Jitter frame and wafer chemical plating jitter device

Abstract

The utility model relates to a jitter frame and a wafer chemical plating jitter device, the jitter frame comprises a support and a bearing structure, and the bearing structure forms an accommodating space for accommodating a wafer. The flower basket containing the wafer can be placed in the containing space of the bearing structure, and then the shaking frame and the flower basket are immersed into a chemical plating tank for film plating. Due to the fact that the bearing structure is of the frame structure jointly defined by the stand columns, the surrounding rods and the bottom supporting rods, large hollow areas exist at the bottom and on the side faces of the bearing structure, and after the shaking frame is taken out of the chemical plating tank, chemical agents in the containing space of the bearing structure can be rapidly drained. Moreover, as the arc-shaped transition section is arranged at the corner of each surrounding rod, no dead angle exists, residues of chemical agents can be effectively reduced, and cleaning is convenient. Therefore, the jittering frame and the wafer chemical plating jittering device can conveniently keep the accommodating space clean after film plating, so that the phenomenon that the wafer is polluted due to crystallization after long-term use is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a shaking frame and a wafer chemical plating shaking device. Background Art

[0002] In the wafer chemical plating process, the flower basket containing the wafers needs to be immersed in the chemical plating tank to make the wafers contact with the chemicals. In order to make each wafer fully contact with the chemicals, the flower basket containing the wafers is generally placed on a shaking rack first, and then the shaking rack and the flower basket are immersed in the chemical plating tank together. By driving the shaking rack to shake through the driving mechanism, the wafers in the flower basket can be vibrated, so that the chemicals can fully enter the gaps between the wafers. However, chemicals are easily left at the bottom of the shaking rack, which will form crystals over time, which may contaminate the wafers. Utility Model Content

[0003] Based on this, it is necessary to provide a shaking frame and a wafer chemical plating shaking device that can effectively avoid contaminating the wafer in order to address the above problems.

[0004] A shaking frame comprises a bracket and a bearing structure, wherein the bearing structure is detachably mounted on the bracket, the bearing structure comprises a column, a surrounding rod and a bottom support rod, a plurality of the columns form an annular structure, a plurality of the surrounding rods are arranged at intervals along the extension direction of the columns, each of the surrounding rods extends along the circumference of the annular structure and is connected to a plurality of the columns in sequence, and a corner of each of the surrounding rods is arranged as an arc-shaped transition section, the bottom support rod is straddled on the surrounding rod located at the bottom of the bearing structure, and a plurality of the columns, a plurality of the surrounding rods and the bottom support rod together enclose a receiving space for accommodating products.

[0005] In one embodiment, the bearing structure is provided with four columns respectively located at the four vertices of the rectangle, and the bearing structure also includes two parallel tie rods and a reinforcing rod connecting the middle parts of the two tie rods, one of the tie rods is connected to two adjacent columns, and the other tie rod is connected to the other two adjacent columns.

[0006] In one embodiment, one end of each of the columns away from the bottom support rod is bent to form a hook-shaped portion, and the column is hung on the bracket through the hook-shaped portion so that the bearing structure can be detachably mounted on the bracket.

[0007] In one of the embodiments, a limiting block is provided on the bracket, a limiting groove is formed on the limiting block, and the hook-shaped portion is received in the limiting groove.

[0008] In one embodiment, the opening of the limiting groove faces upward, and the limiting groove gradually narrows from top to bottom.

[0009] In one of the embodiments, a sensor is disposed on the bracket, and the sensor can be triggered when the bearing structure is connected to the bracket.

[0010] In one embodiment, the cross-sections of the surrounding rod and the bottom support rod are circular.

[0011] In one of the embodiments, the bearing structure further includes a cross bar, which is connected to two opposite edges of the surrounding rod and is arranged together with the plurality of columns, the plurality of surrounding rods and the bottom support rod to form a plurality of the receiving spaces.

[0012] In one of the embodiments, the shaking frame further includes handles disposed at opposite ends of the support.

