Heat dissipation module and server

Abstract

The utility model provides a heat dissipation module and a server, and relates to the technical field of server heat dissipation. The heat dissipation module comprises a first heat conduction part and a second heat conduction part; the first heat-conducting part is used for connecting a first heating element; the second heat conduction part is used for being connected with a second heating element and communicates with the first heat conduction part through a pipeline so that the cooling medium can flow to dissipate heat of the first heating element and the second heating element, integrated heat dissipation of the heat dissipation module can be achieved, the heat dissipation efficiency of the server can be improved, and it is guaranteed that the server supports the high-power heating element; and the working performance of the server is improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a heat dissipation module and a server. Background Art

[0002] With the development of science and technology, the demand for servers continues to increase, and the power of heating components in servers is getting higher and higher. The resulting heat dissipation problem is receiving more and more attention.

[0003] Traditional closed-loop water cooling systems can only dissipate heat for one type of heating element, but the integrated cooling of multiple different heating elements by the heat dissipation module can improve the heat dissipation efficiency of the server, ensure the server's support for high-power heating elements, and improve the server's operating performance. Utility Model Content

[0004] The purpose of the embodiment of the present application is to provide a heat dissipation module and a server, and the technical solution is as follows:

[0005] A first aspect of the present application provides a heat dissipation module, comprising:

[0006] A first heat conducting portion, the first heat conducting portion is used to connect a first heating element;

[0007] The second heat-conducting part is used to connect the second heating element. The second heat-conducting part is connected with the first heat-conducting part through a pipeline so that the cooling medium flows to dissipate heat for the first heating element and the second heating element.

[0008] In some embodiments, in the aforementioned heat dissipation module, the first heat-conducting portion includes at least two parallel and spaced heat-conducting components, and the opposite side surfaces of two adjacent heat-conducting components can at least partially contact the first heating element.

[0009] In some embodiments, the aforementioned heat dissipation module, wherein the thermal conductive component includes a first liquid cooling plate and a thermal conductive pad arranged in a stacked manner, the first liquid cooling plate has a liquid cooling channel through which a cooling medium can flow, and the thermal conductive pads of two adjacent thermal conductive components are arranged relative to each other and can at least partially contact the first heating element; the thermal conductive pad is made of elastic thermally conductive material.

[0010] In some embodiments, in the aforementioned heat dissipation module, the cross-section of the first liquid cooling plate and the thermal pad is U-shaped, and the side surface of the first liquid cooling plate facing away from the thermal pad encloses a heat dissipation space, and the heat dissipation space and the side surface of the thermal pad facing away from the first liquid cooling plate are used for cold air to flow through to dissipate heat from the first heating element.

[0011] In some embodiments, the aforementioned heat dissipation module, wherein the heat conductive component further includes a first heat dissipation fin, the first heat dissipation fin is connected to a side surface of the first liquid cooling plate facing away from the thermal pad, and the first heat dissipation fin is used to dissipate heat from the first heating element through cold air flowing through the heat dissipation space.

[0012] In some embodiments, in the aforementioned heat dissipation module, the first heat conducting part further includes a first water divider and a second water divider, and the first water divider and the second water divider are respectively connected to two ends of at least two heat conducting components.

[0013] In some embodiments, the aforementioned heat dissipation module, wherein the second heat-conducting part includes a second liquid cooling plate, the second liquid cooling plate is connected to the second heating element, the second liquid cooling plate is connected to the first heat-conducting part through a pipeline, and a cooling medium can flow through the second liquid cooling plate to dissipate heat from the second heating element.

[0014] In some embodiments, the aforementioned heat dissipation module further includes a second heat dissipation fin, and the second heat dissipation fin is disposed on a surface of the second liquid cooling plate away from the second heating element.

[0015] In some embodiments, the aforementioned heat dissipation module further includes a pumping unit, which is disposed on a pipeline connecting the first heat conducting unit and the second heat conducting unit.

