Silicon wafer tray cleaning machine

Abstract

The utility model discloses a silicon wafer tray cleaning machine which comprises a cleaning machine body, the interior of the cleaning machine body is rotationally connected with a first rotating rod, the inner end of the first rotating rod is fixedly connected with a cleaning frame, and one end of the inner side of the cleaning frame is fixedly connected with a driving box. The output end of the driving box penetrates through the cleaning frame and is inwards provided with a two-way screw, two threaded blocks are in threaded connection with the two-way screw, an open groove is formed in the inner side of the cleaning frame, and the threaded blocks penetrate through the open groove and are outwards and fixedly connected with clamping plates; by arranging the cleaning frame, the driving box, the bidirectional screw and the threaded block, clamping plates at the two ends can be driven to move relatively, the two ends of a silicon wafer tray can be positioned and clamped through the clamping plates, the stability of the silicon wafer tray during cleaning is ensured, and by arranging a driving motor, a first gear and a second gear, the cleaning frame can be driven to rotate; and the structure is reasonable, and the silicon wafer tray can be cleaned more cleanly and thoroughly.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer tray cleaning machines, in particular to a silicon wafer tray cleaning machine. Background Art

[0002] Silicon wafers are important raw materials in the semiconductor industry, with high purity and uniformity. Each link in silicon wafer manufacturing requires a high degree of cleanliness and precision control. From raw material receipt to processing to finished product delivery, suitable pallets are required for packaging and transportation. Silicon wafer raw material pallets are usually made of plastic materials, including polypropylene (PP), polyethylene (PE), etc.

[0003] The trays need to be cleaned during the production process. Existing silicon wafer tray cleaning machines usually place the silicon wafer trays directly into the cleaning machine for automatic cleaning when in use. This method affects the cleaning efficiency of the silicon wafer trays, resulting in a long cleaning time and poor cleaning effect. In addition, the cleaning liquid is used multiple times to clean the residues on the surface of the silicon wafer trays. The residues will accumulate in the chemical cleaning liquid, causing turbidity of the cleaning liquid, which reduces the cleaning efficiency. The chemical cleaning liquid needs to be replaced. Replacing a large amount of chemical cleaning liquid will increase the purchase funds and the processing cost of the equipment, resulting in waste. Utility Model Content

[0004] The utility model aims to provide a silicon wafer tray cleaning machine, which solves the problem that the silicon wafer tray cleaning machine in the prior art usually directly puts the silicon wafer tray into the interior of the cleaning machine for automatic cleaning during use, which affects the cleaning efficiency of the silicon wafer tray, resulting in a long cleaning time and poor cleaning effect of the silicon wafer tray.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a silicon wafer tray cleaning machine, comprising a cleaning machine body, wherein a first rotating rod is rotatably connected inside the cleaning machine body, a cleaning rack is fixedly connected to the inner end of the first rotating rod, a driving box is fixedly connected to one inner end of the cleaning rack, and a bidirectional screw is arranged inwardly through the output end of the driving box through the cleaning rack;

[0006] Two threaded blocks are threadedly connected on the bidirectional screw rod, a slot is provided on the inner side of the cleaning frame, and the threaded block passes through the slot and is fixedly connected with a clamping plate outwardly.

[0007] As a further description of the above technical solution: a second gear is fixedly connected to the first rotating rod, and a driving motor is fixedly connected to one end of the outer side of the cleaning machine body.

[0008] As a further description of the above technical solution: the output end of the driving motor is fixedly connected to the second rotating rod, the second rotating rod is fixedly connected to the first gear, and the first gear is meshed with the second gear.

[0009] As a further description of the above technical solution: a delivery pipe is provided through one end of the outer side of the cleaning machine body, and a filter box is provided through the other end of the delivery pipe.

[0010] As a further description of the above technical solution: a water pump is arranged in the middle of the delivery pipe, and a filter screen is fixedly connected to the inner side of the filter box.

[0011] As a further description of the above technical solution: an activated carbon adsorption plate is correspondingly arranged at the lower end of the filter screen, a return pipe is arranged through the other end of the filter box to the outside, the other end of the return pipe is arranged through one side of the cleaning machine body, and a delivery pump is arranged on the return pipe.