[0013] A wafer chemical plating shaking device comprises a driving mechanism and a shaking frame as described in any one of the preferred embodiments above, wherein the frame is detachably mounted on the driving end of the driving mechanism, and the product accommodated in the receiving space is a wafer.

[0014] The shaking frame and wafer chemical plating shaking device can first place the flower basket containing the wafers in the receiving space of the bearing structure, and then immerse the shaking frame together with the flower basket into the chemical plating tank for coating. Since the bearing structure is a frame structure surrounded by columns, surrounding rods and bottom support rods, there are large hollow areas at the bottom and sides. Therefore, after the shaking frame is taken out of the chemical plating tank, the chemicals in the receiving space of the bearing structure can be quickly drained. Moreover, since an arc-shaped transition section is provided at the corner of each surrounding rod and there is no dead angle, the residual chemicals can be effectively reduced and cleaning is convenient. Therefore, the shaking frame and wafer chemical plating shaking device can keep the receiving space clean after coating, thereby avoiding contamination of the wafers due to crystallization after long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the structure of the shaking frame in a preferred embodiment of the utility model. DETAILED DESCRIPTION

[0017] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0020] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0022] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0023] See also Figure 1 The utility model provides a wafer chemical plating shaking device (not shown) and a shaking frame 100. The wafer chemical plating shaking device includes a shaking frame 100 and a driving mechanism (not shown).

[0024] The shaking frame 100 is detachably mounted on the driving end of the driving mechanism. Before chemical plating, the flower basket 200 containing the wafers is placed in the shaking frame 100, and then the shaking frame 100 and the flower basket 200 are immersed in the chemical plating tank for coating. During the coating process, the driving mechanism drives the shaking frame 100 to shake, which can cause the wafers in the flower basket 200 to vibrate, so that the chemical agent can fully enter the gaps between the wafers.

[0025] Furthermore, the shaking frame 100 includes a bracket 110 and a bearing structure 120. The bracket 110 plays a supporting role, and the shaking frame 100 is detachably mounted on the driving end of the driving mechanism through the bracket 110. The bracket 110 can be formed by splicing metal rods and plates, and is not easy to deform. Specifically, the bracket 110 in this embodiment is set as a rectangular frame structure.

[0026] In addition, in this embodiment, the shaking frame 100 further includes handles 130 disposed at opposite ends of the bracket 110. The bracket 110 is detachably mounted on the driving end of the driving mechanism through the handles 130 at both ends. Moreover, the handles 130 are easy to hold, and after the bracket 110 is removed from the driving end of the driving mechanism, the handles 130 also facilitate the operator to carry the shaking frame 100.

[0027] The supporting structure 120 is detachably mounted on the support 110 and is used to support the flower basket 200 containing the wafers. Before loading the flower basket 200 into the supporting structure 120, the supporting structure 120 can be removed from the support 110 to avoid the support 110 blocking the supporting structure 120 and facilitate operation. After the flower basket 200 is loaded, the supporting structure 120 is installed on the support 110, and subsequent operations can be performed after it is in place.

[0028] Specifically in this embodiment, a sensor 140 is disposed on the bracket 110 , and the sensor 140 can be triggered when the supporting structure 120 is connected to the bracket 110 .

[0029] The bearing structure 120 includes a column 121, a surrounding rod 122 and a bottom support rod 123. A plurality of columns 121 are provided, and the plurality of columns 121 form a ring-shaped structure. The plurality of columns 121 are substantially parallel to each other, forming the skeleton of the bearing structure 120. Specifically, in this embodiment, four columns 121 are provided, and the four columns 121 are distributed at the four vertices of a rectangle, thereby forming a rectangular ring-shaped structure.

[0030] There are also multiple surrounding rods 122, which are arranged at intervals along the extension direction of the pillars 121, and each surrounding rod 122 extends along the circumference of the annular structure surrounded by the pillars 121, and is connected to the multiple pillars 121 in sequence. Each surrounding rod 122 is annular, and can be connected to the pillars 121 by welding, threaded fastening, etc., or can be inserted into the pillars 121. Further, the corners of each surrounding rod 122 are arranged as arc-shaped transition sections 1221. The arc-shaped transition sections 1221 have smooth transitions and no dead angle structure. For this embodiment, each surrounding rod 122 has four corners, and the arc-shaped transition sections 1221 are arranged at the four corners, so that each surrounding rod 122 is a rounded rectangle.

