Display panel and display device

Abstract

The utility model discloses a display panel and a display device. The display panel comprises a substrate which comprises a display area and a frame area; the glass cover plate is positioned on one side of the substrate; the packaging substrate layer is located in a frame area between the substrate and the glass cover plate; the packaging layer is located in the frame area between the packaging substrate layer and the glass cover plate; the packaging layer comprises a first packaging part and a plurality of second packaging parts which are integrally arranged, the second packaging parts are located between the first packaging part and the display area, and the thickness of the first packaging part is larger than that of the second packaging parts. The acid resistance and alkali resistance of the display panel can be improved, and the application range of the display panel is widened.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] As the application fields of display panels continue to expand, in some application scenarios, the requirements for the acid resistance and alkali resistance of display panels are becoming increasingly higher.

[0003] At present, the packaging cover plate and the driving substrate of the display panel are usually packaged by the Frit packaging method. When the display panel formed by the Frit packaging method is tested for acid and alkali resistance, the metal of the wiring layer will be corroded by the acidic or alkaline environment, resulting in color deficiency on the screen of the display panel. The packaging method of the display panel in the prior art will result in low acid and alkali resistance of the display panel, which is not conducive to the application of the display panel in special environments. Utility Model Content

[0004] The utility model provides a display panel and a display device, so as to improve the acid resistance and alkali resistance of the display panel and expand the application range of the display panel.

[0005] In a first aspect, an embodiment of the utility model provides a display panel, comprising:

[0006] A substrate, comprising a display area and a frame area;

[0007] A glass cover plate, located on one side of the substrate;

[0008] A packaging base layer, located in the frame area between the substrate and the glass cover;

[0009] The encapsulation layer is located in the frame area between the encapsulation base layer and the glass cover plate; the encapsulation layer includes a first encapsulation part and a second encapsulation part which are integrally arranged, the second encapsulation part is located between the first encapsulation part and the display area, and the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part.

[0010] Furthermore, the packaging base layer includes a wiring layer; the vertical projection of the second packaging part on the substrate overlaps with the vertical projection of the wiring layer on the substrate, and the vertical projection of the first packaging part on the substrate does not overlap with the vertical projection of the wiring layer on the substrate.

[0011] Furthermore, the cross-sectional shape of the encapsulation layer includes an L-shape.

[0012] Furthermore, along a vertical direction from the frame area to the display area, a width of the first packaging portion is 1 um to 500 um.

[0013] Furthermore, the encapsulation layer is a glass Frit encapsulation layer.

[0014] Furthermore, the package base layer also includes a reflective metal layer, and the reflective metal layer is located between the wiring layer and the substrate.

[0015] Furthermore, the package base layer further includes a first inorganic layer and an organic layer, and the organic layer and the first inorganic layer are both located between the wiring layer and the substrate.

[0016] Furthermore, the packaging substrate layer also includes a second inorganic layer, and the second inorganic layer is located between the routing layer and the packaging layer.

[0017] Furthermore, the second inorganic layer includes a first inorganic part and a second inorganic part that are integrally arranged, the vertical projection of the second inorganic part on the substrate overlaps with the vertical projection of the routing layer on the substrate, and the vertical projection of the first inorganic part on the substrate overlaps with the vertical projection of the first packaging part on the substrate.

[0018] In a second aspect, an embodiment of the present utility model further provides a display device, comprising the display panel described in any embodiment of the present utility model.

[0019] The utility model provides a display panel and a display device. The display panel includes a substrate and a glass cover plate. The packaging base layer is located in a frame area between the substrate and the glass cover plate. The packaging layer is located in a frame area between the packaging base layer and the glass cover plate. The packaging layer includes a first packaging part and a second packaging part that are integrally arranged. The second packaging part is located between the first packaging part and the display area. By setting the thickness of the first packaging part to be greater than the thickness of the second packaging part, the area where the packaging base layer contacts the outside world is reduced, so that the first packaging part can block the corrosion of the packaging base layer by external acidic or alkaline liquids, thereby improving the acid resistance and alkali resistance of the display panel and enhancing the application range of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic structural diagram of a packaging structure of a display panel in the prior art provided by an embodiment of the utility model.

