Filtering device and chemical vapor deposition filtering system

Abstract

The utility model discloses a filtering device and a chemical vapor deposition filtering system, which are applied to the technical field of film deposition. The filtering device provided by the utility model is arranged between the process coating cavity and the vacuum pump, the internal environment of the filtering tank is divided into the internal environment of the filtering element and the external environment of the filtering element through the filtering element in the filtering tank, and organic chemical gas which is introduced and does not participate in reaction during film deposition can be pumped into the filtering external environment in the filtering tank by the vacuum pump, so that the film deposition efficiency is improved. In the environment, the reaction is carried out with reactants provided by the feeding device, solid products generated by the reaction can be blocked in the filtering tank by the filtering element, and gas generated by the reaction can enter the filtering element and is pumped away by the vacuum pump. The organic chemical gas which does not participate in the reaction is reacted and deposited in the filtering device, so that the reaction lag is not caused, and the influence on a rear-end device is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film deposition, in particular to a filtering device and a chemical vapor deposition filtering system. Background Art

[0002] Chemical Vapor Deposition (CVD) is an advanced thin film deposition technology. Its principle is to pass two or more organic chemical gases through the surface of the substrate to be deposited layer by layer in a certain proportion and order under vacuum heating conditions, and use the chemical reaction between the components to form a dense film on the substrate surface. With the continuous upgrading of production capacity in various application scenarios, the amount of organic chemical gases introduced is also increasing, even to oversaturation.

[0003] However, current technology cannot guarantee an absolute and complete effective reaction. Organic chemical gases that do not participate in the reaction are directly pumped out by the vacuum pump and discharged to the factory discharge. Moreover, organic chemical gases that do not participate in the reaction may react in the vacuum pump gear set during the transmission process of the back-end device, and the generated products may easily break through the internal seal of the pump, or be deposited on the surface of the pump rotor, causing the pump to get stuck. They may also react in the tail exhaust pipeline, causing the exhaust pipeline to be blocked. Since the reaction position of organic chemical gases that do not participate in the reaction is uncontrollable during the transmission process of the back-end device, the maintenance scope of the equipment is significantly increased. Therefore, it is necessary to provide a filtering device to solve the problem in the prior art that the organic chemical gases that do not participate in the reaction are delayed in reaction and affect the back-end device. Utility Model Content

[0004] In view of this, the purpose of the utility model is to provide a filtering device and a chemical vapor deposition filtering system. By arranging a filtering device between the process coating chamber and the vacuum pump, organic chemical gases that do not participate in the reaction (organic chemical substances in a flowing state) can enter the filtering device and react with other reactants. The products after the reaction are blocked inside the filter tank by the filter element, thereby solving the problem in the prior art that the organic chemical gases that do not participate in the reaction are delayed in reaction and affect the back-end device.

[0005] In order to solve the above technical problems, the utility model provides a filtering device, comprising: a filtering tank; the filtering tank is provided with an air inlet and a feed inlet; the air inlet is used to communicate with a process coating chamber storing a gas to be filtered of a process coating device; the feed inlet is used to communicate with a feed device storing a reactant;

[0006] A filter core with a cylindrical structure is arranged in the filter tank, and the internal space of the filter core is used to communicate with the vacuum pump; the reaction space between the filter core and the filter tank is connected with the process coating cavity through the air inlet, and the reaction space between the filter core and the filter tank is connected with the feeding device through the feed port.

[0007] Optionally, the filter tank is provided with a plurality of feed ports.

[0008] And / or, the filter tank and the filter element are detachably connected.

[0009] Optionally, the air inlet is connected to the process coating chamber through a first vacuum pipe; and a first valve is provided on the first vacuum pipe.

[0010] Optionally, the filter tank is provided with an air outlet; a second vacuum pipe passes through the air outlet to achieve communication between the internal space of the filter element and the vacuum pump;

[0011] And / or, the filter element is press-fitted into the filter tank via a second vacuum pipe.

[0012] Optionally, the filter tank includes a tank body and a flange cover; the flange cover is detachably connected to the tank body.

[0013] In order to solve the above-mentioned technical problems, the utility model also provides a chemical vapor deposition filtration system, characterized in that it includes: process coating equipment, a feeding device, a vacuum pump and the above-mentioned filtration device; wherein the process coating chamber of the process coating equipment is connected with the air inlet and the reaction space of the filtration device in sequence; the feeding device is connected with the feed inlet and the reaction space of the filtration device in sequence; the internal space of the filter element of the filtration device is connected with the vacuum pump.

