Silicon wafer cleaning machine

Abstract

The utility model relates to the technical field of silicon wafer cleaning, and discloses a silicon wafer cleaning machine which comprises a cleaning tank, and a cleaning mechanism is arranged at the front end of the cleaning tank. The cleaning mechanism comprises a supporting seat, the front end of the supporting seat is fixedly connected to the outer wall of the cleaning tank, the inner wall of the supporting seat is rotatably connected with a rotating column, the rear end of the rotating column is fixedly connected with a fixing plate, the outer wall of the fixing plate is rotatably connected with a connecting plate, and the outer wall of the connecting plate is rotatably connected with a scraper. A collecting tank is inserted into the outer wall of the cleaning tank, the inner wall of the collecting tank is elastically connected with a movable plate through a connecting spring, a collecting mechanism is arranged at the top end of a scraper, the outer wall of the scraper is slidably connected to the inner wall of the cleaning tank, and the outer wall of the scraper is an inclined plane. According to the cleaning device, related personnel can rotate the rotating plate to enable the scraping plate to move upwards, then sediments in the cleaning tank can be scraped into the collecting tank, and operation is easy and convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning machine. Background Art

[0002] Silicon wafer cleaning machine is a professional equipment used to clean the surface of semiconductor silicon wafers. Its main function is to remove pollutants such as particles, organic matter, metal ions, etc. on the surface of silicon wafers through physical or chemical methods, ensure the cleanliness of silicon wafers, and provide high-quality substrates for subsequent semiconductor manufacturing processes.

[0003] After searching, Chinese patent announcement number: CN219899357U discloses a silicon wafer cleaning machine, including multiple water tank shells and multiple filter shells, one side of the inner wall of the multiple water tank shells is fixedly connected with a transmission pipe, one end of the multiple transmission pipes is fixedly connected with a water pump, the output end of the multiple water pumps is fixedly connected with a water outlet pipe, the pipe wall of the multiple water outlet pipes is fixedly connected with a hole block, one side of the multiple filter shells is opened with a fixed port, and the inner wall of the multiple fixed ports is fixedly connected to the surface of the hole block. The utility model device has an efficient filtering structure. When the cleaning liquid is used to clean the surface of the cleaning silicon wafer for many times and becomes turbid, a filtering device can be used to effectively filter the cleaning liquid, so that the efficiency of the cleaning liquid is improved, the disadvantage of needing to replace a large amount of chemical cleaning liquid is avoided, the purchase funds are reduced, and the processing cost of the equipment is also reduced to avoid waste.

[0004] Although the above technology avoids the disadvantage of requiring a large amount of replacement of chemical cleaning liquid, some chemical cleaning liquids will react with impurities on the silicon wafer to form precipitates during cleaning. The presence of precipitates will hinder the direct contact between the cleaning liquid and the surface of the silicon wafer, affecting the flow and distribution of the cleaning liquid, thereby reducing the cleaning effect. Generally, when cleaning the precipitate, it is necessary to manually enter the cleaning tank and use tools to clean it, and then use a broom to remove the cleaned precipitate, which is rather troublesome. Therefore, a silicon wafer cleaning machine is proposed to solve the above problem. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a silicon wafer cleaning machine, aiming to improve the problem in the prior art that manual cleaning is required.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a silicon wafer cleaning machine, comprising a cleaning tank, wherein a cleaning mechanism is provided at the front end of the cleaning tank;

[0007] The cleaning mechanism comprises a support seat, the front end of the support seat is fixedly connected to the outer wall of the cleaning tank, the inner wall of the support seat is rotatably connected to a rotating column, the rear end of the rotating column is fixedly connected to a fixing plate, the outer wall of the fixing plate is rotatably connected to a connecting plate, the outer wall of the connecting plate is rotatably connected to a scraper, the outer wall of the cleaning tank is plugged into a collecting tank, the inner wall of the collecting tank is elastically connected to a movable plate through a connecting spring, a collecting mechanism is arranged on the top of the scraper, the collecting mechanism comprises a filter plate, the outer wall of the filter plate is fixed with a plug-in seat, the plug-in seat and the outer wall of the filter plate are both plugged into the inner wall of the scraper, the top of the scraper is fixedly connected to the fixing seat, the inner wall of the fixing seat is elastically connected to a latch through a limiting spring, and the top of the filter plate is fixedly connected to the plug-in seat.

[0008] As a further description of the above technical solution:

[0009] The outer wall of the scraper is slidably connected to the inner wall of the cleaning tank, and the outer wall of the scraper is arranged as an inclined surface.

[0010] As a further description of the above technical solution:

[0011] The length of the movable plate is greater than that of the rotating column.

[0012] As a further description of the above technical solution:

[0013] A rotating plate is fixedly connected to the outer wall of the rotating column.

[0014] As a further description of the above technical solution:

[0015] One end of the connecting spring is fixedly connected to the outer wall of the movable plate, the other end of the connecting spring is fixedly connected to the inner wall of the collecting tank, and the outer wall of the movable plate is slidably connected to the inner wall of the collecting tank.