[0021] Figure 2 A schematic structural diagram of a display panel provided in an embodiment of the utility model.

[0022] Figure 3 A schematic structural diagram of a display device provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0024] Figure 1 A schematic diagram of a packaging structure of a display panel in the prior art provided by an embodiment of the utility model is shown in FIG. Figure 1 As shown, in the prior art, the Frit packaging method is used between the cover plate 20 and the driving substrate 30 of the display panel, and one side of the driving substrate 30 is the substrate 10. The Frit packaging method will cause the wiring metal layer 31 in the driving substrate 30 to extend to the frame area of ​​the display panel, resulting in the wiring metal layer 31 in the driving substrate 30 being directly exposed to the outer area of ​​the Frit packaging layer 40. When the display panel formed by the Frit packaging method is tested for acid resistance and alkali resistance, the metal of the wiring metal layer 31 will be corroded by the acidic or alkaline environment, resulting in color deficiency on the screen of the display panel. Therefore, the packaging method of the display panel in the prior art will result in low acid resistance and alkali resistance of the display panel, and a narrow application range. In order to solve the above technical problems, the embodiment of the utility model provides a display panel to improve the acid resistance and alkali resistance of the display panel and enhance the application range of the display panel.

[0025] Figure 2 A schematic diagram of a display panel provided by an embodiment of the utility model, referring to Figure 2 The display panel includes: a substrate 110, including a display area AA and a frame area AB; a glass cover plate 120, located on one side of the substrate 110; a packaging base layer 130, located in the frame area AB between the substrate 110 and the glass cover plate 120; an encapsulation layer 140, located in the frame area AB between the packaging base layer 130 and the glass cover plate 120; the encapsulation layer 140 includes a first encapsulation part 1401 and a second encapsulation part 1402 that are integrally arranged, the second encapsulation part 1402 is located between the first encapsulation part 1401 and the display area AA, and the thickness of the first encapsulation part 1401 is greater than the thickness of the second encapsulation part 1402.

[0026] Among them, the packaging substrate layer 130 is provided with wiring, which is usually formed by metal titanium TI and aluminum AL. When the wiring contacts the acidic or alkaline environment outside the display panel, the metal aluminum AL in the wiring will be corroded, resulting in color loss on the screen of the display panel. The packaging layer 140 can be an inorganic material with water and oxygen blocking effect and strong acid and alkali resistance.

[0027] Specifically, refer to Figure 2In the frame area AB, the first packaging part 1401 and the second packaging part 1402 are integrally arranged, and the thickness of the first packaging part 1401 is greater than the thickness of the second packaging part 1402. Therefore, the thickness of the packaging substrate layer 130 on the side away from the display area AA is less than the thickness of the packaging substrate layer 130 on the side close to the display area AA, thereby reducing the contact area between the packaging substrate layer 130 and the external environment. The thicker thickness of the first packaging part 1401 can prevent external acidic or alkaline liquids from contacting a larger area of ​​the packaging substrate layer 130, thereby reducing the corrosion of the acidic or alkaline liquid on the metal aluminum AL in the routing of the packaging substrate layer 130, thereby improving the acid and alkali resistance of the display panel, allowing the display panel to be used in an acidic or alkaline environment, thereby improving the application range of the display panel.

[0028] The utility model embodiment provides a display panel, including a substrate and a glass cover plate, wherein a packaging base layer is located in a frame area between the substrate and the glass cover plate, and a packaging layer is located in a frame area between the packaging base layer and the glass cover plate, and the packaging layer includes a first packaging part and a second packaging part which are integrally arranged, and the second packaging part is located between the first packaging part and the display area. By setting the thickness of the first packaging part to be greater than the thickness of the second packaging part, the area where the packaging base layer contacts the outside world is reduced, so that the first packaging part can block the corrosion of the packaging base layer by external acidic or alkaline liquids, thereby improving the acid and alkali resistance of the display panel and enhancing the application range of the display panel.