[0014] Optionally, the feeding device includes a pure water tank and a water vapor pipe; the inlet of the water vapor pipe is connected to the pure water tank, and the outlet of the water vapor pipe is connected to the feeding port.

[0015] Optionally, an auxiliary heat belt is provided on the periphery of the pure water tank;

[0016] And / or, the auxiliary heat belt is arranged on the periphery of the water vapor pipe.

[0017] Optionally, a second valve is provided on a side of the water vapor pipeline close to the pure water tank;

[0018] And / or, the second valve is provided on a side of the water vapor pipeline close to the feed inlet;

[0019] And / or, the water vapor pipeline includes a plurality of outlets; the filter tank is provided with a plurality of feed ports; the outlets and the feed ports are connected one by one.

[0020] Optionally, it is characterized in that an angle valve is provided between the vacuum pump and the filter element.

[0021] The utility model provides a filtering device, comprising: a filter tank; the filter tank is provided with an air inlet and a feed port; the air inlet is used to communicate with a process coating chamber of a process coating equipment storing gas to be filtered; the feed port is used to communicate with a feed device storing reactants; a filter element with a cylindrical structure is provided in the filter tank, and the internal space of the filter element is used to communicate with a vacuum pump; the reaction space between the filter element and the filter tank is connected with the process coating chamber through the air inlet, and the reaction space between the filter element and the filter tank is connected with the feed device through the feed port.

[0022] Obviously, the utility model is arranged between the process coating chamber and the vacuum pump, and the internal environment of the filter tank is divided into two environments, the inside of the filter core and the outside of the filter core, through the filter core inside the filter tank. For example, the organic chemical gas that is introduced and does not participate in the reaction during thin film deposition will be pumped into the filter external environment in the filter tank by the vacuum pump, and react with the reactants provided by the feeding device in this environment. The product part generated by the reaction will be blocked by the filter core and collected in the filter tank, and the product part generated by the reaction will enter the inside of the filter core and be pumped away by the vacuum pump. Since the organic chemical gas that does not participate in the reaction is deposited in the filter device after the reaction, it will not cause reaction lag, and therefore will not affect the back-end device. The utility model also provides a chemical vapor deposition filtration system, in which the filter device provided by the utility model is arranged between the process coating chamber and the vacuum pump in the chemical vapor deposition equipment, so it also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the structure of a chemical vapor deposition filtration system provided by an embodiment of the utility model;

[0025] Figure 2 A schematic diagram of a filter element built into a filter tank close to a vacuum pump provided by an embodiment of the utility model;

[0026] Figure 3 A schematic diagram of a filter tank provided in an embodiment of the utility model, with a filter element built in on the side facing away from the vacuum pump.

[0027] The following are the descriptions of the reference numerals:

[0028] 1-filter tank; 2-process coating chamber; 3-vacuum pump; 4-filter element; 51-pure water tank; 52-water vapor pipeline; 53-second valve; 6-first vacuum pipeline; 7-first valve; 8-angle valve; 9-second vacuum pipeline; 10-flange cover. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of a chemical vapor deposition filtration system provided by an embodiment of the utility model. A filtration device provided by an embodiment of the utility model may include: a filter tank 1; the filter tank 1 is provided with an air inlet and a feed inlet; the air inlet is used to communicate with a process coating chamber 2 of a process coating device storing a gas to be filtered; the feed inlet is used to communicate with a feed device storing a reactant;

[0031] A filter core 4 with a cylindrical structure is arranged in the filter tank 1, and the internal space of the filter core 4 is used to communicate with the vacuum pump 3; the reaction space between the filter core 4 and the filter tank 1 is communicated with the process coating chamber 2 through the air inlet, and the reaction space between the filter core 4 and the filter tank 1 is communicated with the feeding device through the feeding port. The gas to be filtered is drawn into the filter tank 1 by the vacuum pump 3, and reacts with the reactant outside the filter core 4 (i.e., the reaction space), and the first product after the reaction is blocked by the filter core 4 and collected inside the filter tank 1 (i.e., the reaction space), and the second product after the reaction enters the inside of the filter core 4 (i.e., the internal space) and is drawn into the back-end device by the vacuum pump 3. It is worth noting that the reaction between the gas to be filtered and the reactant is intended to reduce the environmental pollution or human health impact caused by the direct discharge of the gas to be filtered (i.e., the organic chemical gas), so those skilled in the art should know the corresponding relationship between the gas to be filtered and the reactant, and the utility model does not describe this in detail. For example, trimethylaluminum (Al(CH3)3, TMA) used for solar cell coating can react with water vapor as the reactant, and the reaction formula is: 2AL(CH3)+3H2O=AL2O3↓+6CH4↑, and the final products are aluminum oxide powder and methane. The aluminum oxide powder will be blocked in the reaction space by the filter element 4, while the methane will enter the back-end device under the suction of the vacuum pump 3. Of course, in practical applications, the gas to be filtered can also be other organic chemicals, such as trimethylboron (TMB), phosphine, etc.

