Semiconductor rapid ice making device based on TEC

Abstract

A semiconductor rapid ice-making device based on TEC comprises a base, an ice storage device is arranged on the base, an ice-making unit is arranged above the ice storage device, the ice-making unit is connected with a water supply system, the water supply system is responsible for providing a water source for the ice-making unit, and the ice-making unit stores made ice blocks into the ice storage device through a separation system. The ice making unit, the water supply system and the separation system are all connected with the electrical control system; the ice making unit comprises a semiconductor chilling plate, and the semiconductor chilling plate is provided with a refrigeration end and a heat dissipation end; wherein the refrigeration end of the semiconductor refrigeration sheet is connected with an ice cube tray, the heat dissipation end of the semiconductor refrigeration sheet is provided with a water cooling plate, the water cooling plate is connected with a water inlet and outlet pipeline, and the water inlet and outlet pipeline is connected with a water cooling heat dissipation system. The ice maker is realized through the semiconductor chilling plate, static water is used for making ice, and the ice making speed and the ice making quality are improved.

Description

Technical Field

[0001] The utility model relates to a semiconductor rapid ice-making device based on TEC. Background Art

[0002] An ice maker is a device that makes ice by cooling the supplied ice-making water. Existing ice makers mainly use compressors to make ice, which has the characteristics of low ice-making rate and high noise. The types of ice cubes in existing ice makers are mainly bullet ice and grid ice. Bullet ice cubes are prone to form cavities in the center; while grid ice has a slow ice-making speed and will have continuous ice due to its flowing water refrigeration. Utility Model Content

[0003] The technical problem to be solved by the utility model is: how to solve the problem of continuous ice making. The utility model provides a semiconductor rapid ice making device based on TEC.

[0004] The technical solution of the utility model is specifically as follows:

[0005] A semiconductor rapid ice-making device based on TEC comprises a base, an ice storage device is arranged on the base, an ice-making unit is arranged above the ice storage device, the ice-making unit is connected to a water supply system, the water supply system is responsible for providing water to the ice-making unit, the ice-making unit stores the ice cubes produced in the ice storage device through a separation system, and the ice-making unit, the water supply system and the separation system are all connected to an electrical control system;

[0006] The ice-making unit includes a semiconductor refrigeration plate, which is provided with a refrigeration end and a heat dissipation end; wherein, the refrigeration end of the semiconductor refrigeration plate is connected to an ice-making grid, and the heat dissipation end of the semiconductor refrigeration plate is provided with a water cooling plate, the water cooling plate is connected to water inlet and outlet pipes, and the water inlet and outlet pipes are connected to a water cooling and heat dissipation system.

[0007] A cooling block is connected to the cooling end of the semiconductor refrigeration plate, and an ice making grid is arranged above the cooling block.

[0008] The water supply system includes an ice-making water pump, a water pipeline and a water tank; wherein the ice-making water pump sucks ice-making water from the water tank and then transports it to the ice-making grid through the pipeline.

[0009] The water-cooled heat dissipation system includes a water-cooled row, which is connected to the water-cooled plate of the ice-making unit through an inlet and outlet water pipeline, and a heat dissipation water pump and a refrigeration water pump are respectively arranged on the inlet and outlet water pipelines; and a heat dissipation fan is arranged on the water-cooled row.

[0010] The separation system comprises a flip motor, an output shaft of the flip motor is connected to a flip rod, the flip rod is fixedly connected to a heating plate, and the heating plate is fixedly connected to an ice-making unit.

[0011] The beneficial effects of the utility model are as follows: the utility model is a TEC-based semiconductor rapid ice-making device designed based on semiconductor refrigeration plates. The cooling and heating of the device are both realized through semiconductor refrigeration plates. Static water is used to make ice, which improves the ice-making rate and ice-making quality. In addition, the utility model has the advantages of compact size, low power, low cost, fast ice-making and ice-defrosting speeds, and can complete ice-making in 20 minutes and ice-defrosting in 30 seconds, greatly improving the ice-making efficiency and user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is the overall structure diagram of the utility model;

[0013] Figure 2 It is the structural diagram of the ice making unit;

