Structure for preventing metal pin of FPC from lacking solder paste

Abstract

The utility model discloses a structure for preventing a metal pin of an FPC (Flexible Printed Circuit) from lacking solder paste, which comprises an FPC shell and an electronic element arranged on the FPC shell, and comprises a PI (Polyimide) layer arranged on the electronic element; the tin soldering windowing position is formed on the PI layer, so that a copper layer on the electronic element is exposed for soldering of solder paste; the blocking unit is arranged on the PI layer and used for blocking flowing of solder paste in the tin soldering windowing position. According to the structure for preventing the metal pin of the FPC from being lack of the solder paste provided by the utility model, the blocking unit is arranged on the tin soldering windowing position, so that different welding areas in the tin soldering windowing position can be blocked, and a plurality of different welding units are independently arranged, so that the tin soldering windowing position is prevented from being damaged by the solder paste. Therefore, solder paste before tin soldering can be stabilized, the situation that the thickness of a welding spot after tin soldering is too large or insufficient soldering is caused due to the fact that the solder paste flows relatively is avoided, and stability after soldering is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC metal feet, in particular to a structure for preventing FPC metal feet from lacking solder paste. Background Art

[0002] Soldering is a welding method that uses low-melting-point metal solder to melt and then penetrate and fill the gaps at the joints of metal parts. The name comes from the fact that the solder is often a tin-based alloy. A soldering iron is often used as a heating tool. It is widely used in the electronics industry. Not all materials can be connected by soldering. Only some metals have good solderability (strictly speaking, they should be solderable) and can be connected by soldering. Generally, copper and its alloys, gold, silver, zinc, nickel, etc. have good solderability, while aluminum, stainless steel, cast iron, etc. have poor solderability and generally require special flux and methods for soldering.

[0003] Many components, especially ICs, have a whole copper sheet in the middle that needs to be grounded and connected, but the middle cannot be connected to the back ground by drilling a hole, which makes it easy for the solder paste to flow out of the hole, as shown in the attached manual. Figure 1 As shown in the figure, it can only be directly connected to the pins on the edge, but the above connection operation will cause the solder paste to flow randomly during reflow soldering. The flowing solder paste is not only easy to accumulate somewhere to make the soldering point too thick, but also will cause the solder paste to be missing on the outflowing side, resulting in a lack of solder or loose soldering. For this reason, the present application proposes a structure to prevent the FPC metal foot from lacking solder paste. Utility Model Content

[0004] Based on this, it is necessary to provide a structure to prevent the FPC metal feet from lacking solder paste in response to the above-mentioned technical problems, and to set a blocking unit at the soldering window position so that the blocking unit can divide and block the solder paste injected into the soldering window in a regional manner, thereby ensuring the stability of the solder paste in each area and making it less likely for them to accumulate or be missing, so as to solve the problem that traditional solder paste is prone to lack of solder.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A structure for preventing a metal foot of an FPC from lacking solder paste comprises an FPC housing and an electronic component arranged thereon, and comprises: a PI layer arranged on the electronic component;

[0007] Soldering window, which is formed on the PI layer to allow the copper layer on the electronic component to leak out for soldering of solder paste;

[0008] The blocking unit is arranged on the PI layer and is used to block the flow of solder paste in the soldering window.

[0009] Furthermore, the soldering window positions are composed of outer window positions and inner window positions, and the outer window positions are equidistantly distributed in the circumferential direction around the inner window positions.

[0010] Further, the outer window positions are composed of a first group, a second group, a third group and a fourth group;

[0011] The first group and the second group are both composed of four sub-window positions, and the first group and the second group are adjacently distributed on both sides of the inner window position;

[0012] The third group consists of two sub-window levels, and the fourth group consists of three sub-window levels.

[0013] Furthermore, the inner window level includes a main window level, and the main window level is extended toward the third group and the fourth group to form an extended window, and the extended window is arranged relatively parallel to the sub-window levels in the corresponding third group and the fourth group.

[0014] Furthermore, the blocking unit is a PI gap layer, which is arranged between the extended window and the main window position. The PI gap layer and the PI layer are an integrated structure, and the PI gap layer is used to separate the extended window and the main window position to block the flow of solder paste.

[0015] Furthermore, the barrier unit is a white oil layer, and the white oil layer is arranged between the extension window and the main window position by silk screen printing.

[0016] Furthermore, the soldering window position also includes a side window, and the side window is interconnected with the corresponding outer window position and inner window position to form a whole-surface window position;

[0017] Both ends of the white oil layer extend toward the side window to form a flow barrier for the solder paste.

[0018] Furthermore, the barrier unit is a green oil solder resist layer, and the green oil solder resist layer is coated at the gap between the outer window position and the inner window position to form a flow barrier for soldering.

