Electroplating clamp for semiconductor substrate wafer

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides an electroplating clamp for a semiconductor substrate wafer, which comprises a clamp plate with a circular groove formed in the middle, and is characterized in that a sleeve cylinder is fixedly connected to the middle of the top surface of the clamp plate, a connecting piece is fixedly connected to the upper end of the sleeve cylinder, a cylinder is fixedly connected to the interior of the sleeve cylinder, and the connecting piece is fixedly connected to the lower end of the cylinder. A circular groove is formed in the bottom face of the clamp plate, a telescopic rod is fixedly connected to the interior of the connecting piece and connected to the closing plate through the circular groove, a circular ring is fixedly connected to the bottom face of the closing plate, a rubber gasket ring is fixedly connected to the bottom face of the circular ring, and an adsorption assembly is arranged in the clamp plate. Before the adsorption assembly adsorbs and clamps the substrate wafer, the position of the closing plate is adjusted, and the circular ring is used for shielding main components of the substrate wafer, so that the phenomenon that the middle of the substrate wafer is scratched to generate static electricity in the adsorption, clamping and moving process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and in particular to an electroplating fixture for semiconductor substrate wafers. Background Art

[0002] Semiconductor manufacturing involves a series of complex processes to transform raw materials into finished components. The process usually includes four main stages: wafer manufacturing, wafer test assembly or packaging, and final testing. Each stage has its own unique challenges and opportunities. The manufacturing process also faces many challenges including cost, complexity, diversity and output, but it also brings great opportunities for innovation and development. By addressing the difficulties and seizing the opportunities, we can promote the development of new technologies to change the way we live and work.

[0003] After searching, the existing patent (publication number: CN214736183U) discloses a wafer electroplating fixture, an electroplating fixture bottom plate, and a plane slot in the middle of the electroplating fixture bottom plate for limiting engagement with the wafer; a conductive metal ring that can conduct electricity is fixed on the electroplating fixture bottom plate, and the plane slot is located in the conductive metal ring; a plurality of conductive springs distributed at intervals are fixed on the conductive metal ring, one end of the conductive spring is fixed to the conductive metal ring, and the other end of the conductive spring is located above the plane slot and can be pressed and contacted with the wafer, and after the electroplating current enters the conductive metal ring, it flows evenly to the surface of the wafer through the plurality of conductive springs distributed at intervals; so that the metal atoms are quickly and stably reduced and grown on the surface of the wafer to form a metal coating with good flatness and high uniformity, which solves the problem of poor flatness and uniformity of the electroplated layer formed by existing metal electroplating on the wafer surface, and avoids the occurrence of warping of the metal layer after wafer electroplating.

[0004] However, there are still some shortcomings in the above scheme. When the substrate wafer is adsorbed, because the middle of the substrate wafer is in direct contact, there is a risk of scratching the surface of the substrate wafer. It is necessary to avoid direct contact with the middle of the substrate wafer.

[0005] In view of this, the utility model provides an electroplating fixture for semiconductor substrate wafers. Utility Model Content

[0006] The utility model provides an electroplating fixture for semiconductor substrate wafers, which solves the risk of scratching the surface of the substrate wafer when the wafer electroplating fixture in the related art directly contacts the surface of the substrate wafer.

[0007] The technical solution of the utility model is as follows: A plating fixture for semiconductor substrate wafers, comprising: a fixture plate, and a circular groove is opened in the middle of the fixture plate, a sleeve tube is fixedly connected to the middle of the top surface of the fixture plate, a connecting piece is fixedly connected to the upper end of the sleeve tube, a cylinder is fixedly connected to the inside of the sleeve tube, a telescopic rod is fixedly connected to the inside of the connecting piece, and the telescopic rod is connected to a closing plate through a circular groove, a circular ring is fixedly connected to the bottom surface of the closing plate, a rubber gasket ring is fixedly connected to the bottom surface of the circular ring, and an adsorption component is arranged inside the fixture plate.

[0008] Preferably, the adsorption assembly includes a plurality of vacuum adsorption plates, and the plurality of vacuum adsorption plates are arranged inside the fixture plate and are arranged equidistantly in a ring shape.