[0032] Furthermore, in this embodiment, the filter tank 1 may be provided with a plurality of feed ports. It should be noted that by providing a plurality of feed ports, the input amount of the reactants can be increased, thereby improving the reaction rate and timeliness of the gas to be filtered.

[0033] Furthermore, the filter tank 1 and the filter element 4 are detachably connected. By disassembling the filter element 4, the filter element 4 can be replaced and / or cleaned and the product in the filter tank 1 can be cleaned to ensure the energy efficiency and service life of the present application. Furthermore, in the present embodiment, the air inlet can be connected to the process coating chamber 2 through the first vacuum pipe 6; the first valve 7 can be provided on the first vacuum pipe 6. It should be noted that in the present embodiment, the amount of gas to be filtered can be adjusted by adjusting the valve opening on the vacuum pipe between the air inlet and the process coating chamber 2, thereby adjusting the filtering effect. In addition, the pressure in the process coating chamber 2 can also be adjusted by adjusting the opening of the first valve 7. On the one hand, it can be achieved by adjusting the reaction rate of the reactant and the amount of gas to be filtered, and on the other hand, it can be achieved by adjusting the content of the reactant in the filter tank 1. The specific adjustment method can be based on actual production needs, and this application does not limit it.

[0034] This embodiment does not limit the specific shape of the filter element 4. For example, the cross-sectional shape of the filter element 4 can be circular, square, irregular polygonal, etc., or a cylindrical structure of other shapes. This embodiment does not limit the specific position of the filter element 4. For example, the filter element 4 can be located at the center of the filter tank 1 and coaxial with the filter tank 1; it can also be located at a position deviated from the center of the filter tank 1 and non-coaxial with the filter tank 1. This embodiment does not limit the specific type of the filter element 4. It can be any filter element 4 that can block solid products. For example, the filter element 4 can be a screen, and the size of the screen mesh is smaller than the size of the solid product produced after the reaction between the gas to be filtered and the reactant.

[0035] This embodiment does not limit the specific connection method between the internal space of the filter element 4 and the vacuum pump 3, as long as the internal space of the filter element 4 and the vacuum pump 3 can be connected. For example, the filter tank 1 can be provided with an air outlet; the second vacuum pipe 9 passes through the air outlet to realize the connection between the internal space of the filter element 4 and the vacuum pump 3.

[0036] The present embodiment does not limit the specific fixing method of the filter element 4, as long as the filter element 4 can be fixed in the filter tank 1 during use, for example, the filter element 4 can be press-fitted into the filter tank 1 through the second vacuum pipe 9. It should be noted that the present embodiment uses a press-fitting method to fix the filter element 4, which can facilitate the disassembly of the filter element 4. By disassembling the filter element 4, the reactants intercepted by the reaction space can be processed in time to ensure the filtering efficiency of the device. In other embodiments, the filter element 4 can also be mounted inside the filter tank 1 through a bracket or hung inside the filter tank 1 through a hook.

[0037] Furthermore, in this embodiment, the filter tank 1 may include a tank body and a flange cover 10; the flange cover 10 is detachably connected to the tank body. It should be noted that the flange cover 10 in this embodiment is detachable. By opening the flange cover 10, the filter element 4 can be directly taken out from the side of the filter tank 1 away from the air outlet, so that the filter element 4 can be easily replaced. In this embodiment, the side of the filter tank 1 close to the vacuum pump 3 can also be a flange cover 10 with a through hole, and the through hole can be used as an air outlet. The two ends of the filter element 4 can be axially concave and convex with the second vacuum pipe 9 and / or the flange cover 10, respectively, so that the filter element 4 can be pressed and suspended in the filter tank 1. Of course, in other embodiments, the air outlet can also be set on the tank body, and the filter element 4 is connected to the air outlet through a pipeline and then connected to the vacuum pump 3 through a pipeline, or the filter element 4 is connected to the vacuum pump 3 after passing through the air outlet through a pipeline.

