Surface treatment integrated electroplating device
By designing a layered structure surface treatment integrated electroplating device, the outer and inner circulation of the potion is realized, and the problems of impurity accumulation, coating rupture and equipment operation in the existing electroplating process are solved, and the uniformity and efficiency of copper plating are improved.
Patent Information
- Application Number
- CN202421470513.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-25
AI Technical Summary
In the existing electroplating process, there are problems such as impurity accumulation, coating rupture and equipment operation are not smooth, and uneven copper plating and insufficient mixing of potions are not done.
A surface treatment integrated electroplating device is designed, adopting layered, segmented, module and systematic design, including a support structure with upper and lower layers, copper plating tank, transmission roller group, potion management tank, cold and heat exchanger and filtration system, to realize the outer and inner circulation of potion, remove impurities and reduce the amount of bubbles.
Through the circulation of the potion, a large amount of impurities are removed, reducing the possibility of scratches and cracks in the coating, avoiding the problem of unsmooth operation of the equipment, and improving the uniformity and efficiency of copper plating.
Smart Images
Figure CN222781718U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating surface treatment, in particular to a surface treatment integrated electroplating device. Background Art
[0002] Electroplating refers to the process of reducing metal ions in the plating solution to metal atoms under the action of an external electric field, and then depositing them on the cathode surface. This process is an electrochemical reaction of liquid phase mass transfer, consisting of multiple links such as electrocrystallization. In addition to a low-voltage, high-current power supply to power the plating cell, electroplating also requires an electrolyzer to hold the plating solution, as well as the parts to be plated (cathode) and anode.
[0003] The current electroplating process still has the following shortcomings:
[0004] During the electroplating process, a large amount of impurities will be generated, such as electrolytic metal particle deposition, ash layer or coating particles, etc. These impurities will scratch the film during the operation of the equipment, causing the film to rupture, and the accumulation of impurities will also block the pipeline, causing the electroplating equipment to run unsmoothly. At present, most electroplating equipment uses a single tank body, which is prone to uneven copper plating and insufficient mixing of chemicals during the electroplating process. In addition, during the electroplating process, there will be splashing or overflowing chemicals on the production line or in the tank body, causing water to accumulate in the electroplated workpiece. Utility Model Content
[0005] In view of the deficiencies in the prior art, the utility model proposes a surface treatment integrated electroplating device to solve the problems existing in the prior art.
[0006] The utility model provides a surface treatment integrated electroplating device, which includes a bracket structure, characterized in that: the bracket structure adopts an upper and lower two-layer structure; the upper layer of the bracket structure is provided with at least two groups of copper plating units, each copper plating unit includes a copper plating tank and a group of transmission rollers for driving the film to be plated; the lower layer of the bracket structure is provided with a first copper plating solution management tank, a second copper plating solution management tank and a cold and heat exchanger; the first copper plating solution management tank and the second copper plating solution management tank are both designed with front and rear partitions, and the front and rear partitions are respectively an overflow collection area and a reflux area located behind the overflow collection area, and a partition partition and a plurality of transition areas are provided between the two areas; the collection end of the overflow collection area is connected to the overflow collection pipe at the top of the copper plating tank; the reflux area of the first copper plating solution management tank The liquid outlet end is connected to the liquid inlet end of the overflow collection area of the first copper plating solution management tank through a reflux pump, a first filter barrel and a heat exchanger arranged on the outside of the first copper plating solution management tank; the liquid outlet end of the reflux area of the second copper plating solution management tank is connected to the nozzle in the copper plating tank through the second pump; the reflux area of the first copper plating solution management tank is connected to the transition area of the first copper plating solution management tank, the overflow collection area of the second copper plating solution management tank is connected to the transition area of the second copper plating solution management tank, the overflow collection area of the first copper plating solution management tank is connected to the overflow collection area of the second copper plating solution management tank, the reflux area of the first copper plating solution management tank is connected to the reflux area of the second copper plating solution management tank, and the transition area of the first copper plating solution management tank is connected to the transition area of the second copper plating solution management tank.
