Heat dissipation backlight module

Abstract

The utility model discloses a heat dissipation backlight module, which is characterized in that a soaking film layer is coated on the inner surface of a backlight iron stand by a sputtering coating method, and the soaking film is made of a high-heat-conductivity material, so that the heat conductivity coefficient is high, and heat radiated and conducted from an LED (light-emitting diode) area can be quickly dissipated; and the heat of the whole surface of the backlight module is in a relatively uniform state. And heat on the soaking film is conducted to the external environment through the backlight iron stand in contact with the soaking film. Therefore, the problem of membrane material wrinkling caused by inconsistent heat in different areas of the backlight module is avoided, meanwhile, heat in the near area of the LED is quickly dissipated, and over-temperature caused by continuous concentration of heat in the area is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a heat dissipation backlight module. Background Art

[0002] The liquid crystal display module is an important component of the mobile phone display screen, which is mainly composed of a protective cover, an LCD screen, a backlight, etc. Among them, the backlight is used to provide light for the liquid crystal touch display module. As the brightness requirements of mobile phone displays are increasing, high brightness has been an obvious trend in the past two years. Therefore, the number and current of LED lamps used in the backlight module have increased accordingly, resulting in more and more LED heat. When the LED lamp heats up, the temperature in the vicinity will be higher, while the temperature in the far end area of ​​the LED and the tail area of ​​the backlight will be relatively lower. This will cause different parts of the film materials in the backlight to be heated unevenly, and the dimensional changes caused by thermal expansion and contraction are different, which will cause wrinkles in different parts of the film materials. The thickness of each film material is very thin, only tens of microns, and wrinkles are prone to occur, resulting in different luminous effects in different areas of the backlight, and the overall display consistency is poor. Utility Model Content

[0003] In order to solve the deficiencies of the above-mentioned prior art, the utility model provides a heat dissipation backlight module, which is coated with a layer of heat-sputtering film on the inner surface of the backlight iron frame by sputtering. The heat-spreading film is composed of a high thermal conductivity material and has a high thermal conductivity coefficient. It can quickly disperse the heat radiated and conducted from the LED area, so that the heat of the entire backlight module is in a relatively uniform state. The heat on the heat-spreading film is conducted to the external environment through the backlight iron frame in contact with it. Thereby avoiding the problem of film wrinkles caused by inconsistent heat in different areas of the backlight module, and at the same time quickly dissipating the heat near the LED area to avoid continuous concentration of heat in this area and overheating.

[0004] The technical problem to be solved by the utility model is achieved through the following technical solution: a heat dissipation backlight module, comprising:

[0005] A bottom frame, wherein a light guide plate and an optical film are arranged on the bottom frame, and a light-emitting component is arranged on one side of the light guide plate;

[0006] A heat spreader film, which is coated on the inner surface of the bottom frame by a sputtering process and extends from a side close to the light emitting component to a side away from the light emitting component;

[0007] A reflective film is provided between the heat spreader film and the light guide plate.

[0008] As a preferred solution of the heat dissipation backlight module provided by the utility model, the optical film includes a diffusion film, a lower brightness enhancement film and an upper brightness enhancement film which are sequentially stacked from bottom to top.

[0009] As a preferred solution of the heat dissipation backlight module provided by the utility model, a protective film is provided on the light emitting surface of the upper brightness enhancement film.

[0010] As a preferred solution of the heat dissipation backlight module provided by the utility model, a liquid crystal screen is arranged on the light emitting surface of the protective film, and the liquid crystal screen comprises an upper glass substrate and a lower glass substrate which are stacked in sequence.

[0011] As a preferred solution of the heat dissipation backlight module provided by the utility model, a color filter CF is provided on the side of the upper glass substrate facing the lower glass substrate, and a thin film transistor TFT is provided on the side of the lower glass substrate facing the upper glass substrate;

[0012] The upper glass substrate and the lower glass substrate are bonded by means of frame glue arranged around the sides, and the space enclosed by the upper glass substrate, the frame glue and the lower glass substrate is filled with liquid crystal material.

[0013] As a preferred solution of the heat dissipation backlight module provided by the utility model, an upper polarizer is provided on a side of the upper glass substrate away from the lower glass substrate, and a lower polarizer is provided on a side of the lower glass substrate away from the upper glass substrate.

[0014] As a preferred solution of the heat dissipation backlight module provided by the utility model, it also includes a protection cover plate, and the protection cover plate is attached to the upper surface of the liquid crystal screen.

[0015] As a preferred solution of the heat dissipation backlight module provided by the utility model, the protection cover plate is bonded to the liquid crystal screen by OCA glue.

