Module splicing and coupling structure

Abstract

The utility model belongs to the technical field of scintillator coupling, and relates to a module splicing and coupling structure. According to the utility model, the colloid with specific modulus is adopted, the design of the coupling structure is improved, and the colloid strengthening part and the communication part are formed at the splicing seam of the chip, so that the phenomenon that the colloid falls off at the splicing seam of the chip is improved, the imaging effect of the X-ray detector is greatly improved, and the service life of the X-ray detector is greatly prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of scintillator coupling, in particular to a module splicing and coupling structure. Background Art

[0002] Due to the wafer manufacturing process, the most common wafer diameter is 200mm, and the corresponding image sensor chip size is less than 150mm, and the photosensitive area of ​​the produced X-ray flat panel detector (referred to as the detector) is also less than 150mm. Therefore, if you want to get a detector with a larger imaging size, you need to splice multiple chips together, so there is the industry's CMOS image sensor chip (referred to as chip) splicing process.

[0003] After multiple chips are spliced ​​together, glue is needed to stick the scintillator on the chip surface. However, in the actual production process, it is found that the glue is prone to fall off at the chip joints, which seriously affects the imaging effect and product life of the X-ray detector product. Utility Model Content

[0004] The utility model aims to provide a module splicing and coupling structure which is not prone to debonding, in view of the problem of debonding occurring at chip splicing seams in the prior art.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows.

[0006] A module splicing and coupling structure includes a colloid and a scintillator and multiple chips coupled together by the colloid. A colloid reinforcement part is provided at the joints between the multiple chips along the side walls of the chips. The colloid reinforcement part is integrated with the colloid on the coupling surface between the scintillator and the chip, and gradually narrows from the coupling surface along the side walls of the chip.

[0007] Furthermore, the surface of the colloid reinforcement portion is a flat plane or an uneven curved surface.

[0008] Furthermore, the colloid reinforcement parts of the adjacent chip side walls are connected in the direction close to the coupling surface colloid to form a connecting part, and the height of the connecting part protruding from the coupling surface is 800 μm to 2000 μm.

[0009] Furthermore, the colloid reinforcement portion extends from the lowest point of the connecting portion toward the chip side wall by 10 μm to 50 μm.

[0010] Furthermore, the projection width of the colloid reinforcement part at the joint seam is less than half of the width of the joint seam and greater than one third of the width of the joint seam.

[0011] Furthermore, the modulus of the colloid is less than 2000 MPa.

[0012] Furthermore, the colloid is solidified by gradient solidification.

[0013] Furthermore, the colloid is solidified by curing at room temperature.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model adopts a colloid with a specific modulus and improves the design of the coupling structure to form a colloid reinforcement part and a connecting part at the chip joint seam, thereby improving the phenomenon of colloid shedding at the chip joint seam, thereby greatly improving the imaging effect and product life of the X-ray detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0017] Figure 1 This is a schematic diagram of the module splicing and coupling structure of Embodiment 1 of the present utility model;

[0018] Figure 2 This is a schematic diagram of the coupling structure details of Example 1 of the utility model.

[0019] Figure symbols: 1-scintillator, 2-colloid, 201-colloid strengthening part, 202-connecting part, 3-chip, 4-single substrate, 5-total substrate. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the utility model clearer, the utility model is further described in detail below in combination with the embodiments and drawings. The schematic implementation mode and description of the utility model are only used to explain the utility model and are not intended to limit the utility model. The various technical features in the utility model can be combined with each other to form different schemes, and various combinations also fall within the scope of protection of the utility model.

[0021] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. When an element is referred to as being "provided with" another element, it may be provided on the surface or inside of the element.