[0014] Figure 3 This is the working principle diagram of the semiconductor refrigerator. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] like Figure 1 As shown, a semiconductor rapid ice-making device based on TEC includes a base 6, an ice storage device 3 is arranged on the base 6, an ice-making unit 1 is arranged above the ice storage device 3, the ice-making unit 1 is connected to a water supply system, the water supply system is responsible for providing water to the ice-making unit 1 for use in the ice-making process, the ice-making unit 1 prepares ice cubes, and the ice-making unit 1 stores the prepared ice cubes in the ice storage device 3 through the separation system 2, and the ice storage device 3 is a component specifically used to store prepared ice cubes. The above-mentioned ice-making unit 1, water supply system and separation system 2 are all connected to an electrical control system 5.

[0017] like Figure 2 , Figure 3As shown, the ice-making unit 1 is the core component of the ice-making machine. The ice-making unit 1 is used to reduce the temperature in the ice-making unit, so that water freezes into ice cubes, and ensures the temperature control and cooling effect during the ice-making process. The ice-making unit 1 includes a semiconductor refrigeration plate 14, and the semiconductor refrigeration plate 14 is provided with a refrigeration end 17 and a heat dissipation end 18. Among them, the refrigeration end 17 of the semiconductor refrigeration plate 14 is connected to a cold conduction block 15, and an ice-making grid 11 is arranged above the cold conduction block 15; a water-cooling plate 12 is arranged at the heat dissipation end 18 of the semiconductor refrigeration plate 14, and the water-cooling plate 12 mainly dissipates heat and cools the hot surface of the semiconductor refrigeration plate 14, and the water-cooling plate 12 is connected to an inlet and outlet water pipeline 16, and the inlet and outlet water pipeline 16 is connected to the water-cooling heat dissipation system 4. In this way, the hot surface of the semiconductor refrigeration plate 14 uses water cooling to dissipate heat, is fixedly connected to the water-cooling plate 12, and a heat-conducting material is applied to the contact surface of the two; the cold surface of the semiconductor refrigeration plate 14 is fixedly connected to the ice-making grid 11, and a heat-conducting material is applied to the contact surface of the two, so that sufficient heat conduction can be achieved.

[0018] During operation, since the heat dissipation end 18 is located on the side away from the ice making grid 11, the temperature of the cooling end 17 is lower than that of the heat dissipation end 18 by energizing the semiconductor cooling sheet 14, so as to absorb the heat of the ice making grid 11. The ice making grid 11 at the cold end adopts thermal insulation measures, and the main purpose of the thermal insulation layer is to reduce the heat loss at the cold end and further improve the ice making speed. By changing the current direction of the semiconductor cooling sheet 14, the temperature rise and fall function of the ice making grid 11 is realized.

[0019] It should be noted that the water supply system includes components such as an ice-making water pump, a water pipe, and a water tank. The ice-making water pump is responsible for sucking ice-making water from the water tank and then transporting it to the ice-making grid 11 through a pipeline. The water supply system is a commonly used technical means, so it is not shown in the figure.

[0020] The water cooling and heat dissipation system 4 includes a support plate 41, which is fixed on the base 6. A water cooling row 42 is arranged on the support plate 41, and the water cooling row 42 is connected to the water cooling plate 12 of the ice making unit 1 through the water inlet and outlet pipes 16, and a heat dissipation water pump 44 and a refrigeration water pump are respectively arranged on the water inlet and outlet pipes 16; and a heat dissipation fan 43 is arranged on the water cooling row 42. In this way, in the water cooling and heat dissipation system 4, the water cooling row 42 and the water cooling plate 12 form a closed-loop water cooling system through the water inlet and outlet pipes 16 to ensure that the heat source can effectively dissipate heat. After the water absorbs heat through the water cooling plate 12, it is transported to the water cooling row 42 through the heat dissipation water pump 44, and heat is exchanged with the surrounding air on the water cooling row 42. At the same time, a fan 44 is installed on the water cooling row 42 to accelerate the air flow and enhance the heat dissipation effect. The cooled water is transported back to the heat source again, and the cycle repeats. The refrigeration water pump is responsible for transporting water from the water cooling row to the heat source, and then transporting the hot water back to the water cooling row 42.

