Polishing pad for thinning processing of glass substrate

Abstract

The utility model discloses a polishing pad for thinning processing of a glass substrate, relates to the field of polishing pads, and aims to solve the problems that in the prior art, when the glass substrate is thinned, micro impurity particles often exist on the surface of the glass substrate, and the existing polishing pad is not provided with a deslagging structure, so that the surface of the glass substrate is not damaged during polishing. And the micro particles are easy to scratch the surface of the glass substrate. Four guide columns are fixedly connected to the upper end face of the mounting plate in an annular array mode, a fixed column is fixedly connected to the middle of the upper end face of the mounting plate, the four guide columns are jointly connected with a movable plate, a telescopic pipe is fixedly connected to the middle of the movable plate, and a connecting pipe is fixedly connected to the upper end of the telescopic pipe. A polishing pad base plate is connected to the lower end of the mounting plate, a polishing pad is fixedly connected to the lower end face of the polishing pad base plate, and a plurality of arc-shaped slag guide grooves are formed in the lower end face of the polishing pad in an annular array mode.

Description

Technical Field

[0001] The utility model relates to the field of polishing pads, in particular to a polishing pad for glass substrate thinning processing. Background Art

[0002] Polishing pads, also known as polishing leathers, polishing cloths, and polishing sheets, are important auxiliary materials that determine the surface quality in chemical mechanical polishing. They can be divided into abrasive polishing pads and non-abrasive polishing pads according to whether they contain abrasives; they can be divided into polyurethane polishing pads, non-woven polishing pads, and composite polishing pads according to different materials; they can be roughly divided into plane type, grid type, and spiral type according to different surface structures.

[0003] Authorization announcement number CN 217194629 U, a polishing pad for glass substrate thinning processing, including a polishing plate, the inner surface of the polishing plate is symmetrically provided with a first slide groove, and the two first slide grooves are connected by a sliding plate, the lower surface of the sliding plate is movably connected with a buffer plate, the lower surface of the buffer plate is symmetrically provided with a plug plate, the buffer plate and the sliding plate are connected by a first spring, the lower surface of the buffer plate is symmetrically fixedly connected with a mounting plate, and the two mounting plates are connected by a polishing pad. The utility model polishes the glass surface by a polishing pad. When the polishing pad is used for a long time, the surface of the polishing pad causes serious wear and tear, which reduces the polishing effect of the polishing pad on the glass surface. The user can loosen the fastening bolts to disassemble the polishing pad and replace the polishing pad. The operation is simple and convenient, and the polishing pad can be quickly replaced, which improves practicality.

[0004] Since micro-impurity particles often exist on the surface of the glass substrate during the thinning process, the existing polishing pads do not have a slag removal structure, so that the micro-particles can easily scratch the surface of the glass substrate during polishing; therefore, the market urgently needs to develop a polishing pad for glass substrate thinning to help people solve the existing problem. Utility Model Content

[0005] The utility model aims to provide a polishing pad for glass substrate thinning processing, so as to solve the problem raised in the above background technology that when the glass substrate is thinned, micro impurity particles often exist on the surface of the glass substrate, and the existing polishing pads do not have a slag removal structure, so that the micro particles are easy to scratch the surface of the glass substrate during polishing.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a polishing pad for glass substrate thinning processing, comprising a mounting plate, four guide columns are fixedly connected to the upper end surface of the mounting plate in an annular array, a fixed column is fixedly connected to the middle of the upper end surface of the mounting plate, a movable plate is commonly connected to the four guide columns, a telescopic tube is fixedly connected to the middle of the movable plate, a connecting tube is fixedly connected to the upper end of the telescopic tube, a polishing pad base plate is connected to the lower end surface of the polishing pad base plate, and a polishing pad is fixedly connected to the lower end surface of the polishing pad, and a plurality of arc-shaped slag guide grooves are arranged in an annular array on the lower end surface of the polishing pad.

[0007] Preferably, circular openings are provided at both front and rear ends of both sides of the middle of the movable plate, and the four guide posts respectively pass through the four circular openings, extend to the upper end of the movable plate and are fixedly connected to the limiting plate.

[0008] Preferably, a spring is arranged on the outer side of the guide column between the movable plate and the mounting plate.

[0009] Preferably, rectangular limiting portions are fixedly connected to both sides of the fixing column, and rectangular limiting sliding grooves are arranged on both sides of the inside of the telescopic tube.

[0010] Preferably, the upper end of the fixing column is inserted into the telescopic tube and the two rectangular limiting portions are respectively slid into the two rectangular limiting sliding grooves.

[0011] Preferably, four connection holes are arranged in a circular array on the mounting plate, and four threaded columns are fixedly connected in a circular array on the upper end of the polishing pad substrate.

[0012] Preferably, the mounting plate and the polishing pad substrate are fixed by four threaded columns passing through four connection holes respectively and bolts are used to thread the threaded columns.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. In the utility model, a plurality of arc-shaped slag guide grooves are arranged in an annular array on the lower end surface of the polishing pad through the arrangement of the arc-shaped slag guide grooves. When the polishing pad performs rotational polishing on the glass substrate, the arc-shaped slag guide grooves are used to collect micro impurity particles during rotation. The arc-shaped shape of the arc-shaped slag guide grooves allows the micro impurity particles to move outward along the arc-shaped slag guide grooves as they rotate, and are discharged from one side of the polishing pad, thereby effectively preventing the micro impurity particles from affecting the polishing of the glass substrate.