[0007] Through the above technical solution, during the electroplating process, the medicine in the copper plating tank overflows to the overflow collection area of the first copper plating solution management tank and the overflow collection area of the second copper plating solution management tank through the overflow collection pipe for temporary storage, thereby realizing independent storage of overflow medicine in the copper plating tank. The overflow collection area of the first copper plating solution management tank will flow to the overflow collection area of the second copper plating solution management tank, and after uniformly flowing into the transition area of the second copper plating solution management tank, the medicine will go back and forth between the transition areas of the two copper plating solution management tanks, and then flow into the reflux area of the first copper plating solution management tank, a part of which flows into the reflux area of the second copper plating solution management tank, and then the medicine is pumped into the spray pipe at the top of the copper plating tank by the second pump, and the copper plating tank medicine will overflow from the overflow port back to the overflow collection areas of the two copper plating solution management tanks, thereby realizing the external circulation of the whole medicine. At the same time, turn on the reflux pump, and the liquid in the reflux zone and the transition zone in the first copper plating liquid management tank will flow back to the overflow collection area of the first copper plating liquid management tank through the first filter barrel and the heat exchanger, realizing the independent internal circulation of the first copper plating liquid management tank. The above-mentioned external circulation and internal circulation are carried out simultaneously. Compared with the prior art, a large amount of impurities are removed from the liquid during the internal and external circulation, and a large amount of bubbles are also discharged during the process, which reduces the impurities in the electroplating solution in the copper plating tank, reduces the possibility of scratches on the electroplating film during the operation of the equipment, and avoids the problems of rupture of the plating film and the poor operation of the electroplating equipment (blockage of the spraying pipeline).
[0008] Furthermore, the drive roller group includes a drive roller and multiple conductive drive rollers. The drive rollers of the drive roller group are arranged inside the copper plating tank. The conductive drive rollers of the multiple drive roller groups are respectively located on both sides of the drive rollers and arranged on the top side of the copper plating tank. The film to be plated is wound around the multiple conductive drive rollers and the drive rollers; the drive roller and the multiple conductive drive rollers are driven by corresponding drive shafts respectively.
[0009] Through the above technical solution, during the electroplating process, the electroplating process is carried out on the film to be plated by adopting a multi-drive roller transmission method, which can improve the electroplating efficiency and prevent the film from falling off, breaking or scratching during the electroplating process.
[0010] Furthermore, it also includes a copper powder dissolution tank, which is parallel to the first copper plating solution management tank and is arranged below the copper plating tank; the reflux outlet end of the reflux area of the first copper plating solution management tank is connected to the liquid inlet end of the copper powder dissolution tank through a third pump, and the reflux outlet end of the copper powder dissolution tank is connected to the reflux receiving end of the overflow collection area of the first copper plating solution management tank through a conduit.
[0011] Through the above technical scheme, the solution is pumped from the reflux area of the first copper plating solution management tank into the copper powder dissolution tank through the third pump, and then the fully dissolved solution in the copper powder dissolution tank is refluxed and transmitted to the overflow collection area of the first copper plating solution management tank, thereby realizing the powder dissolution circulation process.
[0012] Furthermore, it also includes a first pump and a second filter barrel; the liquid outlet end of the reflux zone of the first copper plating solution management tank is connected to the liquid inlet end of the first pump, the liquid outlet end of the first pump is connected to the liquid inlet end of the second filter barrel, and the liquid outlet end of the second filter barrel is connected to the nozzle in the copper plating tank.
[0013] Through the above technical scheme, during the electroplating process, the solution in the reflux area of the first copper plating solution management tank is transferred to the filter barrel by the first pump, and then sprayed into the copper plating tank by the nozzle. After the reaction in the copper plating tank, it overflows back to the overflow collection area of the copper solution management tank which is relatively short to the copper plating tank, thereby improving the smoothness of the electroplating filtration cycle.
[0014] Furthermore, the top of the second copper plating solution management tank is connected to an auxiliary agent adding barrel through a conveying pipe. The auxiliary agent adding barrel is located on the side of the second copper plating solution management tank of the copper powder dissolution tank, and a copper powder adding port is opened on the top of the copper powder dissolution tank.