[0012] As a further description of the above technical solution: the four ends of the bottom of the cleaning machine body are fixedly connected with support frames.

[0013] The utility model has the following beneficial effects:

[0014] 1. Compared with the prior art, the silicon wafer tray cleaning machine can drive the clamping plates at both ends to move relative to each other by setting a cleaning frame, a driving box, a bidirectional screw and a threaded block, and can position and clamp the two ends of the silicon wafer tray through the clamping plates to ensure its stability during cleaning, and can drive the cleaning frame to rotate by setting a driving motor, a first gear and a second gear, so as to facilitate the rotation and cleaning of the silicon wafer tray, and has a reasonable structure, which can make the cleaning more thorough;

[0015] 2. Compared with the prior art, this silicon wafer tray cleaning machine can deliver the cleaning liquid after cleaning into the interior of the filter box for filtration by setting a delivery pipe and a water pump, and the filtered cleaning liquid can return to the interior of the cleaning machine body through a reflux pipe, thereby reducing cost expenditure and improving the practicality and convenience of the entire device.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0019] Figure 2 It is a cross-sectional view of the utility model.

[0020] Figure 3 This utility model Figure 1 Schematic diagram of the structure of A.

[0021] Legend:

[0022] 1. Cleaning machine body; 2. First rotating rod; 3. Second rotating rod; 4. First gear; 5. Clamp; 6. Cleaning rack; 7. Second gear; 8. Driving motor; 9. Support frame; 10. Water pump; 11. Activated carbon adsorption plate; 12. Filter box; 13. Filter screen; 14. Delivery pipe; 15. Drive box; 16. Reflux pipe; 17. Thread block; 18. Slot; 19. Bidirectional screw DETAILED DESCRIPTION

[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0024] Reference Figure 1-3 The utility model provides an embodiment of a silicon wafer tray cleaning machine, comprising a cleaning machine body 1, wherein the cleaning machine body 1 is internally rotatably connected to a first rotating rod 2, and the inner end of the first rotating rod 2 is fixedly connected to a cleaning rack 6, and the first rotating rod 2 is provided to ensure that the cleaning rack 6 stably rotates inside the cleaning machine body 1, and the cleaning rack 6 is a vertical through-type structure, which can better clean the silicon wafer tray, and an ultrasonic generator is provided on the outer side of the cleaning machine body 1 of the device, so that the silicon wafer tray can be ultrasonically cleaned, and one end of the inner side of the cleaning rack 6 is fixedly connected to a driving box 15, and the output end of the driving box 15 penetrates the cleaning rack 6 and is provided with a bidirectional screw 19 inwardly;

[0025] Two threaded blocks 17 are threadedly connected on the bidirectional screw 19, and a slot 18 is provided on the inner side of the cleaning rack 6. The threaded block 17 passes through the slot 18 and is fixedly connected to the clamping plate 5 outwardly. Starting the outer driving box 15 can drive the internal bidirectional screw 19 to rotate. Under the action of the threaded connection, the threaded block 17 can drive the clamping plate 5 to move relative to each other. The two ends of the silicon wafer tray can be positioned and clamped through the clamping plate 5 to ensure the stability of the silicon wafer tray during cleaning;

[0026] The first rotating rod 2 is fixedly connected with a second gear 7, an outer end of the cleaning machine body 1 is fixedly connected with a driving motor 8, an output end of the driving motor 8 is fixedly connected with a second rotating rod 3, and the second rotating rod 3 is fixedly connected with a first gear 4, the first gear 4 is meshed with the second gear 7, and during the cleaning process, starting the driving motor 8 can drive the second rotating rod 3 and the first gear 4 to rotate, and under the action of meshing, the first gear 4 can drive the second gear 7 and the first rotating rod 2 to rotate, so that the cleaning rack 6 can be rotated for cleaning, which is convenient for the silicon wafer tray to be rotated for cleaning, and the structure is reasonable, which can make the cleaning more thorough;

