Mixed parameter microstrip coupler structure

Abstract

The utility model discloses a mixed parameter microstrip coupler structure, which belongs to the technical field of couplers, and comprises a PCB (printed circuit board), the PCB is provided with a microstrip line, and the microstrip line consists of a first microstrip group and a second microstrip group which are distributed at an interval; the first micro-strip group is connected with a capacitor group arranged on the PCB, and the second micro-strip group is connected with a resistor group and a coupling adjusting capacitor which are arranged on the PCB; the PCB is provided with a plurality of fastening screws. The structure is simple, the power is large, the parts are small, the size is small, the cost is low, the frequency band is wide and parameters are adjustable; a microstrip line and a resistor-capacitor structure are adopted, and the coupling degree and the return loss can be adjusted at the same time.

Description

Technical Field

[0001] The utility model belongs to the technical field of couplers and relates to a novel high-power PDRX hybrid parameter microstrip coupler structure. Background Art

[0002] There are two types of existing PDRX (all-welded structure) couplers. One is a main rod and PCB parallel coupler, but it has the problems of large size and high cost. The other is a ceramic package coupler, which has a small size and fixed coupling value, but has low power, generally less than 200W, poor return loss consistency, and few application frequency bands and product types.

[0003] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. Utility Model Content

[0004] The utility model aims to provide a hybrid parameter microstrip coupler structure, optimize the existing coupler, take into account wide frequency band and small volume, and make it have the characteristics of high power and echo consistency.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] A hybrid parameter microstrip coupler structure includes a PCB, a microstrip line is arranged on the PCB, and the microstrip line consists of a first microstrip group and a second microstrip group distributed at intervals; the first microstrip group is connected to a capacitor group arranged on the PCB, and the second microstrip group is connected to a resistor group and a coupling adjustment capacitor arranged on the PCB; and a plurality of fastening screws are arranged on the PCB.

[0007] Furthermore, the first microstrip group has a U-shaped structure, including a first microstrip, a second microstrip and a third microstrip that are integrally connected, the first microstrip is an input microstrip, and the third microstrip is an output microstrip.

[0008] Furthermore, the capacitor group is arranged in the area surrounded by the first microstrip group, and includes a first capacitor connected to the first microstrip and a second capacitor connected to the third microstrip.

[0009] Further, the second microstrip group includes a first coupling microstrip, a second coupling microstrip and a third coupling microstrip; the resistor group includes a first resistor and a second resistor, the two pins of the first resistor are respectively connected to the first coupling microstrip and the second coupling microstrip, and the two pins of the second resistor are respectively connected to the second coupling microstrip and the third coupling microstrip.

[0010] Furthermore, the second coupling microstrip forms a first cavity and a second cavity on the PCB, the first coupling microstrip and the first resistor are distributed in the first cavity, and the third coupling microstrip and the second resistor are distributed in the second cavity.

[0011] Furthermore, the coupling adjustment capacitor is disposed at the second cavity and connected to the second coupling microstrip 32 .

[0012] Furthermore, the first microstrip group, the second microstrip group, the coupling adjustment capacitor, the resistor group and the capacitor group are combined into a mixed parameter coupler structure.

[0013] The above technical solution has the following beneficial effects: the hybrid parameter microstrip coupler of the utility model has a simple structure, high power, small parts, small size, low cost, wide bandwidth, and adjustable parameters; the microstrip line and resistor-capacitor structure are adopted, and the coupling degree and return loss can be adjusted at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0015] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0016] Figure 1 This is a structural schematic diagram provided by the utility model.

[0017] Figure 2 This is a structural schematic diagram provided by the utility model.

[0018] In the figure: 1-PCB; 11-first cavity; 12-second cavity; 2-first microstrip group; 21-first microstrip; 22-second microstrip; 23-third microstrip; 3-second microstrip group; 31-first coupling microstrip; 32-second coupling microstrip; 33-third coupling microstrip; 4-capacitor group; 41-first capacitor; 42-second capacitor; 5-resistor group; 51-first resistor; 52-second resistor; 6-fastening screw; 7-coupling adjustment capacitor. DETAILED DESCRIPTION

[0019] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Example

[0021] See also Figure 1-Figure 2 As shown, a hybrid parameter microstrip coupler structure includes a PCB1, on which a first microstrip group 2 and a second microstrip group 3 are fixedly mounted, and the first microstrip group 2 and the second microstrip group 3 are distributed with upper and lower gaps on the PCB1. A capacitor group 4 is fixedly mounted on the PCB1, a resistor group 5 is also fixedly mounted on the PCB1, and a plurality of fastening screws 6 are also provided on the PCB1, and the PCB1 is mounted in the shielding cavity through the fastening screws 6.

[0022] Specifically, the first microstrip group 2 is a U-shaped structure as a whole, including a first microstrip 21, a second microstrip 22, and a third microstrip 23 connected in an integral manner. The first microstrip 21 is an input microstrip, and the third microstrip 23 is an output microstrip, which is responsible for the power input and output ports at the TX end. A capacitor group 4 is arranged in the area enclosed by the first microstrip group 2, and the capacitor group 4 includes a first capacitor 41 and a second capacitor 42. The first capacitor 41 is connected to the first microstrip 21 and PCB1 at the same time, and the second capacitor 42 is connected to the third microstrip 23 and PCB1 at the same time. The first capacitor 41 and the second capacitor 42 are both microstrip capacitors, which are responsible for the echo adjustment of the TX port.

