Polishing device for wafer processing

Abstract

The utility model belongs to the technical field of wafers, and particularly discloses a polishing device for wafer processing, which comprises a polishing table, a [-shaped frame is arranged on the periphery of the polishing table, the section of the [-shaped frame is [-shaped, a sliding groove is arranged on the front side of the polishing table, and the inside of the sliding groove is communicated with the inside of the polishing table. A sliding groove is formed in the top of the polishing table, a collecting box is slidably connected into the sliding groove, a collecting groove is formed in the top of the polishing table, the interior of the collecting groove communicates with the interior of the polishing table, a rotating groove is formed in the top of the polishing table, a supporting rod is fixedly connected to the inner wall of the rotating groove, and an inclined face is arranged at the top of the supporting rod. The top of the polishing table can be cleaned in time through a brush, polishing waste residues can be cleaned into a collecting box for centralized treatment in cooperation with a collecting groove, and therefore the situation that after a workpiece is polished through the polishing device, a large amount of waste residues are accumulated on the top of the polishing table is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer technology, and particularly relates to a polishing device for wafer processing. Background Technique

[0002] The origin of the wafer is to first purify, melt and distill silicon dioxide to make a silicon ingot, and then the wafer factory grinds, polishes and slices the silicon ingot into a mother wafer.

[0003] After retrieval, it is known that the currently published patent: CN220881664U provides a grinding and polishing device for wafers, belonging to the technical field of wafers. The technical problem to be solved is to provide a grinding and polishing device for wafers. The adopted solution is: the grinding and polishing device for wafers includes a polishing table, a fixing frame, an electric push rod and processing raw materials. A transmission device is installed inside the polishing table, and the sliding part of the transmission device contacts the side of the processing raw materials. A telescopic device is installed at the center position inside the polishing table, and a grinding device is fixedly installed at the moving end of the electric push rod. The grinding and polishing device for wafers of the utility model can control the grinding thickness of the processing raw materials by adjusting the height of the processing raw materials through installing a transmission device, a telescopic device and a grinding device.

[0004] However, the following situations will still occur during the use of this device: Since the device is fixed and the height is adjusted by the staff placing the workpiece on the polishing table, and then the workpiece is polished by the polishing device, a large amount of waste residue will accumulate on the polishing table during the polishing process. If it is not cleaned in time, it may adhere to the workpiece, making the workpiece placed unevenly and clamped insecurely, and further making the polishing device inaccurate in polishing the workpiece. In view of the above situation, technological innovation is carried out on the basis of the existing device. Content of the Utility Model

[0005] The purpose of the utility model is to provide a polishing device for wafer processing to solve the problems put forward in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A polishing device for wafer processing, including a polishing table, a U-shaped frame is arranged around the polishing table, and the cross-section of the U-shaped frame is U-shaped. A sliding groove is opened on the front side of the polishing table, the inside of the sliding groove is communicated with the inside of the polishing table, a collection box is slidably connected inside the sliding groove, a collection groove is opened on the top of the polishing table, the inside of the collection groove is communicated with the inside of the polishing table, a rotating groove is opened on the top of the polishing table, a support rod is fixedly connected to the inner wall of the rotating groove, an inclined surface is arranged at the top of the support rod, a retaining wall is fixedly connected to the top of the polishing table, and a transmission groove is opened on the inner wall of the retaining wall, and a power cleaning device is arranged inside the transmission groove.

[0007] Preferably, a forward and reverse motor is fixedly connected to the rear side of the enclosure, and the output end of the forward and reverse motor rotates through the enclosure and extends to the inside of the transmission slot.

[0008] Preferably, the output end of the forward and reverse motor is fixedly connected with a threaded rod, and the threaded rod is rotatably connected to the inside of the transmission groove.

[0009] Preferably, the power cleaning device includes a connecting rod, which is slidably connected to the inside of the transmission groove, the surface of the threaded rod is threadedly connected to the inside of the connecting rod, a power groove is opened inside the connecting rod, the power groove is slidably connected inside with a fixed block extending to the outside thereof, the fixed block is opened inside with a fixed groove extending to the outside thereof, the interior of the fixed groove is communicated with the interior of the power groove, a cleaning plate is fixedly connected to the bottom of the fixed block, and a brush is provided at the bottom of the cleaning plate.