[0016] As a preferred solution of the heat dissipation backlight module provided by the utility model, the light emitting component includes an FPC and a plurality of top-emitting LEDs arranged on the FPC.

[0017] As a preferred solution of the heat dissipation backlight module provided by the utility model, the light guide plate is provided with at least one raised portion at the light incident surface, and the raised portion is located between adjacent LEDs on the FPC and presses the FPC.

[0018] The utility model has the following beneficial effects: a heat dissipation backlight module, comprising: a bottom frame, a light guide plate and an optical film are provided on the bottom frame, a light-emitting component is provided on one side of the light guide plate; a heat spreader film, the heat spreader film is coated on the inner surface of the bottom frame by a sputtering process; a reflective film is provided between the heat spreader film and the light guide plate. The application applies a layer of heat spreader film on the inner surface of the backlight iron frame by a sputtering method. The heat spreader film is composed of a high thermal conductivity material with a high thermal conductivity coefficient, which can quickly disperse the heat radiated and conducted from the LED area, so that the heat of the entire backlight module is in a relatively uniform state. The heat on the heat spreader film is conducted to the external environment through the backlight iron frame in contact with it. Thereby avoiding the problem of film wrinkles caused by inconsistent heat in different areas of the backlight module, and at the same time quickly dissipating the heat in the area near the LED to avoid continuous concentration of heat in this area and overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a schematic structural diagram of the heat dissipation backlight module provided by the utility model;

[0021] Figure 2 A schematic diagram of the stacking structure of the heat dissipation backlight module provided by the utility model;

[0022] Figure 3 A schematic diagram of the structure of a liquid crystal screen of the heat dissipation backlight module provided by the utility model;

[0023] Figure 4 This is a schematic diagram of the light emitting components of the heat dissipation backlight module provided by the utility model.

[0024] 1. Bottom frame; 11. Iron frame; 12. Glue frame; 13. Heat spreader; 14. Reflective film; 15. Light guide plate; 16. Optical film; 161. Diffusion film; 162. Lower brightness enhancement film; 163. Upper brightness enhancement film; 2. LCD screen; 201. Upper glass substrate; 202. Lower glass substrate; 203. Frame glue; 204. Color filter CF; 205. Liquid crystal material; 206. Thin film transistor TFT; 207. Heat spreader; 208. Upper polarizer; 209. Lower polarizer; 3. Protective cover; 4. OCA glue; 5. Light-emitting component; 51. LED; 52. FPC. DETAILED DESCRIPTION

[0025] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0026] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Embodiment 1

[0030] like Figure 1 As shown, the utility model provides a heat dissipation backlight module, comprising:

[0031] A bottom frame 1, on which a light guide plate 15 and an optical film 16 are disposed, and a light-emitting component 5 is disposed on one side of the light guide plate 15;

[0032] The bottom frame 1 includes an iron frame 11 and a plastic frame 12. The side of the iron frame 11 is perpendicular to the bottom surface to form a receiving cavity. The plastic frame 12 is arranged on the side of the iron frame 11.

[0033] A heat-spreading film 13, which is coated on the inner surface of the bottom frame 1 by a sputtering process and extends from a side close to the light-emitting component 5 to a side away from the light-emitting component 5;

[0034] A reflective film 14 is disposed between the heat-spreading film 13 and the light guide plate 15 .

[0035] In this embodiment, a layer of heat-spreading film 13 is coated on the inner surface of the backlight iron frame 11 by sputtering. The heat-spreading film 13 is made of a high thermal conductivity material and has a high thermal conductivity coefficient. It can quickly disperse the heat radiated and conducted from the light-emitting component 5 area, so that the heat of the entire backlight module is in a relatively uniform state. The heat on the heat-spreading film 13 is conducted to the external environment through the backlight iron frame 11 in contact with it. Thereby avoiding the problem of film wrinkles caused by inconsistent heat in different areas of the backlight module, and at the same time quickly dissipating the heat near the light-emitting component 5 to avoid continuous concentration of heat in this area and overheating.

[0036] The heat-spreading film 13 may be, but is not limited to, formed on the inner surface of the bottom frame 1 by a sputtering process using an oxide metal material or a nitride metal material (such as aluminum oxide or aluminum nitride).

