Heat dissipation FPC and backlight module

Abstract

According to the heat dissipation FPC and the backlight module, firstly, heat conduction glue is designed to be of a sandwich structure, namely, pure heat conduction glue is changed into a stacking structure of the heat conduction glue, a base body and the heat conduction glue, the base body is made of a heat conduction steel sheet, the heat conduction effect is guaranteed, meanwhile, the flatness of the FPC can be guaranteed through the base body, and therefore the good attaching effect of the FPC can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the field of display screens, and in particular to a heat dissipation FPC and a backlight module. Background Art

[0002] The LED light bar backlight FPC and the backlight iron frame are usually connected by FPC thermal adhesive to dissipate the heat generated by the LED light. However, if the thermal adhesive is not attached well, the heat cannot be dissipated in time, which may cause the NTC impedance to decrease, thereby affecting the client display effect. The client usually monitors the BLU temperature by monitoring the NTC impedance. Once the set threshold is exceeded, the module BLU will reduce the current, resulting in a decrease in the module brightness.

[0003] The prior art with publication number CN220357394U discloses a backlight structure that is easy to dissipate heat, including: a glue frame and an iron frame that are interlocked, an LED lamp for emitting light is arranged between the glue frame and the iron frame, a heat-conducting component for heat conduction and a heat-dissipating component for heat dissipation are arranged on the inner side of the iron frame facing the LED lamp, and the heat-conducting component and the heat-dissipating component are both in contact with the LED lamp. The heat-conducting component includes a first heat-conducting glue and a second heat-conducting glue, the first heat-conducting glue is located on the inner wall of the iron frame facing the LED lamp, the second heat-conducting glue is located below the LED lamp, and the second heat-conducting glue is connected to the inner bottom of the iron frame. The utility model provides a backlight structure that is easy to dissipate heat, which has good thermal conductivity by arranging the first heat-conducting glue, the second heat-conducting glue, and the first graphite film and the second graphite film, so that when the LED lamp generates heat during operation, the heat is promptly conducted to the iron frame for release, so as to avoid excessive heat accumulation of the LED lamp affecting its use.

[0004] However, due to the small size and softness of the backlight FPC, it is difficult to ensure flatness during attachment, which may result in some areas not being completely attached to the iron frame. At the same time, due to the existence of stress, the product may be at risk of degradation after a period of aging. Thermal conductive adhesives are generally made of acrylic materials. As the temperature rises, the molecular thermal motion becomes active and the viscosity decreases. The heat generated by the LED lamp beads cannot be dissipated through the backlight iron frame in time. It is necessary to improve the FPC heat dissipation adhesive and seek a better FPC heat dissipation method. Utility Model Content

[0005] In order to solve the deficiencies of the above-mentioned prior art, the utility model provides a heat dissipation FPC and a backlight module, by first designing the thermal conductive adhesive into a sandwich structure, that is, the pure thermal conductive adhesive is changed into a stacking structure of thermal conductive adhesive + substrate + thermal conductive adhesive, and the substrate is made of thermal conductive steel sheet. While ensuring the thermal conductive effect, the substrate can ensure the flatness of the FPC, thereby ensuring a good FPC attachment effect.

[0006] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0007] A heat dissipation FPC, comprising: an FPC, with an LED provided on the surface;

[0008] The thermal conductive adhesive is a sandwich structure with a thermal conductive steel sheet in the middle;

[0009] Backlight iron frame, the FPC is adhered to the backlight iron frame by means of thermal conductive adhesive;

[0010] As a preferred implementation of the heat dissipation FPC provided by the utility model, the thermal conductive adhesive is made of acrylic material.

[0011] As a preferred implementation of the heat dissipation FPC provided by the utility model, the thermally conductive adhesive includes a first thermally conductive adhesive and a second thermally conductive adhesive, and the thermally conductive steel sheet is arranged between the first thermally conductive adhesive and the second thermally conductive adhesive.

[0012] As a preferred implementation of the heat dissipation FPC provided by the utility model, the backlight iron frame includes a bottom iron frame, and a plurality of buckles are provided on the outer surface of the bottom iron frame.

