Solid state disk and electronic equipment

Abstract

The utility model discloses a solid state disk and electronic equipment. The solid state disk comprises a main control chip, a storage part, a first heat dissipation assembly and a second heat dissipation assembly. The first heat dissipation assembly is in contact with the main control chip and dissipates heat of the main control chip. The second heat dissipation assembly is in contact with the storage part and is used for dissipating heat of the storage part; and the first heat dissipation assembly and the second heat dissipation assembly are separated from each other so as to isolate heat transfer between the main control chip and the storage part. Therefore, the first heat dissipation assembly and the second heat dissipation assembly are separated from each other to form a split type heat dissipation mode, heat generated by the main control chip cannot be transmitted to the storage part, the storage part cannot be overheated due to abnormal rising, the temperature of the storage part is reduced, and the performance of the solid state disk is improved. For example, speed limitation caused by overheating of the solid state disk is avoided.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to solid-state hard disks and electronic devices. Background Art

[0002] The solid state drive includes a main control chip, storage components (such as NAND flash memory particles) and a heat sink. The heat sink is integrally formed from aluminum profiles.

[0003] During the actual test reading and writing process, the temperature of the main control chip of the solid-state drive is much higher than that of the storage component. The temperature difference between the two does not affect each other in the bare disk state. Because the radiator is integrated, it will cover the main control chip and the storage component at the same time. In addition, the temperature of the main control chip is higher than that of the storage component. Therefore, after the radiator is installed, the temperature of the main control chip is transmitted to the storage component through the integrated radiator (the heat dissipation fins of the radiator are made of metal and are very heat-conductive), causing the temperature of the storage component to rise abnormally and overheat. Overheating of the storage component will cause speed limit, affecting the performance of the solid-state drive. Utility Model Content

[0004] The purpose of the present application is to disclose a solid state hard disk and an electronic device. The solid state hard disk can reduce or isolate the heat transfer between the main control chip and the storage component, reduce the temperature of the storage component, and improve the performance of the solid state hard disk.

[0005] In a first aspect, the present application discloses a solid state drive. The solid state drive comprises a main control chip, a storage component, a first heat dissipation component and a second heat dissipation component. The first heat dissipation component contacts the main control chip to dissipate heat from the main control chip. The second heat dissipation component contacts the storage component to dissipate heat from the storage component. The first heat dissipation component and the second heat dissipation component are separated from each other to isolate heat transfer between the main control chip and the storage component.

[0006] In some embodiments, the first heat dissipation assembly includes a first heat sink, the second heat dissipation assembly includes a second heat sink, and a through cavity is formed between the first heat sink and the second heat sink.

[0007] In some embodiments, the first heat sink includes a protrusion protruding toward the second heat sink.

[0008] In some embodiments, the orthographic projection of the first heat sink in a plane perpendicular to the main control chip is a right-angled trapezoid, the upper base of the right-angled trapezoid is the orthographic projection of the bottom surface of the first heat sink, and the bottom surface is used to contact the main control chip.

[0009] In some embodiments, the hypotenuse of the right-angled trapezoid is the orthographic projection of the inclined surface of the first heat sink, and the supplementary angle between the inclined surface and the bottom surface is a, and 0 degrees ≤ a ≤ 45 degrees.

[0010] In some embodiments, the first heat sink and the second heat sink are cut from an integrated heat sink to form the protrusion.

[0011] In some embodiments, the first heat dissipation component includes a first heat conductive member; the first heat sink contacts the main control chip through the first heat conductive member, and the second heat dissipation component includes a second heat conductive member; the second heat sink contacts the storage component through the second heat conductive member. The first heat conductive member and the second heat conductive member are separated from each other.

[0012] In some embodiments, the solid state drive includes a circuit board; the circuit board includes a first surface and a second surface opposite to each other, the main control chip and the storage component are both assembled on the first surface; the first heat dissipation component includes a first heat sink and a third heat conductor, and the second heat dissipation component includes a second heat sink and a fourth heat conductor; the first heat sink contacts the main control chip and the second heat sink contacts the storage component and are both located above the first surface. The third heat conductor and the fourth heat conductor are both in contact with the second surface and are separated from each other.