[0009] Preferably, a hose is connected through the top end of the vacuum adsorption disk, and the other end of the hose is connected through the socket.

[0010] Preferably, a certain gap is provided between the sleeve tube and the cylinder, and the gap is provided as an exhaust groove.

[0011] Preferably, a connecting pipe is connected through the top end of the sleeve, and the connecting pipe is arranged on one side of the connecting piece.

[0012] Preferably, an outer ring is fixedly sleeved on the surface of the clamp plate, and a clamping groove is formed on the bottom surface of the outer ring.

[0013] Preferably, a closing plate is provided inside the clamping groove, and a certain gap is provided between the clamping plate and the closing plate, and the gap is used to set the vacuum adsorption disk.

[0014] The working principle and beneficial effects of the utility model are:

[0015] In the utility model, by setting the adsorption component, the closing plate, the circular ring and the rubber gasket ring, it can be achieved during use that, before the adsorption component adsorbs and clamps the substrate wafer, the position of the closing plate is adjusted and the main parts of the substrate wafer are shielded by the circular ring, thereby reducing the phenomenon of static electricity caused by scratches on the middle part of the substrate wafer during the adsorption, clamping and movement process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0017] Figure 1 This is a schematic diagram of the structure of an electroplating fixture for a semiconductor substrate wafer proposed by the utility model;

[0018] Figure 2 This is a schematic diagram of a planar perspective structure of an electroplating fixture for a semiconductor substrate wafer proposed by the utility model;

[0019] Figure 3 This is a schematic diagram of a flipping structure of a semiconductor substrate wafer electroplating fixture proposed by the utility model;

[0020] Figure 4 The utility model proposed Figure 3 A is a schematic diagram of the enlarged structure;

[0021] In the figure: 1. clamp plate; 2. outer ring; 3. socket tube; 4. connector; 5. adsorption assembly; 51. vacuum adsorption plate; 52. hose; 53. exhaust groove; 54. connecting pipe; 6. clamp groove; 7. closing plate; 8. circular ring; 9. rubber gasket ring; 10. telescopic rod; 11. cylinder. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The present application embodiment discloses a semiconductor substrate wafer electroplating fixture, please refer to Figure 1 and Figure 4 , including: a fixture plate 1, through the setting of the fixture plate 1, the function of installing parts can be achieved when in use, and a circular groove is opened in the middle of the fixture plate 1, through the setting of the circular groove, the function of facilitating the extension and retraction of the telescopic rod 10 can be achieved when in use, a sleeve tube 3 is fixedly connected to the middle of the top surface of the fixture plate 1, through the setting of the sleeve tube 3, the function of cooperating with the internal cylinder 11 to form a connecting tube 54 when in use, a connecting piece 4 is fixedly connected to the upper end of the sleeve tube 3, through the setting of the connecting piece 4, the function of connecting a mechanical arm can be achieved when in use, the cylinder 11 is fixedly connected to the inside of the sleeve tube 3, and the telescopic rod 10 is fixedly connected to the inside of the connecting piece 4, and through the setting of the telescopic rod 10, when in use The telescopic rod 10 is connected to the closing plate 7 through a circular groove. Through the setting of the closing plate 7, the function of installing parts under the closing plate 7 can be achieved when in use. The bottom surface of the closing plate 7 is fixedly connected with a circular ring 8. Through the setting of the circular ring 8, the function of closing the surface of the substrate wafer can be achieved when in use. The bottom surface of the circular ring 8 is fixedly connected with a rubber gasket ring 9. Through the setting of the rubber gasket ring 9, the function of preventing the circular ring 8 from directly contacting the surface of the substrate wafer can be achieved when in use. The interior of the clamping plate 1 is provided with an adsorption component 5. Through the setting of the adsorption component 5, the function of adsorbing the substrate wafer for clamping and moving can be achieved when in use.

[0024] The adsorption assembly 5 includes a plurality of vacuum adsorption plates 51. Through the arrangement of the vacuum adsorption plates 51, when in use, multiple vacuum adsorption plates 51 can simultaneously adsorb substrate wafers, and multiple vacuum adsorption plates 51 are arranged inside the fixture plate 1 and are arranged equidistantly in a ring shape.