[0016] A second aspect of the present application provides a server, comprising a first heating element, a second heating element and the above-mentioned heat dissipation module, wherein the first heat-conducting portion of the heat-dissipating module is connected to the first heating element, the second heat-conducting portion of the heat-dissipating module is connected to the second heating element, and the second heat-conducting portion is connected to the first heat-conducting portion through a pipeline to allow a cooling medium to flow to dissipate heat from the first heating element and the second heating element.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The isometric structural diagram of a heat dissipation module provided in an embodiment of the present application is schematically shown;

[0020] Figure 2 The isometric structure diagram of a first heat-conducting portion of a heat dissipation module provided in an embodiment of the present application is schematically shown;

[0021] Figure 3 The isometric structural diagram of a heat-conducting component of a heat dissipation module provided in an embodiment of the present application is schematically shown;

[0022] Figure 4 A schematic diagram of a side view structure of a heat-conducting component of a heat dissipation module provided by an embodiment of the present application connected to a first heating element is shown;

[0023] Figure 5 The isometric structural diagram of another heat dissipation module provided in an embodiment of the present application is schematically shown.

[0024] Description of reference numerals:

[0025] 1. first heat conducting part; 11. heat conducting component; 12. first water distributor; 13. second water distributor; 111. first liquid cooling plate; 112. thermal pad; 113. first heat dissipating fin; 1111. liquid cooling channel; 1112. heat dissipating space;

[0026] 2. a second heat conducting part; 21. a second liquid cooling plate;

[0027] 3. Pipeline;

[0028] 4. The first heating element;

[0029] 5. The second heating element;

[0030] 6. Second heat dissipation fin;

[0031] 7. Pumping department. DETAILED DESCRIPTION

[0032] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0033] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0034] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0035] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0036] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0037] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0038] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0039] Embodiment 1

[0040] like Figure 1As shown, the first aspect of the present application provides a heat dissipation module, including a first heat-conducting part 1 and a second heat-conducting part 2; the first heat-conducting part 1 is used to connect the first heating element 4; the second heat-conducting part 2 is used to connect the second heating element 5, and the second heat-conducting part 2 is connected to the first heat-conducting part 1 through a pipeline 3 so that the cooling medium flows to dissipate heat to the first heating element 4 and the second heating element 5.

[0041] Specifically, the present application realizes a closed-loop flow of the cooling medium in the first heat conducting part 1 and the second heat conducting part 2 by providing a first heat conducting part 1 and a second heat conducting part 2 connected by a pipeline 3. Under the closed-loop flow, the cooling medium has low consumption, less pollution and can stably conduct heat and dissipate heat, so that the heat dissipation module of the present application can provide stable and efficient heat dissipation for the first heating element 4 and the second heating element 5. The cooling medium can be cooling water, deionized water, a composite coolant, a fluoride liquid, dibutyl phosphate, etc., without limitation, as long as the heat generated by the first heating element 4 and the second heating element 5 can be exchanged to achieve heat dissipation.

[0042] The first heat conducting part 1 and the second heat conducting part 2 are arranged close to the first heating element 4 and the second heating element 5, so that the distance required for the cooling medium to flow is short, the cooling medium flow path is simple and clear, the system flow resistance is effectively reduced, and the heat dissipation level is improved. The closed-loop cooling medium flow channel formed by the first heat conducting part 1, the second heat conducting part 2 and the pipeline 3 is easy to maintain, and the installation in the server is more flexible. The disassembly operation can be carried out or the layout of the first heat conducting part 1 and the second heat conducting part 2 and the direction of the pipeline 3 can be adjusted accordingly as needed.

[0043] In one embodiment of the present application, the first heating element 4 is a memory stick, the second heating element 5 is a central processing unit, the first heat conducting part 1 is arranged corresponding to the memory stick, the second heat conducting part 2 is arranged corresponding to the central processing unit, and the second heat conducting part 2 is connected to the first heat conducting part 1 through a pipe 3 to form a closed-loop cooling medium flow channel, so that the cooling medium flows and simultaneously transfers and dissipates the heat generated by the memory stick and the central processing unit. In another embodiment of the present application, the present application can also dissipate heat for other heating elements in the server, and other heating elements can be a graphics processor, a hard disk drive, a solid state drive, a power supply unit, a chip module, etc. in the server. The heat dissipation module of the present application can be provided with a plurality of heat conducting parts corresponding to the above-mentioned heating elements, and the plurality of heat conducting parts are connected to the first heat conducting part 1 and the second heat conducting part 2 through a pipe 3 so that the cooling medium simultaneously dissipates heat for the first heating element 4, the second heating element 5 and any other heating element.