[0013] In some embodiments, the solid-state hard disk includes a bracket that supports the circuit board, the first heat dissipation component and the second heat dissipation component, and a groove is provided at the bottom of the bracket to separate the bottom of the bracket into independent first and second areas, and the third heat conductor is located in the first area; the fourth heat conductor is located in the second area.

[0014] In some embodiments, the first heat dissipation component includes a first heat sink for dissipating heat from the main control chip, and the second heat dissipation component includes a second heat sink for dissipating heat from the storage component. The first heat sink and the second heat sink are exposed as a whole in the circumference of the solid state drive.

[0015] In some embodiments, the solid-state hard disk includes a circuit board, a bracket and an upper cover, wherein: the main control chip and the storage component are assembled on the circuit board; along the thickness direction of the circuit board, the bracket is located below the circuit board, and is assembled with the first heat sink and the second heat sink in a first direction to support the circuit board, the first heat dissipation component and the second heat dissipation component; the upper cover is assembled with the first heat sink and the second heat sink in a second direction; the second direction is along the thickness direction of the circuit board, and the first direction is perpendicular to the second direction.

[0016] In a second aspect, the present application discloses an electronic device, which includes any of the aforementioned solid state hard disks.

[0017] For the solid-state drive and the electronic device, since the first heat dissipation component dissipates heat for the main control chip, and the second heat dissipation component dissipates heat for the storage component, and the first heat dissipation component and the second heat dissipation component are separated from each other to isolate the heat transfer between the main control chip and the storage component, the first heat dissipation component and the second heat dissipation component are separated from each other to form a split heat dissipation method, and the heat generated by the main control chip will not be transferred to the storage component, and will not cause the storage component to abnormally rise and overheat, thereby reducing the temperature of the storage component and improving the performance of the solid-state drive. For example, the solid-state drive will not cause speed limit due to overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional diagram of a solid state drive according to an embodiment of the present application;

[0019] Figure 2 yes Figure 1 A front view of a solid state drive is shown;

[0020] Figure 3 yes Figure 1 An exploded view of the solid state drive shown;

[0021] Figure 4 is a schematic diagram of the first radiator, the second radiator, the upper cover and the first fixing screw in a disassembled state;

[0022] Figure 5 yes Figure 1 The exploded view of the SSD shown is without the bracket;

[0023] Figure 6 It is a schematic diagram of a bracket, a third heat-conducting member, a fourth heat-conducting member, a circuit board, a main control chip and a storage component in a disassembled state. DETAILED DESCRIPTION

[0024] Here, the technical solutions in the embodiments (or "implementations") of the present application will be described clearly and completely in conjunction with the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0025] If there are terms involving directional indications or positional relationships in the embodiments of the present application (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indication or positional relationship will also change accordingly. In addition, the terms "first", "second", etc. involved in the embodiments of the present application are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance.

[0026] See also Figure 3 and Figure 5 Combined with Figure 1 , Figure 2 and Figure 4 , the present application discloses a solid-state hard disk. The solid-state hard disk includes a main control chip 1, a storage component 2, a first heat dissipation component and a second heat dissipation component. The storage component 2 is, for example, a NAND flash memory particle. In other embodiments, it can also be a DRAM, etc. The first heat dissipation component 3 is in contact with the main control chip 1 to dissipate heat from the main control chip 1. The contact can be direct contact or indirect contact through a first heat conductor 32 as described later. The second heat dissipation component 4 is in contact with the storage component 2 to dissipate heat from the storage component 2. The contact here can also be direct contact or indirect contact through a second heat conductor 42 as described later. The first heat dissipation component 3 and the second heat dissipation component 4 are separated from each other to isolate the heat transfer between the main control chip 1 and the storage component 2.