[0010] Preferably, a first bellows is fixedly connected to one side of the connecting rod, the first bellows is away from, one end of the connecting rod is fixedly connected to the inner wall of the transmission groove, and the first bellows is sleeved on the surface of the threaded rod.

[0011] Preferably, a second bellows is fixedly connected to a side of the connecting rod away from the first bellows, an end of the second bellows away from the connecting rod is fixedly connected to the inner wall of the transmission groove, and the second bellows is also sleeved on the surface of the threaded rod.

[0012] Preferably, the interior of the power slot is slidably connected with a power rod, the top of the power rod is fixedly connected with a protrusion extending to the outside of the connecting rod, and the power rod is plugged into the interior of the fixed slot.

[0013] Preferably, one end of the power rod away from the fixing groove is fixedly connected to a spring, and one end of the spring away from the power rod is fixedly connected to the inner wall of the power groove.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The polishing device for wafer processing can timely clean the top of the polishing table by means of a brush, and can cooperate with a collection groove to clean the polishing waste residue into the interior of a collection box for centralized treatment, thereby reducing the occurrence of a large amount of waste residue accumulated on the top of the polishing table after the polishing device polishes the workpiece. By timely cleaning the top of the polishing table, it is possible to effectively reduce the waste residue on the top of the polishing table from adhering to the surface of the workpiece, causing the workpiece to be placed unsteadily and clamped unfirmly, thereby affecting the polishing effect of the polishing device on the workpiece, and the like.

[0016] 2. For the polishing device for wafer processing, by sliding the bump by the staff, when the cleaning plate fails or the cleaning power of the brush is insufficient after long-term use, the staff can quickly disassemble the cleaning plate for repair and replacement, so that the cleaning plate can maintain efficient cleaning. At the same time, to a certain extent, the service life of the device can be extended, and the use cost can be effectively reduced. Brief Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of a polishing device for wafer processing according to the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the threaded rod of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the collection tank of the present utility model;

[0020] Figure 4 It is a schematic structural diagram of the power tank of the present utility model.

[0021] In the figure: 1, polishing table; 2, enclosure; 3, U-shaped frame; 4, sliding groove; 5, collection box; 6, transmission groove; 7, connecting rod; 8, fixed block; 9, cleaning plate; 10, positive and negative motor; 11, fixed groove; 12, first corrugated pipe; 13, second corrugated pipe; 14, threaded rod; 15, collection tank; 16, support rod; 17, power tank; 18, spring; 19, power rod; 20, rotating groove. Detailed Embodiment

[0022] Please refer to Figure 1-4, the present utility model provides a technical solution: a polishing device for wafer processing, including a polishing table 1. A U-shaped frame 3 is arranged around the polishing table 1. The cross-section of the U-shaped frame 3 is U-shaped. A polishing device is arranged at the bottom of the U-shaped frame 3. The polishing device is a conventional structure and will not be elaborated here. Workers can polish workpieces through the polishing device. The inside of the polishing table 1 is a hollow structure. A sliding groove 4 is opened on the front side of the polishing table 1. The inside of the sliding groove 4 communicates with the inside of the polishing table 1. A collection box 5 is slidably connected inside the sliding groove 4. A collection groove 15 is opened on the top of the polishing table 1. The inside of the collection groove 15 communicates with the inside of the polishing table 1. The number of the collection grooves 15 is two. A rotation groove 20 is opened on the top of the polishing table 1. A support rod 16 is fixedly connected to the inner wall of the rotation groove 20. The top of the support rod 16 is provided with an inclined surface. Through the inclined surface, the situation of polishing waste residue accumulating on the support rod 16 can be effectively reduced. A telescopic device is arranged on the support rod 16. The telescopic device is a conventional structure and will not be elaborated here. Workers can adjust the height of the workpiece through the telescopic device. A retaining wall 2 is fixedly connected to the top of the polishing table 1. Through the retaining wall 2, the polishing waste residue on the top of the polishing table 1 can be blocked, reducing the situation of polishing waste residue splashing. A transmission groove 6 is opened on the inner wall of the retaining wall 2. A power cleaning device is arranged inside the transmission groove 6.