[0044] The first aspect of the present application provides a heat dissipation module, including a first heat-conducting part 1 and a second heat-conducting part 2; the first heat-conducting part 1 is used to connect the first heating element 4; the second heat-conducting part 2 is used to connect the second heating element 5, and the second heat-conducting part 2 is connected to the first heat-conducting part 1 through a pipeline 3 so that the cooling medium flows to dissipate heat to the first heating element 4 and the second heating element 5. The present application realizes the closed-loop flow of the cooling medium in the first heat-conducting part 1 and the second heat-conducting part 2 by setting the first heat-conducting part 1 and the second heat-conducting part 2 connected through the pipeline 3. Under the closed-loop flow, the cooling medium consumption is small, the pollution is small, and the heat dissipation can be stably conducted. In addition, the first heat-conducting part 1 and the second heat-conducting part 2 are arranged close to the first heating element 4 and the second heating element 5, so that the distance required for the cooling medium to flow is short, the cooling medium flow path is simple and clear, and the system flow resistance is effectively reduced, and the heat dissipation level is improved. The closed-loop cooling medium flow channel formed by the first heat conducting part 1, the second heat conducting part 2 and the pipeline 3 is easy to maintain, and the installation in the server is more flexible. The first heat conducting part 1 and the second heat conducting part 2 are used to dissipate heat for the first heating element 4 and the second heating element 5 at the same time, thereby realizing the integrated heat dissipation of the heat dissipation module and improving the overall heat dissipation efficiency of the server. Through the application of the present application, the integrated heat dissipation of the heat dissipation module is realized, which can improve the heat dissipation efficiency of the server, ensure the server's support for high-power heating elements, and improve the working performance of the server.

[0045] like Figure 1 and Figure 2 As shown, in some embodiments, the first heat conducting portion 1 includes at least two heat conducting components 11 that are arranged in parallel and at intervals, and the opposite side surfaces of two adjacent heat conducting components 11 can at least partially contact the first heating element 4 .

[0046] Specifically, in one embodiment of the present application, the first heating element 4 is a memory stick plugged in a vertical state in a server, and usually, a plurality of memory sticks are arranged in parallel at a certain interval in a certain area. In order to realize that the first heat-conducting part 1 dissipates heat for the first heating element 4, the first heat-conducting part 1 includes at least two parallel and spaced heat-conducting components 11, so as to dissipate heat corresponding to the plurality of memory sticks arranged in parallel at a certain interval. The opposite side surfaces of two adjacent heat-conducting components 11 can at least partially contact the first heating element 4, that is, when there is one memory stick, there are two heat-conducting components 11 and they are respectively located on both sides of the memory stick. Similarly, when there are two memory sticks, there are three heat-conducting components 11, and one of the heat-conducting components 11 is located between the two memory sticks. By analogy, when there are three, four or even more memory sticks, the heat-conducting components 11 can be arranged accordingly according to the above-mentioned setting logic. The present application arranges the two opposite side surfaces of two adjacent heat-conducting components 11 to at least partially contact the first heating element 4, so that both side surfaces of each first heating element 4 can be contacted and dissipated by the heat-conducting components 11, thereby simultaneously protecting the electronic components on both side surfaces of the first heating element 4 at a suitable operating temperature, thereby ensuring the normal operating performance of the server.

[0047] At the same time, when the first heating element 4 is a memory bar, the installation of the heat-conducting component 11 of the present application is convenient. It only needs to ensure that the heat-conducting component 11 is placed between two adjacent memory bars along the vertical direction according to the gap between the memory bars. In one embodiment, a connecting frame can be set for multiple heat-conducting components 11 to ensure that multiple heat-conducting components 11 can be inserted into the gaps of multiple memory bars at the same time, or the pipes 3 connecting the multiple heat-conducting components 11 can be combined and concentrated through a water divider, and the assembly support of the multiple heat-conducting components 11 can be realized through the water divider to achieve the above-mentioned effect, without limitation.