[0019] Furthermore, the soldering window positions are composed of special-shaped window positions and strip-shaped window positions, a plurality of strip-shaped window positions are equidistantly distributed along the outer circumference of the special-shaped window positions, and a transition gap is formed between one end of the plurality of strip-shaped window positions facing the special-shaped window positions and the special-shaped window positions;

[0020] The barrier unit is specifically a PI covering layer, the PI covering layer is arranged on the transition gap, and the PI covering layer and the PI layer are an integrated structure.

[0021] Furthermore, the special-shaped window opening is circular.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The utility model provides a structure for preventing the FPC metal foot from lacking solder paste. The blocking unit is arranged on the soldering window position, so that different soldering areas in the soldering window position can be blocked, so that the solder paste can be independently divided into a plurality of different soldering units, so that the solder paste before soldering can be stabilized, so that it is not easy to flow relative to each other, thereby causing the situation that the solder joint thickness is too high after soldering or the solder joint is cold due to lack of solder, thereby ensuring the stability after soldering;

[0024] At the same time, when actually opening the window, the part of the PI layer that can be retained is retained. The retained PI layer can not only achieve the barrier effect of the solder paste itself, but also further improve the overall performance of the electronic component. For some situations where the gap is too small and the PI layer cannot be retained during the window opening process, the relative blocking of the window position can be achieved by covering with green oil, which is suitable for most situations. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the structure of the conventional state of the FPC metal foot solder paste proposed in the technical background provided by the utility model;

[0026] Figure 2 A schematic diagram of the structure of preventing the FPC metal pin from lacking solder paste provided by the utility model;

[0027] Figure 3 A schematic structural diagram of Embodiment 1 of the structure for preventing the FPC metal foot from lacking solder paste provided by the utility model;

[0028] Figure 4 A schematic diagram of the structure of Embodiment 2 of the structure for preventing the FPC metal foot from lacking solder paste provided by the utility model;

[0029] Figure 5 This is a schematic structural diagram of Example 3 of the structure for preventing the FPC metal foot from lacking solder paste provided by the utility model.

[0030] The markings in the figure are as follows:

[0031] FPC housing 1;

[0032] Electronic components 2;

[0033] PI layer 3;

[0034] Soldering window position 4; outer window position 40, inner window position 41, first group 42, second group 43, third group 44, fourth group 45, main window position 46, extension window 47, side window 48; special-shaped window position 49;

[0035] Sub-window level 401, strip window level 490, transition gap 491,

[0036] PI gap layer 50 , white oil layer 51 , green oil solder resist layer 52 , and PI covering layer 53 . DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0038] As described in the background art, a barrier unit is provided at the soldering window position, so that the barrier unit divides and isolates the solder paste introduced into the soldering window into regions, thereby ensuring the stability of the solder paste in each region and preventing accumulation or loss of the solder paste.

[0039] In order to solve this technical problem, the utility model provides a structure for preventing the metal foot of an FPC from lacking solder paste, and the structure is applied to the field of soldering of the metal foot of an FPC.

[0040] Specifically, please refer to Figure 1-5 The structure to prevent the FPC metal feet from lacking solder paste specifically includes:

[0041] The invention comprises an FPC housing 1 and an electronic component 2 arranged thereon, and includes:

[0042] A PI layer 3, which is disposed on the electronic component 2;

[0043] A soldering window 4 is formed on the PI layer 3 to allow the copper layer on the electronic component 2 to leak out for soldering of solder paste;

[0044] The blocking unit is arranged on the PI layer 3 and is used to block the flow of solder paste in the soldering window position 4.

[0045] The utility model provides a structure for preventing the FPC metal foot from lacking solder paste. A blocking unit is arranged on the soldering window position, so that different soldering areas in the soldering window position 4 can be blocked, making it independent of a plurality of mutually different soldering units. Thus, the solder paste before soldering can be stabilized and it is not easy for them to flow relative to each other, thereby causing the situation that the solder joint thickness is too high after soldering or a cold solder joint due to lack of solder, thereby ensuring the stability after soldering.