[0016] As a further description of the above technical solution:

[0017] One end of the limit spring is fixedly connected to the outer wall of the latch, the other end of the limit spring is fixedly connected to the inner wall of the fixing seat, and the outer wall of the latch is slidably connected to the inner wall of the fixing seat.

[0018] As a further description of the above technical solution:

[0019] The outer wall of the plug is plugged into the inner wall of the socket.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, by the mutual cooperation between the cleaning tank and its cleaning mechanism and other structures, the relevant personnel can rotate the rotating plate to move the scraper upward, and then the sediment in the cleaning tank can be scraped into the collecting tank, which is simple and convenient to operate.

[0022] 2. In the utility model, by the cooperation between the collecting mechanism and other structures, when the scraper moves upward, the impurities on the filter plate will also move upward, and then the latch can be moved to release the limit to remove the filter plate, and then the impurities on the filter plate can be removed and cleaned, avoiding manual entry into the collection tank for cleaning and collection. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an overall three-dimensional schematic diagram of a silicon wafer cleaning machine proposed by the utility model;

[0024] Figure 2 This is an overall three-dimensional schematic diagram of a rotating plate of a silicon wafer cleaning machine proposed by the utility model;

[0025] Figure 3 This is a schematic diagram of the cleaning tank and scraper of a silicon wafer cleaning machine proposed by the utility model;

[0026] Figure 4 This is a schematic diagram of the internal cross section of a collection tank of a silicon wafer cleaning machine proposed by the utility model;

[0027] Figure 5 This is an overall three-dimensional schematic diagram of a support base of a silicon wafer cleaning machine proposed by the utility model;

[0028] Figure 6 This is a schematic diagram of the enlarged structure of point A of a silicon wafer cleaning machine proposed by the utility model.

[0029] Legend:

[0030] 1. Cleaning tank; 2. Cleaning mechanism; 201. Rotating plate; 202. Rotating column; 203. Support seat; 204. Collecting tank; 205. Scraper; 206. Fixed plate; 207. Connecting plate; 208. Connecting spring; 209. Movable plate; 3. Collecting mechanism; 301. Filter plate; 302. Fixed seat; 303. Plug seat; 304. Limiting spring; 305. Latch. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Reference Figure 1-Figure 3 The utility model provides an embodiment: a silicon wafer cleaning machine, including a cleaning tank 1, the cleaning tank 1 is used to clean silicon wafers, which is a prior art and will not be explained in detail here. A cleaning mechanism 2 is arranged at the front end of the cleaning tank 1; the cleaning mechanism 2 includes a support seat 203, the front end of the support seat 203 is fixedly connected to the outer wall of the cleaning tank 1, the support seat 203 is L-shaped, and plays a supporting and connecting role, the inner wall of the support seat 203 is rotatably connected with a rotating column 202, the rear end of the rotating column 202 is fixedly connected with a fixed plate 206, the outer wall of the fixed plate 206 is rotatably connected with a connecting plate 207, and the fixed plate 206 is driven to rotate by the rotation of the rotating column 202, and the connecting plate 207 is connected to the fixed plate 206. The plate 207 will also move accordingly. The outer wall of the connecting plate 207 is rotatably connected to the scraper 205. The movement of the connecting plate 207 drives the scraper 205 to move upward, thereby achieving the cleaning effect of the inner wall of the cleaning tank 1. The outer wall of the cleaning tank 1 is plugged with a collecting tank 204. The collecting tank 204 is used to collect the precipitated impurities cleaned by the scraper 205, and the collecting tank 204 can be disassembled and cleaned as a whole. The inner wall of the collecting tank 204 is elastically connected to the movable plate 209 through the connecting spring 208. A block is set at the front end of the movable plate 209, and the block serves to facilitate movement. The top of the scraper 205 is provided with a collecting mechanism 3, and the collecting mechanism 3 can collect the precipitate at the bottom and then take it out together.

[0033] Reference Figure 3-Figure 5 The outer wall of the scraper 205 is slidably connected to the inner wall of the cleaning tank 1. The outer wall of the scraper 205 is set with an inclined surface. The inclined surface can scrape off the sediment on the inner wall of the cleaning tank 1 and discharge it through the inclined surface. The length of the movable plate 209 is greater than the rotating column 202. When the movable plate 209 is moved to retract into the inner wall of the collecting tank 204, the collecting tank 204 can be taken out at this time. The outer wall of the rotating column 202 is fixedly connected with a rotating plate 201, and the movement of the rotating column 202 is controlled by the rotation of the rotating plate 201. One end of the connecting spring 208 is fixedly connected to the outer wall of the movable plate 209, and the other end of the connecting spring 208 is fixedly connected to the inner wall of the collecting tank 204. The outer wall of the movable plate 209 is slidably connected to the inner wall of the collecting tank 204. The elasticity of the connecting spring 208 enables the movable plate 209 to have a reset function.