[0048] It should be noted that, with respect to the arrangement of the first heating element 4 in the server, when the first heating element 4 is located in two or three areas in the server, the heat-conducting components 11 of the first heat-conducting part 1 are arranged accordingly to ensure that the first heating element 4 in each area can be cooled by the first heat-conducting heat-conducting components 11. In one embodiment, there are a first target area and a second target area in the server for plugging in memory sticks, wherein 5 memory sticks are plugged in parallel and at intervals in the first target area, and 6 memory sticks are plugged in parallel and at intervals in the second target area. Then, corresponding to the first target area, this application is provided with 6 heat-conducting components 11, and corresponding to the second target area, this application is provided with 7 heat-conducting components 11, so as to ensure that the two opposite sides of the adjacent heat-conducting components 11 can at least partially contact the first heating element 4. When the number and layout of the first heating element 4 in the server change, no examples are given here one by one, but the arrangement can be made in the same way as above.

[0049] like Figure 2 and Figure 3 As shown, the heat-conducting component 11 includes a first liquid cooling plate 111 and a heat-conducting pad 112 which are stacked. The first liquid cooling plate 111 has a liquid cooling channel 1111 through which a cooling medium can flow. The heat-conducting pads 112 of two adjacent heat-conducting components 11 are arranged opposite to each other and can at least partially contact the first heating element 4. The heat-conducting pad 112 is made of elastic heat-conducting material.

[0050] Specifically, in order to improve the heat dissipation efficiency of the first heating element 4, the heat conducting assembly 11 of the present application includes a first liquid cooling plate 111 and a heat conducting pad 112 which are stacked, wherein the first liquid cooling plate 111 has a liquid cooling channel 1111 through which a cooling medium flows, so that the first liquid cooling plate 111 can form a closed-loop cooling medium channel with the pipeline 3 and the second heat conducting part 2 through the liquid cooling channel 1111, and the heat generated by the first heating element 4 is continuously conducted and dissipated through the cooling medium flowing through the liquid cooling channel 1111. The heat conducting pad 112 can provide a high thermal conductivity, so that the heat generated by the first heating element 4 can be quickly and efficiently conducted to the first liquid cooling plate 111 through the heat conducting pad 112, and carried away by the cooling medium flowing through the first liquid cooling plate 111.

[0051] In one embodiment, when the first heating element 4 is a memory stick, when multiple memory sticks are inserted into the server in parallel and at intervals, in order to place the heat-conducting component 11 of the present application into the gap between two adjacent memory sticks to form contact while avoiding damage to the memory stick caused by the heat-conducting component 11, the present application uses a heat-conducting pad 112 of elastic heat-conducting material, such as a heat-conducting pad 112 of silicone rubber, polyurethane, etc., to form a buffer between the memory stick and the first liquid cold plate 111 through the elastic deformation of the heat-conducting pad 112, thereby playing a protective role. At the same time, it should be noted that the size of the first liquid cold plate 111 of the heat-conducting component 11 of the present application and the thickness of the heat-conducting pad 112 are adaptively adjusted according to the spacing size between two adjacent heating elements in the server, so as to ensure heat dissipation while avoiding damage to the components.

[0052] like Figure 4 As shown, in some embodiments, the cross-sections of the first liquid cooling plate 111 and the thermal pad 112 are U-shaped, and the side surface of the first liquid cooling plate 111 facing away from the thermal pad 112 encloses a heat dissipation space 1112, and the heat dissipation space 1112 and the side surface of the thermal pad 112 facing away from the first liquid cooling plate 111 are used for cold air to flow through to dissipate heat from the first heating element 4.