[0023] Further, a positive and negative motor 10 is fixedly connected to the rear side of the retaining wall 2. The positive and negative motor 10 is a conventional structure and will not be elaborated here. The output end of the positive and negative motor 10 rotates through the retaining wall 2 and extends into the inside of the transmission groove 6.

[0024] Further, a threaded rod 14 is fixedly connected to the output end of the positive and negative motor 10. The threaded rod 14 is rotatably connected to the inside of the transmission groove 6.

[0025] Further, the power cleaning device includes a connecting rod 7. The connecting rod 7 is slidably connected to the inside of the transmission groove 6. The surface of the threaded rod 14 is threadedly connected to the inside of the connecting rod 7. By rotating the threaded rod 14, workers can make the connecting rod 7 perform a reciprocating motion. A power groove 17 is opened inside the connecting rod 7. A fixing block 8 extending to the outside is slidably connected inside the power groove 17. A fixing groove 11 extending to the outside is opened inside the fixing block 8. The inside of the fixing groove 11 communicates with the inside of the power groove 17. A cleaning plate 9 is fixedly connected to the bottom of the fixing block 8. A brush is arranged at the bottom of the cleaning plate 9. The brush can clean the top of the polishing table 1.

[0026] Further, a first bellows 12 is fixedly connected to one side of the connecting rod 7. One end of the first bellows 12 away from the connecting rod 7 is fixedly connected to the inner wall of the transmission groove 6. The first bellows is sleeved on the surface of the threaded rod 14.

[0027] Furthermore, a second bellows 13 is fixedly connected to one side of the connecting rod 7 away from the first bellows 12, and one end of the second bellows 13 away from the connecting rod 7 is fixedly connected to the inner wall of the transmission groove 6. The second bellows 13 is also sleeved on the surface of the threaded rod 14. Through the cooperation of the first bellows 12 and the second bellows 13, the occurrence of polishing waste adhering to the surface of the threaded rod 14 can be effectively reduced.

[0028] The staff starts the forward and reverse motor 10 through an external device, so that the output end of the forward and reverse motor 10 can drive the threaded rod 14 to rotate, the threaded rod 14 drives the connecting rod 7 to reciprocate, and the connecting rod drives the cleaning plate 9 to reciprocate. The cleaning plate 9 can timely clean the top of the polishing table 1 through the brush arranged at the bottom thereof, and can cooperate with the collecting groove 15 to sweep the polishing waste residue into the interior of the collecting box 5 for centralized treatment, thereby reducing the occurrence of a large amount of waste residue accumulated on the top of the polishing table 1 after the polishing device polishes the workpiece. By timely cleaning the top of the polishing table 1, it is possible to effectively reduce the waste residue on the top of the polishing table 1 adhering to the surface of the workpiece, making the workpiece unstable and not firmly clamped, thereby affecting the polishing effect of the polishing device on the workpiece.

[0029] Furthermore, a power rod 19 is slidably connected inside the power groove 17 , and a protrusion extending to the outside of the connecting rod 7 is fixedly connected to the top of the power rod 19 , and the power rod 19 is plugged into the inside of the fixing groove 11 .

[0030] Furthermore, one end of the power rod 19 away from the fixing groove 11 is fixedly connected to the spring 18, and one end of the spring 18 away from the power rod 19 is fixedly connected to the inner wall of the power groove 17. The staff can compress and reset the spring 18 by moving the power rod.

[0031] The staff can slide the protrusion on the top of the power rod 19 to make the power rod 19 slide out of the fixing groove 11 to release the fixation of the fixing block 8 and compress the spring 18. The staff can release the protrusion to reset the spring 18. The reaction force generated by the spring 18 makes the power rod 19 slide into the fixing groove 11 to fix the fixing block 8. By sliding the protrusion, the staff can quickly disassemble, repair and replace the cleaning plate 9 when the cleaning plate 9 fails or the brush is not strong enough after long-term use, so that the cleaning plate can maintain efficient cleaning. At the same time, the service life of the device can be extended to a certain extent and the use cost can be effectively reduced.

