Moulding matching plate, molding film covering plate and light-emitting device
By adjusting the distance and thickness difference of the light emitting chip on the molded mating plate, the problem of poor consistency of the fluorescent layer thickness is solved, and the luminous performance of the light emitting device is improved.
Patent Information
- Application Number
- CN202421305201.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-06-07
AI Technical Summary
The existing fluorescent layer molded on different light-emitting chips has poor consistency in the thickness of the fluorescent layer molded on different light-emitting chips, resulting in discrete distribution of the color coordinates of multiple light-emitting elements in the light-emitting device, affecting the luminescent performance.
By adjusting the absolute difference between the first distance and the first thickness on the light emitting chips of the different units to be coated in the molding mating plate, the absolute difference of the second distance is less than or equal to the preset difference value, thereby improving the thickness consistency of the fluorescent layer during the preparation of the molded film coating plate.
The absolute difference between the second distances of the light emitting chips of different units to be coated is reduced, so that the third surface thereof is close to coplanar, thereby improving the thickness consistency of the fluorescent layer in the molded film plate, and thus improving the luminous performance of the light emitting device.
Smart Images
Figure CN222786282U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of light-emitting elements, and in particular to a molded mating plate, a molded film-coated plate, and a light-emitting device. Background Art
[0002] A light-emitting device often includes multiple light-emitting elements, which often include a stacked packaging substrate, a die-bonding layer, a light-emitting chip, and a fluorescent layer, and the fluorescent layer is used to convert the light emitted by the light-emitting chip to form the light emitted by the light-emitting element. Multiple light-emitting elements in a light-emitting device are often prepared by cutting a molded film-covered board.
[0003] The molded laminate includes a plurality of light-emitting elements distributed in an array, and the package substrates of the light-emitting elements in the molded laminate are integrally formed to form a larger package total board. Cutting the molded laminate includes separating the package substrates in the area where each light-emitting chip is located to form a plurality of separately arranged light-emitting elements.
[0004] Generally, a molded coated board is prepared by combining a molded mating board with a prefabricated mold, wherein the molded mating board includes a plurality of units to be coated distributed in an array, and the units to be coated have the same structure as the light-emitting element when no fluorescent layer is set, and the prefabricated mold is used to mold the fluorescent layer on the light-emitting chips of different units to be coated.
[0005] The preparation method of molded laminated boards is often referred to as fluorescent layer molding. The fluorescent layers molded on different light-emitting chips by the existing fluorescent layer molding methods have poor thickness consistency, which in turn leads to poor thickness consistency of the fluorescent layers of multiple light-emitting elements in the corresponding light-emitting device, resulting in discrete distribution of color coordinates of different light-emitting elements, affecting the light-emitting performance of the light-emitting device.
[0006] Therefore, how to improve the consistency of the thickness of the fluorescent layers of different light-emitting elements to improve the light-emitting performance of the corresponding light-emitting device is a technical problem that those skilled in the art need to solve urgently. Utility Model Content
[0007] In view of this, in order to solve the above technical problems, the present application provides a molded matching plate, a molded film-covered plate and a light-emitting device. .
[0008] In order to solve the above technical problems, one of the technical solutions adopted in the present application provides a molded matching plate, which includes a plurality of units to be coated, and the units to be coated include a packaging substrate, a solid crystal layer and a light-emitting chip; a first surface is formed on one side of the packaging substrate, and the solid crystal layer and the light-emitting chip are sequentially stacked on the first surface; the packaging substrates of different units to be coated are integrally formed, and the light-emitting chips of adjacent units to be coated are arranged at intervals;
[0009] The light-emitting chip has a second surface facing the packaging substrate and a third surface away from the packaging substrate; the second surface has a first distance from the first surface, and the third surface has a second distance from the first surface; the second surface and the third surface of the light-emitting chip have a first thickness; any two light-emitting chips belonging to different units to be coated and whose absolute difference in first thickness is greater than a preset difference are respectively the first light-emitting chip and the second light-emitting chip; the absolute difference between the first distance of the first light-emitting chip and the first distance of the second light-emitting chip is matched with the absolute difference between the first thicknesses of the corresponding two light-emitting chips, so that the absolute difference between the second distances of the corresponding two light-emitting chips is less than or equal to the preset difference.