[0053] Specifically, in order to increase the heat dissipation area of ​​the heat-conducting assembly 11 placed in the gap space of the first heating element 4, so as to improve the heat dissipation efficiency of the first heating element 4, the cross-section of the first liquid cold plate 111 and the thermal pad 112 stacked in the present application to form the heat-conducting assembly 11 is U-shaped, so as to ensure that the heat-conducting assembly 11 can provide a larger heat dissipation area based on the spacing between the two adjacent first heating elements 4. And the side surface of the first liquid cold plate 111 away from the thermal pad 112 is surrounded by a heat dissipation space 1112, and the cold air blown by the fan unit in the server can flow through the heat dissipation space 1112, so as to cooperate with the liquid cooling channel 1111 set in the first liquid cold plate 111 to conduct and dissipate the heat generated by the first heating element 4. And on this basis, the side surface of the thermal pad 112 away from the first liquid cold plate 111 can also be partially exposed to the air in the server after the heat-conducting assembly 11 is installed in contact with the first heating element 4, so that cold air can be blown to dissipate the heat generated by the first heating element 4.

[0054] like Figure 4 As shown, in some embodiments, the heat conductive assembly 11 further includes a first heat dissipating fin 113, which is connected to a side surface of the first liquid cooling plate 111 facing away from the thermal pad 112, and the first heat dissipating fin 113 is used to dissipate heat from the first heating element 4 through cold air flowing through the heat dissipation space 1112.

[0055] Specifically, in order to improve the heat conduction effect of cold air flowing through the heat dissipation space 1112, the present application connects a first heat dissipation fin 113 to the surface of the first liquid cooling plate 111 on the side away from the thermal pad 112. The heat dissipation fin can increase the contact area between the cold air and the cold air when the cold air flows through the heat dissipation space 1112, so that more heat generated by the first heating element 4 can be carried away by the cold air, thereby improving the heat dissipation efficiency of the heat conductive component 11, the first heat conductive part 1, the heat dissipation module of the present application and the server.

[0056] like Figure 5 As shown, in some embodiments, the first heat conducting part 1 further includes a first water separator 12 and a second water separator 13 , and the first water separator 12 and the second water separator 13 are respectively connected to two ends of at least two heat conducting components 11 .

[0057] Specifically, in order to ensure that when each first heating element 4 is dissipated, the heat-conducting components 11 on both sides of each first heating element 4 can evenly provide coldness through the flow of the cooling medium, ensure the stable and uniform cooling effect, and avoid the occurrence of local temperature differences, the first heat-conducting part 1 of the present application also includes a first water distributor 12 and a second water distributor 13, and the first water distributor 12 and the second water distributor 13 are respectively connected to the two ends of at least two heat-conducting components 11, so as to be able to simultaneously distribute the flow of the cooling medium in at least two heat-conducting components 11. At the same time, the provision of the first water distributor 12 and the second water distributor 13 also helps to maintain the pressure balance in the closed-loop cooling medium flow channel formed by the first heat-conducting part 1, the second heat-conducting part 2 and the pipeline 3, avoid local pressure being too high or too low, ensure the cooling medium flow channel is smooth, and will not cause damage to the pipeline 3, etc. It should also be noted that, with respect to the arrangement of the first heating element 4 in the server, when the first heating element 4 is located in two areas or three areas in the server, the heat-conducting components 11 of the first heat-conducting part 1 are arranged in a corresponding number. At this time, for the several heat-conducting components 11 in a single area, a first water divider 12 and a second water divider 13 are correspondingly arranged, that is, the number of the first water divider 12 and the second water divider 13 arranged in the present application is related to the number of arrangement areas where the first heating element 4 is located, and is adaptively adjusted.

[0058] like Figure 5 As shown, in some embodiments, the second heat-conducting part 2 includes a second liquid cooling plate 21, which is connected to the second heating element 5. The second liquid cooling plate 21 is connected to the first heat-conducting part 1 through a pipeline 3, and a cooling medium can flow through the second liquid cooling plate 21 to dissipate heat for the second heating element 5.

[0059] Specifically, in order to conduct heat and dissipate heat for the second heating element 5, the second heat conducting part 2 of the present application includes a second liquid cooling plate 21, and the second liquid cooling plate 21 is connected to the second heating element 5. The connection method can be that the second liquid cooling plate 21 covers the surface of the second heating element 5, or it can be a cover arranged above the second heating element 5, or it can be a method of framing the second heating element 5 in the middle, etc., and there is no limitation to the specific method, as long as a certain contact is ensured between the second liquid cooling plate 21 and the second heating element 5, the heat generated by the second heating element 5 can be conducted and dissipated.