[0037] Furthermore, the optical film 16 includes a diffusion film 161, a lower brightness enhancement film 162 and an upper brightness enhancement film 163 which are sequentially stacked from bottom to top. The diffusion film 161 is used to scatter the incident light so that the light presents a uniform diffusion distribution on the surface of the film. This helps to reduce reflection and improve transmittance, and can also reduce surface reflection and glare, thereby improving the visual comfort of the optical device. The lower brightness enhancement film 162 is used to increase the transmittance of the incident light and reduce the reflectivity, thereby improving the light transmission performance of the optical device. The lower brightness enhancement film is usually achieved by depositing a layer of high refractive index material on the surface of the film, which can effectively reduce reflection loss and improve the optical performance of the optical device. The upper brightness enhancement film 163 is similar to the lower brightness enhancement film, but it is usually achieved by depositing a layer of low refractive index material on the surface of the film. The upper brightness enhancement film can further reduce reflection loss, improve the light transmission performance of the optical device, and can also increase the wear resistance and corrosion resistance of the optical device. The optical film group 16 can effectively improve the light transmission performance of optical devices, reduce reflection losses, improve visual comfort and increase durability through reasonable design and superposition of thin film layers with different functions.

[0038] Through the above structural setting, the backlight module can effectively improve the transmission efficiency and uniformity of light, so that the display screen can present a clear and bright picture under different angles and lighting conditions. At the same time, the optical film 16 can also effectively reduce reflection and refraction, improve the display effect and viewing experience. Overall, this backlight module structure can improve the brightness, contrast and color expression of the display screen, and enhance the user experience.

[0039] Furthermore, a protective film 17 is provided on the light emitting surface of the upper brightness enhancement film 163 .

[0040] Embodiment 2

[0041] like Figure 2 As shown, a liquid crystal panel 2 is disposed on the light emitting surface of the protective film 17 , and the liquid crystal panel 2 includes an upper glass substrate 201 and a lower glass substrate 202 which are stacked in sequence.

[0042] Furthermore, a color filter CF204 is provided on a side of the upper glass substrate 201 facing the lower glass substrate 202, and a thin film transistor TFT206 is provided on a side of the lower glass substrate 202 facing the upper glass substrate 201;

[0043] The upper glass substrate 201 and the lower glass substrate 202 are bonded together by means of a sealant 203 provided around the sides, and the space enclosed by the upper glass substrate 201 , the sealant 203 and the lower glass substrate 202 is filled with liquid crystal material 205 .

[0044] It should be noted that the thin film transistor TFT206 is a component used to control the switch of each pixel in the liquid crystal display. It can change the arrangement state of the liquid crystal molecules by controlling the voltage, thereby achieving the display effect. The color filter CF204 is a key component for displaying color images in the liquid crystal display. It can decompose white light into three basic colors of red, green and blue, and display rich colors by adjusting the transmittance of different colors, which can ensure that the liquid crystal display displays real and bright color images.

[0045] Furthermore, an upper polarizer 208 is provided on the side of the upper glass substrate 201 away from the lower glass substrate 202, and a lower polarizer 209 is provided on the side of the lower glass substrate 202 away from the upper glass substrate 201. The polarizer has a fixed polarization axis, and only allows light with a vibration direction consistent with the polarization direction to pass through, and absorbs light with a vibration direction perpendicular to the polarization axis, and is used to convert natural light without polarization into polarized light, allowing light with a direction perpendicular to the electric field to pass through, so that the liquid crystal display panel can display images normally.

[0046] The liquid crystal screen 2 described in this embodiment is filled with liquid crystal material 205. Among them, the liquid crystal is a special substance, which has properties between liquid and solid. The liquid crystal molecules are arranged in an orderly manner when there is no external influence, but when subjected to external effects such as electric field, temperature or pressure, the liquid crystal molecules will change their arrangement structure, thereby producing different optical properties. Liquid crystal materials are usually composed of organic molecules or polymers, which have a long shape so that they can form a specific arrangement structure in the liquid crystal state. According to the arrangement of liquid crystal molecules, liquid crystals can be divided into various types, including nematic liquid crystals, twisted nematic liquid crystals, helical liquid crystals, etc. Liquid crystal materials are widely used in display technology, especially in liquid crystal display screens. In liquid crystal display screens, liquid crystal materials are filled between two pieces of glass to form a liquid crystal layer. When an electric field is applied, the arrangement structure of the liquid crystal molecules will change, thereby changing the polarization state of light passing through the liquid crystal layer to achieve image display.

[0047] Embodiment 3

[0048] In this embodiment, the heat dissipation backlight module further includes a protective cover plate 3, which is attached to the upper surface of the liquid crystal screen 2. The protective cover plate 3 is a transparent material used to protect the liquid crystal screen 2, and can prevent the screen from being scratched or damaged.

[0049] Furthermore, the protective cover plate 3 is bonded to the liquid crystal screen 2 by means of an OCA adhesive 4. The OCA adhesive 4 is a transparent double-sided adhesive having good bonding performance and transparency, and can ensure the bonding strength between the protective cover plate and the liquid crystal screen 2.