[0025] The top end of the vacuum adsorption disk 51 is connected with a hose 52 . The hose 52 can be used to exhaust the air inside the exhaust groove 53 during use. The other end of the hose 52 is connected to the socket 3 .

[0026] A certain gap is provided between the sleeve tube 3 and the cylinder 11, and the gap is provided as an exhaust groove 53. Through the provision of the exhaust groove 53, an exhaust gap can be formed inside during use.

[0027] The top end of the sleeve 3 is connected with a connecting pipe 54 . Through the setting of the connecting pipe 54 , an external vacuum device can be connected during use to make the vacuum adsorption plate 51 adsorb the substrate wafer, and the connecting pipe 54 is set on one side of the connecting piece 4 .

[0028] An outer ring 2 is fixedly sleeved on the surface of the clamp plate 1, and a clamping groove 6 is provided on the bottom surface of the outer ring 2. Through the setting of the clamping groove 6, when in use, the clamping groove 6 can provide an adsorption space inside when the substrate wafer is adsorbed through the vacuum adsorption plate 51 inside.

[0029] A closing plate 7 is provided inside the clamping groove 6 , and a certain gap is provided between the clamping plate 1 and the closing plate 7 , and the gap is used to set the vacuum adsorption disk 51 .

[0030] Working principle and usage process: The vacuum device is connected through the connecting piece 4 to the external mechanical arm and the connecting pipe 54. When the closing plate 7 is partially on the surface of the substrate wafer, the position of 7) is adjusted by the telescopic rod 10, and the main use part of the surface of the substrate wafer is covered by the circular ring 8 and the rubber gasket ring 9. The vacuum adsorption plate 51 in the gap between the closing plate 7 and the outer ring 2 adsorbs the substrate wafer through the external vacuum device. After the multi-point vacuum adsorption plate 51 adsorbs the substrate wafer at the same time, it is accommodated in the clamping groove 6, leaving only the bottom surface of the substrate wafer exposed to the air, thereby clamping and moving.

[0031] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor substrate wafer electroplating fixture, comprising: A clamp plate (1), wherein a circular groove is provided in the middle of the clamp plate (1), characterized in that a sleeve tube (3) is fixedly connected to the middle of the top surface of the clamp plate (1), a connecting piece (4) is fixedly connected to the upper end of the sleeve tube (3), a cylinder (11) is fixedly connected to the inside of the sleeve tube (3), a telescopic rod (10) is fixedly connected to the inside of the connecting piece (4), and the telescopic rod (10) is connected to the closing plate (7) through the circular groove, a circular ring (8) is fixedly connected to the bottom surface of the closing plate (7), a rubber gasket ring (9) is fixedly connected to the bottom surface of the circular ring (8), and an adsorption component (5) is arranged inside the clamp plate (1).

2. The electroplating fixture for semiconductor substrate wafer according to claim 1, characterized in that: The adsorption assembly (5) comprises a plurality of vacuum adsorption discs (51), and the plurality of vacuum adsorption discs (51) are arranged inside the fixture plate (1) and are arranged in a ring shape and at equal distances.

3. The electroplating fixture for semiconductor substrate wafer according to claim 2, characterized in that: The top end of the vacuum adsorption disk (51) is connected to a hose (52), and the other end of the hose (52) is connected to the sleeve (3).

4. The electroplating fixture for semiconductor substrate wafer according to claim 3, characterized in that: A certain gap is provided between the sleeve tube (3) and the cylinder (11), and the gap is provided as an exhaust groove (53).

5. The electroplating fixture for semiconductor substrate wafer according to claim 4, characterized in that: The top end of the sleeve (3) is connected through a connecting pipe (54), and the connecting pipe (54) is arranged on one side of the connecting piece (4).

6. The electroplating fixture for semiconductor substrate wafer according to claim 1, characterized in that: An outer ring (2) is fixedly sleeved on the surface of the clamp plate (1), and a clamping groove (6) is provided on the bottom surface of the outer ring (2).

7. The electroplating fixture for semiconductor substrate wafer according to claim 6, characterized in that: A closing plate (7) is arranged inside the clamping groove (6), and a certain gap is arranged between the clamping plate (1) and the closing plate (7), and the gap is used to arrange an air suction adsorption disk (51).

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