[0013] As a preferred implementation of the heat dissipation FPC provided by the utility model, the buckle is trapezoidal, the long side of the trapezoid is in contact with the bottom iron frame, and the side of the trapezoid faces the back of the backlight iron frame.

[0014] As a preferred implementation of the heat dissipation FPC provided by the utility model, the LEDs are welded on the surface of the FPC in an array.

[0015] A backlight module also includes a glue frame, which is clamped with the backlight iron frame frame and partially wraps the backlight iron frame side frame.

[0016] As a preferred implementation of the backlight module provided by the utility model, the rubber frame is provided with a plurality of limit slots, and the slots correspond one-to-one with the buckles of the backlight iron frame.

[0017] As a preferred embodiment of the backlight module provided by the utility model, it also includes a reflective sheet, a light guide plate, an optical film group and a sponge. The reflective sheet is arranged on the upper surface of the backlight iron sheet, the light guide plate is arranged on the upper surface of the reflective sheet, and the side edge of the light guide plate is aligned with the LED; the optical film group is arranged on the upper surface of the light guide plate, and the sponge is arranged on the light emitting side of the optical film group.

[0018] As a preferred implementation of the backlight module provided by the utility model, the optical film set includes a diffusion film, a lower brightness enhancement film and an upper brightness enhancement film which are stacked in sequence.

[0019] The utility model has the following beneficial effects: a heat dissipation FPC, comprising: an FPC, with an LED on the surface; a thermally conductive adhesive, which is a sandwich structure, with a thermally conductive steel sheet in the middle; a backlight iron frame, the FPC is pasted to the backlight iron frame through the thermally conductive adhesive; the thermally conductive steel sheet is a steel sheet. The heat dissipation FPC uses a thermally conductive adhesive with a steel sheet as the base material to first attach the backlight FPC, and then attach it to the backlight iron frame. The steel sheet here plays a supporting role to ensure that the backlight FPC can be flatly attached to the backlight iron frame, ensuring that the FPC thermally conductive adhesive has a good attachment effect, and by designing the thermally conductive adhesive into a sandwich structure, that is, the pure thermally conductive adhesive is changed into a stacked structure of thermally conductive adhesive + substrate + thermally conductive adhesive, the thermally conductive steel sheet can ensure the thermal conductivity while the substrate can ensure the flatness of the FPC, so that a good attachment effect of the FPC can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic diagram of the heat dissipation FPC structure provided by the utility model;

[0022] Figure 2 A schematic diagram of the heat dissipation FPC stacking structure provided by the utility model;

[0023] Figure 3 This is a schematic diagram of the heat dissipation FPC thermal conductive adhesive structure provided by the utility model;

[0024] Figure 4 This is a schematic diagram of the backlight module structure provided by the utility model.

[0025] 1. FPC; 11. LED; 2. Thermal conductive adhesive; 21. First thermal conductive adhesive; 22. Thermal conductive steel sheet; 23. Second thermal conductive adhesive; 3. Backlight iron frame; 31. Bottom iron frame; 32. Buckle; 4. Reflector; 5. Sponge; 6. Optical film assembly; 61. Upper brightness enhancement film; 62. Lower brightness enhancement film; 63. Diffusion film; 7. Glue frame; 71. Card slot; 8. Light guide plate. DETAILED DESCRIPTION

[0026] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0030] like Figure 1-3 As shown, a heat dissipation FPC includes: FPC1, with LEDs provided on the surface;

[0031] The heat-conducting adhesive 2 is a sandwich structure with a heat-conducting steel sheet 22 in the middle;

[0032] Backlight iron frame 3, the FPC1 is adhered to the backlight iron frame by thermal conductive adhesive;

[0033] The thermally conductive adhesive 2 includes a first thermally conductive adhesive 21 and a second thermally conductive adhesive 23 , and the thermally conductive steel sheet 22 is disposed between the first thermally conductive adhesive 21 and the second thermally conductive adhesive 23 .