[0015] Through the above technical scheme, during the electroplating process, the copper powder dissolution tank is used to add medicine powder, and the auxiliary agent adding barrel is used to add auxiliary agent (three agents). The auxiliary agent is added to the auxiliary agent adding barrel, and the auxiliary agent flows into the overflow collection area in the second copper plating solution management tank for initial dissolution. After being dissolved back and forth between multiple second copper plating solution management tanks, it flows into the copper powder dissolution tank and is fully mixed with the medicine powder, thereby achieving deep dissolution of the medicine powder and realizing the medicine powder adding circulation process.
[0016] Furthermore, it also includes a solenoid valve, which is installed outside the first copper plating solution management tank; the solenoid valve is communicatively connected to the liquid level sensor in the first copper plating solution management tank; the valve ends of the multiple solenoid valves are respectively arranged at the water inlet and the drain of the reflux zone.
[0017] Through the above technical solution, when the liquid level in the first copper plating solution management tank drops to the low liquid level sensor, the solenoid valve opens the corresponding valve to replenish the solution, and opens the corresponding valve to discharge the solution, thereby achieving water inlet and outlet.
[0018] Furthermore, a current rectifier is provided in the lower layer of the support structure, and the current rectifier is electrically connected to the cathode and anode in the copper plating tank through a wire.
[0019] Specifically, the current rectifier is used to provide a stable current to the copper plating tank.
[0020] Furthermore, the diameter of the transmission roller is larger than that of the conductive transmission roller, and the linear speeds of the transmission roller and the plurality of conductive transmission rollers are the same.
[0021] Furthermore, a plurality of slidable outer shielding plates are arranged on the top of the support structure, and foot pedals are arranged on the bottom sides of the outer shielding plates, and the foot pedals are fixedly connected to both sides of the top layer of the support structure.
[0022] Furthermore, a plurality of retractable foot cups are provided at the bottom of the support structure.
[0023] The beneficial effects of the utility model are:
[0024] 1. Compared with the prior art, the utility model improves the position installation and connection relationship of the equipment components. According to the copper plating process requirements, the equipment installed on the bracket structure can be used individually or in combination to form a corresponding process system, so as to solve the problem in the prior art that the electroplating film is scratched during the operation of the equipment, causing the plating film to rupture and the electroplating equipment to operate unsmoothly.
[0025] 2. Compared with the prior art, the utility model adopts a layered, segmented, modular and systematic design, which is conducive to the improvement of the process flow, and each section of the device of the utility model can be disassembled independently, which avoids the cumbersome problems of disassembly and installation and the trouble of transportation.
[0026] 3. Compared with the prior art, the utility model adopts a bracket design, which is divided into an upper and lower layer design, which saves space and is easy to assemble. A foot pedal is provided on the upper layer of the bracket structure, and sliding outer shielding plates are provided on both sides of the bracket structure, which is convenient for staff to observe and record the process, and plays a role in preventing foreign matter from splashing, dust prevention, protecting personnel and exhaust gas extraction. The lower layer of the bracket structure has a large space capacity, which is convenient for adding medicines or equipment, easy to install, and the process can be flexibly changed. A foot cup is provided at the bottom of the bracket structure and is separated from the ground. It can be adjusted according to the storage environment of the equipment so that all components maintain a horizontal angle to maintain the balance of the overall device. The bracket design saves space on the site, improves installation efficiency, and facilitates maintenance and observation operations.
[0027] 4. Compared with the prior art, the bracket design of the device of the utility model has a relatively close distance between the electroplating layer and the auxiliary layer, and the pipeline is laid shorter, making the characteristics of the medicine more stable.
[0028] 5. Compared with the existing technology, different transmission rollers are driven by multiple sets of main transmission shafts. The rotation speed of the main transmission shafts is adjusted to make the linear speeds of different transmission rollers the same, which can provide bidirectional tension to the film to be electroplated, thereby better controlling the coating tension. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0030] Figure 1 It is a front view of the surface treatment integrated electroplating device in the embodiment of the utility model.
[0031] Figure 2 It is a schematic diagram of the lateral structure of the upper layer of the surface treatment integrated electroplating device in the embodiment of the utility model.
[0032] Figure 3 It is a top-down structural connection diagram of the lower layer of the surface treatment integrated electroplating device in the embodiment of the utility model.
[0033] Figure 4 It is a rear view of the surface treatment integrated electroplating device in the embodiment of the utility model.