[0029] For further information, please refer to Figure 2 , the packaging base layer 130 includes a wiring layer 1302; the vertical projection of the second packaging part 1402 on the substrate 110 overlaps with the vertical projection of the wiring layer 1302 on the substrate 110, and the vertical projection of the first packaging part 1401 on the substrate 110 does not overlap with the vertical projection of the wiring layer 1302 on the substrate 110.

[0030] Specifically, the wiring layer 1302 includes metal aluminum AL and metal titanium TI. Figure 1 In the wiring metal layer 31 of the prior art shown, the wiring layer 1302 is retracted relative to the packaging layer 140 to prevent the wiring layer 1302 from being directly exposed to the outside, so that the vertical projection of the second packaging part 1402 on the substrate 110 overlaps with the vertical projection of the wiring layer 1302 on the substrate 110, and the vertical projection of the first packaging part 1401 on the substrate 110 does not overlap with the vertical projection of the wiring layer 1302 on the substrate 110, that is, the first packaging part 1401 and the second packaging part 1402 wrap the wiring layer 1302, avoiding direct contact between the wiring layer 1302 and the external environment, and avoiding chemical reaction between the metal aluminum AL in the wiring layer 1302 and the acid and alkali solutions, thereby improving the acid and alkali resistance of the display panel.

[0031] Optionally, the inward shrinkage length of the routing layer 1302 relative to the packaging layer 140 is 1 um to 500 um, which can prevent the routing layer 1302 from contacting the outside, thereby improving the acid resistance and alkali resistance of the routing layer 1302 .

[0032] For further information, please refer to Figure 2 , the cross-sectional shape of the encapsulation layer 140 includes an L-shape.

[0033] Specifically, the thickness of the first packaging part 1401 is greater than the thickness of the second packaging part 1402, so that the cross-sectional shape of the packaging layer 140 is L-shaped, and the packaging layer 140 forms a wrap around the routing layer 1302 in the packaging base layer 130, which can improve the corrosion resistance of the routing layer 1302.

[0034] It should be noted that the organic light emitting diodes in the display area AA are very sensitive to air and water vapor, and usually need to be used as shown in the following example. Figure 1 The Frit packaging method shown packages the driving substrate 30 and the cover plate 20 of the organic light emitting diode together, so that the organic light emitting diode is located in the closed display area AA, which will result in a limited thickness of the Frit packaging layer 40, and oxygen and water vapor in the external air can penetrate into the display area AA through the Frit packaging layer 40, so that the electrical performance of the organic light emitting diode in the display area AA is degraded. In addition, in order to improve the sealing effect of the packaging structure, it is usually necessary to increase the width of the Frit packaging layer 40 in the prior art. However, the increase in the width of the Frit packaging layer 40 is obviously not conducive to narrow frame lighting. For this reason, in the implementation of the present invention, in this embodiment, the cross-sectional figure of the packaging layer 140 is L-shaped, so that the thickness of the first packaging part 1401 located at the edge of the frame area AB is thicker, so that the thickness of part of the packaging layer 140 can be increased without changing the width of the packaging layer 140, so that the sealing of the display area AA can be improved, and the external water vapor can be prevented from entering the display area AA, resulting in a decrease in the display performance of the display panel.

[0035] For further information, please refer to Figure 2 , along the vertical direction from the frame area AB to the display area AA, the width of the first packaging part 1401 is 1um to 500um.

[0036] Specifically, along the vertical direction from the frame area AB to the display area AA, the width of the first packaging part 1401 is 1um to 500um. By setting the width of the first packaging part 1401 and making the routing layer 1302 shrink relative to the packaging layer 140, the first packaging part 1401 with a larger thickness occupies a larger proportion of the packaging layer 140, which can improve the acid and alkali resistance of the packaging layer 140 and make the routing layer 1302 less likely to come into contact with the external environment.