[0060] In order to realize a closed-loop circulation flow channel of the cooling medium in the first heat conducting part 1 and the second liquid cooling plate 21, the second liquid cooling plate 21 is connected to the first heat conducting part 1 through the pipeline 3 to conduct and dissipate the heat generated by the second heating element 5 through the cooling medium.

[0061] like Figure 5 As shown, in some embodiments, second heat dissipation fins 6 are further included, and the second heat dissipation fins 6 are arranged on the surface of the second liquid cooling plate 21 away from the second heating element 5 .

[0062] Specifically, in order to improve the heat dissipation effect of the second heating element 5 and improve the overall heat dissipation efficiency of the heat dissipation module of the present application, the present application is also provided with a second heat dissipation fin 6, and the second heat dissipation fin 6 is arranged on the surface of the second liquid cooling plate 21 away from the second heating element 5. The arrangement of the second heat dissipation fin 6 increases the heat dissipation area of ​​the second liquid cooling plate 21 on the one hand, and on the other hand, the second heat dissipation fin 6 increases the contact area with the cold air in the server, so that the heat generated by the second heating element 5 can also be partially carried away by the cold air during the conduction process through the second liquid cooling plate 21 and the second heat dissipation fin 6, thereby improving the heat dissipation efficiency of the second heating element 5 at the second heat conducting part 2 of the present application, that is, improving the overall heat dissipation efficiency of the heat dissipation module.

[0063] like Figure 5 As shown, in some embodiments, a pumping part 7 is further included, and the pumping part 7 is arranged on the pipeline 3 connecting the first heat conducting part 1 and the second heat conducting part 2.

[0064] Specifically, in order to realize the closed-loop flow of the cooling medium in the first heat conducting part 1, the second heat conducting part 2 and the pipeline 3 connecting the two, the present application is also provided with a pumping part 7, and the pumping part 7 provides power to drive the cooling medium to circulate in the closed-loop cooling medium flow channel formed by the first heat conducting part 1, the second heat conducting part 2 and the pipeline 3, and the setting of the pumping part 7 also helps to maintain a stable pressure in the entire flow channel, and the heat generated by the first heating element 4 and the second heating element 5 can be quickly taken away by the cooling medium while ensuring the cooling medium flow rate, thereby improving the heat dissipation efficiency and improving the working performance of the server. The pumping part 7 can be a circulating pump, a magnetic pump, a centrifugal pump, etc., without limitation, as long as the circulating flow of the cooling medium can be guaranteed. The setting position of the pumping part 7 is adaptively adjusted based on the layout of the pipeline 3 in the heat dissipation module, without limitation. In one embodiment of the present application, Figure 5 As shown, the pumping part 7 is arranged on the pipeline 3 near the second heat conducting part 2 .

[0065] Embodiment 2

[0066] The second aspect of the present application provides a server, comprising a first heating element 4, a second heating element 5 and the above-mentioned heat dissipation module, wherein the first heat-conducting part 1 of the heat-dissipating module is connected to the first heating element 4, the second heat-conducting part 2 of the heat-dissipating module is connected to the second heating element 5, and the second heat-conducting part 2 is connected to the first heat-conducting part 1 through a pipeline 3 so that a cooling medium flows to dissipate heat from the first heating element 4 and the second heating element 5.

[0067] Specifically, please refer to the first embodiment for the specific structure of the heat dissipation module, which will not be described in detail here.

