High-efficiency main shaft cooling device

By designing a cooling sleeve and agitation mechanism in the spindle cooling device, combining semiconductor refrigeration sheet and circulating flow, the problem of low temperature transfer cooling efficiency in the prior art is solved, and efficient and fast spindle cooling effect is achieved.

CN222791400UActive Publication Date: 2025-04-25YINGYUAN SCI & TECH NANJING
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Patent Information

Application Number
CN202421769417.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-25
Publication Date
2025-04-25
Estimated Expiration
2034-07-25

AI Technical Summary

Technical Problem

The existing spindle cooling device uses a single semiconductor refrigeration sheet to cool the coolant, which has low temperature transfer cooling efficiency, which is not conducive to efficient and rapid spindle cooling.

Method used

A high-efficiency spindle cooling device is designed, using a cooling sleeve and an agitating mechanism. The coolant flows circulating through the pump, and the semiconductor refrigeration sheet is combined to cool down. The contact between the coolant and the spindle is enhanced through the agitating mechanism to improve the heat dissipation efficiency.

Benefits of technology

Through the combination of circulating flow and semiconductor refrigeration sheet, the cooling efficiency of the coolant is significantly improved, the loss time during the temperature transfer process is reduced, and the overall heat dissipation efficiency is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a high-efficiency main shaft cooling device, which relates to the technical field of main shaft cooling devices and comprises a cooling jacket, a water inlet is arranged on the right side above the outer surface of the cooling jacket, a water outlet is arranged on the right side below the outer surface of the cooling jacket, and an assembly plate is fixedly arranged on the right rear side of the outer surface of the cooling jacket. A semiconductor chilling plate is fixedly arranged on the rear side of the surface of the assembly plate, and a stirring mechanism is arranged in the cooling sleeve. According to the high-efficiency main shaft cooling device, compared with an existing common main shaft cooling device, cooling liquid can cool the portion, wrapped by the lantern ring, of the shaft body through the through opening, the main shaft rotates through friction of the rubber pad, the lantern ring and the blades are driven to rotate, the blade cooling liquid is stirred, the cooling liquid can make full contact with the main shaft in an all-dimensional mode, and the cooling effect is improved. And the cooling device can be in full contact with the position of the semiconductor chilling plate for rapid cooling, so that the time consumed by cooling through temperature transfer is shortened, and the overall heat dissipation efficiency is further improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of spindle cooling devices, in particular to a high-efficiency spindle cooling device. Background Art

[0002] The machining center generally uses a spindle for transmission operation. One end of the spindle is connected to an external drive device, and the other end is fixed to a corresponding mechanical connection part. When the spindle rotates, since the vertical machining center is generally provided with components for supporting the spindle, the rotation of the spindle will generate a certain amount of heat due to friction with the supporting components, causing the temperature of the spindle to rise, further causing deformation of the components, and changing the rotation center of the spindle, affecting the machining accuracy. Therefore, the spindle needs to be cooled.

[0003] For example, the public document with application number 202321417538.3 discloses a spindle cooling device for a vertical machining center. The utility model ensures that when in use, the cooling operation is completed by directly utilizing semiconductor refrigeration plates. The operation is relatively simple, eliminating the steps of pump body delivery and circulating cooling of the coolant, and is convenient to use. In addition, since the device is made of steel as a whole, it is not prone to aging. It also ensures that the drain pipe is not prone to leakage, and at the same time, the condensed water in the cooling process can be discharged outward along the drain pipe in time, so as to achieve the effect of convenient use and not prone to leakage and damage to electronic devices. However, the spindle cooling device utilizes a single semiconductor refrigeration plate to directly cool the liquid inside the cooling sleeve, and the internal coolant can only be cooled gradually through temperature transfer. The temperature transfer cooling efficiency is low, which is not conducive to efficient and rapid cooling of the spindle.

[0004] Therefore, in view of this, the existing structural deficiencies are studied and improved, and a high-efficiency spindle cooling device is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a high-efficiency spindle cooling device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-efficiency spindle cooling device, comprising a cooling jacket, a water inlet is installed on the upper right side of the outer surface of the cooling jacket, a drain outlet is arranged on the lower right side of the outer surface of the cooling jacket, an assembly plate is fixedly installed on the right rear side of the outer surface of the cooling jacket, a semiconductor refrigeration plate is fixedly installed on the rear side of the surface of the assembly plate, and a stirring mechanism is arranged inside the cooling jacket.

[0007] Preferably, an upper bearing seat is fixedly provided through the middle portion of the inner wall of the upper end of the cooling jacket, and a lower bearing seat is fixedly provided through the middle portion of the inner wall of the lower end of the cooling jacket.

