OGS binding positioning structure

Abstract

The utility model discloses an OGS binding positioning structure, which comprises a glass cover plate layer, a frame ink layer, a first shadow elimination layer, a binding pin layer and a second shadow elimination layer which are stacked in sequence, the second shadow elimination layer is provided with a windowing area so as to expose the binding pin layer, and the binding pin layer comprises a plurality of metal pins; an ultraviolet absorption layer is further arranged between the first shadow elimination layer and the binding pin layer in a stacked mode. According to the OGS binding positioning structure, the problem of ink color change of the frame ink layer located at the windowing position can be prevented.

Description

Technical Field

[0001] The utility model relates to a touch screen technology, in particular to an OGS binding position structure. Background Art

[0002] OGS (On Glass Sensor) is a type of touch screen that directly manufactures the touch sensor on the terminal cover. The binding position structure on the existing OGS touch screen includes a glass cover layer, a frame ink layer, a first shadow elimination layer, a binding pin layer and a second shadow elimination layer stacked in sequence, wherein the second shadow elimination layer needs to be windowed to expose the metal pins in the binding pin layer.

[0003] However, after the second shadow-eliminating layer is subjected to the window opening treatment, the frame ink layer at the window opening lacks the shielding of the second shadow-eliminating layer, while the first shadow-eliminating layer has a high transmittance to ultraviolet light. When conducting an ultraviolet light test on the OGS touch screen, the ultraviolet light passes through the first shadow-eliminating layer at the window opening and irradiates the frame ink layer, causing the frame ink layer to have ink discoloration problems at the window opening, affecting the consistency of the product appearance. Utility Model Content

[0004] In order to solve the above-mentioned deficiencies of the prior art, the utility model provides an OGS binding position structure, which can prevent the ink layer of the frame located at the window from discoloring.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] An OGS binding position structure comprises a glass cover layer, a frame ink layer, a first shadow elimination layer, a binding pin layer and a second shadow elimination layer which are stacked in sequence, wherein the second shadow elimination layer is provided with a window area to expose the binding pin layer, and the binding pin layer comprises a plurality of metal pins; an ultraviolet absorption layer is also stacked between the first shadow elimination layer and the binding pin layer.

[0007] Furthermore, the ultraviolet absorption layer is an ITO layer, the ITO layer is provided with a plurality of first pin openings, each metal pin of the binding pin layer is located in a corresponding first pin opening, and a gap region is provided between each metal pin and the ITO layer.

[0008] Furthermore, the width of the gap area is 0.01 mm-0.05 mm.

[0009] Furthermore, a protective layer is stacked on the second shadow elimination layer, and the protective layer is provided with a plurality of second pin openings, and each metal pin of the binding pin layer is exposed from the corresponding second pin opening.

[0010] Furthermore, each metal pin has an overlapping area with the protection layer.

[0011] Furthermore, the width of the overlapping area is 0.01 mm-0.05 mm.

[0012] Furthermore, the ultraviolet absorption layer is an ITO layer, the ITO layer is provided with a plurality of first pin openings, each metal pin of the binding pin layer is located in a corresponding first pin opening, and a gap area is provided between each metal pin and the ITO layer; the protective layer is an insulating layer.

[0013] Furthermore, the insulating layer is filled in the gap area.

[0014] Furthermore, the edge spacing between the first pin opening and the corresponding second pin opening is 0.02 mm-0.10 mm.

[0015] Furthermore, the thickness of the protective layer is not greater than 1.8 μm.

[0016] The utility model has the following beneficial effects: the OGS binding position structure of the utility model adds the ultraviolet absorption layer between the first shadow elimination layer and the binding pin layer, so that the frame ink layer located in the window opening area is above the first shadow elimination layer, and the ultraviolet absorption layer is additionally added for shielding. The ultraviolet absorption layer has a high absorption rate for ultraviolet light, and can absorb ultraviolet light in the ultraviolet light test of the OGS touch screen, thereby preventing the ultraviolet light from causing the frame ink layer to have ink discoloration problems in the window opening area. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the stacking structure of the OGS binding bit structure provided by the utility model.

[0018] Figure 2 for Figure 1 The schematic diagram of the planar structure of the ultraviolet absorption layer, the binding pin layer and the second shadow elimination layer in the OGS binding site structure is shown.

[0019] Figure 3 A schematic diagram of the stacking structure of another OGS binding site structure provided by the utility model.

[0020] Figure 4 for Figure 2 The planar structure schematic diagram of the binding pin layer, the second shadow elimination layer and the protection layer in the OGS binding bit structure is shown. DETAILED DESCRIPTION

[0021] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Embodiment 1

[0026] like Figure 1 and 2 As shown, an OGS binding position structure includes a glass cover layer 1, a frame ink layer 2, a first shadow elimination layer 3, a binding pin layer 5 and a second shadow elimination layer 6 which are stacked in sequence, wherein the second shadow elimination layer 6 is provided with a window area 61 to expose the binding pin layer 5, and the binding pin layer 5 includes a plurality of metal pins 51; an ultraviolet absorption layer 4 is also stacked between the first shadow elimination layer 3 and the binding pin layer 5.