[0027] As set up above, since the first heat dissipation component 3 dissipates heat for the main control chip 1, and the second heat dissipation component 4 dissipates heat for the storage component 2, and the first heat dissipation component 3 and the second heat dissipation component 4 are separated from each other to isolate the heat transfer between the main control chip 1 and the storage component 2, the first heat dissipation component 3 and the second heat dissipation component 4 are separated from each other to form a split heat dissipation method, and the heat generated by the main control chip 1 will not be transferred to the storage component 2, and will not cause the storage component 2 to rise abnormally and overheat, thereby reducing the temperature of the storage component 2 (for example, in some tests, the temperature of the storage component 2 can be reduced from 83 degrees to 75 degrees. 83 degrees is the temperature of the storage component 2 when an integrated radiator is used), and the performance of the solid-state hard disk is improved. For example, the solid-state hard disk will not cause speed limit due to overheating.

[0028] See also Figure 3 , Figure 4 and Figure 5 Combined with Figure 1 and Figure 2The first heat dissipation component 3 includes a first heat sink 31. The second heat dissipation component 4 includes a second heat sink 41. A through cavity 40 is formed between the first heat sink 31 and the second heat sink 41. In this embodiment, the first heat sink 31 and the second heat sink 41 both include parallel and spaced heat dissipation fins, but are not limited to this structure, and can dissipate heat for the main control chip 1 and the storage component 2 accordingly.

[0029] As set up above, a through cavity 40 is formed between the first heat sink 31 and the second heat sink 41. The through cavity 40 prevents the first heat sink 31 and the second heat sink 41 from contacting each other. Therefore, on the one hand, the heat generated by the main control chip 1 will not be transferred to the storage component 2, which can prevent the storage component 2 from overheating due to abnormal temperature rise. Therefore, the temperature of the storage component 2 is reduced and the performance of the solid state drive is improved. On the other hand, wind can pass through the through cavity 40 to facilitate heat dissipation.

[0030] In some embodiments, the first heat sink 31 includes a protrusion 311 protruding toward the second heat sink 41. The protrusion 311 is located obliquely above the main control chip 1. Figure 3 , Figure 4 , Figure 5 , Figure 1 and Figure 2 In the embodiment, the protrusion 311 is a sharp corner, but according to the function of the protrusion 311 described later, the protrusion 311 is not limited to this.

[0031] As set up above, since the first heat sink 31 includes a protrusion 311 protruding toward the second heat sink 41, and the protrusion 311 is located obliquely above the main control chip 1, it can be understood that, when projected toward the main control chip 1, the contact area between the first heat sink 31 and the main control chip 1 includes not only the area of ​​the first heat sink 31 covering the main control chip 1, but also the area of ​​the protrusion 311, and the area of ​​the protrusion 311 is an increased area. Therefore, the above setting provides a larger heat dissipation area for the main control chip 1 when the first heat sink 31 has sufficient contact area with the main control chip 1, thereby achieving a better heat dissipation effect on the main control chip 1.

[0032] A configuration of the protrusion 311 is described below:

[0033] See also Figure 1 , Figure 2 , Figure 3 and Figure 4 Combined with Figure 5 , the orthographic projection of the first heat sink 31 in a plane perpendicular to the main control chip 1 (i.e., a vertical plane) is a right-angled trapezoid. Figure 4 and Figure 2The above projection can be understood by referring to the upper base 3121, lower base 3122, hypotenuse 3123 and right-angled side 3124 of the right-angled trapezoid. The upper base of the right-angled trapezoid is the positive projection of the bottom surface of the first heat sink 31, and the bottom surface is used to contact the main control chip 1. In this embodiment, the structure of the second heat sink 41 can be the structure shown in the figure, or it can be other structures, as long as it can form the through cavity 40.

[0034] As set up above, since the orthographic projection of the first heat sink 31 is a right-angled trapezoid, the corresponding surfaces such as the inclined surface and the top surface (the orthographic projection of the top surface is the lower base) of the first heat sink 31 form the protrusion 311. Therefore, the heat dissipation area (which can also be understood as the volume) of the first heat sink 31 is large, thereby achieving a good heat dissipation effect on the main control chip 1.