[0023] Specifically, the resistor group 5 includes a first resistor 51 and a second resistor 52, wherein the first resistor 51 is a coupling matching resistor responsible for 51 ohm load matching; the second resistor 52 is a coupling attenuation resistor responsible for adjusting the coupling degree.

[0024] The second microstrip group 3 includes a first coupling microstrip 31, a second coupling microstrip 32 and a third coupling microstrip 33, wherein the first coupling microstrip 31 is a coupling input microstrip, the second coupling microstrip 32 is a coupling matching microstrip, and the third coupling microstrip 33 is a coupling output microstrip. The two pins of the first resistor 51 are connected to the first coupling microstrip 31 and the second coupling microstrip 32 respectively, and the two pins of the second resistor 52 are connected to the second coupling microstrip 32 and the third coupling microstrip 33 respectively.

[0025] In this embodiment, the first microstrip 21 , the second microstrip 22 , the third microstrip 23 , the first coupling microstrip 31 , the second coupling microstrip 32 and the third coupling microstrip 33 are collectively referred to as microstrip lines.

[0026] In this embodiment, the second coupling microstrip 32 is distributed in an S shape and forms a first cavity 11 and a second cavity 12 on the PCB1. The first coupling microstrip 31 and the first resistor 51 are distributed in the first cavity 11, and the third coupling microstrip 33 and the second resistor 52 are distributed in the second cavity 12. A coupling adjustment capacitor 7 is also provided on the PCB1. The coupling adjustment capacitor 7 is installed at the second cavity 12 and connected to the second coupling microstrip 32. The coupling adjustment capacitor 7 in this embodiment is a microstrip capacitor, which is responsible for adjusting the echo adjustment of the coupling port.

[0027] In this embodiment, the first microstrip group 2, the second microstrip group 3, the coupling adjustment capacitor 7, the resistor group 5 and the capacitor group 4 are combined into a hybrid parameter coupler structure.

[0028] The hybrid parameter coupler composed of microstrip lines and microstrip capacitors in the utility model can adjust the coupling degree and return loss at the same time; it has the characteristics of wide frequency band and high power, and can realize coupling from low frequency to radio frequency band, meeting the power of more than 300W. The use of microstrip capacitors and microstrip hybrid parameters can realize low-end 600MH-3GHz coupling. Among them, the microstrip capacitors can be combined according to the actual parameters to flexibly adjust the return loss requirements. The first resistor and the second resistor can be combined according to the actual parameters to flexibly adjust the 10-40dB coupling degree requirements.

[0029] The utility model adopts PCB and microstrip capacitors to replace the cavity main rod and PCB combined parallel coupler, thereby solving the volume, weight and cost problems of the existing coupler.

[0030] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A hybrid parameter microstrip coupler structure, characterized in that: The invention comprises a PCB, wherein a microstrip line is arranged on the PCB, wherein the microstrip line consists of a first microstrip group and a second microstrip group distributed at intervals; the first microstrip group is connected to a capacitor group arranged on the PCB, and the second microstrip group is connected to a resistor group and a coupling adjustment capacitor arranged on the PCB; and a plurality of fastening screws are arranged on the PCB.

2. The hybrid parameter microstrip coupler structure according to claim 1, characterized in that: The first microstrip group is in a U-shaped structure, and includes a first microstrip, a second microstrip and a third microstrip that are integrally connected. The first microstrip is an input microstrip, and the third microstrip is an output microstrip.

3. The hybrid parameter microstrip coupler structure according to claim 2, characterized in that: The capacitor group is arranged in the area surrounded by the first microstrip group, and includes a first capacitor connected to the first microstrip and a second capacitor connected to the third microstrip.

4. The hybrid parameter microstrip coupler structure according to claim 1, characterized in that: The second microstrip group includes a first coupling microstrip, a second coupling microstrip and a third coupling microstrip; the resistor group includes a first resistor and a second resistor, the two pins of the first resistor are respectively connected to the first coupling microstrip and the second coupling microstrip, and the two pins of the second resistor are respectively connected to the second coupling microstrip and the third coupling microstrip.

5. The hybrid parameter microstrip coupler structure according to claim 4, characterized in that: The second coupling microstrip forms a first cavity and a second cavity on the PCB, the first coupling microstrip and the first resistor are distributed in the first cavity, and the third coupling microstrip and the second resistor are distributed in the second cavity.

6. The hybrid parameter microstrip coupler structure according to claim 5, characterized in that: The coupling adjustment capacitor is arranged at the second cavity and connected to the second coupling microstrip 32 .

7. The hybrid parameter microstrip coupler structure according to claim 1, characterized in that: The first microstrip group, the second microstrip group, the coupling adjustment capacitor, the resistor group and the capacitor group are combined into a mixed parameter coupler structure.

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