[0008] Preferably, the stirring mechanism comprises two bearing rings installed on the upper and lower sides of the inner surface of the cooling jacket, and blades are evenly distributed and installed on the inner sides of the surfaces of the bearing rings.

[0009] Preferably, the stirring mechanism further comprises a same sleeve ring on which the blade is fixedly arranged at one end away from the bearing ring, and a rubber pad is fixedly arranged on the inner side of the surface of the sleeve ring.

[0010] Preferably, the stirring mechanism further comprises a through opening formed on the surface of the collar, and the through opening penetrates the collar and the rubber pad.

[0011] Preferably, a shaft body is rotatably provided through the inner side of the surface of the upper bearing seat and the lower bearing seat, and a ring is passed through the surface of the shaft body to fit with a rubber pad.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model arranges an upper bearing seat, a lower bearing seat, a water inlet, a drain outlet, an assembly plate and a semiconductor refrigeration sheet, and utilizes the upper bearing seat and the lower bearing seat to prevent the entire cooling jacket from rotating when the spindle is working. The pump and the circulation pipeline connect the water inlet with the coolant storage tank, and the drain outlet is also connected to the coolant storage tank through the pipeline, so that the coolant is circulated in the cooling jacket through the pipeline, the water inlet and the drain outlet by the pump, so as to cool the spindle. The semiconductor refrigeration sheet can be used to further cool the coolant in the cooling jacket, so that the coolant keeps flowing at an extremely low temperature, thereby greatly improving the cooling efficiency of the entire spindle by liquid cooling;

[0014] 2. The utility model arranges a stirring mechanism, a bearing ring, blades, a sleeve ring, a rubber pad and a through-portion. The through-portion is utilized to allow the coolant to flow into the interior of the sleeve ring, and the portion of the shaft body covered by the sleeve ring can also be effectively cooled. When the main shaft rotates, the friction of the rubber pad can be utilized to drive the sleeve ring and the blades to rotate. The blades stir the coolant inside the cooling sleeve, so that the coolant can fully contact the main shaft in all directions, and can also fully contact the position of the semiconductor refrigeration plate for rapid cooling, thereby reducing the time lost by temperature transfer cooling, and further improving the overall heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the cross-sectional structure of the cooling jacket of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the stirring mechanism of the utility model.

[0018] In the figure: 1. cooling jacket; 2. upper bearing seat; 3. lower bearing seat; 4. water inlet; 5. drain outlet; 6. assembly plate; 7. semiconductor cooling plate; 8. stirring mechanism; 801. bearing ring; 802. blade; 803. sleeve ring; 804. rubber pad; 805. through port; 9. shaft. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-Figure 3 As shown, a high-efficiency spindle cooling device includes a cooling jacket 1, a water inlet 4 is installed on the upper right side of the outer surface of the cooling jacket 1, a drain outlet 5 is arranged on the lower right side of the outer surface of the cooling jacket 1, a mounting plate 6 is fixedly installed on the right rear side of the outer surface of the cooling jacket 1, a semiconductor refrigeration plate 7 is fixedly installed on the rear side of the surface of the mounting plate 6, and a stirring mechanism 8 is arranged inside the cooling jacket 1; the water inlet 4 is connected to the coolant storage tank by a pipeline and a pump, and the drain outlet 5 is also connected to the coolant storage tank by a pipeline.

[0021] By adopting the above technical solution, the coolant is circulated in the cooling jacket 1 through the pipeline, the water inlet 4 and the outlet 5 by a pump, so as to cool the spindle; the semiconductor refrigeration plate 7 can further cool the coolant in the cooling jacket 1, so that the coolant maintains an extremely low temperature while flowing.

[0022] Furthermore, an upper bearing seat 2 is fixedly provided through the middle of the inner wall of the upper end of the cooling jacket 1 , and a lower bearing seat 3 is fixedly provided through the middle of the inner wall of the lower end of the cooling jacket 1 .

[0023] By adopting the above technical solution, the upper bearing seat 2 and the lower bearing seat 3 prevent the entire cooling jacket 1 from rotating when the main shaft is working.

[0024] Furthermore, the stirring mechanism 8 comprises two bearing rings 801 installed on the upper and lower sides of the inner surface of the cooling jacket 1 , and blades 802 are evenly distributed and installed on the inner sides of the surfaces of the bearing rings 801 .