[0035] See also Figure 5 Combined with Figure 3 and Figure 4 The hypotenuse of the right-angled trapezoid is the orthographic projection of the inclined surface of the first heat sink. The complementary angle between the inclined surface and the bottom surface is a, 0 degrees < a ≤ 45 degrees, for example, 5 degrees, 8 degrees, 10 degrees, 12 degrees, 15 degrees, 18 degrees, 20 degrees, 23 degrees, 25 degrees, 28 degrees, 30 degrees, 33 degrees, 35 degrees, 38 degrees, 40 degrees, 42 degrees or 45 degrees.

[0036] As configured above, since 0 degrees < a ≤ 45 degrees, the heat dissipation area of ​​the first heat sink 31 is larger, and the heat dissipation effect on the main control chip 1 is good.

[0037] See also Figure 4 Combined with Figure 5 , Figure 3 , Figure 2 and Figure 1 , the first heat sink 31 and the second heat sink 41 are cut from an integrated heat sink to form the protrusion 311. In this embodiment, the first heat sink 31 and the second heat sink 41 are cut and arranged oppositely and at intervals, thereby forming the through cavity 40. However, the technicians can understand that based on the function of the through cavity 40, the configuration of the through cavity 40 is not limited to this, and it is sufficient to play the role. Correspondingly, in other embodiments, the protrusion 311 may not be formed by cutting the integrated heat sink.

[0038] As configured above, since the first radiator 31 and the second radiator 41 are formed by cutting an integrated radiator along the cut surface 312, combined with the first radiator 31 and the second radiator 41 being independent of each other, it is ensured that the first radiator 31 has a larger heat dissipation area and a better heat dissipation effect.

[0039] For cutting, the cutting surface may not be a straight inclined surface as shown in the figure, but may be a curved surface, etc. The cutting surface is a straight inclined surface, that is, when the orthographic projection of the first heat sink 31 is a right-angled trapezoid, and the first heat sink 31 and the second heat sink 41 are formed by cutting an integrated heat sink, the through cavity 40 is formed by the relative inclined surfaces, so the inclined surface will not block the flow of wind and is also conducive to heat dissipation.

[0040] See also Figure 3 , Figure 4 and Figure 5 The first heat dissipation component 3 includes a first heat conductive member 32. The first heat sink 31 contacts the main control chip 1 through the first heat conductive member 32. The second heat dissipation component 4 includes a second heat conductive member 42. The second heat sink 41 contacts the storage component 2 through the second heat conductive member 42. The first heat conductive member 32 and the second heat conductive member 42 are separated from each other.

[0041] As set up above, when the first heat sink 31 is in contact with the main control chip 1 through the first heat conductor 32, the first heat conductor 32 is located at the bottom of the first heat sink 31. Similarly, the second heat conductor 42 is located at the bottom of the second heat sink 41. In addition, the first heat conductor 32 and the second heat conductor 42 are separated from each other. In this way, heat transfer from the main control chip 1 to the storage component 2 can be avoided, and further, abnormal temperature rise and overheating of the storage component 2 can be avoided. Therefore, the temperature of the storage component 2 is reduced, and the performance of the solid-state hard disk is improved.

[0042] See also Figure 3 and Figure 6 , the solid state hard disk includes a circuit board 5. The circuit board 5 includes a first surface and a second surface opposite to each other. In the present application, the first surface is the front surface of the circuit board 5. The second surface is the back surface of the circuit board 5. The main control chip 1 and the storage component 2 are both assembled on the first surface of the circuit board 5 (in the present application, both are assembled on the front surface of the circuit board 5). The first heat dissipation component 3 includes a first heat sink 31 and a third heat conductor 33. The second heat dissipation component 4 includes a second heat sink 41 and a fourth heat conductor 43. The first heat sink 31 contacts the main control chip 1 and the second heat sink 41 contacts the storage component 2 and are both located above the first surface. The third heat conductor 33 and the fourth heat conductor 43 are both in contact with the second surface and are separated from each other. The third heat conductor 33 and the fourth heat conductor 43 are thermal pads in this embodiment, but their structures are not limited to this.