[0027] The OGS binding position structure of the utility model adds the ultraviolet absorption layer 4 between the first shadow elimination layer 3 and the binding pin layer 5, so that the frame ink layer 2 located at the window area 61 is above the first shadow elimination layer 3, and the ultraviolet absorption layer 4 is additionally added for shielding. The ultraviolet absorption layer 4 has a high absorption rate for ultraviolet light and can absorb ultraviolet light in the ultraviolet light test of the OGS touch screen, thereby preventing the ultraviolet light from causing the frame ink layer 2 to have ink discoloration problems in the window area 61.

[0028] In this embodiment, the ultraviolet absorption layer 4 is an ITO layer. Although the ITO layer is a transparent film layer, its absorption rate for ultraviolet light is relatively high and can reach more than 85%.

[0029] The ITO layer is provided with a plurality of first pin openings 41, and each metal pin 51 of the binding pin layer 5 is located in the corresponding first pin opening 41, and there is a gap area between each metal pin 51 and the ITO layer to avoid short circuit of each metal pin 51 due to contact with the ITO layer when the ITO layer is used as the ultraviolet absorption layer 4.

[0030] The OGS binding position structure of the present invention designs the ITO layer to be complementary to the binding pin layer 5, that is, the ITO layer is provided with the first pin opening window 41 at the position corresponding to each metal pin 51 to accommodate the corresponding metal pin 51, and is entirely covered at the non-pin position, so as to maximize the shielding range of the ITO layer on the frame ink layer 2 without causing a short circuit to each metal pin 51.

[0031] Preferably, the width D1 of the gap area is 0.01 mm-0.05 mm.

[0032] In this embodiment, the frame ink layer 2 is black ink, the first shadow eliminating layer 3 and the second shadow eliminating layer 6 are composite film layers of silicon nitride and silicon oxide, and the binding pin layer 5 is a composite film layer of molybdenum-aluminum-molybdenum.

[0033] Embodiment 2

[0034] As an optimization solution of the first embodiment, in this embodiment, if Figure 3 and 4 As shown, a protective layer 7 is further stacked on the second shadow elimination layer 6 , and the protective layer 7 is provided with a plurality of second pin openings 71 , and each metal pin 51 of the binding pin layer 5 is exposed from the corresponding second pin opening 71 .

[0035] The OGS binding structure of the present invention adds the protective layer 7 on the second shadow elimination layer 6 to protect the outermost surface thereof to prevent water vapor erosion and scratches by foreign objects, and exposes each metal pin 51 for binding through the multiple second pin opening windows 71.

[0036] There is an overlapping area between each metal pin 51 and the protection layer 7 to improve the protection effect of the metal pin 51.

[0037] Preferably, the width D2 of the overlapping area is 0.02 mm-0.05 mm.

[0038] When the ITO layer is used as the ultraviolet absorption layer 4, the protective layer 7 is an insulating layer to insulate the ITO layer from the outside to avoid short circuits caused by the pins on the FPC contacting the ITO layer when the FPC is bound.

[0039] Preferably, the insulating layer is filled in the gap area between each metal pin 51 and the ITO layer to enhance the insulating isolation effect on the ITO layer, and the edge spacing D3 between the first pin window 41 and the corresponding second pin window 71 is 0.01mm-0.05mm.

[0040] In this embodiment, the protective layer 7 is made of polyisoprene, and its thickness is not greater than 1.8 μm, so as to prevent the thickness from being increased and affecting the binding effect with the FPC.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. An OGS binding position structure, comprising a glass cover layer, a frame ink layer, a first shadow elimination layer, a binding pin layer and a second shadow elimination layer stacked in sequence, wherein the second shadow elimination layer is provided with a window area to expose the binding pin layer, and the binding pin layer comprises a plurality of metal pins; characterized in that: An ultraviolet absorption layer is further stacked between the first shadow elimination layer and the binding pin layer.

2. The OGS binding site structure according to claim 1, characterized in that: The ultraviolet absorption layer is an ITO layer, and the ITO layer is provided with a plurality of first pin openings. Each metal pin of the binding pin layer is located in a corresponding first pin opening, and a gap area is provided between each metal pin and the ITO layer.

3. The OGS binding site structure according to claim 2, characterized in that: The width of the gap area is 0.01mm-0.05mm.

4. The OGS binding site structure according to any one of claims 1 to 3, characterized in that: A protective layer is stacked on the second shadow elimination layer, and the protective layer is provided with a plurality of second pin openings, and each metal pin of the binding pin layer is exposed from the corresponding second pin opening.

5. The OGS binding site structure according to claim 4, characterized in that: There is an overlapping area between each metal pin and the protection layer.

6. The OGS binding site structure according to claim 5, characterized in that: The width of the overlapping area is 0.01 mm-0.05 mm.

7. The OGS binding site structure according to claim 4, characterized in that: The ultraviolet absorption layer is an ITO layer, the ITO layer is provided with a plurality of first pin openings, each metal pin of the binding pin layer is located in a corresponding first pin opening, and a gap region is provided between each metal pin and the ITO layer; the protective layer is an insulating layer.

8. The OGS binding site structure according to claim 7, characterized in that: The insulating layer is filled in the gap area.

9. The OGS binding site structure according to claim 7, characterized in that: The edge spacing between the first pin opening and the corresponding second pin opening is 0.02 mm-0.10 mm.

10. The OGS binding site structure according to claim 7, characterized in that: The thickness of the protective layer is no more than 1.8 μm.

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