[0010] In order to solve the above technical problems, another technical solution adopted by the present application provides a molded film-covered board, which includes:
[0011] A molded matching plate, wherein the molded matching plate is the above-mentioned molded matching plate;
[0012] And fluorescent layers are respectively arranged on the third surface of the light-emitting chip of each unit to be coated on the molded matching plate; at least the unit to be coated and the corresponding fluorescent layer are combined into a light-emitting element; the fluorescent layer is used to convert the light emitted by the light-emitting chip to form the emitted light of the light-emitting element.
[0013] In order to solve the above technical problems, another technical solution adopted by the present application is to provide a light-emitting device, which includes a circuit substrate and a plurality of light-emitting elements, wherein the light-emitting elements include a packaging substrate, a solid crystal layer, a light-emitting chip and a fluorescent layer; the packaging substrate is arranged on the circuit substrate, and a first surface is formed on one side of the packaging substrate, and the solid crystal layer, the light-emitting chip and the fluorescent layer are sequentially stacked on the first surface; the packaging substrates of the plurality of light-emitting elements are separately arranged;
[0014] Among them, the light-emitting chip has a second surface facing the packaging substrate and a third surface away from the packaging substrate; there is a first distance between the second surface and the first surface; there is a second distance between the third surface and the first surface; there is a first thickness between the second surface and the third surface of the light-emitting chip; any two light-emitting chips belonging to different light-emitting elements and the absolute difference between the first thicknesses is greater than the preset difference are respectively the first light-emitting chip and the second light-emitting chip; the absolute difference between the first distance of the first light-emitting chip and the first distance of the second light-emitting chip is matched with the absolute difference between the first thicknesses of the corresponding two light-emitting chips, so that the absolute difference between the second distances of the corresponding two light-emitting chips is less than or equal to the preset difference.
[0015] Beneficial effect: Different from the prior art, in the technical solution of the present application, the absolute difference between the first distances of two light-emitting chips belonging to different units to be coated is combined with the absolute difference between the first thicknesses of the corresponding two light-emitting chips, so that the absolute difference between the second distances of the corresponding two light-emitting chips is less than or equal to the preset difference. In this way, the absolute difference between the second distances of any two light-emitting chips belonging to different units to be coated can be reduced, so that the third surfaces of the light-emitting chips of multiple different units to be coated are close to being coplanar. In this way, when the molded matching plate cooperates with the prefabricated mold to form the corresponding molded coated plate, the consistency of the thickness of the fluorescent layer formed on the third surfaces of different light-emitting chips is improved, that is, the consistency of the thickness of the fluorescent layer of the corresponding different light-emitting elements is improved, thereby improving the luminous performance of the corresponding light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a structural schematic diagram of a molded matching plate provided in step S110 in the method for preparing a molded film-covered plate in the prior art;
[0017] Figure 2 It is a structural schematic diagram of the prefabricated mold provided in step S110 in the method for preparing a molded film-covered laminate in the prior art;
[0018] Figure 3 It is a schematic diagram of an implementation of step S120 in the method for preparing a molded film-covered laminate in the prior art;
[0019] Figure 4 It is a schematic diagram of an implementation of step S130 in the method for preparing a molded film-covered laminate in the prior art;
[0020] Figure 5 It is a schematic structural diagram of a molded film-covered board prepared in step S140 in the method for preparing a molded film-covered board in the prior art;
[0021] Figure 6 It is a schematic diagram of the structure of the molded matching plate of the present application;
[0022] Figure 7 yes Figure 6 Dimensioning diagram of
[0023] Figure 8 It is a schematic diagram of the structure of the molded film-covered board of the present application;
[0024] Fig. 9 is a schematic structural diagram of the light-emitting device of the present application;
[0025] Fig.10 is a schematic structural diagram of a light-emitting element in the light-emitting device of the present application;
[0026] Fig.11 yes Fig.10 Dimensioning diagram.