[0031] The bottom support rod 123 is straddled on the surrounding rod 122 located at the bottom of the supporting structure 120. Specifically, the bottom support rod 123 is arranged on the lowest surrounding rod 122 to play a supporting role. The bottom support rod 123 is generally in the shape of an elongated strip, and its two ends are respectively connected to the two opposite edges of the surrounding rod 122. A plurality of columns 121, a plurality of surrounding rods 122 and the bottom support rod 123 are jointly arranged to form a receiving space for accommodating products (not shown). Specifically, the product refers to a wafer, and the wafer to be coated is loaded into a flower basket 200, and the flower basket 200 is received in the above-mentioned receiving space.

[0032] Specifically in this embodiment, the bearing structure 120 further includes a crossbar 126, which is connected to two opposite edges of the surrounding rod 122 and is surrounded by a plurality of columns 121, a plurality of surrounding rods 122 and a bottom support rod 123 to form a plurality of receiving spaces. In this way, the bearing structure 120 can accommodate a plurality of flower baskets 200 at the same time, thereby improving the coating efficiency of the wafer.

[0033] Since the bearing structure 120 is a frame structure surrounded by columns 121, surrounding rods 122 and bottom support rods 123, there are large hollow areas at the bottom and sides. Therefore, after the shaking frame 100 is taken out of the chemical plating tank, the chemicals in the receiving space of the bearing structure 120 can be quickly drained. In addition, since an arc-shaped transition section 1221 is provided at the corner of each surrounding rod 122, there is no dead angle, so the residual chemicals can be effectively reduced and cleaning is convenient. Therefore, after long-term use, crystallization is not easy to occur in the receiving space, thereby effectively avoiding contamination of the wafer.

[0034] Moreover, the structure of the bracket 110 and the bearing structure 120 is simple and can be formed by splicing a number of plates and rods, so the processing cost of the shaking frame 100 can also be reduced.

[0035] Specifically in this embodiment, the cross-sections of the surrounding rod 122 and the bottom support rod 123 are circular. It can be seen that the surfaces of the surrounding rod 122 and the bottom support rod 123 are smooth, and the chemical agent can flow smoothly from the surface, thereby further reducing the chemical agent residue and facilitating cleaning.

[0036] In this embodiment, the bearing structure 120 further includes two parallel tie rods 124 and a reinforcing rod 125 connecting the middle parts of the two tie rods 124 , wherein one tie rod 124 is connected to two adjacent columns 121 , and the other tie rod 124 is connected to another two adjacent columns 121 .

[0037] The pull rod 124 and the reinforcing rod 125 can provide support in two mutually perpendicular directions, thereby increasing the overall structural strength of the bearing structure 120 and effectively preventing the bearing structure 120 from being deformed during shaking.

[0038] In addition, in this embodiment, one end of each column 121 away from the bottom support rod 123 is bent to form a hook-shaped portion 1211, and the column 121 is hung on the bracket 110 through the hook-shaped portion 1211 so that the supporting structure 120 can be detachably installed on the bracket 110. The supporting structure 120 can be removed from the bracket 110 by removing the hook-shaped portion 1211 from the bracket 110, and the supporting structure 120 can be installed on the bracket 110 by hanging the hook-shaped portion 1211 on the bracket 110. In this way, it is more convenient to disassemble and assemble the supporting structure 120.

[0039] Furthermore, in this embodiment, a limiting block 111 is provided on the bracket 110, a limiting groove 1111 is formed on the limiting block 111, and the hook-shaped portion 1211 is received in the limiting groove 1111. The limiting block 111 can be mounted on the bracket 110 by welding, threaded fastening, etc. The limiting groove 1111 can limit the position of the hook-shaped portion 1211, so that the bearing structure 120 can be prevented from sliding relative to the bracket 120 during the shaking process, and the wafer in the receiving space is effectively prevented from being bumped.