[0015] 2. In the utility model, a spring is arranged on the outside of the guide column between the movable plate and the mounting plate through the setting of the spring. When the mounting plate pushes the polishing pad substrate to make the polishing pad polish the glass substrate, the spring is contracted by pressing down the movable plate, thereby increasing the pressure of the polishing pad on the glass substrate, increasing the polishing force, and facilitating the adjustment of the polishing force on the glass substrate.

[0016] 3. In the utility model, through the setting of threaded columns, four connecting holes are arranged in a circular array on the mounting plate, and four threaded columns are fixedly connected to the circular array on the upper end of the polishing pad substrate. The mounting plate and the polishing pad substrate are fixed by four threaded columns passing through the four connecting holes respectively and being threadedly connected and fixed by bolts and the threaded columns. At the same time, when the polishing pad is worn, the polishing pad can be replaced by separating the bolts. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a front view of a polishing pad for glass substrate thinning processing according to the utility model;

[0018] Figure 2 It is a bottom view of the utility model;

[0019] Figure 3 It is a top view of the utility model;

[0020] Figure 4 It is the main sectional view of the utility model.

[0021] In the figure: 1. Mounting plate; 101. Connecting hole; 102. Guide column; 103. Spring; 104. Limiting plate; 2. Fixed column; 201. Rectangular limiting portion; 3. Movable plate; 301. Circular opening; 302. Telescopic tube; 303. Rectangular limiting groove; 304. Connecting tube; 4. Polishing pad base plate; 401. Threaded column; 402. Bolt; 5. Polishing pad; 501. Arc-shaped slag guide groove. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] See also Figure 1-4The utility model provides an embodiment: a polishing pad for glass substrate thinning processing, comprising a mounting plate 1, wherein four guide columns 102 are fixedly connected in an annular array on the upper end surface of the mounting plate 1, a fixed column 2 is fixedly connected in the middle of the upper end surface of the mounting plate 1, a movable plate 3 is commonly connected to the four guide columns 102, a telescopic tube 302 is fixedly connected in the middle of the movable plate 3, a connecting tube 304 is fixedly connected to the upper end of the telescopic tube 302, a polishing pad substrate 4 is connected to the lower end of the mounting plate 1, a polishing pad 5 is fixedly connected to the lower end surface of the polishing pad substrate 4, and a plurality of arc-shaped slag guide grooves 501 are arranged in an annular array on the lower end surface of the polishing pad 5. When the polishing pad 5 performs rotational polishing on the glass substrate, the arc-shaped slag guide grooves 501 are used to collect micro impurity particles during rotation, and the arc-shaped shape of the arc-shaped slag guide grooves 501 allows the micro impurity particles to move outward along the arc-shaped slag guide grooves 501 when the arc-shaped slag guide grooves 501 rotate, and are discharged from one side of the polishing pad 5, thereby effectively preventing the micro impurity particles from affecting the polishing of the glass substrate.

[0024] Furthermore, circular openings 301 are provided at both front and rear ends of both sides of the middle part of the movable plate 3, and four guide columns 102 extend to the upper end of the movable plate 3 through the four circular openings 301 respectively and are fixedly connected to the limiting plates 104, so that the movable plate 3 can be raised and lowered on the guide columns 102, and the lifting and lowering of the movable plate 3 is guided by the guide columns 102 to ensure the stability of the lifting and lowering of the movable plate 3.

[0025] Furthermore, a spring 103 is arranged on the outside of the guide column 102 between the movable plate 3 and the mounting plate 1. When the mounting plate 1 pushes the polishing pad substrate 4 to make the polishing pad 5 polish the glass substrate, the spring 103 is contracted by pressing down the movable plate 3, thereby increasing the pressure of the polishing pad 5 on the glass substrate, thereby increasing the polishing force and facilitating the adjustment of the polishing force on the glass substrate.

[0026] Furthermore, rectangular limiting portions 201 are fixedly connected to both sides of the fixed column 2 , and rectangular limiting sliding grooves 303 are arranged on both sides of the telescopic tube 302 .

[0027] Furthermore, the upper end of the fixed column 2 is inserted into the telescopic tube 302 and the two rectangular limiting parts 201 are respectively slid into the two rectangular limiting grooves 303, and the connecting tube 304 is installed on the driving device. The driving device drives the connecting tube 304 to rotate, and then drives the telescopic tube 302 to rotate, so that the telescopic tube 302 drives the fixed column 2 to rotate, and then the mounting plate 1 drives the polishing pad substrate 4 to rotate, and the glass substrate is polished by the rotation of the polishing pad 5.

[0028] Furthermore, four connecting holes 101 are arranged in a circular array on the mounting plate 1 , and four threaded columns 401 are fixedly connected in a circular array on the upper end of the polishing pad substrate 4 .