[0037] Optionally, the side surfaces of the first encapsulation part 1401 and the second encapsulation part 1402 are inclined relative to the side surfaces of the encapsulation base layer 130 , thereby improving the bonding force between the encapsulation layer 140 and the glass cover plate 120 .

[0038] Optionally, the encapsulation layer 140 is a glass Frit encapsulation layer.

[0039] Specifically, the glass Frit packaging layer can be formed by glass glue (Frit Seal), which is sintered by glass powder and adhesive. It can be coated on the glass and has excellent water and oxygen barrier properties after curing. The method of using glass glue for packaging is called Frit packaging. The glass Frit packaging layer has excellent water and oxygen barrier effects, so that the wiring layer 1302 can be blocked from contacting the acidic or alkaline environment outside the display panel, and the metal aluminum AL in the wiring layer 1302 can be prevented from being corroded, resulting in color loss on the display panel screen, thereby improving the acid and alkali resistance of the display panel. In addition, the glass Frit packaging layer can realize the packaging of OLED devices, has strong sealing properties, and simple processes, and can be widely used in mobile phones, tablet computers and other products.

[0040] In addition, the glass Frit packaging layer can be obtained by the following process: glass glue is made on the glass cover plate 120 by coating or screen printing process, the glass glue is solidified by high-temperature baking, the glass cover plate 120 and the packaging base layer 130 are bonded by glue coating and box forming process, and the glass glue is re-melted and solidified, thereby forming a glass Frit packaging layer with excellent water and oxygen blocking effect.

[0041] Optional, continue to refer to Figure 2 The package base layer 130 also includes a reflective metal layer ( Figure 2 The reflective metal layer is located between the wiring layer 1302 and the substrate 110 .

[0042] The encapsulation substrate layer 130 further includes a first inorganic layer and an organic layer ( Figure 2 (not shown in the figure), the organic layer and the first inorganic layer are both located between the wiring layer 1302 and the substrate 110.

[0043] Specifically, the reflective metal layer, the first inorganic layer and the organic layer are all located in the base layer 1303 between the wiring layer 1302 and the substrate 110, and the base layer 1303, the wiring layer 1302 and the second inorganic layer 1301 together form the encapsulation base layer 130. Among them, the material of the first inorganic layer is an inorganic material, which can be silicon oxide, silicon nitride, silicon oxynitride, etc. The first inorganic layer is located below the wiring layer 1302 and can isolate the wiring layer 1302; the organic layer is formed of an organic material, which can be polyimide, resin, etc., and can be arranged below the first inorganic layer to form an organic insulating layer, which can prevent oxygen and water vapor in the air from entering the display panel; the reflective metal layer is formed of a metal material, which can be used to reflect the light in the display area AA to improve the display brightness.

[0044] Optional, continue to refer to Figure 2 The packaging base layer 130 also includes a second inorganic layer 1301 , and the second inorganic layer 1301 is located between the routing layer 1302 and the packaging layer 140 .

[0045] Specifically, the second inorganic layer 1301 may be an inorganic insulating layer made of an inorganic material, so as to isolate the wiring layer 1302 from the packaging layer 140 .

[0046] For further information, please refer to Figure 2 The second inorganic layer 1301 includes a first inorganic part 1301a and a second inorganic part 1301b that are integrally arranged, the vertical projection of the second inorganic part 1301b on the substrate 110 overlaps with the vertical projection of the wiring layer 1302 on the substrate 110, and the vertical projection of the first inorganic part 1301a on the substrate 110 overlaps with the vertical projection of the first packaging part 1401 on the substrate 110.