[0040] Furthermore, in this embodiment, the opening of the limiting groove 1111 faces upward, and the limiting groove 111 gradually narrows from top to bottom. In other words, the limiting groove 111 is a trumpet-shaped structure that is wide at the top and narrow at the bottom, which can guide the hook-shaped portion 1211. Therefore, when the supporting structure 120 is installed on the bracket 110, it is convenient to insert the hook-shaped portion 1211 into the limiting groove 1111.

[0041] The shaking frame 100 and the wafer chemical plating shaking device can first place the flower basket 200 containing the wafers in the receiving space of the supporting structure 120, and then immerse the shaking frame 100 together with the flower basket 200 into the chemical plating tank for coating. Since the supporting structure 120 is a frame structure surrounded by columns 121, surrounding rods 122 and bottom support rods 123, there are large hollow areas at the bottom and sides. Therefore, after the shaking frame 100 is taken out of the chemical plating tank, the chemicals in the receiving space of the supporting structure 120 can be quickly drained. Moreover, since an arc-shaped transition section 1221 is provided at the corner of each surrounding rod 122, there is no dead angle, so the residual chemicals can be effectively reduced and cleaning is convenient. Therefore, the shaking frame 100 and the wafer chemical plating shaking device can keep the receiving space clean after coating, thereby avoiding the contamination of wafers due to crystallization after long-term use.

[0042] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A shaking frame, characterized in that: It includes a bracket and a bearing structure, the bearing structure can be detachably installed on the bracket, the bearing structure includes columns, surrounding rods and bottom support rods, a plurality of the columns form an annular structure, a plurality of the surrounding rods are arranged at intervals along the extension direction of the columns, each of the surrounding rods extends along the circumference of the annular structure and is connected to a plurality of the columns in sequence, and the corner of each of the surrounding rods is arranged as an arc-shaped transition section, the bottom support rod is straddled on the surrounding rod located at the bottom of the bearing structure, and a plurality of the columns, a plurality of the surrounding rods and the bottom support rod are jointly arranged to form a receiving space for accommodating products.

2. The shaking frame according to claim 1, characterized in that: The bearing structure is provided with four columns respectively located at the four vertices of the rectangle. The bearing structure also includes two parallel pull rods and a reinforcing rod connecting the middle parts of the two pull rods. One of the pull rods is connected to two adjacent columns, and the other pull rod is connected to another two adjacent columns.

3. The shaking frame according to claim 1, characterized in that: One end of each of the columns away from the bottom support rod is bent to form a hook-shaped portion, and the columns are hung on the bracket through the hook-shaped portion so that the bearing structure can be detachably installed on the bracket.

4. The shaking frame according to claim 3, characterized in that: A limiting block is arranged on the bracket, a limiting groove is formed on the limiting block, and the hook-shaped portion is received in the limiting groove.

5. The shaking frame according to claim 4, characterized in that: The opening of the limiting groove faces upward, and the limiting groove gradually narrows from top to bottom.

6. The shaking frame according to claim 1, characterized in that: A sensor is arranged on the bracket, and the sensor can be triggered when the bearing structure is connected to the bracket.

7. The shaking frame according to claim 1, characterized in that: The cross sections of the surrounding rod and the bottom support rod are circular.

8. The shaking frame according to claim 1, characterized in that The bearing structure further comprises a cross bar, which is connected to two opposite edges of the surrounding rod and is arranged together with the plurality of upright posts, the plurality of surrounding rods and the bottom support rod to form a plurality of the receiving spaces.

9. The shaking frame according to claim 1, characterized in that: The shaking frame also includes handles arranged at opposite ends of the bracket.

10. A wafer chemical plating jitter device, characterized in that: It comprises a driving mechanism and a shaking frame as described in any one of claims 1 to 9, wherein the bracket is detachably mounted on the driving end of the driving mechanism, and the product accommodated in the receiving space is a wafer.

Images