[0022] Due to the size limitation of the wafer itself, the imaging size of the X-ray detector is severely limited. Therefore, the industry has spliced ​​multiple chips into a large-size detector. Generally, there are two splicing processes. One is to directly use the chips to splice onto a substrate. This process has extremely high yield requirements. Once a problem occurs with one chip, the entire module composed of these chips will be scrapped, resulting in a huge waste of cost. Another process is to first paste a single chip onto a single substrate to form a single module, and then splice multiple single modules onto a total substrate. The advantage of this process is that the single module can be tested and screened, and the screened good products can be spliced ​​to ensure that the spliced ​​products are all good products. However, no matter which splicing method is used, it is necessary to use glue on the surface of the spliced ​​chip to couple the chip and the scintillator together. The type of glue and the curing method of the glue have an important impact on the reliability of the product. Improper selection will cause debonding at the splicing gap. In order to solve the problem of debonding at chip joints in the prior art, the utility model provides a module splicing and coupling structure that is not prone to debonding. By setting a colloid reinforcement part and a connecting part, the shrinkage stress of the colloid at sharp right angles and the stress at the joint of the colloid are reduced, and the pulling force of the colloid on the bonding surface caused by thermal expansion and contraction is resisted. The utility model is described in detail below through specific embodiments.

[0023] Example 1

[0024] The chip splicing method of this embodiment adopts the second splicing method mentioned above, that is, firstly a single chip is pasted onto a single substrate 4 to form a single module, and then multiple single modules are spliced ​​onto a total substrate 5.

[0025] This embodiment provides a module splicing and coupling structure, such as Figure 1 As shown, it includes a colloid 2 and a scintillator 1 and a plurality of chips coupled together by the colloid 2, and a colloid reinforcement part 201 is provided at the joints between the plurality of chips along the side wall of the chip, and the colloid reinforcement part 201 is integrated with the colloid 2 at the coupling surface between the scintillator 1 and the chip, and gradually narrows along the side wall of the chip from the coupling surface. Optionally, the colloid reinforcement part 201 is bonded to the side wall of the chip, and the bottom is integrated with the coupling surface, and the surface, i.e., the side exposed to the air, can be a flat plane or an uneven curved surface. The module splicing and coupling structure of this embodiment can be formed by a corresponding mold, and the molding surface of the mold matches the surface of the colloid reinforcement part 201 and / or the connecting part 202 of the module splicing and coupling structure of this embodiment.

[0026] In the traditional coupling structure, the colloid 2 and the chip are bonded together through a flat adhesive surface. During the use of the product, the colloid 2 expands and contracts due to the heat release and cooling cycle of the chip and the change of seasons in spring, summer, autumn and winter, causing the colloid 2 and the chip to shift at the bonding surface. Over time, the colloid 2 eventually falls off the bonding surface. The utility model uses the design of the colloid reinforcement part 201 to wrap the sharp right angles and chip boundaries of the chip at the splicing seam. The pulling force generated by the thermal expansion and contraction of the colloid 2 not only needs to overcome the colloid adhesion force of the chip and the scintillator 1 coupling surface, but also needs to overcome the adhesion force between the chip side wall and the colloid 2. Under the condition of unchanged use, the force that the colloid 2 needs to overcome due to thermal expansion and contraction increases, and it is naturally not easy to break free from the bondage of the adhesion force. In addition, the structure of the colloid reinforcement part 201 extending toward the chip side wall also makes the thermal expansion and contraction direction of the colloid 2 no longer limited to the shear force parallel to the coupling surface, but disperses this shear force to the vertical direction, that is, the shear force of the coupling surface is reduced, and the adhesive destructiveness to the coupling surface is also weakened, thereby improving or even avoiding the phenomenon of the colloid 2 falling off at the splicing seam.

[0027] The details of the module splicing and coupling mechanism of this embodiment are as follows Figure 2 As shown, specifically, in order to achieve a good wrapping effect, the colloid reinforcement part 201 described in this embodiment extends 10μm to 50μm toward the chip side wall along the lowest point of the connecting part 202. If the extension is too short, the ideal coating cannot be achieved, and the anti-falling effect will be greatly reduced. If the extension is too long, it will cause material waste. In addition, the colloid reinforcement parts 201 of the adjacent chip side walls are connected in the direction close to the coupling surface colloid 2 to form a connecting part 202, and the height of the connecting part 202 protruding from the coupling surface is 800μm to 2000μm. The connecting part 202 buffers the dispersion and transformation of the colloid stress of the coupling surface by the colloid reinforcement part 201, and also absorbs part of the pulling force from the coupling surface colloid 2, and absorbs part of the pulling force from the vertical direction of the colloid reinforcement part 201, and at the same time weakens the colloid stress on the coupling surface and the side wall of the chip 3, thereby further reducing the risk of debonding between the coupling surface and the side wall of the chip 3.