[0029] Furthermore, the mounting plate 1 and the polishing pad substrate 4 are fixed via four threaded columns 401 that pass through the four connecting holes 101 respectively and are threadedly connected and fixed with bolts 402 and the threaded columns 401. At the same time, when the polishing pad 5 is worn, the polishing pad 5 can be replaced by separating the bolts 402.

[0030] Working principle: When in use, four guide columns 102 are fixedly connected to the circular array on the upper end surface of the mounting plate 1, and a fixed column 2 is fixedly connected to the middle part of the upper end surface of the mounting plate 1. The four guide columns 102 are commonly connected to a movable plate 3. Circular openings 301 are provided at the front and rear ends on both sides of the middle part of the movable plate 3. The four guide columns 102 respectively pass through the four circular openings 301 to extend to the upper end of the movable plate 3 and are fixedly connected to the limiting plates 104, so that the movable plate 3 can be lifted and lowered on the guide columns 102. At the same time, the lifting and lowering of the movable plate 3 is guided by the guide columns 102 to ensure the stability of the lifting and lowering of the movable plate 3. A spring 103 is provided between the movable plate 3 and the mounting plate 1 on the outer side of the guide column 102. When the mounting plate 1 pushes the polishing pad substrate 4 to make the polishing pad 5 polish the glass substrate, the spring 103 is contracted by pressing down the movable plate 3, thereby increasing the pressure of the polishing pad 5 on the glass substrate, increasing the polishing force, and facilitating the adjustment of the polishing force on the glass substrate. Four threaded columns 4 are passed between the mounting plate 1 and the polishing pad substrate 4. 01 passes through the four connecting holes 101 respectively and is threadedly connected and fixed with bolts 402 and threaded columns 401, so that the mounting plate 1 and the polishing pad substrate 4 are fixed. At the same time, when the polishing pad 5 is worn, the polishing pad 5 can be replaced by separating the bolts 402, and the connecting pipe 304 is installed on the driving device. The driving device drives the connecting pipe 304 to rotate, and then drives the telescopic tube 302 to rotate, so that the telescopic tube 302 drives the fixed column 2 to rotate, and then the mounting plate 1 drives the polishing pad substrate 4 to rotate, and the glass substrate is polished by rotating the polishing pad 5. A plurality of arc-shaped slag guide grooves 501 are arranged in an annular array on the lower end surface of the polishing pad 5. When the polishing pad 5 rotates and polishes the glass substrate, the arc-shaped slag guide grooves 501 are used to collect micro impurity particles during rotation, and the arc-shaped shape of the arc-shaped slag guide grooves 501 makes the micro impurity particles move outward along the arc-shaped slag guide grooves 501 when the arc-shaped slag guide grooves 501 rotate, and are discharged from one side of the polishing pad 5, effectively preventing the micro impurity particles from affecting the polishing of the glass substrate.

[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A polishing pad for glass substrate thinning, comprising a mounting plate (1), characterized in that: The upper end surface of the mounting plate (1) is fixedly connected to four guide columns (102) in an annular array, the middle portion of the upper end surface of the mounting plate (1) is fixedly connected to a fixed column (2), the four guide columns (102) are commonly connected to a movable plate (3), the middle portion of the movable plate (3) is fixedly connected to a telescopic tube (302), the upper end of the telescopic tube (302) is fixedly connected to a connecting tube (304), the lower end of the mounting plate (1) is connected to a polishing pad substrate (4), the lower end surface of the polishing pad substrate (4) is fixedly connected to a polishing pad (5), and the lower end surface of the polishing pad (5) is provided with a plurality of arc-shaped slag guide grooves (501) in an annular array.

2. The polishing pad for glass substrate thinning according to claim 1, characterized in that: Circular openings (301) are provided at both front and rear ends of the middle of the movable plate (3), and the four guide posts (102) respectively pass through the four circular openings (301) to extend to the upper end of the movable plate (3) and are fixedly connected to the limiting plate (104).

3. The polishing pad for glass substrate thinning according to claim 2, characterized in that: A spring (103) is arranged on the outside of the guide column (102) between the movable plate (3) and the mounting plate (1).

4. The polishing pad for glass substrate thinning according to claim 1, characterized in that: Rectangular limiting portions (201) are fixedly connected to both sides of the fixed column (2), and rectangular limiting sliding grooves (303) are arranged on both sides of the inside of the telescopic tube (302).

5. The polishing pad for glass substrate thinning according to claim 4, characterized in that: The upper end of the fixing column (2) is inserted into the interior of the telescopic tube (302) and enables the two rectangular limiting portions (201) to slide into the two rectangular limiting sliding grooves (303) respectively.

6. The polishing pad for glass substrate thinning according to claim 1, characterized in that: Four connection holes (101) are arranged in an annular array on the mounting plate (1), and four threaded columns (401) are fixedly connected in an annular array on the upper end of the polishing pad substrate (4).

7. The polishing pad for glass substrate thinning according to claim 6, characterized in that: The mounting plate (1) and the polishing pad base plate (4) are connected by four threaded columns (401) passing through four connection holes (101) respectively, and are fixed by bolts (402) and the threaded columns (401) through thread connection.

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