[0027] Description of reference numerals:
[0028] 100, molded matching plate; 200, prefabricated mold; 110, unit to be coated; 111, package substrate; 112, solid crystal layer; 113, light-emitting chip; 114, package main board; 300, molded coated plate; 120, fluorescent layer; 130, light-emitting element; A1, first surface; A2, docking support surface; 200, prefabricated mold; 210, molding groove; 10, fluorescent glue;
[0029] 400, molded matching plate; 410, unit to be coated; 411, packaging substrate; 412, solid crystal layer; 413, light-emitting chip; 414, packaging total board; 500, molded coated plate; 420, fluorescent layer; 600, light-emitting device; 610, circuit substrate; 430, light-emitting element; B1, first surface; B2, second surface; B3, third surface; d1, first distance; d2, second distance; d3, first thickness; d4, thickness of fluorescent layer. DETAILED DESCRIPTION
[0030] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods. Based on the implementation methods in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0031] like Figures 1 to 5 As shown, the conventional method for preparing the molded film-covered board 300 usually utilizes a fluorescent layer molding method, and the preparation steps generally include steps S110 to S140.
[0032] like Figure 1 and Figure 2 As shown, step S110: providing a molding mating plate 100 and a prefabricated mold 200.
[0033] like Figure 1 As shown, the overmolding matching board 100 includes a plurality of units 110 to be coated, and the units 110 to be coated include a packaging substrate 111, a solid crystal layer 112, and a light-emitting chip 113. A first surface A1 is formed on one side of the packaging substrate 111, and the solid crystal layer 112 and the light-emitting chip 113 are sequentially stacked on the first surface A1. The packaging substrates 111 of different units 110 to be coated are integrally formed and combined into a packaging total board 114, and the light-emitting chips 113 of adjacent units 110 to be coated are arranged at intervals. Figure 2As shown, a docking support surface A2 and a plurality of molding grooves 210 spaced apart along the docking support surface A2 are formed on one side of the prefabricated mold 200 , and the molding grooves 210 extend from the docking support surface A2 into the prefabricated mold 200 .
[0034] Combination Figure 2 See also Figure 3 , step S120 : injecting fluorescent glue 10 into the mold 210 .
[0035] Combination Figure 1-Figure 3 See also Figure 4 Step S130: aligning and molding the molding mating plate 100 and the prefabricated mold 200. The aligning and molding includes supporting the first surface A1 on the docking support surface A2 and molding the fluorescent glue 10 onto the light emitting chip 113 to form a stacked structure with the light emitting chip 113.
[0036] contrast Figure 4 See also Figure 5 Step S140: separate the fluorescent glue 10 molded on the light-emitting chip 113 from the mold matching plate 100 from the prefabricated mold 200, and bake the fluorescent glue 10 separated from the prefabricated mold 200 to form a fluorescent layer 120.
[0037] In the molded film-laminated board 300 prepared through the above steps S110 to S140 , each unit to be laminated 110 is combined with the fluorescent layer 120 of the corresponding area to form a light-emitting element 130 , and the color coordinate distribution of the light-emitting element 130 is determined by the thickness of the fluorescent layer 120 .
[0038] The inventors have studied and found that in the molded laminated board 300 prepared by the above steps S110 to S140, since in the prefabricated mold 200 provided in step S110, the bottoms of multiple molding grooves 210 are nearly coplanar, and the thicknesses of the light-emitting chips 113 of different units 110 to be laminated are uneven, there are some units 110 to be laminated with a larger thickness of the light-emitting chips 113, and some units 110 to be laminated with a smaller thickness of the light-emitting chips 113, which will cause the thickness of the fluorescent layer 120 of different light-emitting elements 130 in the molded laminated board 300 to be uneven. In order to solve the above technical problems, the inventors of the present application propose the following embodiments.
[0039] like Figure 6 and Figure 7 As shown, the molded mating plate 400 of the present application includes a plurality of units 410 to be coated, and the units 410 to be coated include a packaging substrate 411, a solid crystal layer 412, and a light-emitting chip 413. A first surface B1 is formed on one side of the packaging substrate 411, and the solid crystal layer 412 and the light-emitting chip 413 are sequentially stacked on the first surface B1. The packaging substrates 411 of different units 410 to be coated are integrally formed and combined into a packaging total plate 414, and the light-emitting chips 413 of adjacent units 410 to be coated are arranged at intervals.