[0043] In the solid state drive, although the heat is mainly concentrated on the first side (front side) where the main control chip 1 and the storage component 2 are assembled, and the second side (such as the back side) generates less heat, the third heat conductor 33 and the fourth heat conductor 43 are separated from each other and respectively contacted with the second side of the circuit board 5, the effect of isolating heat transfer is enhanced.

[0044] Based on the role of the third heat conducting member 33 and the fourth heat conducting member 43 being separated from each other, there is no limit on how to separate them from each other, as long as no heat transfer occurs between the two. The separation method in the application is described as follows:

[0045] See also Figure 3 and Figure 6 The solid state hard disk includes a bracket 6 that supports the circuit board 5, the first heat dissipation component 3, and the second heat dissipation component 4. A groove 62 is provided at the bottom of the bracket 6 to separate the bracket 6 into an independent first area 63 and a second area 64. The third heat conducting member 33 is located in the first area 63. The fourth heat conducting member 43 is located in the second area 64.

[0046] As described above, the bracket 6 is divided into an independent first area 63 and a second area 64 by the groove 62, and the third heat conductor 33 is located in the first area 63, and the fourth heat conductor 43 is located in the second area 64. In this way, the structure for separating the third heat conductor 33 and the fourth heat conductor 43 is simple, and the assembly of the third heat conductor 33 and the fourth heat conductor 43 is also convenient.

[0047] See also Figure 1 and Figure 2 Combined with Figure 3 The first heat dissipation component 3 includes a first heat sink 31 for dissipating heat from the main control chip 1. The second heat dissipation component 4 includes a second heat sink 41 for dissipating heat from the storage component 2. The first heat sink 31 and the second heat sink 41 are exposed as a whole in the circumference of the solid state drive. As a whole, it means that the part corresponding to the circumference of the solid state drive is exposed. Because the first heat sink and the second heat sink are arranged relative to each other, the relative surfaces are not exposed from the circumference of the solid state drive.

[0048] As set up above, since the first heat sink 31 and the second heat sink 41 are exposed as a whole in the circumference of the solid state hard disk, the heat of the first heat sink 31 and the heat of the second heat sink 41 can also be dissipated outward from the circumference of the solid state hard disk, which is more convenient for heat dissipation, and the circumference is used for heat dissipation, so the heat dissipation effect is good.

[0049] See also Figure 3 , Figure 4 and Figure 5 Combined with Figure 1 and Figure 2The solid state drive comprises a circuit board 5, a bracket 6 and an upper cover 7. The main control chip 1 and the storage component 2 are assembled on the circuit board 5. Along the thickness direction of the circuit board 5, the bracket 6 is located below the circuit board 5 and is assembled with the first heat sink 31 and the second heat sink 41 in a first direction to carry the circuit board 5, the first heat sink component 3 and the second heat sink component 4. For more details, see Figure 3 , Figure 4 , Figure 1 and Figure 2 The bracket 6 is provided with a first connecting hole 65, the first radiator 31 and the second radiator 41 are respectively provided with second connecting holes 66, and the first connecting bolt 67 passes through the first connecting hole 65 and is connected to the second connecting hole 66, and then the bracket 6 is connected to the first radiator 31 and the second radiator 41.

[0050] The upper cover 7 is assembled with the first heat sink 31 and the second heat sink 41 in the second direction. Figure 3 , Figure 4 and Figure 5 , the first heat sink 31 and the second heat sink 41 are respectively provided with through holes 68 along the second direction, and the upper cover 7 is provided with a connecting column 71 with a screw hole. The second connecting bolt 69 passes through the through hole 68 and penetrates into the screw hole of the connecting column 71, thereby, the upper cover 7 is connected with the first heat sink 31 and the second heat sink 41 in the second direction. The second direction is along the thickness direction of the circuit board 5, which is a vertical direction in this embodiment. The first direction is perpendicular to the second direction, which is a horizontal direction in this embodiment.

[0051] As set above, the bracket is assembled with the first radiator 31 and the second radiator 41 in the first direction, and the upper cover 7 is assembled with the first radiator 31 and the second radiator 41 in the second direction, thereby realizing the assembly of the solid state drive, which is simple and convenient.

