

[0071] and Figure 2 The difference from the COG solution shown in the figure is that the present application does not set the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 in the middle of the binding area, but limits at least two of the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 to be staggered in the long side direction of the binding area 200. Specifically, it can be understood that at least two of the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 are staggered in the d1 direction.

[0072] Exemplarily, the touch binding pad group 210 and the display driver chip 220 may be staggered, or the display driver chip 220 and the display binding pad group 230 may be staggered, or both the touch binding pad group 210 and the display binding pad group 230 may be staggered with the display driver chip 220.

[0073] Specifically, for Figure 2 In the illustrated case, since the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 are all located in the middle of the binding area 200 in the d1 direction, in order to achieve a reasonable arrangement of the signal line, the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230, it is necessary to reserve sufficient space for 210, the display driver chip 220 and the display binding pad group 230 in the d2 direction, which leads to a larger border width. In the touch display panel provided in the present application, since at least two of the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 are staggered, it is possible to utilize the non-central area in the binding area 200 and to a certain extent achieve the reuse of the space in the binding area 200 in the d2 direction, thereby helping to reduce the width of the border.

[0074] The touch display panel provided in the present application is described below in conjunction with specific embodiments.

[0075] In a possible implementation, the touch binding pad group 210 and the display driving chip 220 are staggered in the long side direction of the binding area 200 , and the touch binding pad group 210 is located at the corner of the touch display panel.

[0076] based on Figure 2 It can be seen from the diagram that the binding area 200 includes two corners of the touch display panel, so each touch binding pad 211 that needs to be set can be set as a touch binding pad group 210, or each touch binding pad 211 can be divided into two touch binding pad groups 210 for setting.

[0077] In the case where the touch display panel includes a set of touch binding pad groups 210, the touch binding pad group 210 is located at any corner of the touch display panel in the binding area 200. Figure 3 As shown, the touch binding pad group 210 can be set at the round edge of the lower left corner of the touch display panel, or it can also be set as shown in FIG. Figure 4 As shown, the touch bonding pad group 210 is disposed at the rounded edge of the lower right corner of the touch display panel.

[0078] In the case where the touch display panel includes two groups of touch binding pad groups 210, the two groups of touch binding pad groups 210 can be respectively set at different corners of the touch display panel in the binding area 200. Exemplarily, each touch binding pad 211 that needs to be set can be evenly divided to obtain two touch binding pad groups 210 containing the same number of touch binding pads 211, and the two touch binding pad groups 210 are respectively set at different corners of the touch display panel; or, each touch binding pad 211 that needs to be set can be non-uniformly divided to obtain two touch binding pad groups 210 containing different numbers of touch binding pads 211, and the two touch binding pad groups 210 are respectively set at different corners of the touch display panel.

[0079] See also Figure 5 As shown in the figure, the first touch binding pad group 210-1 and the second touch binding pad group 210-2 both contain the same number of touch binding pads 211, which are both 5. The first touch binding pad group 210-1 is set at the round edge of the lower left corner of the touch display panel, and the second touch binding pad group 210-2 is set at the round edge of the lower right corner of the touch display panel.

[0080] See also Figure 6 As shown in FIG. 1 , the first touch binding pad group 210-1 and the second touch binding pad group 210-2 each contain a different number of touch binding pads 211, which are 4 and 6 respectively. The first touch binding pad group 210-1 is arranged at the round edge of the lower left corner of the touch display panel, and the second touch binding pad group 210-2 is arranged at the round edge of the lower right corner of the touch display panel.

[0081] Below Figures 3 to 6 In the schematic diagram, the connection between the display bonding pad group 230 and the display driving chip 220, and the connection between the touch bonding pad group 210 and the touch signal line in the touch display area 1 are described.

[0082] Among them, for Figures 3 to 6 , showing the connection between the bonding pad group 230 and the display driver chip 220 as shown in FIG. Figure 7As shown. Specifically, the display driver chip 220 includes a first bump group 221 close to the touch display area 1, and a second bump group 222 farther from the touch display area 1 than the first bump group 221. Generally speaking, the first bump group 221 can be used to realize the connection between the display driver chip 220 and the display signal line in the display touch area 1 (not shown in the figure), and the second bump group 222 can be used to realize the connection between the display driver chip 220 and the display driver pad group 230. In this case, the signal line 240 connecting the display driver chip 220 and the touch binding pad group 210 can be specifically led out from the second bump group 222, and the line is output on the side of the display driver chip 220 away from the touch display area 1, and connected to the display binding pad group 230.