[0040] The light-emitting chip 413 has a second surface B2 facing the packaging substrate 411 and a third surface B3 facing away from the packaging substrate 411. There is a first distance d1 between the second surface B2 and the first surface B1, and there is a second distance d2 between the third surface B3 and the first surface B1. There is a first thickness d3 between the second surface B2 and the third surface B3 of the light-emitting chip 413. Any two light-emitting chips 413 belonging to different units 410 to be coated and whose absolute difference in first thickness d3 is greater than a preset difference are respectively a first light-emitting chip 413a and a second light-emitting chip 413b. The absolute difference between the first distance d1 of the first light-emitting chip 413a and the first distance d1 of the second light-emitting chip 413b is matched with the absolute difference between the first thickness d3 of the corresponding two light-emitting chips 413, so that the absolute difference between the second distance d2 of the corresponding two light-emitting chips 413 is less than or equal to the preset difference.
[0041] In the above manner, the absolute difference between the first distance d1 of two light-emitting chips 413 belonging to different units 410 to be coated is used to match the absolute difference between the first thickness d3 of the two corresponding light-emitting chips 413, so that the absolute difference between the second distance d2 of the two corresponding light-emitting chips 413 is less than or equal to the preset difference. In this way, the absolute difference between the second distance d2 of any two light-emitting chips 413 belonging to different units 410 to be coated can be reduced, so that the third surfaces B3 of the light-emitting chips 413 of multiple different units 410 to be coated are close to being coplanar. In this way, the molded mating plate 400 is formed in cooperation with the prefabricated mold as shown in FIG. Figure 8 When the molded film-covered plate 500 is used, the consistency of the thickness of the fluorescent layer 420 formed on the third surface B3 of different light-emitting chips 413 is improved, that is, the consistency of the thickness of the fluorescent layer 420 of the corresponding different light-emitting elements 430 is improved, so that Fig. 9 As shown, the light emitting performance of the corresponding light emitting device 600 is improved.
[0042] like Figure 6 and Figure 7 As shown, the first light emitting chip 413a is the one with the larger first thickness d3 among the corresponding two light emitting chips 413, and the second light emitting chip 413b is the one with the smaller first thickness d3 among the corresponding two light emitting chips 413. It should be understood that Figure 6 Only a pair of the first light emitting chip 413 a and the second light emitting chip 413 b is exemplarily shown.
[0043] like Figure 6 and Figure 7As shown, the preset difference is k, the first thickness d3 of the first light emitting chip 413a is a1, the first thickness d3 of the second light emitting chip 413b is a2, the first distance d1 of the first light emitting chip 413a is b1, the first distance d1 of the second light emitting chip 413b is b2, the absolute difference between the first thickness d3 of the first light emitting chip 413a and the first thickness d3 of the second light emitting chip 413b is c1, and the absolute difference between the first distance d1 of the first light emitting chip 413a and the first distance d1 of the second light emitting chip 413b is c2; then a1>a2, c1=a1-a2, c1>k, 0.5μm≤k≤3μm, b2>b1, c2=b2-b1, and c1-k≤c2≤c1+k. Optionally, k includes but is not limited to 0.5μm, 1μm, 1.5μm or 3μm.
[0044] In the above manner, abs() is recorded as an absolute value function, and the absolute difference between the second distance d2 of the first light-emitting chip 413a and the second distance d2 of the second light-emitting chip 413b is abs((a1+b1)-(a2+b2)). After conversion, the absolute difference between the second distance d2 of the first light-emitting chip 413a and the second distance d2 of the second light-emitting chip 413b is abs((a1-a2)-(b2-b1)), that is, abs(c1-c2). Since c1-k≤c2≤c1+k, abs(c1-c2)≤k can be obtained.
[0045] Alternatively, if Figure 6 As shown, the first light emitting chip 413a is at least partially embedded in the corresponding bonding layer 412. The second light emitting chip 413b is at least partially embedded in the corresponding bonding layer 412. The thickness of the portion of the first light emitting chip 413a embedded in the bonding layer 412 is greater than the thickness of the portion of the second light emitting chip 413b embedded in the bonding layer 412, so that b2>b1.
[0046] By the above method, the difference between the thickness of the first light emitting chip 413a embedded in the solid crystal layer 412 and the thickness of the second light emitting chip 413b embedded in the solid crystal layer 412 can be used to make b2>b1, so that c2 can cooperate with c1 to make abs(c1-c2)≤k.
[0047] In order to ensure that the thickness of the portion of the first light-emitting chip 413a embedded in the solid crystal layer is sufficient for c2 to match c1 so that abs(c1-c2)≤k, the thickness of the solid crystal layer can be greater than or equal to 17μm. Further, c1≤20μm, c2≤23μm. Optionally, the material of the solid crystal layer 412 includes conductive silver paste, but is not limited thereto.