[0038] Based on the above embodiment, the utility model is arranged between the process coating chamber 2 and the vacuum pump 3, and the internal environment of the filter tank 1 is divided into two environments, the inside of the filter core 4 and the outside of the filter core 4, through the filter core 4 inside the filter tank 1. The organic chemical gas that is introduced during the film deposition and does not participate in the reaction will be sucked into the filtering external environment in the filter tank 1 by the vacuum pump 3, and react with the reactants provided by the feeding device in this environment. The solid product generated by the reaction will be blocked in the filter tank 1 by the filter core 4, and the gas generated by the reaction will enter the inside of the filter core 4 and be sucked away by the vacuum pump 3. Since the organic chemical gas that does not participate in the reaction is deposited in the filter device, it will not cause reaction lag, and therefore will not affect the back-end device.

[0039] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of a chemical vapor deposition filtration system provided for an embodiment of the utility model. The utility model also provides a chemical vapor deposition device which may include: a process coating device, a feeding device, a vacuum pump 3 and the above-mentioned filtering device; wherein the process coating chamber 2 of the process coating device is connected with the air inlet and the reaction space of the filtering device in sequence; the feeding device is connected with the feeding port and the reaction space of the filtering device in sequence; the internal space of the filter core 4 of the filtering device and the vacuum pump 3 are connected with the process coating chamber 2, the feeding device, the above-mentioned filtering device, the vacuum pump 3 and the back-end device.

[0040] This embodiment does not limit the specific type of reactants, which can be determined according to the actual type of gas to be filtered, as long as it can react with the gas to be filtered. This embodiment does not limit the specific structure of the feeding device, which can be determined according to the actual type of reactants required. For example, when the reactant is water vapor, the feeding device may include a pure water tank 51 and a water vapor pipe 52; the inlet of the water vapor pipe 52 is connected to the pure water tank 51, and the outlet of the water vapor pipe 52 is connected to the feeding port. It should be noted that the feeding device is a reaction source type device, which is used to provide water vapor as a reactant and transmit the water vapor into the filter tank 1 through the water vapor pipe 52. The feeding device is suitable for filtering any gas that can react with water, such as trimethylaluminum (TMA).

[0041] The present embodiment does not limit the specific position of the water vapor pipe 52. For example, the water vapor pipe 52 can be located above or above the filter tank 1. Accordingly, the position of the feed port on the filter tank 1 should correspond to the outlet of the water vapor pipe 52. When the water vapor pipe 52 is located above the filter tank 1, the filter tank 1 is provided with a feed port facing upward; when the water vapor pipe 52 is located above the filter tank 1, the filter tank 1 is provided with a feed port facing one side. The present embodiment also does not limit the specific positions of the air inlet and the air outlet, which can be determined according to the position of the actual process coating chamber 2 and the position of the vacuum pump 3.

[0042] Furthermore, in the present embodiment, an auxiliary heat belt may be provided on the periphery of the pure water tank 51; and / or, an auxiliary heat belt may be provided on the periphery of the water vapor pipe 52.

[0043] Furthermore, in this embodiment, a second valve 53 may be provided on one side of the water vapor pipe 52 close to the pure water tank 51; and / or, a second valve 53 may be provided on one side of the water vapor pipe 52 close to the feed port. It should be noted that in this embodiment, the amount of water vapor can be adjusted by adding an auxiliary belt around the pure water tank 51 and the water vapor pipe 52 or adjusting the valve opening on the water vapor pipe 52, thereby adjusting the filtering effect; and the pressure in the process coating chamber 2 can also be adjusted by the amount of water vapor.

[0044] This embodiment does not limit the specific structure and number of the water vapor pipe 52. For example, the feed device may include a water vapor pipe 52, the water vapor pipe 52 may include an inlet and an outlet, or the water vapor pipe 52 may include multiple outlets, and the filter tank 1 may be provided with multiple feed ports, and the outlets and feed ports are connected one by one; the feed device may also include multiple water vapor pipes 52, each of which may include an inlet and an outlet, and the filter tank 1 may be provided with multiple feed ports, and the outlets of each water vapor pipe 52 are connected one by one. It should be noted that the latter two multi-outlet structures can increase the input amount of reactants, thereby increasing the reaction rate with the gas to be filtered.