[0047] Specifically, the second inorganic layer 1301 includes an integrally arranged first inorganic portion 1301a and a second inorganic portion 1301b, so that the edge shape of the second inorganic layer 1301 corresponds to the edge shape of the encapsulation layer 140. The second inorganic portion 1301b corresponds to the second encapsulation portion 1402, and the vertical projection of the second inorganic portion 1301b on the substrate 110 overlaps with the vertical projection of the wiring layer 1302 on the substrate 110, that is, the vertical projection of the second inorganic portion 1301b on the substrate 110 overlaps with the vertical projection of the second encapsulation portion 1402 on the substrate 110. The first inorganic portion 1301a corresponds to the first encapsulation portion 1401, and the vertical projection of the first inorganic portion 1301a on the substrate 110 overlaps with the vertical projection of the first encapsulation portion 1401 on the substrate 110, so that the wiring layer 1302 shrinks inward and does not contact the outside world, thereby preventing the wiring layer 1302 from being corroded by the external acidic or alkaline environment. The wiring layer 1302 is further wrapped by the first inorganic part 1301a and the second inorganic part 1301b, so that the external acidic or alkaline environment is not easy to corrode the wiring layer 1302, thereby avoiding damage to the wiring layer 1302, thereby improving the acid and alkali resistance of the display panel, thereby expanding the application range of the display panel.

[0048] The embodiment of the utility model provides a display panel, and sets an inward-retracted wiring layer to prevent the wiring layer from being exposed to the outside, so that the first packaging part can block the corrosion of the wiring layer by external acidic or alkaline liquids, thereby improving the acid and alkali resistance of the display panel, thereby expanding the application range of the display panel.

[0049] Figure 3 This is a schematic diagram of the structure of a display device provided by an embodiment of the utility model. Figure 3 The embodiment of the utility model further provides a display device 20, comprising the display panel 10 in any of the above embodiments.

[0050] Specifically, the display device 20 provided in the embodiment of the present invention includes the display panel 10 proposed in any of the above embodiments, and has the beneficial effects of the display panel 10 proposed in the above embodiments, which will not be repeated here. Exemplarily, the display device 20 can be a display device such as a mobile phone, a wearable device with a display function, a computer, etc.

[0051] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a display area and a frame area; A glass cover plate, located on one side of the substrate; A packaging base layer, located in the frame area between the substrate and the glass cover; The encapsulation layer is located in the frame area between the encapsulation base layer and the glass cover plate; the encapsulation layer includes a first encapsulation part and a second encapsulation part which are integrally arranged, the second encapsulation part is located between the first encapsulation part and the display area, and the thickness of the first encapsulation part is greater than the thickness of the second encapsulation part.

2. The display panel according to claim 1, characterized in that: The packaging base layer includes a wiring layer; the vertical projection of the second packaging part on the substrate overlaps with the vertical projection of the wiring layer on the substrate, and the vertical projection of the first packaging part on the substrate does not overlap with the vertical projection of the wiring layer on the substrate.

3. The display panel according to claim 1, characterized in that: The cross-sectional shape of the encapsulation layer includes an L-shape.

4. The display panel according to claim 1, characterized in that: Along the vertical direction from the frame area to the display area, the width of the first packaging portion is 1um to 500um.

5. The display panel according to claim 1, characterized in that: The encapsulation layer is a glass Frit encapsulation layer.

6. The display panel according to claim 2, characterized in that: The package base layer further includes a reflective metal layer, and the reflective metal layer is located between the wiring layer and the substrate.

7. The display panel according to claim 2, characterized in that: The package base layer further includes a first inorganic layer and an organic layer, and the organic layer and the first inorganic layer are both located between the wiring layer and the substrate.

8. The display panel according to claim 2, characterized in that: The packaging substrate layer further includes a second inorganic layer, and the second inorganic layer is located between the wiring layer and the packaging layer.

9. The display panel according to claim 8, characterized in that: The second inorganic layer includes a first inorganic part and a second inorganic part that are integrally arranged, the vertical projection of the second inorganic part on the substrate overlaps with the vertical projection of the wiring layer on the substrate, and the vertical projection of the first inorganic part on the substrate overlaps with the vertical projection of the first packaging part on the substrate.

10. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 9.

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