[0034] Reference Figure 5 and Figure 6The collecting mechanism 3 includes a filter plate 301, and a socket 303 is fixed on the outer wall of the filter plate 301. The movement trajectories of the two are the same. The socket 303 and the outer wall of the filter plate 301 are both plugged into the inner wall of the scraper 205. The filter plate 301 is used to collect sediment. When there is too much sediment, the filter plate 301 can be taken out for cleaning. The top of the scraper 205 is fixedly connected with a fixed seat 302, and the inner wall of the fixed seat 302 is elastically connected with a pin 305 through a limit spring 304. The pin 305 penetrates and is slidably connected to the inner wall of the fixed seat 302. The penetration setting is convenient for manual movement of the pin 305, and the top of the filter plate 301 is fixedly connected with the socket 303.

[0035] Reference Figure 5-Figure 6 One end of the limit spring 304 is fixedly connected to the outer wall of the pin 305, and the other end of the limit spring 304 is fixedly connected to the inner wall of the fixing seat 302. The outer wall of the pin 305 is slidably connected to the inner wall of the fixing seat 302. The elasticity of the limit spring 304 enables the pin 305 to have a reset and limit function. The outer wall of the pin 305 is plugged into the inner wall of the socket 303. The outer wall of the socket 303 is provided with a slot hole that matches the pin 305, and the pin 305 is plugged into the slot hole.

[0036] Working principle: When relevant personnel need to clean the silicon wafers and there is sediment attached to the inside of the cleaning tank 1, they can manually rotate the rotating plate 201, so that the rotating plate 201 drives the rotating column 202 to rotate, and then the rotating column 202 drives the fixed plate 206 and the connecting plate 207 to move accordingly, so that the scraper 205 moves upward, and when the scraper 205 moves upward, the scraper 205 will scrape off the sediment on the inner wall of the cleaning tank 1, and after the scraper 205 scrapes off the sediment, it will follow the inclined surface of the scraper 205 into the inner wall of the collecting tank 204 for collection. When the sediment in the collecting tank 204 is collected to a certain extent, the movable plate 209 can be moved and then the collecting tank 204 can be moved upward for cleaning. The operation is simple and convenient, and manual entry into the inner wall of the cleaning tank 1 for cleaning is avoided.

[0037] When the scraper 205 moves to the highest point, the filter plate 301 will also be at the highest point, and the precipitated impurities will accumulate on the filter plate 301. At this time, the latch 305 can be manually moved to release the limit between the latch 305 and the socket 303, and then the filter plate 301 can be moved upward to separate from the scraper 205, and then the filter plate 301 can be pulled out, so that the precipitated impurities accumulated inside the cleaning tank 1 can be taken out together, and the operation is simple and convenient.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer cleaning machine, comprising a cleaning tank (1), characterized in that: A cleaning mechanism (2) is provided at the front end of the cleaning tank (1); The cleaning mechanism (2) comprises a support seat (203), the front end of the support seat (203) is fixedly connected to the outer wall of the cleaning tank (1), the inner wall of the support seat (203) is rotatably connected to a rotating column (202), the rear end of the rotating column (202) is fixedly connected to a fixing plate (206), the outer wall of the fixing plate (206) is rotatably connected to a connecting plate (207), the outer wall of the connecting plate (207) is rotatably connected to a scraper (205), the outer wall of the cleaning tank (1) is plugged with a collecting tank (204), and the inner wall of the collecting tank (204) is elastically connected to the collecting tank (204) by a connecting spring (208). A movable plate (209) is connected, a collecting mechanism (3) is arranged at the top of the scraper (205), the collecting mechanism (3) comprises a filter plate (301), a plug-in seat (303) is fixed to the outer wall of the filter plate (301), the plug-in seat (303) and the outer wall of the filter plate (301) are both plugged into the inner wall of the scraper (205), the top of the scraper (205) is fixedly connected to a fixing seat (302), the inner wall of the fixing seat (302) is elastically connected to a latch (305) via a limit spring (304), and the top of the filter plate (301) is fixedly connected to the plug-in seat (303).

2. A silicon wafer cleaning machine according to claim 1, characterized in that: The outer wall of the scraper (205) is slidably connected to the inner wall of the cleaning tank (1), and the outer wall of the scraper (205) is arranged as an inclined surface.

3. A silicon wafer cleaning machine according to claim 1, characterized in that: The length of the movable plate (209) is greater than that of the rotating column (202).

4. A silicon wafer cleaning machine according to claim 1, characterized in that: The outer wall of the rotating column (202) is fixedly connected with a rotating plate (201).

5. The silicon wafer cleaning machine according to claim 1, characterized in that: One end of the connecting spring (208) is fixedly connected to the outer wall of the movable plate (209), the other end of the connecting spring (208) is fixedly connected to the inner wall of the collecting groove (204), and the outer wall of the movable plate (209) is slidably connected to the inner wall of the collecting groove (204).

6. A silicon wafer cleaning machine according to claim 1, characterized in that: One end of the limit spring (304) is fixedly connected to the outer wall of the latch (305), the other end of the limit spring (304) is fixedly connected to the inner wall of the fixing seat (302), and the outer wall of the latch (305) is slidably connected to the inner wall of the fixing seat (302).

7. The silicon wafer cleaning machine according to claim 1, characterized in that: The outer wall of the plug pin (305) is plugged into the inner wall of the socket (303).

Images