[0034] Figure 5 It is an overall schematic diagram of a surface treatment integrated electroplating device in an embodiment of the utility model.
[0035] Figure 6 It is a position relationship diagram of the transmission roller group and the copper plating tank in the embodiment of the utility model.
[0036] Explanation of reference numerals: 300, support structure; 101, copper plating tank; 102, outer shielding plate; 103, foot pedal; 104, drive roller group; 1041, drive roller; 1042, first conductive drive roller; 1043, second conductive drive roller; 201, copper powder dissolution tank; 202, first filter barrel; 203, third pump; 204, first copper plating solution management tank; 205, auxiliary agent adding barrel; 206, second pump; 207, second copper plating solution management tank; 208, second filter barrel; 209, first pump; 210, third filter barrel; 211, heat exchanger; 212, solenoid valve; 213, current rectifier; 301, foot cup; 100, overflow collection area; 200, reflux area; 214, reflux pump. DETAILED DESCRIPTION
[0037] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0038] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.
[0039] This embodiment discloses a surface treatment integrated electroplating device, which is used to solve the problems existing in the prior art.
[0040] Reference Figure 1-Figure 4 A surface treatment integrated electroplating device includes a support structure 300, a copper plating tank 101, a transmission roller group 104, a first copper plating solution management tank 204, a second copper plating solution management tank 207, a copper powder dissolution tank 201, an auxiliary agent adding barrel 205, a first pump 209, a second pump 206, a first filter barrel 202, a second filter barrel 208, a third filter barrel 210, a heat exchanger 211, a solenoid valve 212 and a current rectifier 213.
[0041] Among them, Figure 2 and Figure 3As shown, the support structure 300 is divided into an upper and lower structure, and the copper plating tank 101 and the drive roller group 104 are arranged on the upper layer of the support structure 300 for performing the electroplating process of the coating. The upper layer of the support structure 300 is provided with at least two groups of copper plating units, each of which includes a copper plating tank 101 and a group of drive roller groups 104 for winding the film to be plated. The lower layer of the support structure 300 is provided with the above-mentioned first copper plating solution management tank 204, the second copper plating solution management tank 207, the copper powder dissolving tank 201 and the cold and heat exchanger 211. In this embodiment, the first copper plating solution management tank 204 and the second copper plating solution management tank 207 are both separated by partition partitions in front and back to form an overflow collection area 100 and a reflux area 200 located behind the overflow collection area 100. In this embodiment, a three-layer transition area is arranged between the overflow collection area 100 and the reflux area 200. The collection end of the overflow collection area 100 is connected to the overflow collection pipe at the top of the copper plating tank 101 to collect the liquid overflowing from the copper plating tank 101. A reflux pump 214, a first filter barrel 202 and a heat exchanger 211 are provided outside the first copper plating liquid management tank 204. The liquid outlet end of the reflux area 200 of the first copper plating liquid management tank 204 is connected to the liquid inlet end of the reflux pump 214, the liquid outlet end of the reflux pump 214 is connected to the liquid inlet end of the first filter barrel 202, the liquid outlet end of the first filter barrel 202 is connected to the liquid inlet end of the heat exchanger 211, and the liquid outlet end of the heat exchanger 211 is connected to the liquid inlet end of the overflow collection area 100 of the first copper plating liquid management tank 204. The reflux zone 200 of the first copper plating solution management tank 204 is connected to the nearest transition zone of the first copper plating solution management tank 204, the overflow collection zone 100 of the second copper plating solution management tank 207 is connected to the nearest transition zone of the second copper plating solution management tank 207, the overflow collection zone 100 of the first copper plating solution management tank 204 is connected to the overflow collection zone 100 of the second copper plating solution management tank 207, the reflux zone 200 of the first copper plating solution management tank 204 is connected to the reflux zone 200 of the second copper plating solution management tank 207, and the transition zone of the first copper plating solution management tank 204 is connected to the transition zone of the second copper plating solution management tank 207. The liquid outlet of the second copper plating solution management tank 207 is connected to the nozzle in the copper plating tank 101 through the second pump 206.