[0046] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0047] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0048] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0049] Example 1

[0050] Please refer to the figure Figure 1 , Figure 2 and Figure 3 As shown, a structure for preventing the metal foot of an FPC from lacking solder paste, the soldering window position 4 is composed of an outer window position 40 and an inner window position 41, and the outer window position 40 is equidistantly distributed around the outer circumference direction of the inner window position 41;

[0051] The outer window position 40 is composed of a first group 42, a second group 43, a third group 44 and a fourth group 45, wherein the first group 42 and the second group 43 are each composed of four sub-window positions 401 arranged in an arranged manner, and the first group 42 and the second group 43 are adjacently distributed on both sides of the inner window position 41, the third group 44 is composed of two sub-window positions 401, and the fourth group 45 is composed of three sub-window positions 401;

[0052] The inner window level 41 includes a main window level 46, and the main window level 46 is extended toward the third group 44 and the fourth group 45 to form an extension window 47, and the extension window 47 is arranged relatively parallel to the sub-window level 401 in the corresponding third group 44 and the fourth group 45;

[0053] like Figure 2 As shown, specifically, the two sub-window positions 401 in the third group 44 are located inside the extension window 47, and the third group 45 consists of three sub-window positions 401 which are respectively located outside the corresponding extension windows 47;

[0054] The blocking unit is a PI gap layer 50, which is disposed between the extension window 47 and the main window position 46. The PI gap layer 50 and the PI layer 3 are an integral structure, and the PI gap layer 50 is used to separate the extension window 47 and the main window position 46 to block the flow of solder paste.

[0055] Since the PI gap layer 50 and the PI layer 3 in the barrier unit provided in this embodiment are an integrated structure, the technical solution in this embodiment is suitable for a larger gap, and the PI gap layer 50 can be retained as a barrier unit for soldering barrier during the window opening process;

[0056] Please refer to Figure 1 , Figure 2As shown, in the actual window opening process, the PI gap layer 50 retained in the inner window position 41 is placed between the main window position 46 and the extension window 47 to block the interconnected channels, so that in the actual welding process, the solder drips between the corresponding main window position 46 and the extension window 47, and the PI gap layer 50 plays a role in blocking the solder, thereby avoiding problems such as poor welding and cold solder joints caused by the flow of solder paste after welding;

[0057] And because the above-mentioned barrier unit itself is formed by the PI layer retained in the window opening process, there is no need to add additional structure, which not only ensures the solder paste barrier effect, but also saves material expenses, so that the integrated performance of the electronic component itself is also guaranteed, which is convenient for practical promotion and use.

[0058] Example 2

[0059] On the basis of Example 1, the PI gap layer 50 in the barrier unit is replaced with a white oil layer 51, as follows:

[0060] The structure for preventing the FPC metal foot from lacking solder paste provided in Example 1 is further optimized. Specifically, Figure 3 As shown, the barrier unit is a white oil layer 51, which is arranged between the extension window 47 and the main window position 46 by silk screen printing, and the soldering window position 4 also includes a side window 48, which is interconnected with the corresponding outer window position 40 and the inner window position 41 to form a whole-surface window position;

[0061] like Figure 3 As shown, the side window 48 is formed by opening a window with a larger area, so that the operation space for screen printing white oil is larger. Specifically, before the actual welding, the white oil is printed on the side window 48, so that the white oil layer 51 is arranged between the extension window 47 and the main window position 46, and the extension window 47 and the main window position 46 are also blocked from each other, so that the solder paste is not easy to flow and cause the problem of cold solder joints during the soldering process;

[0062] As a further optimization in this embodiment: both ends of the white oil layer 51 are extended toward the side window 48 to form a flow barrier for the solder paste. By extending the two ends of the white oil layer 51 into the side window 48 during the silk-screen printing process, the sealing effect of the solder paste between the extension window 47 and the main window position 46 is further improved, thereby ensuring the subsequent welding effect.

[0063] Example 3

[0064] In the above-mentioned embodiments 1 and 2, the PI layer can be effectively retained under the premise of actual implementation, that is, it is used in the case of a large gap, while this embodiment is mainly used in the case of a small gap, and the PI layer cannot be effectively retained during the window opening process;

[0065] The structure for preventing the FPC metal foot from lacking solder paste provided in Example 1 or 2 is further optimized, such as Figure 4 As shown, the structural barrier unit for preventing the FPC metal foot from lacking solder paste is a green oil solder resist layer 52, which is coated at the gap between the outer window position 40 and the inner window position 41 to form a flow barrier for soldering. The specific coating method of the green oil solder resist layer 52 is to use a green oil process for coating;

[0066] In the actual window opening process, the PI layer cannot be effectively retained due to the small gap. Figure 4 As shown, by setting the green solder resist layer 52, a barrier effect is formed on the area between the extension window 47 and the main window position 46, and the gap of the green solder resist layer 52 can be as small as 0.1m to meet the use of smaller gap conditions.