[0045] Furthermore, in this embodiment, an angle valve 8 is provided between the vacuum pump 3 and the filter element 4. It should be noted that, in this embodiment, the flow rate or transmission direction of the gas entering the vacuum pump 3 can be adjusted by the angle valve 8.

[0046] This embodiment does not limit the specific structures of the process coating chamber 2, the vacuum pump 3, and the back-end device, and the specific structures of the process coating chamber 2, the vacuum pump 3, and the back-end device can be determined according to actual coating requirements.

[0047] This embodiment does not limit the specific structure of the filtering device, and any filtering device in the above embodiments may be used, which will not be described in detail here.

[0048] Based on the above embodiments, the utility model is provided with the above-mentioned filtering device between the process coating chamber 2 and the vacuum pump 3. The internal environment of the filter tank 1 is divided into two environments, the inside of the filter core 4 and the outside of the filter core 4, through the filter core 4 inside the filter tank 1. The organic chemical gas that is introduced during the film deposition and does not participate in the reaction will be sucked into the filtering external environment in the filter tank 1 by the vacuum pump 3, and react with the reactants provided by the feeding device in this environment. The solid product generated by the reaction will be blocked by the filter core 4 in the filter tank 1, and the gas generated by the reaction will enter the inside of the filter core 4 and be sucked away by the vacuum pump 3. Since the organic chemical gas that does not participate in the reaction is deposited in the filtering device, it will not cause reaction lag, and therefore will not affect the back-end device.

[0049] In order to make the present invention easier to understand, the working principle of the filtering device provided by the present invention is described in detail below with reference to specific examples. This embodiment only lists a thin film deposition process and the principle of filtering reaction by introducing organic chemical gas, and the same principle can be applied to other chemical vapor deposition equipment technology applications.

[0050] This embodiment adopts Figure 1 The filtering device shown in the figure, wherein the filter tank 1 has a built-in filter core 4, the filter core 4 is a circular cylindrical structure, the two environments inside and outside the filter core 4 are connected to the process coating chamber 2 and the vacuum pump 3 through the filter tank 1, the first vacuum pipe 6, and the second vacuum pipe 9 respectively, and the vacuum pump 3 is provided with an angle valve 8; a plurality of water vapor pipes 52 are connected above the filter tank 1, each water vapor pipe 52 is provided with a second valve 53, and the other end of the water vapor pipe 52 is connected to the pure water tank 51.

[0051] When the filtering device is working, the second valve 53 of the water vapor pipeline 52 and the first valve 7 of the first vacuum pipeline 6 are all opened, and the pure water tank 51, the water vapor pipeline 52, the filter tank 1, the process coating chamber 2, the first vacuum pipeline 6 and the second vacuum pipeline 9 are all in a vacuum state; the pure water in the pure water tank 51 is in a state of natural volatilization under vacuum, the lower layer is in a liquid state, the upper layer is in a vapor state, and the water vapor pipeline 52 is in a vapor state. In addition, auxiliary heat belts can be added to the periphery of the pure water tank 51 and the water vapor pipeline 52, or the opening of the second valve 53 or the opening of the first valve 7 can be adjusted to adjust the filtering effect, and the pressure in the process coating chamber 2 can also be adjusted by the amount of water vapor.

[0052] The gas flow direction in the filter tank 1 is as follows: the gas in the process coating chamber 2 is drawn into the external environment of the filter element 4 in the filter tank 1, filtered by the filter element 4, enters the internal environment of the filter element 4, and finally at the other end of the filter element 4 (such as Figure 2 The vacuum is sucked away by the second vacuum pipe 9 connected to the vacuum pump 3.

[0053] During the process coating process, trimethylaluminum Al(CH3)3 that has not participated in the reaction and has entered the process coating chamber 2 is pumped by the vacuum pump 3 to the external environment of the filter element 4 inside the filter tank 1, and then reacts with the water vapor volatilized from the water vapor pipe 52 (2AL(CH3)+3H2O=AL2O3↓+6CH4↑) to generate the final product aluminum oxide powder, which is blocked by the filter element 4 in the filter tank 1, while the methane gas enters the interior of the filter element 4 and is then pumped into the back-end device through the second vacuum pipe 9. The filter element 4 can be replaced regularly during the process coating process.