[0042] Compared with the prior art, the liquid medicine in the device of the utility model removes a large amount of impurities during the internal and external circulation processes, and cools down the liquid medicine through the heat exchanger 211 to eliminate a large number of bubbles, thereby reducing the impurities in the plating liquid flowing back into the copper plating tank 101, reducing the possibility of scratches on the plated film during the operation of the equipment, and avoiding the problems of film rupture and poor operation of the plating equipment (such as blockage of the spraying pipeline).
[0043] It should be explained that the first copper plating solution management tank 204 and the second copper plating solution management tank 207 can be provided in plurality according to actual conditions, so as to increase the number of circulations of the solution, so that the solution of the entire line is more uniform and has less bubbles.
[0044] like Figure 3 As shown, in this embodiment, in order to extend the solution flow channel and reduce the occupied space, the overflow collection area 100 of the first copper plating solution management tank 204 includes the A layer, the transition area of the first copper plating solution management tank 204 includes the B, C and D layers, and the reflow area 200 of the first copper plating solution management tank 204 includes the E layer. In contrast, the overflow collection area 100 of the second copper plating solution management tank 207 includes the F layer, the transition area of the second copper plating solution management tank 207 includes the G, H and I layers, and the reflow area 200 of the second copper plating solution management tank 207 includes the J layer.
[0045] Among them, layer A and layer B are completely separated by a partition partition and are not connected to each other. Layer B is connected to layer C, and an impurity collection plate is provided between layer B and layer C. Layer C is completely separated from layer D by a partition partition and are not connected to each other. Layer D is connected to layer E, and an impurity collection plate is provided between layer D and layer E. Layer F is connected to layer G and a partition partition is provided between the two layers, layer G and layer H are separated by a partition partition, layer H and layer I are connected and an impurity collection plate is provided between the two layers, and layer I and layer J are completely separated by a partition partition. The liquid outlet of layer A is connected to the liquid inlet of layer F, the liquid outlet of layer G is connected to the liquid inlet of layer B, the liquid outlet of layer C is connected to the liquid inlet of layer H, the liquid outlet of layer I is connected to the liquid inlet of layer D, and the liquid outlet of layer E is connected to the liquid inlet of layer J.
[0046] It should be noted that the impurity collecting plate may be an activated carbon plate, which has a strong ability to adsorb impurities.
[0047] It needs to be explained that the specific flow direction of the potion in the above two copper plating potion management tanks is: A->F->G->B->C->H->I->D->E->J.
[0048] Through the above technical scheme, the first copper plating solution management tank 204 and the second copper plating solution management tank 207 are both set to 5 sections, and the first copper plating solution management tank 204 and the second copper plating solution management tank 207 adopt a self-circulating solution flow method to extend the solution flow channel. Both copper plating solution management tanks are multi-layer structures, which are conducive to more uniform solution mixing, larger exchange volume and greater impurity removal. The solution flowing through the first copper plating solution management tank 204 and the second copper plating solution management tank 207 has a better copper plating effect.
[0049] Preferably, Figure 1 and Figure 6As shown, the device of the utility model includes at least two electroplating units, each of which includes a copper plating tank 101 and a group of transmission rollers 104. The transmission roller group 104 includes a transmission roller 1041, two first conductive transmission rollers 1042 and two second conductive transmission rollers 1043. The transmission roller 1041 is arranged inside the copper plating tank 101, the two first conductive transmission rollers 1042 are respectively located on both sides of the transmission roller 1041 and arranged on the top side of the copper plating tank 101, and the two second conductive transmission rollers 1043 are arranged between the two first conductive transmission rollers 1042 and arranged on the top side of the copper plating tank 101. The winding direction of the film to be plated is: the top side of the left first conductive transmission roller 1042 -> the left side of the adjacent second conductive transmission roller 1043 -> the bottom side of the transmission roller 1041 -> the right side of the other second conductive transmission roller 1043 -> the top side of the right first conductive transmission roller 1042. Furthermore, the transmission roller 1041 has the largest diameter, the first conductive transmission roller 1042 has the second largest diameter, and the second conductive transmission roller 1043 has the smallest diameter. The three are driven by corresponding main transmission shafts and have the same linear speed.