[0025] By adopting the above technical solution, the bearing ring 801 is the mounting fulcrum of the stirring mechanism 8 as a whole, and at the same time, the cooling jacket 1 is prevented from rotating with the stirring mechanism 8; when the blades 802 rotate, the coolant in the cooling jacket 1 can be stirred.

[0026] Furthermore, the stirring mechanism 8 also includes a same collar 803 fixedly arranged at one end of the blade 802 away from the bearing ring 801 , and a rubber pad 804 is fixedly arranged on the inner side of the surface of the collar 803 .

[0027] By adopting the above technical solution, the collar 803 is used to locate the main shaft penetration position; the rubber pad 804 can increase the contact friction.

[0028] Furthermore, the stirring mechanism 8 also includes a through-hole 805 opened on the surface of the collar 803 , and the through-hole 805 penetrates the collar 803 and the rubber pad 804 .

[0029] By adopting the above technical solution, the opening 805 allows the coolant to flow into the interior of the collar 803 , and the portion of the shaft 9 covered by the collar 803 can also be effectively cooled.

[0030] Furthermore, a shaft body 9 is rotatably provided through the inner side of the surface of the upper bearing seat 2 and the lower bearing seat 3 , and the surface of the shaft body 9 passes through a sleeve ring 803 and fits with a rubber pad 804 .

[0031] By adopting the above technical solution, the shaft body 9 utilizes the friction of the rubber pad 804 to drive the collar 803 and the blades 802 to rotate and stir when rotating.

[0032] Working principle: When using the high-efficiency spindle cooling device, first, the pump and the circulation pipeline connect the water inlet 4 to the coolant storage tank, and the drain port 5 is also connected to the coolant storage tank through the pipeline, so that the coolant is circulated in the cooling jacket 1 through the pipeline, the water inlet 4 and the drain port 5 by the pump, so as to cool the spindle. The coolant in the cooling jacket 1 can be further cooled by the semiconductor refrigeration sheet 7, so that the coolant keeps flowing at an extremely low temperature. The coolant can flow into the collar 803 by the through port 805, so as to cool the spindle. The portion of the shaft 9 covered by the collar 803 can also be effectively cooled. When the shaft 9 rotates, the friction of the rubber pad 804 drives the collar 803 and the blade 802 to rotate. The blade 802 stirs the coolant inside the cooling sleeve 1, so that the coolant can fully contact the main shaft in all directions, and can also fully contact the position of the semiconductor refrigeration plate 7 to quickly cool down, thereby reducing the time lost by temperature transfer cooling and further improving the overall heat dissipation efficiency. This is the working principle of the high-efficiency main shaft cooling device.

Claims

1. A high-efficiency spindle cooling device, comprising a cooling jacket (1), characterized in that: A water inlet (4) is installed on the upper right side of the outer surface of the cooling jacket (1), a drain outlet (5) is provided on the lower right side of the outer surface of the cooling jacket (1), a mounting plate (6) is fixedly installed on the right rear side of the outer surface of the cooling jacket (1), a semiconductor cooling plate (7) is fixedly installed on the rear side of the surface of the mounting plate (6), and a stirring mechanism (8) is provided inside the cooling jacket (1).

2. A high-efficiency spindle cooling device according to claim 1, characterized in that: An upper bearing seat (2) is fixedly disposed through the middle of the inner wall at the upper end of the cooling jacket (1), and a lower bearing seat (3) is fixedly disposed through the middle of the inner wall at the lower end of the cooling jacket (1).

3. A high-efficiency spindle cooling device according to claim 1, characterized in that: The stirring mechanism (8) comprises two bearing rings (801) installed on the upper and lower sides of the inner surface of the cooling jacket (1), and blades (802) are evenly distributed and installed on the inner side of the surface of the bearing ring (801).

4. A high-efficiency spindle cooling device according to claim 1, characterized in that: The stirring mechanism (8) further comprises a same collar (803) fixedly arranged at one end of the blade (802) away from the bearing ring (801), and a rubber pad (804) is fixedly arranged on the inner side of the surface of the collar (803).

5. The high-efficiency spindle cooling device according to claim 1, characterized in that: The stirring mechanism (8) further comprises a through-hole (805) opened on the surface of the collar (803), and the through-hole (805) penetrates the collar (803) and the rubber pad (804).

6. A high-efficiency spindle cooling device according to claim 2, characterized in that: A shaft body (9) is rotatably provided through the inner side of the surface of the upper bearing seat (2) and the lower bearing seat (3), and a sleeve ring (803) is passed through the surface of the shaft body (9) to fit with the rubber pad (804).

Citation Information

Patent Citations

  • Spindle cooling device of vertical machining center

    CN220408083U