SMT (Surface Mount Technology) packaging device

Abstract

The utility model discloses an SMT patch packaging device, which belongs to the technical field of SMT patch packaging and comprises a packaging machine, a packaging bin is arranged in the packaging machine, rotating plates are symmetrically arranged in the packaging bin, one side surface of each rotating plate is rotatably connected with the inner wall of the packaging bin through a rotating shaft, and electric telescopic rods are symmetrically and fixedly connected to the other side surface of each rotating plate. One end of the electric telescopic rod is fixedly connected with a transverse plate, one rotating shaft penetrates through the packaging machine to be fixedly connected with a gear, a driving assembly is arranged on the surface of one side of the gear, and the gear is sleeved with a protection box. The circuit board can be conveniently overturned in the process of packaging the SMT patch on the circuit board, so that one-side-by-side packaging of the SMT patch on the circuit board is avoided, the trouble and the packaging workload of workers are reduced, and meanwhile, the packaging efficiency of the circuit SMT patch is improved.

Description

Technical Field

[0001] The utility model relates to an SMT patch packaging device, belonging to the technical field of SMT patch packaging. Background Art

[0002] SMT is surface mount technology (surface mount technology), which is the most popular technology and process in the current electronic assembly industry. It is a circuit assembly technology that mounts pinless or short-lead surface mount components (abbreviated as SMC / SMD, called chip components in Chinese) on the surface of printed circuit boards or other substrates, and assembles them by soldering through reflow soldering or dip soldering.

[0003] SMT patches are small and are distributed on both sides of the circuit board. Therefore, when packaging the SMT patches, it is necessary to ensure the stability of the circuit board. If the circuit board is unstable, it is easy to cause the packaging point to be misaligned. The existing packaging device cannot adjust the circuit board when it is fixedly packaged on the circuit board. Therefore, when packaging the SMT patches on the circuit, the circuit board needs to be reversed, which increases the packaging trouble and packaging workload of the SMT patches, and also reduces the packaging efficiency of the SMT patches. Utility Model Content

[0004] The purpose of the utility model is to provide an SMT patch packaging device in order to solve the above-mentioned problem, which can facilitate the flipping of the circuit board during the SMT patch packaging process on the circuit board, thereby avoiding the packaging of the SMT patches on the circuit board one side at a time, reducing the trouble and packaging workload of the staff, and improving the efficiency of the circuit SMT patch packaging.

[0005] The utility model achieves the above-mentioned purpose through the following technical scheme: an SMT patch packaging device, including a packaging machine, a packaging bin is provided inside the packaging machine, and a rotating plate is symmetrically provided inside the packaging bin, one side surface of the rotating plate is rotatably connected to the inner wall of the packaging bin through a rotating shaft, and the other side surface of the rotating plate is symmetrically fixedly connected to an electric telescopic rod, one end of the electric telescopic rod is fixedly connected to a cross plate, one group of the rotating shafts passes through the packaging machine and is fixedly connected to a gear, and a driving component is provided on one side surface of the gear, and a protective box is provided on the outer side of the gear.

[0006] Preferably, the driving assembly includes a motor, and the motor is installed on the outside of the protection box, one end of the motor passes through the protection box and is fixedly connected to a half gear, and the side surface of the half gear is meshingly connected with the side surface of the gear.

[0007] Preferably, the inner surface of the transverse plate is fixedly connected to a bearing plate, and a support plate is fixedly installed above the bearing plate. A sliding rod is slidably connected inside the support plate, and a driving rod is provided at the upper end of the sliding rod, and the driving rod is hinged to the inner surface of the transverse plate.

[0008] Preferably, a spring is sleeved on the side surface of the slide rod, and the upper end of the spring is fixedly connected to the lower surface of the support plate, and the lower end of the spring is fixedly connected to the upper surface of the clamping plate.

[0009] Preferably, a welder is fixedly connected to the inner wall of the packaging bin, and a machine cover is provided above the welder. The machine cover is rotatably connected to the inner wall of the packaging bin, and an observation port is provided inside the machine cover.

[0010] The beneficial effect of the utility model is that the utility model can conveniently flip the circuit board during the SMT patch packaging on the circuit board through the cooperation of the rotating plate symmetrically arranged inside the packaging bin and the horizontal plate at one end of the electric telescopic rod fixedly connected to the surface of one side of the rotating plate, the gear inside the protection box and the driving component on one side of the gear, thereby avoiding the packaging of the SMT patches on the circuit board one side, reducing the trouble and packaging workload of the staff, and improving the efficiency of circuit SMT patch packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure of the utility model;

[0012] Figure 2 This is a schematic diagram of the internal structure of the protection box in the utility model;

[0013] Figure 3 for Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0014] In the figure: 1 packaging machine, 2 protection box, 3 motor, 4 electric telescopic rod, 5 horizontal plate, 6 machine cover, 7 observation port, 8 welding device, 9 rotating plate, 10 gear, 11 half gear, 12 driving rod, 13 supporting plate, 14 clamping plate, 15 bearing plate, 16 sliding rod, 17 spring, 18 packaging bin. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] See also Figure 1-3As shown, an SMT patch packaging device includes a packaging machine 1, wherein a packaging bin 18 is provided inside the packaging machine 1, and a rotating plate 9 is symmetrically provided inside the packaging bin 18, one side surface of the rotating plate 9 is rotatably connected to the inner wall of the packaging bin 18 through a rotating shaft, and the other side surface of the rotating plate 9 is symmetrically fixedly connected to an electric telescopic rod 4, one end of the electric telescopic rod 4 is fixedly connected to a cross plate 5, one set of the rotating shafts passes through the packaging machine 1 and is fixedly connected to a gear 10, and a driving assembly is provided on one side surface of the gear 10, and a protective box 2 is provided on the outer side of the gear 10.