[0083] Combine the following Figure 8 ,right Figure 3 The connection between the touch binding pad group 210 and the touch signal line is described by schematically setting the touch binding pad group 210 at the lower left corner of the touch display panel.

[0084] Specifically, the touch display area 1 includes row-direction touch electrodes 11 and column-direction touch electrodes 12. Each row of row-direction touch electrodes 11 can lead to a row-direction touch signal line 13, and each column of column-direction touch electrodes 12 can lead to a column-direction touch signal line 14. In the case where the touch binding pad group 210 is only set at a corner of the touch display panel, the row-direction signal line 13 can be led out from a side of the touch display area 1 close to the touch binding pad group 210 and connected to the touch binding pad group 210.

[0085] for Figure 8 For example, the touch binding pad group 210 is set at the round edge of the lower left corner of the touch display panel. Therefore, the row direction signal line 13 is led out from the left side of the touch display area 1 and connected to the touch binding pad group 210, thereby simplifying the wiring. The column direction signal line 13 is led out from the bottom of the touch display area 1 and connected to the touch binding pad group 210.

[0086] for Figure 4 For example, the connection between the touch bonding pad group 210 and the touch signal line can be seen in FIG. Fig. 9 .like Fig. 9 Schematically, the touch binding pad group 210 is arranged at the rounded edge of the lower right corner of the touch display panel, so the row direction signal line 13 is led out from the right side of the touch display area 1 and connected to the touch binding pad group 210 .

[0087] for Figure 5In the case where the first touch binding pad group 210-1 and the second touch binding pad group 210-2 include the same number of touch binding pads 211, the first to N / 2 column direction touch signal lines 14 can be set to be connected to the touch binding pads 211 in the first touch binding pad group 210-1, and the N / 2+1 to N column direction touch signal lines 14 can be connected to the touch binding pads 211 in the second touch binding pad group 210-2. And the row direction touch signal lines 13 of the odd rows are set to be connected to the touch binding pads 211 in the first touch binding pad group 210-1, and the row direction touch signal lines 13 of the even rows are connected to the touch binding pads 211 in the second touch binding pad group 210-2.

[0088] As an example, for Figure 5 For example, the connection between the touch bonding pad group 210 and the touch signal line can be seen in Fig.10 . It can be seen that the row-direction touch lines 13 of the first row, the third row, and the fifth row extend from the left side of the touch display area 1 and are connected to the first touch binding pad group 210-1 in the lower left corner, while the row-direction touch lines 13 of the second row, the fourth row, and the sixth row extend from the right side of the touch display area 1 and are connected to the second touch binding pad group 210-2 in the lower right corner. In addition, the column-direction touch signal lines 14 of the first column and the second column extend from the bottom of the touch display area 1 and are connected to the first touch binding pad group 210-1 in the lower left corner, while the column-direction touch signal lines 14 of the third column and the fourth column extend from the bottom of the touch display area 1 and are connected to the first touch binding pad group 210-1 in the lower right corner.

[0089] As another example, for Figure 5 In the case of indication, it can also be Fig.11 Appropriately, the row-direction touch lines 13 of the first to third rows are arranged to extend from the left side of the touch display area 1 and be connected to the first touch binding pad group 210-1 at the lower left corner, and the row-direction touch lines 13 of the fourth to sixth rows are arranged to extend from the right side of the touch display area 1 and be connected to the second touch binding pad group 210-2 at the lower right corner.

[0090] Specifically, for Fig.10 and Fig.11In the schematic wiring method, a part of the row-direction touch lines 13 are connected from the left side of the touch display area 1 to the first touch binding pad group 210-1 in the lower left corner, and another part of the row-direction touch lines 13 are connected from the right side of the touch display area 1 to the second touch binding pad group 210-2 in the lower right corner. Therefore, the number of row-direction touch lines 13 that need to be arranged on the left side frame of the touch display panel and the number of row-direction touch lines 13 that need to be arranged on the right side frame of the touch display panel are both relatively small, which helps to reduce the width of the side frame of the touch display panel.