[0054] Replacement of filter element 4: During operation, filter element 4 is squeezed and fixed in filter tank 1 through flange cover 10 on the side of filter tank 1 away from the gas outlet and second vacuum pipeline. Open flange cover 10 of filter tank 1. Schematic diagram of built-in filter element 4 after filter tank 1 is opened is as shown in FIG. Figure 3 As shown, the filter element 4 can be directly taken out.

[0055] The filtering device provided by the embodiment of the utility model is arranged between the process coating chamber 2 and the vacuum pump 3. The internal environment of the filter tank 1 is divided into two environments, the inside of the filter core 4 and the outside of the filter core 4, through the filter core 4 inside the filter tank 1. The organic chemical gas that is introduced during the film deposition and does not participate in the reaction will be sucked into the filtering external environment in the filter tank 1 by the vacuum pump 3, and react with the reactants provided by the feeding device in this environment. The solid product generated by the reaction will be blocked in the filter tank 1 by the filter core 4, and the gas generated by the reaction will enter the inside of the filter core 4 and be sucked away by the vacuum pump 3. Since the organic chemical gas that does not participate in the reaction is deposited in the filtering device, it will not cause reaction lag, and therefore will not affect the back-end device.

[0056] The above is a detailed introduction to a filter device and a chemical vapor deposition filter system provided by the utility model. For a person skilled in the art, according to the idea of ​​the embodiments of the utility model, there may be changes in the specific implementation method and the scope of application. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A filtering device, characterized in that: include: Filter tank; The filter tank is provided with an air inlet and a feed inlet; The gas inlet is used to communicate with the process coating chamber of the process coating equipment storing the gas to be filtered; the feed port is used to communicate with the feed device storing the reactants; A filter core with a cylindrical structure is arranged in the filter tank, and the internal space of the filter core is used to communicate with the vacuum pump; the reaction space between the filter core and the filter tank is connected with the process coating cavity through the air inlet, and the reaction space between the filter core and the filter tank is connected with the feeding device through the feed port.

2. The filtering device according to claim 1, characterized in that: The filter tank is provided with a plurality of feed ports; and / or, The filter tank and the filter core are detachably connected.

3. The filtering device according to claim 1, characterized in that: The air inlet is connected to the process coating chamber through a first vacuum pipeline; and a first valve is arranged on the first vacuum pipeline.

4. The filtering device according to any one of claims 1 to 3, characterized in that: The filter tank is provided with an air outlet; a second vacuum pipe passes through the air outlet to achieve communication between the inner space of the filter element and the vacuum pump; And / or, the filter element is press-fitted into the filter tank via a second vacuum pipe.

5. The filtering device according to claim 4, characterized in that: The filter tank comprises a tank body and a flange cover; the flange cover is detachably connected to the tank body.

6. A chemical vapor deposition filtration system, characterized in that: include: A process coating equipment, a feeding device, a vacuum pump and a filtering device as described in any one of claims 1 to 5; wherein the process coating chamber of the process coating equipment is sequentially connected with the air inlet and the reaction space of the filtering device; the feeding device is sequentially connected with the feed inlet and the reaction space of the filtering device; the internal space of the filter element of the filtering device is connected with the vacuum pump.

7. The chemical vapor deposition filtration system according to claim 6, characterized in that: The feeding device comprises a pure water tank and a water vapor pipeline; the inlet of the water vapor pipeline is connected to the pure water tank, and the outlet of the water vapor pipeline is connected to the feeding port.

8. The chemical vapor deposition filtration system according to claim 7, characterized in that: The outer periphery of the pure water tank is provided with an auxiliary heat belt; And / or, the auxiliary heat belt is arranged on the periphery of the water vapor pipe.

9. The chemical vapor deposition filtration system according to claim 7, characterized in that: A second valve is provided on one side of the water vapor pipeline close to the pure water tank; And / or, the second valve is provided on a side of the water vapor pipeline close to the feed inlet; And / or, the water vapor pipeline includes a plurality of outlets; the filter tank is provided with a plurality of feed ports; the outlets and the feed ports are connected one by one.

10. The chemical vapor deposition filtration system according to any one of claims 7 to 9, characterized in that: An angle valve is arranged between the vacuum pump and the filter element.

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