[0032] Working principle: For this type of polishing device for wafer processing, the staff first controls the external device to start the forward and reverse motor 10, so that the output end of the forward and reverse motor 10 can drive the threaded rod 14 to rotate, and the threaded rod 14 drives the connecting rod 7 to reciprocate, and the connecting rod drives the cleaning plate 9 to reciprocate. The cleaning plate 9 can clean the top of the polishing table 1 in time through the brush arranged at the bottom thereof, and can cooperate with the collection groove 15 to clean the polishing waste into the collection box 5 for centralized treatment. The staff can slide the power rod 19 out of the fixed groove 11 to release the fixation of the fixed block 8 and compress the spring 18 by sliding the protrusion on the top of the power rod 19. The staff can reset the spring 18 by loosening the protrusion, and the reaction force generated by the spring 18 causes the power rod 19 to slide into the fixed groove 11 for internal insertion, thereby fixing the fixed block 8.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polishing device for wafer processing, including a polishing table (1), a U-shaped frame (3) is arranged around the polishing table (1), and the cross-section of the U-shaped frame (3) is U-shaped, characterized in that: The front side of the polishing table (1) is provided with a sliding groove (4), the interior of the sliding groove (4) is communicated with the interior of the polishing table (1), the interior of the sliding groove (4) is slidably connected with a collecting box (5), the top of the polishing table (1) is provided with a collecting groove (15), the interior of the collecting groove (15) is communicated with the interior of the polishing table (1), the top of the polishing table (1) is provided with a rotating groove (20), the inner wall of the rotating groove (20) is fixedly connected with a support rod (16), the top of the support rod (16) is provided with an inclined surface, the top of the polishing table (1) is fixedly connected with an enclosure (2), the inner wall of the enclosure (2) is provided with a transmission groove (6), and the interior of the transmission groove (6) is provided with a power cleaning device.

2. A polishing device for wafer processing according to claim 1, characterized in that: A forward and reverse motor (10) is fixedly connected to the rear side of the enclosure (2), and the output end of the forward and reverse motor (10) rotates through the enclosure (2) and extends to the inside of the transmission slot (6).

3. A polishing device for wafer processing according to claim 2, characterized in that: The output end of the forward and reverse motor (10) is fixedly connected with a threaded rod (14), and the threaded rod (14) is rotationally connected to the inside of the transmission groove (6).

4. A polishing device for wafer processing according to claim 3, characterized in that: The power cleaning device comprises a connecting rod (7), wherein the connecting rod (7) is slidably connected to the inside of a transmission groove (6), the surface of the threaded rod (14) is threadedly connected to the inside of the connecting rod (7), a power groove (17) is provided inside the connecting rod (7), a fixed block (8) extending to the outside of the power groove (17) is slidably connected to the inside of the power groove (17), a fixed groove (11) extending to the outside of the fixed block (8) is provided inside the fixed block (8), the inside of the fixed groove (11) is communicated with the inside of the power groove (17), a cleaning plate (9) is fixedly connected to the bottom of the fixing block (8), and a brush is provided at the bottom of the cleaning plate (9).

5. A polishing device for wafer processing according to claim 4, characterized in that: A first bellows (12) is fixedly connected to one side of the connecting rod (7), the first bellows (12) is away from one end of the connecting rod (7) and is fixedly connected to the inner wall of the transmission groove (6), and the first bellows is sleeved on the surface of the threaded rod (14).

6. A wafer processing polishing device according to claim 5, characterized in that: A second bellows (13) is fixedly connected to the side of the connecting rod (7) away from the first bellows (12); an end of the second bellows (13) away from the connecting rod (7) is fixedly connected to the inner wall of the transmission groove (6); and the second bellows (13) is also sleeved on the surface of the threaded rod (14).

7. A wafer processing polishing device according to claim 4, characterized in that: The power slot (17) is slidably connected to a power rod (19), the top of the power rod (19) is fixedly connected to a protrusion extending to the outside of the connecting rod (7), and the power rod (19) is plugged into the inside of the fixing slot (11).

8. A wafer processing polishing device according to claim 7, characterized in that: One end of the power rod (19) away from the fixing groove (11) is fixedly connected to a spring (18), and one end of the spring (18) away from the power rod (19) is fixedly connected to the inner wall of the power groove (17).

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