[0052] In a second aspect, the present application discloses an electronic device. The electronic device includes any of the aforementioned solid state hard disks. The electronic device is, for example, a desktop computer.

[0053] As configured above, the electronic device at least has the beneficial effects of the solid state hard disk, for example, the electronic device has a good heat dissipation effect.

[0054] It should be noted that the technical solutions or technical features described in the above embodiments can be combined or supplemented with each other without causing conflicts. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the drawings; all modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application should be included in the scope of protection of this application.

Claims

1. A solid state hard disk, characterized in that: The solid state hard disk comprises a main control chip, a storage component, a first heat dissipation component and a second heat dissipation component, wherein: The first heat dissipation component is in contact with the main control chip to dissipate heat for the main control chip; The second heat dissipation component is in contact with the storage component to dissipate heat from the storage component; the first heat dissipation component and the second heat dissipation component are separated from each other to isolate heat transfer between the main control chip and the storage component.

2. The solid state drive according to claim 1, wherein: The first heat dissipation component includes a first heat sink; the second heat dissipation component includes a second heat sink; and a through cavity is formed between the first heat sink and the second heat sink.

3. The solid state drive according to claim 2, wherein: The first heat sink includes a protrusion that protrudes toward the second heat sink.

4. The solid state drive according to claim 3, characterized in that: The orthographic projection of the first heat sink in a plane perpendicular to the main control chip is a right-angled trapezoid, the upper base of the right-angled trapezoid is the orthographic projection of the bottom surface of the first heat sink, and the bottom surface is used to contact the main control chip.

5. The solid state drive according to claim 4, characterized in that: The hypotenuse of the right-angled trapezoid is the orthographic projection of the inclined surface of the first heat sink, the supplementary angle between the inclined surface and the bottom surface is a, 0 degrees ≤ a ≤ 45 degrees; And / or, the first heat sink and the second heat sink are cut from an integrated heat sink to form the protruding portion.

6. The solid state drive according to claim 2, wherein: The first heat dissipation component includes a first heat conductive member, and the first heat sink is in contact with the main control chip through the first heat conductive member; The second heat dissipation assembly includes a second heat conductive member, and the second heat sink contacts the storage component through the second heat conductive member; The first heat conducting member and the second heat conducting member are separated from each other.

7. The solid state drive according to claim 1, wherein: The solid state drive comprises a circuit board; the circuit board comprises a first surface and a second surface opposite to each other, and the main control chip and the storage component are both assembled on the first surface; The first heat dissipation component includes a first heat sink and a third heat conducting member, and the second heat dissipation component includes a second heat sink and a fourth heat conducting member; the first heat sink contacts the main control chip and the second heat sink contacts the storage component and are both located above the first surface; The third heat conducting member and the fourth heat conducting member are both in contact with the second surface and are separated from each other.

8. The solid state drive according to claim 7, characterized in that: The solid state drive includes a bracket that supports the circuit board, the first heat dissipation component and the second heat dissipation component. A groove is provided at the bottom of the bracket to separate the bottom of the bracket into an independent first area and a second area. The third heat conductor is located in the first area; the fourth heat conductor is located in the second area.

9. The solid state drive according to claim 1, wherein: The first heat dissipation component includes a first heat sink for dissipating heat from the main control chip, and the second heat dissipation component includes a second heat sink for dissipating heat from the storage component, and the first heat sink and the second heat sink are exposed as a whole in the circumferential direction of the solid state drive; And / or, the solid state hard disk comprises a circuit board, a bracket and an upper cover, wherein: The main control chip and the storage component are assembled on the circuit board; The bracket is located below the circuit board along the thickness direction of the circuit board, and is assembled with the first heat sink and the second heat sink in a first direction to carry the circuit board, the first heat sink assembly and the second heat sink assembly; The upper cover is assembled with the first heat sink and the second heat sink in a second direction; the second direction is along the thickness direction of the circuit board, and the first direction is perpendicular to the second direction.

10. An electronic device, characterized in that: The electronic device comprises the solid state drive according to any one of claims 1 to 9.

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