[0021] The separation system 2 is a key component for separating ice cubes from the ice making grid 11, and its function is to ensure that the ice cubes can be easily and completely removed from the freezing surface for collection or storage. The separation system 2 includes a flip motor 21, the output shaft of the flip motor 21 is connected to the flip rod, the flip rod is fixedly connected to the heating plate 22, and the heating plate 22 is fixedly connected to the water-cooled plate 12 in the ice making unit 1. After ice making is completed, the flip motor 21 works, and the flip rod rotates, thereby driving the entire ice making unit 1 above to flip together, so that the ice making grid 11 is driven by the flip motor 21 to flip 150°, and gravity is used to cause the ice cubes to peel off the ice making grid 11 and fall into the ice storage device 3 below. At the same time, the current direction of the semiconductor refrigeration plate is changed to heat the ice making grid to ensure that the ice cubes fall off quickly and completely. In addition, the heating plate 22 can also be started, and the heating plate 22 adopts a conventional heating method.

[0022] It should be noted that the semiconductor cooling plate 14 in the ice making unit 1, the ice making water pump in the water supply system, the cooling water pump 44 and the cooling water pump in the water cooling and heat dissipation system 4, and the flip motor 21 in the separation system 2 are all connected to the electrical control system 5. The electrical control system 5 mainly realizes functions such as driving operation, control logic, safety protection and fault diagnosis. It is responsible for driving, controlling and protecting the normal operation of the ice making machine. The user can operate and set it through the control panel.

[0023] The utility model is a TEC-based semiconductor rapid ice-making device designed based on semiconductor refrigeration sheets. The device realizes cooling and heating through semiconductor refrigeration sheets. It has compact size, low power, low cost, fast ice-making and ice-defrosting speeds. It can make ice in 20 minutes and defrost in 30 seconds, greatly improving the ice-making efficiency and user experience.

[0024] The above is only a preferred embodiment of the present invention. It should be pointed out that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor rapid ice-making device based on TEC, characterized in that: The ice making device comprises a base (6), an ice storage device (3) is arranged on the base (6), an ice making unit (1) is arranged above the ice storage device (3), the ice making unit (1) is connected to a water supply system, the water supply system is responsible for providing water to the ice making unit (1), the ice making unit (1) stores the produced ice cubes in the ice storage device (3) through the separation system (2), and the ice making unit (1), the water supply system and the separation system (2) are all connected to an electrical control system (5); The ice-making unit (1) comprises a semiconductor refrigeration plate (14), wherein the semiconductor refrigeration plate (14) is provided with a refrigeration end (17) and a heat dissipation end (18); wherein the refrigeration end (17) of the semiconductor refrigeration plate (14) is connected to an ice-making tray (11), and a water-cooling plate (12) is provided at the heat dissipation end (18) of the semiconductor refrigeration plate (14), the water-cooling plate (12) is connected to a water inlet and outlet pipe (16), and the water inlet and outlet pipe (16) is connected to a water cooling and heat dissipation system (4).

2. The semiconductor rapid ice-making device based on TEC according to claim 1, characterized in that: A cooling block (15) is connected to the cooling end (17) of the semiconductor cooling sheet (14), and an ice making tray (11) is arranged above the cooling block (15).

3. The semiconductor rapid ice-making device based on TEC according to claim 1, characterized in that: The water supply system comprises an ice-making water pump, a water pipeline and a water tank; wherein the ice-making water pump sucks ice-making water from the water tank and then transports the ice-making water to the ice grid (11) through the pipeline.

4. The semiconductor rapid ice-making device based on TEC according to claim 1, characterized in that: The water-cooling heat dissipation system (4) comprises a water-cooling row (42), the water-cooling row (42) being connected to the water-cooling plate (12) of the ice-making unit (1) via an inlet and outlet water pipeline (16), and a heat dissipation water pump (44) and a refrigeration water pump are respectively arranged on the inlet and outlet water pipeline (16); and a heat dissipation fan (43) is arranged on the water-cooling row (42).

5. The semiconductor rapid ice-making device based on TEC according to claim 1, characterized in that: The separation system (2) comprises a flip motor (21), the output shaft of the flip motor (21) is connected to a flip rod, the flip rod is fixedly connected to a heating plate (22), and the heating plate (22) is fixedly connected to an ice-making unit (1).

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