Wafer cleaning machine

Abstract

The wafer cleaning machine comprises a rack, a plurality of groove bodies are arranged in the rack, a cover plate is arranged on the groove bodies, the left end of the cover plate is hinged to the rack, and a driving mechanism for driving the cover plate to rotate along the hinged position is arranged on the rack. According to the cleaning machine, the telescopic air cylinder drives the telescopic pulling cover plate to rotate along the hinged position so as to open the cover, the cover plate is subjected to dead weight to close the cover after the telescopic air cylinder is unloaded, the cover can be automatically opened and closed, and efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of silicon wafers, and in particular to a wafer cleaning machine. Background Art

[0002] In the prior art, when cleaning wafers, a robot is required to place a basket containing wafers into different tanks for cleaning. During the cleaning process, the robot needs to grab the basket and constantly open and close the cover. This process is generally manually operated, which is very inconvenient and affects the cleaning efficiency. Utility Model Content

[0003] The utility model aims to provide a wafer cleaning machine to overcome the deficiencies in the prior art.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The embodiment of the present application discloses a wafer cleaning machine, comprising a frame, wherein a plurality of troughs are arranged in the frame, and a cover plate is arranged on the troughs. The machine is characterized in that: the left end of the cover plate is hinged to the frame, and a driving mechanism for driving the cover plate to rotate along the hinge is arranged on the frame, and the driving mechanism comprises a telescopic cylinder, a pair of ropes and a plurality of guide wheels, the telescopic cylinder is horizontally fixed to the top of the frame, a push plate is fixed to the output end of the telescopic cylinder, and a plurality of guide wheels are symmetrically arranged on the frame in two rows front and back, the guide wheels are rotatably connected to the frame, one end of a pair of the ropes are respectively fixedly connected to the two ends of the push plate, and the other ends of a pair of the ropes are respectively passed through the two rows of guide wheels and fixedly connected to the right end of the cover plate.

[0006] Preferably, in the above-mentioned wafer cleaning machine, the left end fixing sleeve of the cover plate is arranged on the rotating shaft, and the front and rear ends of the rotating shaft are rotatably connected to the frame through bearing seats.

[0007] Preferably, in the above-mentioned wafer cleaning machine, the guide wheel is arranged on the outer wall of the frame.

[0008] Preferably, in the above-mentioned wafer cleaning machine, the guide wheels in each row are arranged equally spaced.

[0009] Preferably, in the above-mentioned wafer cleaning machine, a slide rail is horizontally provided on the top of the frame, and the push plate is slidably connected with the slide rail.

[0010] Compared with the prior art, the advantages of the utility model are:

[0011] The telescopic cylinder drives the cover plate to rotate along the hinge to open the cover. After the telescopic cylinder unloads the force, the cover plate is closed by its own weight. In this way, the cover can be opened and closed automatically to improve efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, it is easy to obtain other drawings based on these drawings without creative work.

[0013] Figure 1 The figure is a schematic diagram of the structure of a wafer cleaning machine in a specific embodiment of the utility model;

[0014] Figure 2 Shown is a schematic diagram of the top view of the wafer cleaning machine in a specific embodiment of the utility model. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the utility model to describe the technical solutions in the embodiments of the utility model in detail. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0016] Ginseng Figure 1~2 As shown, the wafer cleaning machine in this embodiment includes a frame 1, a plurality of troughs 2 are arranged in the frame 1, a cover plate 3 is arranged on the troughs 2, the left end of the cover plate 3 is hinged to the frame 1, and a driving mechanism 4 for driving the cover plate 3 to rotate along the hinge is provided on the frame 1, the driving mechanism 4 includes a telescopic cylinder 401, a pair of ropes 402 and a plurality of guide wheels 403, the telescopic cylinder 401 is horizontally fixed on the top of the frame 1, a push plate 404 is fixed at the output end of the telescopic cylinder 401, and a plurality of guide wheels 403 are symmetrically arranged on the frame 1 in two rows front and back, the guide wheels 403 are rotatably connected to the frame 1, one end of a pair of ropes 402 is respectively fixedly connected to the two ends of the push plate 404, and the other ends of the pair of ropes 402 respectively pass through the two rows of guide wheels 403 and are fixedly connected to the right end of the cover plate 3.

[0017] Furthermore, the left end fixing sleeve of the cover plate 3 is arranged on the rotating shaft 5 , and the front and rear ends of the rotating shaft 5 are rotatably connected to the frame 1 through the bearing seat 6 .

[0018] Furthermore, the guide wheel 403 is arranged on the outer wall of the frame 1 .

[0019] Furthermore, each row of guide wheels 403 is arranged at equal intervals.

[0020] Furthermore, a slide rail 7 is horizontally provided on the top of the frame 1, and the push plate 404 is slidably connected with the slide rail 7.

[0021] In this technical solution, the cover is opened by driving the telescopic cylinder to pull the cover plate to rotate along the hinge, and the cover is closed by its own weight after the telescopic cylinder unloads the force, thereby automating the opening and closing of the cover and improving efficiency.

[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0023] The above is only a specific implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A wafer cleaning machine, comprising a frame, wherein a plurality of slots are arranged in the frame, and a cover plate is arranged on the slots, wherein: The left end of the cover plate is hinged to the frame, and the frame is provided with a driving mechanism for driving the cover plate to rotate along the hinge. The driving mechanism includes a telescopic cylinder, a pair of ropes and a plurality of guide wheels. The telescopic cylinder is horizontally fixed on the top of the frame, and a push plate is fixed to the output end of the telescopic cylinder. The plurality of guide wheels are symmetrically arranged on the frame in two rows front and back, and the guide wheels are rotatably connected to the frame. One ends of a pair of ropes are respectively fixedly connected to the two ends of the push plate, and the other ends of a pair of ropes pass through the two rows of guide wheels and are fixedly connected to the right end of the cover plate.

2. A wafer cleaning machine according to claim 1, characterized in that: The left end fixing sleeve of the cover plate is arranged on the rotating shaft, and the front and rear ends of the rotating shaft are rotatably connected with the frame through the bearing seat.

3. A wafer cleaning machine according to claim 1, characterized in that: The guide wheel is arranged on the outer wall of the frame.

4. A wafer cleaning machine according to claim 1, characterized in that: The guide wheels in each row are arranged at equal intervals.

5. The wafer cleaning machine according to claim 1, characterized in that: A slide rail is horizontally arranged on the top of the frame, and the push plate is slidably connected with the slide rail.

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