[0091] Naturally, for Figure 5 In the illustrated case, the connection between the first touch binding pad group 210-1, the second touch binding pad group 210-2 and the touch line is not limited to Fig.10 and Fig.11 For example, the row direction touch signal lines 13 of the first to fifth rows may be arranged to extend from the left side of the touch display area 1 and connected to the first touch binding pad group 210-1 at the lower left corner, and the row direction touch signal line 13 of the sixth row and each column direction touch signal line may be arranged to be connected to the second touch binding pad group 210-2 at the lower right corner.

[0092] for Figure 6 In the case where the first touch bonding pad group 210-1 and the second touch bonding pad group 210-2 include different numbers of touch bonding pads 211, the Fig.12 As shown, the column direction touch signal line 14 is connected to the first touch binding pad group 210-1 at the lower left corner, and the row direction touch signal line 13 is connected to the second touch binding pad group 210-2 at the lower right corner, so as to simplify the wiring design of the touch signal line. Figure 5 In the illustrated case, the connection between the first touch binding pad group 210-1, the second touch binding pad group 210-2 and the touch line is not limited to Fig.12 For example, two row-direction touch signal lines 13 and two column-direction signal lines 14 may be connected to the first touch binding pad group 210-1, and four row-direction touch signal lines 13 and two column-direction signal lines 14 may be connected to the second touch binding pad group 210-2. Other wiring arrangements may also be provided depending on the number of touch binding pads 211 included in the first touch binding pad group 210-1 and the second touch binding pad group 210-2.

[0093] Combined with the above Figures 3 to 13It can be seen from the description that the above embodiment of the present application makes full use of the corner position in the binding area 200 by staggering the touch binding pad group 210 and the display driver chip 220, and specifically arranges the touch binding pad group 210 at the corner of the touch display panel, thereby effectively reducing the width of the touch binding pad group 210 in the direction d2 in the part directly below the touch display area 1, and thus reducing the border width of the touch display panel. It has been verified that when using Figure 5 When the touch binding pad group 210 is set according to the schematic scheme, the border width w1 occupied by the touch binding pad group 210 can be Figure 2 The 0.69mm in the test was reduced to 0.19mm.

[0094] In a possible implementation, the display driver chip 220 and the display binding pad group 230 are staggered in the long side direction of the binding area 200. Specifically, each display binding pad 231 that needs to be set can be used as a display binding pad group 230, and the display binding pad group 230 is set to be located on one side of the display driver chip 220 in the long side direction of the binding area 200, or each display binding pad 231 that needs to be set can be divided into two display binding pad groups 230, and the two display binding pad groups 230 are set to be located on both sides of the display driver chip 220 in the long side direction.

[0095] like Fig.13 As shown, the touch display panel includes a display binding pad group 230, and the display binding pad group 230 is located on the right side of the display driver chip 220 in the long side direction of the binding area 200. Specifically, when the display binding pad group 230 and the display driver chip 220 are staggered, in order to further reduce the frame width, the signal line 240 connecting the display driver chip 220 and the display binding pad group 230 may not be arranged in a line. Figure 7 The schematic scheme allows the signal line 240 to extend from the bottom of the display driver chip 220. Instead, the signal line 240 can be set to extend from the spacing area between the first bump group 221 and the second bump group 222 and connected to the display binding pad group, thereby further reducing the border thickness required to be occupied by the display driver chip 220 and the display binding pad group 230 in the d2 direction.

[0096] For example, it can also be Fig.14 As shown, the display bonding pad group 230 is arranged to be located on the left side of the display driving chip 220 in the long side direction of the bonding area 200 .

[0097] In the case where each display binding pad 231 that needs to be set is divided into two display binding pad groups 230 for setting, each display binding pad 231 can be evenly divided into two display binding pad groups 230 containing the same number of display binding pads 231, and the two display binding pad groups 230 are respectively arranged on both sides of the display driver chip 220 in the long side direction. Alternatively, each display binding pad 231 can also be unevenly divided into two display binding pad groups 230 containing different numbers of display binding pads 231, and the two display binding pad groups 230 are respectively arranged on both sides of the display driver chip 220 in the long side direction.