[0017] As a technical optimization solution of the utility model, the driving assembly includes a motor 3, and the motor 3 is installed on the outside of the protective box 2. One end of the motor 3 passes through the protective box 2 and is fixedly connected with a half gear 11, and the side surface of the half gear 11 is meshed with the side surface of the gear 10, so that the driving gear 10 drives the rotating plate 9 to rotate, thereby facilitating the flipping of the circuit board.

[0018] As a technical optimization solution of the utility model, the inner surface of the horizontal plate 5 is fixedly connected with a carrier plate 15, and a support plate 13 is fixedly installed above the carrier plate 15. The inside of the support plate 13 is slidably connected with a slide rod 16, and the upper end of the slide rod 16 is provided with a driving rod 12. The driving rod 12 is hinged to the inner surface of the horizontal plate 5, which can clamp and fix the circuit board and improve the stability of the circuit board.

[0019] As a technical optimization solution of the utility model, a spring 17 is sleeved on the side surface of the sliding rod 16, and the upper end of the spring 17 is fixedly connected to the lower surface of the support plate 13, and the lower end of the spring 17 is fixedly connected to the upper surface of the clamping plate 14, which can pull the clamping plate 14 up when the driving rod 12 is loosened, thereby facilitating the removal of the circuit board.

[0020] As a technical optimization solution of the present invention, a welder 8 is fixedly connected to the inner wall of the packaging bin 18, and a machine cover 6 is provided above the welder 8. The machine cover 6 is rotatably connected to the inner wall of the packaging bin 18, and an observation port 7 is opened inside the machine cover 6.

[0021] When the utility model is in use, the machine cover 6 is first opened, and then the circuit board is placed on the upper surface of the carrier plate 15 inside the horizontal plate 5, and then the spacing of the horizontal plate 5 is adjusted according to the width of the circuit board, and then the sliding rod 16 is pushed by the rotating driving rod 12, so that the sliding rod 16 clamps and fixes the circuit board through the clamping plate 14, and after fixation, the machine cover 6 can be covered, and at this time, the welder 8 can be started to package the circuit board, and when the packaging of one side of the circuit board is completed, the motor 3 in the driving mechanism is started, and at this time, the motor 3 drives the gear 10 to rotate 180 degrees through the half gear 11, so the rotating plate 9 drives the horizontal plate 5 to rotate 180 degrees as well, so that the circuit board can be turned over, thereby reducing the workload of workers and improving the efficiency of edge sealing.

[0022] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A SMT patch packaging device, comprising a packaging machine (1), characterized in that: The packaging machine (1) is provided with a packaging bin (18) inside, and a rotating plate (9) is symmetrically provided inside the packaging bin (18), one side surface of the rotating plate (9) is rotatably connected to the inner wall of the packaging bin (18) via a rotating shaft, and the other side surface of the rotating plate (9) is symmetrically fixedly connected to an electric telescopic rod (4), one end of the electric telescopic rod (4) is fixedly connected to a transverse plate (5), one set of the rotating shafts passes through the packaging machine (1) and is fixedly connected to a gear (10), and a driving assembly is provided on one side surface of the gear (10), and a protective box (2) is provided on the outer side of the gear (10).

2. The SMT patch packaging device according to claim 1, characterized in that: The driving assembly comprises a motor (3), and the motor (3) is mounted on the outside of the protection box (2), one end of the motor (3) passes through the protection box (2) and is fixedly connected to a half gear (11), and the side surface of the half gear (11) is meshedly connected to the side surface of the gear (10).

3. The SMT patch packaging device according to claim 1, characterized in that: The inner surface of the transverse plate (5) is fixedly connected to a bearing plate (15), and a support plate (13) is fixedly installed above the bearing plate (15). A sliding rod (16) is slidably connected inside the support plate (13), and a driving rod (12) is provided at the upper end of the sliding rod (16). The driving rod (12) is hinged to the inner surface of the transverse plate (5).

4. The SMT patch packaging device according to claim 3, characterized in that: A spring (17) is sleeved on the side surface of the slide bar (16), and the upper end of the spring (17) is fixedly connected to the lower surface of the support plate (13), and the lower end of the spring (17) is fixedly connected to the upper surface of the clamping plate (14).

5. The SMT patch packaging device according to claim 1, characterized in that: A welder (8) is fixedly connected to the inner wall of the packaging bin (18), and a machine cover (6) is provided above the welder (8). The machine cover (6) is rotatably connected to the inner wall of the packaging bin (18), and an observation port (7) is provided inside the machine cover (6).

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