[0068] The second aspect of the present application provides a server, including a first heating element 4, a second heating element 5 and the above-mentioned heat dissipation module, wherein the first heat-conducting part 1 of the heat-dissipating module is connected to the first heating element 4, the second heat-conducting part 2 of the heat-dissipating module is connected to the second heating element 5, and the second heat-conducting part 2 is connected to the first heat-conducting part 1 through a pipeline 3 so that the cooling medium flows to dissipate the heat of the first heating element 4 and the second heating element 5. The heat dissipation module in the server of the present application realizes the closed-loop flow of the cooling medium in the first heat-conducting part 1 and the second heat-conducting part 2 by setting the first heat-conducting part 1 and the second heat-conducting part 2 connected through the pipeline 3. Under the closed-loop flow, the cooling medium consumption is small, the pollution is small, and the heat dissipation can be stably conducted. In addition, the first heat-conducting part 1 and the second heat-conducting part 2 arranged near the first heating element 4 and the second heating element 5 make the required flow distance of the cooling medium short, the cooling medium flow path is simple and clear, the system flow resistance is effectively reduced, and the heat dissipation level is improved. The closed-loop cooling medium flow channel formed by the first heat conducting part 1, the second heat conducting part 2 and the pipeline 3 is easy to maintain, and the installation in the server is more flexible. The first heat conducting part 1 and the second heat conducting part 2 are used to dissipate heat for the first heating element 4 and the second heating element 5 at the same time, thereby realizing the integrated heat dissipation of the heat dissipation module and improving the overall heat dissipation efficiency of the server. Through the application of the present application, the integrated heat dissipation of the heat dissipation module is realized, which can improve the heat dissipation efficiency of the server, ensure the server's support for high-power heating elements, and improve the working performance of the server.

[0069] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0070] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A heat dissipation module, characterized in that: include: a first heat-conducting portion, the first heat-conducting portion being used to connect a first heating element; The second heat-conducting part is used to connect the second heating element. The second heat-conducting part is connected with the first heat-conducting part through a pipeline so that a cooling medium flows to dissipate heat for the first heating element and the second heating element.

2. The heat dissipation module according to claim 1, characterized in that: The first heat-conducting portion includes at least two heat-conducting components that are arranged in parallel and at intervals, and the opposite side surfaces of two adjacent heat-conducting components can at least partially contact the first heating element.

3. The heat dissipation module according to claim 2, characterized in that: The heat-conducting assembly comprises a first liquid-cooling plate and a heat-conducting pad which are stacked, wherein the first liquid-cooling plate has a liquid-cooling channel through which the cooling medium can flow, and the heat-conducting pads of two adjacent heat-conducting assemblies are arranged opposite to each other and can at least partially contact the first heating element; The thermally conductive pad is made of elastic thermally conductive material.

4. The heat dissipation module according to claim 3, characterized in that: The cross-sections of the first liquid cooling plate and the thermal pad are U-shaped, and a surface of one side of the first liquid cooling plate facing away from the thermal pad forms a heat dissipation space, and the heat dissipation space and a surface of the thermal pad facing away from the first liquid cooling plate are used for cold air to flow through to dissipate heat from the first heating element.

5. The heat dissipation module according to claim 4, characterized in that: The heat conduction assembly further includes a first heat dissipation fin, which is connected to a surface of the first liquid cooling plate on one side facing away from the heat conduction pad, and is used to dissipate heat from the first heating element through the cold air flowing through the heat dissipation space.

6. The heat dissipation module according to claim 2, characterized in that: The first heat conducting part further includes a first water separator and a second water separator, and the first water separator and the second water separator are respectively connected to two ends of the at least two heat conducting components.

7. The heat dissipation module according to claim 1, characterized in that: The second heat-conducting part includes a second liquid cooling plate, which is connected to the second heating element. The second liquid cooling plate is in communication with the first heat-conducting part through a pipeline, and the cooling medium can flow through the second liquid cooling plate to dissipate heat for the second heating element.

8. The heat dissipation module according to claim 7, characterized in that: Also includes: The second heat dissipation fins are arranged on a surface of the second liquid cooling plate away from the second heating element.

9. The heat dissipation module according to claim 1, characterized in that: Also includes: A pumping part is provided on the pipeline connecting the first heat conducting part and the second heat conducting part.

10. A server, characterized in that: include: a first heating element and a second heating element; The heat dissipation module according to any one of claims 1 to 9, wherein the first heat-conducting portion of the heat-dissipating module is connected to the first heating element, the second heat-conducting portion of the heat-dissipating module is connected to the second heating element, and the second heat-conducting portion is connected to the first heat-conducting portion through a pipeline to allow a cooling medium to flow to dissipate heat to the first heating element and the second heating element.

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