[0098] See also Fig.15 As shown in the figure, the first display binding pad group 230-1 and the second display binding pad group 230-2 contain the same number of display binding pads 231, both of which are 5, and the first display binding pad group 230-1 is arranged on the left side of the display driver chip 220 in the long side direction of the binding area 200, and the second display binding pad group 230-2 is arranged on the right side of the display driver chip 220 in the long side direction of the binding area 200.

[0099] See also Fig.16 As shown in the figure, the first display binding pad group 230-1 and the second display binding pad group 230-2 contain different numbers of display binding pads 231, which are 3 and 7 respectively, and the first display binding pad group 230-1 is arranged on the left side of the display driver chip 220 in the long side direction of the binding area 200, and the second display binding pad group 230-2 is arranged on the right side of the display driver chip 220 in the long side direction of the binding area 200.

[0100] against Figures 13 to 16 In the illustrated case, the connection relationship between the touch binding pad group 210 and the touch signal line in the touch display area 1 can refer to Fig.17 As shown in FIG. 1 , a portion of the row direction touch signal lines 13 are connected from the left side of the touch display area 1 to the touch binding pad group 210, another portion of the row direction touch signal lines 13 are connected from the right side of the touch display area 1 to the touch binding pad group 210, and the column direction touch signal lines 14 are connected from the bottom of the touch display area 1 to the touch binding pad group 210. Naturally, other connection methods can also be used between the touch binding pad group 210 and the touch signal lines in the touch display area 1.

[0101] Based on the above Figures 13 to 16 It can be seen from the description that Figure 2Compared with the solution shown in the figure, which requires to reserve sufficient space for the display driver chip 220 and the display binding pad group 230 in the binding area 200 in the direction d2, and the display driver chip 220 and the display binding pad group 230 also need to reserve a certain interval to arrange the signal line 240, the above-mentioned embodiment of the present application arranges the display driver chip 220 and the display binding pad group 230 in a staggered manner, so that the display driver chip 220 and the display binding pad group 230 can reuse the space in the binding area 200 in the direction d2, thereby reducing the border width w2 that the display driver chip 220 and the display binding pad group 230 need to occupy in the direction d2, and can play the effect of reducing the border width of the touch display panel. It has been verified that when using Figures 13 to 16 When the display driver chip 220 and the display binding pad group 230 are arranged according to the schematic scheme, the border width w2 occupied by the display driver chip 220 and the display binding pad group 230 can be Figure 2 The 2.21mm in the video is reduced to 1.71mm.

[0102] In a possible implementation, the touch binding pad group 210 and the display binding pad group 230 may be arranged staggered with the display driving chip 220 in the long side direction of the binding area.

[0103] For example, Fig.18 As shown, the touch bonding pad group 210 is disposed at the corner of the touch display panel in the bonding area 200 , and the display bonding pad group 230 is disposed on one side of the display driving chip 220 in the long side direction of the bonding area 200 .

[0104] For example, it can also be Fig.19 As shown, the touch binding pad 211 to be set is divided into a second touch binding pad group 210-2 and a second touch binding pad group 210-2, and the second touch binding pad group 210-2 and the second touch binding pad group 210-2 are respectively set at different corners of the touch display panel in the binding area 200, and the display binding pad group 230 is set on one side of the display driver chip 220 in the long side direction of the binding area 200.

[0105] For example, it can also be Fig. 20 As shown, the touch binding pad group 210 is set at the corner of the touch display panel in the binding area 200, and the display binding pad 231 to be set is divided into a first display binding pad group 230-1 and a second display binding pad group 230-2, and the first display binding pad group 230-1 and the second display binding pad group 230-2 are respectively set on both sides of the display driver chip 220 in the long side direction of the binding area 200.

[0106] For example, it can also be Fig.21 As shown, the touch binding pad 211 to be set is divided into a second touch binding pad group 210-2 and a second touch binding pad group 210-2, and the second touch binding pad group 210-2 and the second touch binding pad group 210-2 are respectively set at different corners of the touch display panel in the binding area 200, and the display binding pad 231 to be set is divided into a first display binding pad group 230-1 and a second display binding pad group 230-2, and the first display binding pad group 230-1 and the second display binding pad group 230-2 are respectively set on both sides of the display driver chip 220 in the long side direction of the binding area 200.