[0050] It needs to be explained that drive rollers of different diameters use different drive systems. The drive system of drive roller 1041 needs to be waterproofed. Multiple sets of drive systems ensure that the linear speed of the drive roller surface is the same, which is conducive to ensuring the stability of the relative tension of the film and improving the quality of the coating. Relatively speaking, drive rollers of different diameters have different angular velocities, which helps the surface of the film to be plated to be nearly flat. In addition, using multiple drive rollers to drive the film to be plated and using the above-mentioned winding method is conducive to maintaining the stability of the tension of the film to be plated and preventing the film from falling off, breaking or scratching during the electroplating process.
[0051] Preferably, the second conductive transmission roller 1043 needs to be higher than the overflow collection pipe to prevent the film from being contaminated by splashed impurities after the electroplating is completed.
[0052] Preferably, Figure 3 As shown, the device of the utility model further includes a first pump 209 and a second filter barrel 208. The liquid outlet of the reflux zone 200 of the first copper plating solution management tank 204 is connected to the liquid inlet of the first pump 209, the liquid outlet of the first pump 209 is connected to the liquid inlet of the second filter barrel 208, and the liquid outlet of the second filter barrel 208 is connected to the nozzle in the copper plating tank 101.
[0053] Through the above technical solution, during the electroplating process, the solution in the reflux area 200 of the first copper plating solution management tank 204 is transferred to the second filter barrel 208 through the first pump 209, and then sprayed into the copper plating tank 101 by the nozzle. After the reaction in the copper plating tank 101, it overflows back to the overflow collection area 100 of the copper solution management tank which is relatively short to the copper plating tank 101, thereby improving the smoothness of the electroplating filtration cycle.
[0054] Preferably, a third filter barrel 210 may be provided between the second copper plating solution management tank 207 and the second pump 206 to further improve the solution filtering effect.
[0055] It needs to be explained that the above-mentioned copper plating tank 101, the first copper plating solution management tank 204, the second copper plating solution management tank 207, the first filter barrel 202, the second filter barrel 208, the third filter barrel 210, the heat exchanger 211 and its related valve bodies and pipes all constitute the copper plating filtration system of the device of the utility model.
[0056] like Figure 2 and Figure 3 As shown, in this embodiment, the device of the utility model also includes a copper powder dissolving tank 201, which is arranged side by side with the first copper plating solution management tank 204 and is arranged below the copper plating tank 101. The reflux outlet end of the reflux zone 200 of the first copper plating solution management tank 204 is connected to the liquid inlet end of the copper powder dissolving tank 201 through the third pump 203, and the reflux outlet end of the copper powder dissolving tank 201 is connected to the reflux receiving end of the overflow collection zone 100 of the first copper plating solution management tank 204 through a conduit. The overflow collection zone 100 of the second copper plating solution management tank 207 is connected to an auxiliary agent adding barrel 205 through a conveying pipe, and the auxiliary agent adding barrel 205 is used to add auxiliary agents (three agents). During the electroplating process, auxiliary agent is added to the auxiliary agent adding barrel 205 on the side of the copper powder dissolving tank 201, and powder is added to the top of the copper powder dissolving tank 201. The auxiliary agent flows into the overflow collection area 100 in the second copper plating solution management tank 207 for initial dissolution, and after being dissolved back and forth between the two copper plating solution management tanks, it flows into the copper powder dissolving tank 201 and is fully mixed with the powder to achieve deep dissolution of the powder.
[0057] like Figure 4 As shown, the current rectifier 213 plays a role in stabilizing the output current in the entire electroplating device, provides current for copper plating, connects the cathode and the anode through a wire, so that the copper plating process reaches a stable state and makes the copper plating more uniform.
[0058] like Figure 5As shown, the device of the utility model also includes a solenoid valve 212, which is an important component of the water inlet and outlet system of the device of the utility model. The solenoid valve 212 is installed outside the first copper plating solution management tank 204. The solenoid valve 212 is communicatively connected to the liquid level sensor in the first copper plating solution management tank 204, and the valve ends of multiple solenoid valves 212 are respectively arranged at the water inlet and outlet of the reflux area 200. When the liquid level of the first copper plating solution management tank 204 decreases, the corresponding solenoid valve 212 will open to add water. When the liquid level of the management tank reaches a high level, the corresponding solenoid valve 212 will close and stop adding water. When the solution overflows to the copper plating tank 101, the solution in the tank maintains a stable concentration and removes excess water. At the same time, it can also be discharged according to different solutions, so that the water inlet and outlet reach a stable state.