[0050] In another preferred embodiment of the present invention, the protective cover plate 3 is made of transparent glass. Transparent glass is a highly transparent material that can ensure that the display effect of the liquid crystal screen 2 is not affected. At the same time, transparent glass has high hardness and wear resistance, and can effectively protect the screen from being scratched or damaged. Therefore, using transparent glass as the protective cover plate 3 can improve the service life and display effect of the liquid crystal screen 2.

[0051] like Figure 3 As shown, a light emitting assembly 5 is disposed on one side of the light guide plate 15 , and the light emitting assembly 5 includes an FPC 52 and a plurality of top-emitting LEDs 51 disposed on the FPC 52 .

[0052] Furthermore, the light guide plate 15 is provided with at least one protrusion at the light incident surface, and the protrusion is located between adjacent LEDs 51 on the FPC 52 and presses the FPC 52 .

[0053] In this embodiment, the light emitting assembly 5 includes an FPC 52 and a plurality of top-emitting LEDs 51 disposed on the FPC 52. The light guide plate 15 is provided with at least one protrusion at the light incident surface, and the protrusion is located between adjacent LEDs 51 on the FPC 52 and presses the FPC 52. The FPC 52 is thin and light in structure, which can effectively reduce the thickness of the frame and the weight of the backlight module. However, since the FPC 52 generates a rebound force against bending at the place where it needs to be bent, it is also easy to warp, especially when heated at high temperatures. After the protrusion is provided at the position of the light guide plate 15 corresponding to the FPC 52, the protrusion can press the FPC 52, effectively preventing the FPC 52 from warping.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A heat dissipation backlight module, characterized in that: include, A bottom frame (1), wherein a light guide plate (15) and an optical film (16) are provided on the bottom frame (1), and a light emitting component (5) is provided on one side of the light guide plate (15); The bottom frame (1) comprises an iron frame (11) and a plastic frame (12); the side of the iron frame (11) is perpendicular to the bottom surface to form a receiving cavity, and the plastic frame (12) is arranged on the side of the iron frame (11); A heat-spreading film (13), the heat-spreading film (13) being coated on the inner surface of the bottom frame (1) by a sputtering process and extending from a side close to the light-emitting component (5) to a side far from the light-emitting component (5); A reflective film (14) is provided between the heat-spreading film (13) and the light guide plate (15).

2. The heat dissipation backlight module according to claim 1, characterized in that: The optical film (16) comprises a diffusion film (161), a lower brightness enhancement film (162) and an upper brightness enhancement film (163) which are sequentially stacked from bottom to top.

3. The heat dissipation backlight module according to claim 2, characterized in that: The light-emitting surface of the upper brightness enhancement film (163) is provided with a protective film (17).

4. The heat dissipation backlight module according to claim 3, characterized in that: A liquid crystal screen (2) is provided on the light-emitting surface of the protective film (17), and the liquid crystal screen (2) comprises an upper glass substrate (201) and a lower glass substrate (202) which are stacked in sequence.

5. The heat dissipation backlight module according to claim 4, characterized in that: A color filter CF (204) is provided on the side of the upper glass substrate (201) facing the lower glass substrate (202), and a thin film transistor TFT (206) is provided on the side of the lower glass substrate (202) facing the upper glass substrate (201); The upper glass substrate (201) and the lower glass substrate (202) are bonded together by means of a frame glue (203) provided around the sides, and a space enclosed by the upper glass substrate (201), the frame glue (203) and the lower glass substrate (202) is filled with liquid crystal material (205).

6. The heat dissipation backlight module according to claim 1, characterized in that: An upper polarizer (208) is provided on a side of the upper glass substrate (201) away from the lower glass substrate (202), and a lower polarizer (209) is provided on a side of the lower glass substrate (202) away from the upper glass substrate (201).

7. The heat dissipation backlight module according to claim 4, characterized in that: It also comprises a protective cover plate (3), wherein the protective cover plate (3) is attached to the upper surface of the liquid crystal screen (2).

8. The heat dissipation backlight module according to claim 7, characterized in that: The protective cover plate (3) is bonded to the liquid crystal screen (2) via OCA glue (4).

9. The heat dissipation backlight module according to claim 1, characterized in that: The light-emitting component (5) comprises an FPC (52) and a plurality of top-emitting LEDs (51) arranged on the FPC (52).

10. The heat dissipation backlight module according to claim 9, characterized in that: The light guide plate (15) is provided with at least one raised portion at the light incident surface, and the raised portion is located between adjacent LEDs (51) on the FPC (52) and presses the FPC (52).

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