[0027] A delivery pipe 14 is provided through one end of the outer side of the cleaning machine body 1, and a filter box 12 is provided through the other end of the delivery pipe 14. A water pump 10 is provided in the middle of the delivery pipe 14, and a filter screen 13 is fixedly connected to the inner side of the filter box 12. After a long period of cleaning, the cleaning liquid inside will become turbid. At this time, starting the water pump 10 can send the cleaning liquid into the inside of the filter box 12 through the delivery pipe 14, and the cleaning liquid can be filtered and adsorbed by the filter screen 13 and the activated carbon adsorption plate 11 inside the filter box 12 to ensure its recycling;

[0028] An activated carbon adsorption plate 11 is correspondingly arranged at the lower end of the filter screen 13, and a return pipe 16 is arranged outside through the other end of the filter box 12, and the other end of the return pipe 16 is arranged through one side of the cleaning machine body 1, and a delivery pump 20 is arranged on the return pipe 16. By starting the delivery pump 20, the cleaning liquid after filtration and adsorption can be re-delivered into the interior of the cleaning machine body 1 through the return pipe 16, thereby achieving the purpose of recycling and reducing the waste of resources;

[0029] The four ends of the bottom of the cleaning machine body 1 are fixedly connected with support frames 9. By providing the support frames 9, the device can be stably supported to improve its stability.

[0030] Working principle: When the device is in use, first place the silicon wafer tray to be cleaned in the middle of the cleaning rack 6, then start the outer drive box 15 to drive the internal bidirectional screw 19 to rotate, and under the action of the threaded connection, the threaded block 17 can drive the clamping plate 5 to move relative to each other, and the clamping plate 5 can be used to position and clamp the two ends of the silicon wafer tray to ensure the stability of the silicon wafer tray during cleaning, and then the ultrasonic generator can be used to perform ultrasonic cleaning of the silicon wafer tray, and during the cleaning process, start the drive motor 8 to drive the second rotating rod 3 and the first gear 4 to rotate, and under the action of meshing, the first gear 4 can drive the second gear 7 and the first rotating rod 2 to rotate, thereby realizing the rotation cleaning of the cleaning rack 6, which can facilitate the rotation cleaning of the silicon wafer tray, and the reasonable structure can make the cleaning more thorough.

[0031] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A silicon wafer tray cleaning machine, comprising a cleaning machine body (1), characterized in that: The cleaning machine body (1) is rotatably connected to a first rotating rod (2), the inner end of the first rotating rod (2) is fixedly connected to a cleaning rack (6), one inner end of the cleaning rack (6) is fixedly connected to a driving box (15), and the output end of the driving box (15) penetrates the cleaning rack (6) and is provided with a bidirectional screw (19) inwardly; The bidirectional screw (19) is threadedly connected with two threaded blocks (17), the inner side of the cleaning frame (6) is provided with a slot (18), and the threaded block (17) penetrates the slot (18) and is fixedly connected to a clamping plate (5) outwardly.

2. A silicon wafer tray cleaning machine according to claim 1, characterized in that: A second gear (7) is fixedly connected to the first rotating rod (2), and a driving motor (8) is fixedly connected to an outer end of the cleaning machine body (1).

3. A silicon wafer tray cleaning machine according to claim 2, characterized in that: The output end of the driving motor (8) is fixedly connected to a second rotating rod (3), the second rotating rod (3) is fixedly connected to a first gear (4), and the first gear (4) is meshed with a second gear (7).

4. The silicon wafer tray cleaning machine according to claim 1, characterized in that: A delivery pipe (14) is provided through one end of the outer side of the cleaning machine body (1), and a filter box (12) is provided through the other end of the delivery pipe (14).

5. A silicon wafer tray cleaning machine according to claim 4, characterized in that: A water pump (10) is arranged in the middle of the delivery pipe (14), and a filter screen (13) is fixedly connected to the inner side of the filter box (12).

6. The silicon wafer tray cleaning machine according to claim 5, characterized in that: An activated carbon adsorption plate (11) is correspondingly arranged at the lower end of the filter screen (13), a return pipe (16) is arranged through the other end of the filter box (12) and extends outward, the other end of the return pipe (16) is arranged through one side of the cleaning machine body (1), and a delivery pump (20) is arranged on the return pipe (16).

7. The silicon wafer tray cleaning machine according to claim 1, characterized in that: The four ends of the bottom of the cleaning machine body (1) are fixedly connected to support frames (9).

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