[0107] For example, in the use of Fig.21 In the solution shown in the figure, the border width w3 of the touch display panel will be Figure 2 The 2.9mm in the middle solution is reduced to 1.9mm, of which w1 and w2 account for 0.19mm and 1.71mm respectively.

[0108] Based on the above description, it can be seen that the touch display panel provided in the above embodiment of the present application follows the idea of ​​the COG solution and optimizes the arrangement of the touch binding pad group 210, the display driver chip 220 and the display binding pad group 230 in the binding area 200, thereby effectively reducing the border width, while meeting users' needs for low cost and narrow borders, and enhancing product competitiveness.

[0109] In a possible implementation, in order to make the touch bonding pad group 210 have electrostatic protection performance, the touch bonding pad group 210 includes at least one first non-electrical connection pad 212 , and the first non-electrical connection pad 212 is close to the outer side of the touch bonding pad group 210 .

[0110] The first non-electrical connection pad 212 can be specifically understood as a dummy pin or a floating pad, that is, although the first non-electrical connection pad 212 has a pad structure, it is not connected to other components through a signal line.

[0111] The first non-electrical connection pads 212 are specifically located at both ends of the touch bonding pad group 210, see Fig. 22As shown in FIG. 1 , when the display touch panel includes only one set of touch binding pad groups 210, first non-electrical connection pads 212 may be provided at both ends of the touch binding pad groups 210. In this case, if static electricity appears in the touch display panel, the static electricity will preferentially destroy the first non-electrical connection pads 212 when entering the touch binding pad groups 210, and may disappear after destroying the first non-electrical connection pads 212, so that the touch binding pads 211 with electrical connection in the touch binding pad groups 210 can be effectively protected and continue to realize their normal functions.

[0112] Specifically, Fig. 22 Only one first non-electrical connection pad 212 is provided at each end of the touch bonding pad group 210. In fact, multiple first non-electrical connection pads 212 may be provided at each end of the touch bonding pad group 210 to improve the electrostatic protection performance of the touch bonding pad group 210.

[0113] See also Fig.23 As shown in the figure, for the case where the display touch panel includes a first touch binding pad group 210-1 and a second touch binding pad group 210-2, a first non-electrical connection pad 212 can be set at both ends of the first touch binding pad group 210-1 and the second touch binding pad group 210-2.

[0114] Accordingly, in a possible implementation, in order to make the display binding pad group 230 have electrostatic protection performance, the display binding pad group 230 includes at least one second non-electrical connection pad 232, and the second non-electrical connection pad 232 is close to the outer side of the display binding pad group 230.

[0115] The second non-electrical connection pads 232 are specifically located at both ends of the display bonding pad group 230, see Fig. 22 As shown in FIG. 1 , when the display touch panel includes only one display binding pad group 230 , second non-electrical connection pads 232 may be provided at both ends of the display binding pad group 230 .

[0116] Similar to the description of the first non-electrical connection pad 212 , a plurality of second non-electrical connection pads 232 may be respectively disposed at both ends of the display bonding pad group 230 to improve the electrostatic protection performance of the display bonding pad group 230 .

[0117] See also Fig.23 As shown in the figure, for the case where the display touch panel includes a first display binding pad group 230-1 and a second display binding pad group 230-2, a second non-electrical connection pad 232 can be set at both ends of the first display binding pad group 230-1 and the second display binding pad group 230-2.

[0118] In a possible implementation, a protective layer may be provided for each touch binding pad 211 in the touch binding pad group 210 to protect the touch binding pad 211 from being damaged during use.

[0119] In addition, regarding the above application Figures 2 to 23 For example, the arrangement directions of the touch binding pads 211 in the touch binding pad group 210 and the display binding pads 231 in the display binding pad group 230 are perpendicular to the frame direction of the touch display panel. In a possible implementation, the arrangement directions of the touch binding pads 211 in the touch binding pad group 210 and / or the display binding pads 231 in the display binding pad group 230 may be arranged with an acute angle to the frame direction of the touch display panel. This may also be understood as arranging the touch binding pads 211 and / or the display binding pads 231 at an angle to accommodate different wiring requirements.