[0028] Furthermore, the present embodiment studies the width of the colloid reinforcement portion 201 , and the projection width of the colloid reinforcement portion 201 at the joint seam is less than half of the width of the joint seam and greater than one third of the width of the joint seam.

[0029] On the other hand, the modulus of the colloid 2 described in this embodiment is less than 2000 MPa. The modulus here is the modulus of the colloid 2 after curing. If the modulus of the colloid is too high, the debonding phenomenon will be more obvious. The modulus of the colloid 2 in this embodiment is less than 2000 MPa. A smaller modulus corresponds to a smaller stress and is less likely to fall off.

[0030] In addition to the colloid modulus, the curing method of colloid 2 in this embodiment can also further improve the debonding phenomenon at the joints. The colloid 2 described in this embodiment is cured by gradient curing. Specifically, segmented curing is adopted (after curing at room temperature for 4 hours, heating to 40°C*2 hours, and then heating to 60°C*1 hour). After curing, the product is placed in a high and low temperature box for high and low temperature cycle storage (-30-80, 10 cycles). After the experiment, the image was tested and there was no abnormality at the joint gap. Strengthen the experiment (-40-90, 10 cycles), and there was very little debonding in the joint gap.

[0031] In addition, it can also be cured at room temperature, for example, for 24 hours at room temperature. After curing, the product is placed in a high and low temperature box for high and low temperature cycle storage (-30-80, 10cycle). After the experiment, the image is tested and there is no abnormality at the splicing gap. Strengthen the experiment (-40-90, 10cycle), the splicing gap is still good and there is no abnormality.

[0032] The choice of glue has a lot to do with the size of the spliced ​​product. The product size of the above embodiment is 200*200mm, and the number of modules is 2 rows and 3 columns, a total of 6.

[0033] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0034] Finally, it should be pointed out that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit them. Although the utility model is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents, and these modifications or replacements, or different forms of combinations between the various features, do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the utility model.

Claims

1. A module splicing and coupling structure, characterized in that: It includes a colloid, a scintillator and a plurality of chips coupled together by the colloid, wherein a colloid reinforcing portion is provided at the joints between the plurality of chips along the side walls of the chips, the colloid reinforcing portion is integrated with the colloid at the coupling surface between the scintillator and the chip, and gradually narrows from the coupling surface along the side walls of the chip.

2. A module splicing and coupling structure according to claim 1, characterized in that: The surface of the colloid reinforcement portion is a flat plane or an uneven curved surface.

3. A module splicing and coupling structure according to claim 2, characterized in that: The colloid reinforcement parts of the adjacent chip side walls are connected in the direction close to the coupling surface colloid to form a connecting part, and the height of the connecting part protruding from the coupling surface is 800 μm to 2000 μm.

4. A module splicing and coupling structure according to claim 3, characterized in that: The colloid reinforcement portion extends 10 μm to 50 μm along the lowest point of the connecting portion toward the chip side wall.

5. A module splicing and coupling structure according to claim 4, characterized in that: The projection width of the colloid reinforcement part at the joint seam is less than half of the width of the joint seam and greater than one third of the width of the joint seam.

6. A module splicing and coupling structure according to any one of claims 1 to 5, characterized in that: The modulus of the colloid is less than 2000 MPa.

7. A module splicing and coupling structure according to claim 6, characterized in that: The colloid is solidified by gradient solidification.

8. The module splicing and coupling structure according to claim 6, characterized in that: The colloid is solidified by curing at room temperature.

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