[0059] like Figure 5 As shown, a foot pedal 103 is provided at the bottom edge of the upper support of the support structure 300, a plurality of slidable outer shielding plates 102 are provided on both sides of the upper support, and a plurality of retractable foot cups 301 are provided at the bottom. The height of the upper support ranges from 1m to 3m, the height of the lower support ranges from 1m to 3.5m, and the width of the overall support ranges from 2m to 5m. The height of the foot cup 301 at the bottom of the support structure 300 ranges from 100mm to 600mm.
[0060] Compared with the prior art, the upper layer is provided with a foot pedal 103 and a slidable outer shielding plate 102, which is convenient for the staff to stand on the foot pedal 103 to observe and record the process, while the slidable outer shielding plate 102 plays the role of preventing foreign matter from splashing, dust prevention, protecting personnel and exhaust gas extraction. The lower layer has a large space capacity, which is convenient for adding medicine or equipment, easy to install, and the process can be flexibly changed. The bottom is provided with a foot cup 301, which is separated from the ground and can be adjusted according to the storage environment of the equipment, so that all equipment maintains a horizontal angle to maintain the balance of the entire equipment. The bracket design saves the occupied space of the site, improves the installation efficiency, and is convenient for maintenance and observation.
[0061] The working principle of the utility model device is:
[0062] During the electroplating process, the solution in the copper plating tank 101 overflows through the overflow collection pipe to the overflow collection area 100 of the first copper plating solution management tank 204 and the overflow collection area 100 of the second copper plating solution management tank 207 and the transition area for temporary storage, thereby realizing independent storage of the overflow solution in the copper plating tank 101. The overflow collection area 100 located in the first copper plating solution management tank 204 will flow to the overflow collection area 100 of the second copper plating solution management tank 207. After flowing into the transition area of the second copper plating solution management tank 207, the solution will move back and forth between the transition areas of the two copper plating solution management tanks, and then flow into the reflux area 200 of the first copper plating solution management tank 204, a part of which flows into the reflux area 200 of the second copper plating solution management tank 207, and then the solution is pumped into the spray pipe at the top of the copper plating tank 101 through the second pump 206. The solution in the copper plating tank 101 will then overflow from the overflow port back to the overflow collection areas 100 of the two copper plating solution management tanks, thereby realizing the overall external circulation of the solution. At the same time, the reflux pump 214 is turned on, and the liquid in the reflux area 200 and the transition area in the first copper plating liquid management tank 204 will flow back to the overflow collection area 100 of the first copper plating liquid management tank 204 through the first filter barrel 202 and the cold and heat exchanger 211, realizing the independent internal circulation of the first copper plating liquid management tank 204. The above external circulation and internal circulation are carried out simultaneously.
[0063] For those skilled in the art, various other corresponding changes and deformations can be made according to the technical solutions and concepts described above, and all of these changes and deformations should fall within the protection scope of the claims of the utility model.
Claims
1. A surface treatment integrated electroplating device, comprising a support structure (300), characterized in that: The support structure (300) adopts an upper and lower two-layer structure; the upper layer of the support structure (300) is provided with at least two groups of copper plating units, each of which includes a copper plating tank (101) and a group of drive rollers (104) for driving the film to be plated; the lower layer of the support structure (300) is provided with a first copper plating solution management tank (204), a second copper plating solution management tank (207) and a cold and heat exchanger (211); the first copper plating solution management tank (204) and the second copper plating solution management tank (207) have internal The front and rear partitions are designed, and the front and rear partitions are respectively an overflow collection area (100) and a reflux area (200) located behind the overflow collection area (100), and a partition partition and a plurality of transition areas are provided between the two areas; the collection end of the overflow collection area (100) is connected to the overflow collection pipe at the top of the copper plating tank (101); the liquid outlet end of the reflux area (200) of the first copper plating solution management tank (204) is connected to the first copper plating solution management tank (204) through a reflux pump (214) arranged outside the first copper plating solution management tank (204), a first filter barrel (2014), and a first filter barrel (2015). 2) and a cold-heat exchanger (211) are connected to the liquid inlet of the overflow collection area (100) of the first copper plating solution management tank (204); the liquid outlet of the reflux area (200) of the second copper plating solution management tank (207) is connected to the nozzle in the copper plating tank (101) through a second pump (206); the reflux area (200) of the first copper plating solution management tank (204) is connected to the transition area of the first copper plating solution management tank (204), and the overflow collection area (100) of the second copper plating solution management tank (207) is connected to the transition area of the first copper plating solution management tank (204). ) is connected to the transition zone of the second copper plating solution management tank (207), the overflow collection zone (100) of the first copper plating solution management tank (204) is connected to the overflow collection zone (100) of the second copper plating solution management tank (207), the reflux zone (200) of the first copper plating solution management tank (204) is connected to the reflux zone (200) of the second copper plating solution management tank (207), and the transition zone of the first copper plating solution management tank (204) is connected to the transition zone of the second copper plating solution management tank (207).