[0034] In the present application, a thermally conductive adhesive 2 with a steel sheet as a substrate is first attached to the backlight FPC1, and then attached to the backlight iron frame 3. The steel sheet here plays a supporting role to ensure that the backlight FPC1 can be flatly attached to the backlight iron frame 3, ensuring that the FPC1 thermally conductive adhesive 2 has a good attachment effect, and the thermally conductive adhesive 2 is designed to be a sandwich structure, that is, the pure thermally conductive adhesive is converted into a stacked structure of thermally conductive adhesive + substrate + thermally conductive adhesive. The thermally conductive steel sheet 22 is made of a thermally conductive material. While ensuring the thermal conductivity effect, the substrate can ensure the flatness of the FPC, thereby ensuring a good FPC attachment effect.

[0035] In this embodiment, the heat-conducting steel sheet 22 is a steel sheet. In this embodiment, the material of the heat-conducting steel sheet 22 is not particularly limited, and other materials with high hardness, good heat conductivity and thin thickness can also be selected.

[0036] Furthermore, if Figure 2 and Figure 3 As shown, the thermal conductive adhesive 2 is made of acrylic material, and the thermal conductive adhesive 2 includes a first thermal conductive adhesive 21 and a second thermal conductive adhesive 23 , and the thermal conductive steel sheet 22 is disposed between the first thermal conductive adhesive 21 and the second thermal conductive adhesive 23 .

[0037] The first thermally conductive adhesive 21 and the second thermally conductive adhesive 23 are both made of acrylic material, which has good thermal conductivity and adhesion properties. The thermally conductive steel sheet 22 is arranged between the first thermally conductive adhesive 21 and the second thermally conductive adhesive 23 to support and enhance the thermal conductivity. The thermally conductive adhesive 2 can be used in situations where the FPC heatsink and the backlight iron frame are in thermal contact, which can effectively improve the heat dissipation effect and thermal conductivity. At the same time, due to the use of acrylic material, the thermally conductive adhesive 2 has good high temperature resistance and chemical corrosion resistance, and can be used stably for a long time in harsh environments.

[0038] In another preferred implementation manner of this embodiment, the backlight iron frame 3 includes a bottom iron frame 31 , and a plurality of buckles 32 are disposed on the outer surface of the bottom iron frame 31 .

[0039] Furthermore, the buckle 32 is trapezoidal in shape, the long side of the trapezoid is in contact with the bottom iron frame 31 , and the side of the trapezoid faces the back of the backlight iron frame 3 .

[0040] In another preferred implementation of this embodiment, FPC (Flexible Printed Circuit) is a highly reliable and excellently flexible printed circuit board made of polyimide or polyester film as a substrate.

[0041] In another preferred implementation manner of this embodiment, the FPC1 has the characteristics of high wiring density, light weight, thin thickness and good bendability.

[0042] Furthermore, the LEDs 11 are welded to the surface of the FPC 1 in an array. Example

[0043] like Figure 4 As shown, the present application also provides a backlight module, which includes the heat dissipation FPC of the above embodiment, including: FPC1, with LEDs on the surface; thermal conductive adhesive 2, which is a sandwich structure with a thermal conductive steel sheet 22 in the middle; a backlight iron frame 3, the FPC1 is adhered to the backlight iron frame by thermal conductive adhesive; the thermal conductive steel sheet 22 is a steel sheet.

[0044] Furthermore, the backlight module also includes a plastic frame 7, which is clamped with the frame of the backlight iron frame 3 and partially wraps the side frame of the backlight iron frame 3.

[0045] The plastic frame 7 is provided with a plurality of limit slots 71 , and the slots 71 correspond to the backlight iron frame 3 in a one-to-one manner.

[0046] The combination of the plastic frame 7 and the backlight iron frame 3 can well fix the display screen and the backlight module. The plastic frame 7 is integrally injection molded to fix, support and protect the various components of the backlight assembly.

[0047] Furthermore, the backlight module also includes a reflective sheet 4, a light guide plate 8, an optical film group 6 and a sponge 5. The reflective sheet 4 is arranged on the upper surface of the backlight iron frame 3, the light guide plate 8 is arranged on the upper surface of the reflective sheet 4, and the side of the light guide plate 8 is aligned with the LED 11; the optical film group 6 is arranged on the upper surface of the light guide plate 8, and the sponge 5 is arranged on the light emitting side of the optical film group 6.

[0048] Furthermore, the optical film set 6 includes a diffusion film 63 , a lower brightness enhancement film 62 and an upper brightness enhancement film 61 which are sequentially stacked.