[0120] For example, see Fig.24 As shown in the figure, the first four touch binding pads 211 located at the top in the touch binding pad group 210 are arranged vertically, the remaining six touch binding pads 211 are arranged obliquely, and the display binding pads 231 in the display binding pad group 230 are arranged obliquely.

[0121] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0122] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0123] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A touch display panel, characterized in that: include: Touch display area and binding area; The binding area includes: a touch binding pad group, a display driver chip and a display binding pad group; The touch binding pad group is connected to the touch signal line in the touch display area, the display driver chip is connected to the display signal line in the touch display area, and the display binding pad group is connected to the display driver chip; At least two of the touch binding pad group, the display driving chip and the display binding pad group are staggered in the long side direction of the binding area.

2. The touch display panel according to claim 1, characterized in that: The touch binding pad group includes at least one first non-electrical connection pad, which is close to the outer side of the touch binding pad group, and / or the display binding pad group includes at least one second non-electrical connection pad, which is close to the outer side of the display binding pad group.

3. The touch display panel according to claim 1, characterized in that: The touch binding pad group and the display driving chip are staggered in the long side direction of the binding area, and the touch binding pad group is located at the corner of the touch display panel.

4. The touch display panel according to claim 3, characterized in that: The touch display panel includes a group of touch binding pads; The touch binding pad group is located at any corner of the touch display panel in the binding area.

5. The touch display panel according to claim 3, characterized in that: The touch display panel includes a first touch binding pad group and a second touch binding pad group; The first touch binding pad group is located at a first corner, and the second touch binding pad group is located at a second corner. The first corner and the second corner are different corners of the touch display panel in the binding area.

6. The touch display panel according to claim 5, characterized in that: The first touch bonding pad group and the second touch bonding pad group have different numbers of touch bonding pads.

7. The touch display panel according to claim 6, characterized in that: The column-direction touch signal lines are connected to the touch binding pads of the first touch binding pad group, and the row-direction touch signal lines are connected to the touch binding pads of the second touch binding pad group.

8. The touch display panel according to claim 5, characterized in that: The number of touch bonding pads in the first touch bonding pad group and the number of touch bonding pads in the second touch bonding pad group are the same.

9. The touch display panel according to claim 8, characterized in that: The first to N / 2 column direction touch signal lines are connected to the touch binding pads of the first touch binding pad group, and the N / 2+1 to N column direction touch signal lines are connected to the touch binding pads of the second touch binding pad group, where N is the total number of column direction touch signal lines.

10. The touch display panel according to claim 8, characterized in that: The row direction touch signal lines of the odd rows are connected to the touch binding pads of the first touch binding pad group, and the row direction touch signal lines of the even rows are connected to the touch binding pads of the second touch binding pad group.

11. The touch display panel according to claim 1, characterized in that: The display driving chip and the display binding pad group are staggered in the long side direction of the binding area.

12. The touch display panel according to claim 11, characterized in that: The touch display panel includes a group of display binding pads; The display binding pad group is located at one side of the display driving chip in the long side direction of the binding area.

13. The touch display panel according to claim 11, characterized in that: The touch display panel includes a first display binding pad group and a second display binding pad group; The first display binding pad group and the second display binding pad group are respectively located at two sides of the display driving chip in the long side direction of the binding area.

14. The touch display panel according to claim 1, characterized in that: The arrangement direction of the touch binding pads in the touch binding pad group is perpendicular to the frame direction of the touch display panel, and / or there is an acute angle between the arrangement direction of the touch binding pads in the touch binding pad group and the frame direction of the touch display panel.

15. The touch display panel according to any one of claims 11 to 13, characterized in that: The display driver chip has a first bump group and a second bump group. A first signal line of the display driver chip extends from a spacing area between the first bump group and the second bump group and is connected to the display binding pad group.

16. The touch display panel according to claim 4, characterized in that: The touch signal lines include row-direction touch signal lines, and the row-direction touch signal lines extend from a side of the touch display area close to the touch binding pad group and are connected to the touch binding pad group.

17. The touch display panel according to any one of claims 1 to 13, characterized in that: The border width of the touch display panel does not exceed 2.4 mm.

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