2. The surface treatment integrated electroplating device according to claim 1, characterized in that: The drive roller group (104) comprises a drive roller (1041) and a plurality of conductive drive rollers; the drive roller (1041) of the drive roller group (104) is arranged inside the copper plating tank (101); the conductive drive rollers of the plurality of drive roller groups (104) are respectively located on both sides of the drive roller (1041) and are arranged on the top side of the copper plating tank (101); the film to be plated is wound around the plurality of conductive drive rollers and the drive roller (1041); the drive roller (1041) and the plurality of conductive drive rollers are respectively driven by corresponding drive shafts.
3. The surface treatment integrated electroplating device according to claim 1, characterized in that: It also includes a copper powder dissolving tank (201), which is arranged side by side with the first copper plating solution management tank (204) and is arranged below the copper plating tank (101); the reflux outlet end of the reflux zone (200) of the first copper plating solution management tank (204) is connected to the liquid inlet end of the copper powder dissolving tank (201) through a third pump (203), and the reflux outlet end of the copper powder dissolving tank (201) is connected to the reflux receiving end of the overflow collection zone (100) of the first copper plating solution management tank (204) through a conduit.
4. The surface treatment integrated electroplating device according to claim 1, characterized in that: It also includes a first pump (209) and a second filter barrel (208); the liquid outlet of the reflux zone (200) of the first copper plating solution management tank (204) is connected to the liquid inlet of the first pump (209), the liquid outlet of the first pump (209) is connected to the liquid inlet of the second filter barrel (208), and the liquid outlet of the second filter barrel (208) is connected to the nozzle in the copper plating tank (101).
5. The surface treatment integrated electroplating device according to claim 3, characterized in that: The top of the second copper plating solution management tank (207) is connected to an auxiliary agent adding barrel (205) through a conveying pipe, and the auxiliary agent adding barrel (205) is located on the side of the second copper plating solution management tank (207). A copper powder adding port is opened on the top of the copper powder dissolution tank (201).
6. The surface treatment integrated electroplating device according to claim 1, characterized in that: It also includes a solenoid valve (212), which is installed outside the first copper plating solution management tank (204); the solenoid valve (212) is communicatively connected to a liquid level sensor in the first copper plating solution management tank (204); and the valve ends of the plurality of solenoid valves (212) are respectively arranged at the water inlet and the water outlet of the recirculation zone (200).
7. The surface treatment integrated electroplating device according to claim 1, characterized in that: A current rectifier (213) is provided in the lower layer of the support structure (300), and the current rectifier (213) is electrically connected to the cathode and anode in the copper plating tank (101) through a wire.
8. The surface treatment integrated electroplating device according to claim 2, characterized in that: The diameter of the transmission roller (1041) is larger than that of the conductive transmission roller, and the linear speed of the transmission roller (1041) and the plurality of conductive transmission rollers are the same.
9. The surface treatment integrated electroplating device according to claim 1, characterized in that: A plurality of slidable outer shielding plates (102) are provided on the top of the support structure (300), and a foot pedal (103) is provided on the bottom side of the outer shielding plate (102), and the foot pedal (103) is fixedly connected to both sides of the top layer of the support structure (300).
10. The surface treatment integrated electroplating device according to claim 1, characterized in that: A plurality of retractable foot cups (301) are provided at the bottom of the support structure (300).