[0048] Combination Figure 6-Figure 7 See also Figure 8The molded film-covered board 500 of the present application includes a molded matching board 400 and a fluorescent layer 420 .
[0049] The molded matching plate 400 is the molded matching plate 400 described above, which will not be described in detail. The fluorescent layer 420 is respectively disposed on the third surface B3 of the light emitting chip 413 of each unit to be coated 410 of the molded matching plate 400. At least the unit to be coated 410 and the corresponding fluorescent layer 420 are combined into a light emitting element 430. The fluorescent layer 420 is used to convert the light emitted by the light emitting chip 413 to form the emitted light of the light emitting element 430.
[0050] By the above method, the consistency of the thickness d4 of the fluorescent layer 420 of different light emitting elements 430 is improved, so that Fig. 9 The luminous performance of the corresponding luminous device 600 is improved.
[0051] Optionally, combined Figure 6-Figure 7 See also Figure 8 , the light emitting chip 413 is a blue light chip, the light emitted by the light emitting chip 413 is blue light, and the light emitted by the light emitting element 420 is white light. Based on this, a first example and a second example are proposed.
[0052] First example, combined Figure 6-Figure 7 See also Figure 8 The fluorescent layer 420 includes a yellow fluorescent layer, and the yellow fluorescent layer is used to convert blue light into white light output.
[0053] The second example combines Figure 6-Figure 7 See also Figure 8 The fluorescent layer 420 includes a stacked green fluorescent layer and a red fluorescent layer, which cooperate with each other to convert blue light into white light for emission.
[0054] See also Figure 9-11 As shown, the light-emitting device 600 of the present application includes a circuit substrate 610 and a plurality of light-emitting elements 430, and the light-emitting element 430 includes a packaging substrate 411, a solid crystal layer 412, a light-emitting chip 413 and a fluorescent layer 420. The packaging substrate 411 is arranged on the circuit substrate 610, and a first surface B1 is formed on one side of the packaging substrate 411, and the solid crystal layer 412, the light-emitting chip 413 and the fluorescent layer 420 are sequentially stacked on the first surface B1. The packaging substrates 411 of the plurality of light-emitting elements 430 are separately arranged.
[0055] The light-emitting chip 413 has a second surface B2 facing the package substrate 411 and a third surface B3 facing away from the package substrate 411. A first distance d1 is provided between the second surface B2 and the first surface B1. A second distance d2 is provided between the third surface B3 and the first surface B1. A first thickness d3 is provided between the second surface B2 and the third surface B3 of the light-emitting chip 413. Any two light-emitting chips 413 belonging to different light-emitting elements 430 and having an absolute difference between their first thicknesses d3 greater than a preset difference are respectively a first light-emitting chip 413a and a second light-emitting chip 413b. The absolute difference between the first distance d1 of the first light-emitting chip 413a and the first distance d1 of the second light-emitting chip 413b is matched with the absolute difference between the first thicknesses d3 of the corresponding two light-emitting chips 413, so that the absolute difference between the second distances d2 of the corresponding two light-emitting chips 413 is less than or equal to the preset difference.
[0056] By means of the above method, in the light-emitting device 600 , the consistency of the thickness d4 of the fluorescent layer 420 of different light-emitting elements 430 is improved, thereby improving the light-emitting performance of the light-emitting device 600 .
[0057] Optionally, the light emitting elements 430 in the light emitting device 600 can be obtained by cutting the molded film laminate 500 to separate the packaging substrate 411 in the area where each light emitting element 430 is located in the film laminate 500 .
[0058] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A molded matching plate, characterized in that: The molded matching plate includes a plurality of units to be coated, each of which includes a packaging substrate, a solid crystal layer and a light-emitting chip; a first surface is formed on one side of the packaging substrate, and the solid crystal layer and the light-emitting chip are sequentially stacked on the first surface; the packaging substrates of different units to be coated are integrally formed, and the light-emitting chips of adjacent units to be coated are arranged at intervals; The light emitting chip has a second surface facing the packaging substrate and a third surface facing away from the packaging substrate; There is a first distance between the second surface and the first surface, and there is a second distance between the third surface and the first surface; there is a first thickness between the second surface and the third surface of the light-emitting chip; any two light-emitting chips belonging to different units to be coated and whose absolute difference in the first thicknesses is greater than the preset difference are respectively the first light-emitting chip and the second light-emitting chip; the absolute difference between the first distance of the first light-emitting chip and the first distance of the second light-emitting chip is matched with the absolute difference between the first thicknesses of the corresponding two light-emitting chips, so that the absolute difference between the second distances of the corresponding two light-emitting chips is less than or equal to the preset difference.