[0049] In this embodiment, the light guide plate 8 is located above the backlight iron frame 3, and is used to evenly transmit light to the surface of the entire backlight module; the diffusion film 63 is located above the light guide plate 8, and is used to diffuse light and enhance the backlight effect; the lower light enhancement film 62 and the upper light enhancement film 61 are located above the diffusion film 63, and are used to enhance the brightness of light and make the display effect clearer and brighter.

[0050] Furthermore, the thickness of the lower brightness enhancement film 62 and the upper brightness enhancement film 61 is 70-90 um. The brightness enhancement film is used to enhance the brightness of light and make the display effect clearer and brighter. In this embodiment, the thickness of the lower brightness enhancement film 62 and the upper brightness enhancement film 61 is preferably 80 um.

[0051] The utility model first attaches the thermal conductive adhesive 2 with a steel sheet as the base material to the backlight FPC1, and then attaches it to the backlight iron frame 3. The steel sheet here plays a supporting role to ensure that the backlight FPC1 can be attached to the backlight iron frame flatly, ensuring that the thermal conductive adhesive attachment effect of FPC1 is good. Example

[0052] The present application also provides a display device having a backlight module structure provided by the above utility model embodiment.

[0053] In this embodiment, the display device further includes a display screen (not shown in the figure), and the display screen is installed between the plastic frame 7 and the backlight iron frame 3.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the utility model rather than to limit them. Although the embodiments of the utility model are described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the embodiments of the utility model can still be modified or replaced by equivalents, and these modifications or equivalent replacements cannot cause the modified technical solutions to deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A heat dissipation FPC, characterized in that: include: FPC (1), with LEDs provided on the surface; The heat-conducting adhesive (2) is a sandwich structure with a heat-conducting steel sheet (22) in the middle; A backlight iron frame (3), wherein the FPC (1) is adhered to the backlight iron frame via a thermally conductive adhesive.

2. The heat dissipation FPC according to claim 1, characterized in that: The thermal conductive adhesive (2) is made of acrylic material.

3. The heat dissipation FPC according to claim 1 or 2, characterized in that: The thermally conductive adhesive (2) comprises a first thermally conductive adhesive (21) and a second thermally conductive adhesive (23), and the thermally conductive steel sheet (22) is arranged between the first thermally conductive adhesive (21) and the second thermally conductive adhesive (23).

4. The heat dissipation FPC according to claim 1, characterized in that: The backlight iron frame (3) comprises a bottom iron frame (31), and a plurality of buckles (32) are provided on the outer surface of the bottom iron frame (31).

5. The heat dissipation FPC according to claim 4, characterized in that: The buckle (32) is in the shape of a trapezoid, the long side of the trapezoid is in contact with the bottom iron frame (31), and the side of the trapezoid faces the back of the backlight iron frame (3).

6. The heat dissipation FPC according to claim 1, characterized in that: The LEDs (11) are welded in an array on the surface of the FPC (1).

7. A backlight module, characterized in that: It comprises the heat dissipation FPC as claimed in any one of claims 1 to 6, and also comprises a glue frame (7), wherein the glue frame (7) is snap-fitted to the frame of the backlight iron frame (3) and partially wraps the side frame of the backlight iron frame (3).

8. The backlight module according to claim 7, wherein: The rubber frame (7) is provided with a plurality of limit slots (71), and the slots (71) correspond one-to-one with the buckles (32) of the backlight iron frame (3).

9. The backlight module according to claim 7, wherein: It also comprises a reflective sheet (4), a light guide plate (8), an optical film group (6) and a sponge (5), wherein the reflective sheet (4) is arranged on the upper surface of the backlight iron frame (3), the light guide plate (8) is arranged on the upper surface of the reflective sheet (4), and the side edge of the light guide plate (8) is aligned with the LED (11); the optical film group (6) is arranged on the upper surface of the light guide plate (8), and the sponge (5) is arranged on the light emitting side of the optical film group (6).

10. The backlight module according to claim 9, wherein: The optical film set (6) comprises a diffusion film (63), a lower brightness enhancement film (62) and an upper brightness enhancement film (61) which are stacked in sequence.

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