[0067] Example 4

[0068] This embodiment is different from the above-mentioned embodiment 1, embodiment 2 and embodiment 3. Figure 5 As shown, compared with the above embodiment, this embodiment mainly adjusts the pad window of the middle copper block, adopts a circular or special-shaped window opening method, that is, reduces the window of the copper layer, increases the PI spacing between the inner copper layer and the peripheral PIN pin, so that the PI can cover, and makes the copper layer less likely to warp;

[0069] like Figure 1 As shown, the soldering window position 4 is composed of a special-shaped window position 49 and a strip window position 490, and a plurality of strip window positions 490 are equidistantly distributed along the peripheral direction of the special-shaped window position 49, and a transition gap 491 is formed between one end of the plurality of strip window positions 490 facing the special-shaped window position 49 and the special-shaped window position 49. Since the window opening method of this embodiment is different from that of the above-mentioned embodiment, the outer window position 40 and the inner window position 41 are cancelled, and the strip window position 490 and the special-shaped window position 49 are directly separated by the transition gap 491. Therefore, the setting of this structure not only retains the PI layer 3 to a greater extent than the above-mentioned embodiment, but also better achieves the blocking of solder paste by retaining part of the PI layer 3. At the same time, since the PI layer 3 is larger than before, the copper layer can be better covered by the enlarged part of the PI layer 3, so it is not easy to cause warping.

[0070] The barrier unit is specifically a PI covering layer 53, which is disposed on the transition gap 491, and the PI covering layer 53 and the PI layer 3 are an integrated structure, and the special-shaped window position 49 is circular.

[0071] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. A structure for preventing a metal foot of an FPC from lacking solder paste, comprising an FPC housing (1) and an electronic component (2) disposed thereon, characterized in that: It includes: A PI layer (3) disposed on the electronic component (2); A soldering window (4) is formed on the PI layer (3) to allow the copper layer on the electronic component (2) to leak out for soldering of solder paste; The blocking unit is arranged on the PI layer (3) and is used to block the flow of solder paste in the soldering window position (4).

2. The structure for preventing the FPC metal foot from lacking solder paste according to claim 1, characterized in that: The soldering window positions (4) are composed of an outer window position (40) and an inner window position (41), and the outer window positions (40) are equidistantly distributed in the outer peripheral direction of the inner window position (41).

3. The structure for preventing the FPC metal foot from lacking solder paste according to claim 2, characterized in that: The outer window positions (40) are composed of a first group (42), a second group (43), a third group (44) and a fourth group (45); The first group (42) and the second group (43) are both composed of four arranged sub-window positions (401), and the first group (42) and the second group (43) are adjacently distributed on both sides of the inner window position (41); The third group (44) consists of two sub-window positions (401), and the fourth group (45) consists of three sub-window positions (401).

4. The structure for preventing the FPC metal foot from lacking solder paste according to claim 3, characterized in that: The inner window position (41) comprises a main window position (46), and the main window position (46) is extended in the direction of the third group (44) and the fourth group (45) to form an extension window (47), and the extension window (47) is arranged relatively parallel to the sub-window positions (401) in the corresponding third group (44) and the fourth group (45).

5. The structure for preventing the FPC metal foot from lacking solder paste according to claim 4, characterized in that: The blocking unit is a PI gap layer (50), and the PI gap layer (50) is arranged between the extension window (47) and the main window position (46). The PI gap layer (50) and the PI layer (3) are an integrated structure, and the PI gap layer (50) is used to separate the extension window (47) and the main window position (46) to achieve blocking of the flow of solder paste.

6. The structure for preventing the FPC metal foot from lacking solder paste according to claim 4, characterized in that: The barrier unit is a white oil layer (51), and the white oil layer (51) is arranged between the extension window (47) and the main window position (46) by silk screen printing.

7. The structure for preventing the FPC metal foot from lacking solder paste according to claim 6, characterized in that: The soldering window position (4) further comprises a side window (48), wherein the side window (48) is interconnected with the corresponding outer window position (40) and inner window position (41) to form a whole-surface window position; Both ends of the white oil layer (51) extend towards the side window (48) to form a flow barrier for the solder paste.

8. The structure for preventing the FPC metal foot from lacking solder paste according to claim 7, characterized in that: The barrier unit is a green oil solder resist layer (52), and the green oil solder resist layer (52) is coated at the gap between the outer window position (40) and the inner window position (41) to form a flow barrier for soldering.

9. The structure for preventing the FPC metal foot from lacking solder paste according to claim 1, characterized in that: The soldering window position (4) is composed of a special-shaped window position (49) and a strip window position (490), a plurality of the strip window positions (490) are equidistantly distributed along the peripheral direction of the special-shaped window position (49), and a transition gap (491) is formed between one end of the plurality of the strip window positions (490) facing the special-shaped window position (49) and the special-shaped window position (49); The barrier unit is specifically a PI covering layer (53), the PI covering layer (53) is arranged on the transition gap (491), and the PI covering layer (53) and the PI layer (3) are an integrated structure.

10. The structure for preventing the FPC metal foot from lacking solder paste according to claim 9, characterized in that: The special-shaped window opening (49) is circular.

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