2. The molded mating plate according to claim 1, characterized in that The first light-emitting chip is the one of the two corresponding light-emitting chips with a larger first thickness; the second light-emitting chip is the one of the two corresponding light-emitting chips with a smaller first thickness; Among them, the preset difference is k, the first thickness of the first light-emitting chip is a1, the first thickness of the second light-emitting chip is a2, the first distance of the first light-emitting chip is b1, the first distance of the second light-emitting chip is b2, the absolute difference between the first thickness of the first light-emitting chip and the first thickness of the second light-emitting chip is c1, and the absolute difference between the first distance of the first light-emitting chip and the first distance of the second light-emitting chip is c2; then a1>a2, c1=a1-a2, c1>k, 0.5μm≤k≤3μm, b2>b1, c2=b2-b1, and c1-k≤c2≤c1+k.
3. The molded mating plate according to claim 2, characterized in that The first light-emitting chip is at least partially embedded in the solid-crystal layer of the unit to be coated; the second light-emitting chip is at least partially embedded in the solid-crystal layer of the unit to be coated; The thickness of the portion where the first light emitting chip is embedded in the bonding layer is greater than the thickness of the portion where the second light emitting chip is embedded in the bonding layer, so that b2>b1.
4. The molded mating plate according to claim 3, characterized in that The thickness of the solid crystal layer is greater than or equal to 17 μm.
5. The molded mating plate according to claim 3, characterized in that c1≤20μm.
6. The molded mating plate according to claim 3, characterized in that c2≤23μm.
7. The molded mating plate according to claim 1, characterized in that The material of the solid crystal layer includes conductive silver paste.
8. A molded film-faced board, characterized in that: The molded film-faced board comprises: A molded matching plate, wherein the molded matching plate is the molded matching plate according to any one of claims 1 to 7; And a fluorescent layer is respectively arranged on the third surface of the light-emitting chip of each unit to be coated on the mold matching plate; at least the unit to be coated and the corresponding fluorescent layer are combined into a light-emitting element; the fluorescent layer is used to convert the light emitted by the light-emitting chip to form the emitted light of the light-emitting element.
9. The molded film-faced laminate according to claim 8, characterized in that: The light emitting chip is a blue light chip, the light emitted by the light emitting chip is blue light, and the light emitted by the light emitting element is white light; Among them, the fluorescent layer includes a yellow fluorescent layer, and the yellow fluorescent layer is used to convert the blue light to form the white light emission; or, the fluorescent layer includes a stacked green fluorescent layer and a red fluorescent layer, and the green fluorescent layer and the red fluorescent layer cooperate with each other to convert the blue light into the white light emission.
10. A light-emitting device, comprising a circuit substrate and a plurality of light-emitting elements, wherein the light-emitting elements comprise a packaging substrate, a solid crystal layer, a light-emitting chip and a fluorescent layer; the packaging substrate is disposed on the circuit substrate, and a first surface is formed on one side of the packaging substrate, and the solid crystal layer, the light-emitting chip and the fluorescent layer are sequentially stacked on the first surface; The packaging substrates of the plurality of light-emitting elements are separately arranged; in, The light emitting chip has a second surface facing the packaging substrate and a third surface facing away from the packaging substrate; There is a first distance between the second surface and the first surface; there is a second distance between the third surface and the first surface; there is a first thickness between the second surface and the third surface of the light-emitting chip; any two light-emitting chips belonging to different light-emitting elements and whose absolute difference in the first thickness is greater than the preset difference are respectively the first light-emitting chip and the second light-emitting chip; the absolute difference between the first distance of the first light-emitting chip and the first distance of the second light-emitting chip is matched with the absolute difference between the first thicknesses of the corresponding two light-emitting chips, so that the absolute difference between the second distances of the corresponding two light-emitting chips is less than or equal to the preset difference.