Transportation device for semiconductor equipment part processing

Abstract

The utility model discloses a transporting device for semiconductor equipment part processing, which relates to the technical field of transporting devices and comprises a pressing mechanism, the pressing mechanism comprises a transporting box, a box cover is arranged at the top of the transporting box, mounting bins are arranged on two sides of the transporting box, air cylinders are arranged in the two mounting bins, and the air cylinders are arranged in the transporting box. And telescopic rods are arranged at the output ends of the tops of the two air cylinders correspondingly, a sponge cushion is arranged on the bottom side in the conveying box, a partition plate is arranged in the conveying box, and four pressing plates are arranged at the bottom of the box cover. The air cylinder is started to enable the telescopic rod to drive the box cover to ascend and descend automatically, in the descending process of the box cover and the pressing plate, the bottom of the pressing plate can make contact with semiconductor equipment parts stacked in the compartment, and then the effect of pressing the semiconductor equipment parts in the compartment is achieved; and the semiconductor equipment parts in the transportation box are prevented from shaking in the transportation process, and the quality safety of the semiconductor equipment parts is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of transport devices, in particular to a transport device for processing semiconductor equipment parts. Background Art

[0002] Semiconductor equipment parts refer to various components used to manufacture and assemble semiconductor equipment. These parts play a vital role in electronic equipment, including integrated circuits, transistors, diodes, resistors, capacitors, etc. These parts are interconnected through sophisticated process technology and together constitute the core part of semiconductor equipment.

[0003] The existing authorization announcement number is CN214002461U, which discloses a semiconductor parts processing transportation device with a classified storage function, including a transportation box, rollers and a storage mechanism, the bottom of the transportation box is equipped with four rollers in a rectangular array, a push handle is installed on one side of the transportation box, a baffle is fixedly inserted in the middle of the inner cavity of the transportation box, and a connecting pipe is fixedly inserted in the middle of the baffle, and a hot air blower is installed at the top center of the transportation box, and the output end of the hot air blower is connected to the connecting pipe; the inner cavity of the transportation box is equipped with multiple storage mechanisms, and the storage mechanisms include a storage box, a ventilation hole 1 and a ventilation hole 2, and the inner walls of the two sides of the transportation box are evenly connected with multiple slide rails, and a storage box is connected between the corresponding two slide rails through a slider. The semiconductor parts processing transportation device with a classified storage function can always keep the inside of the device dry to ensure that the semiconductor parts will not be damaged by moisture.

[0004] The above technical solution can always keep the inside of the device dry and ensure that the semiconductor parts will not be damaged by moisture. However, during transportation, the road surface may be uneven, which may cause the semiconductor equipment parts in the transport box to shake, which may increase the friction between the parts, thereby affecting the surface quality of the parts. Secondly, the shaking may also cause the relative position between the parts to change, thereby affecting the assembly accuracy of the equipment. Therefore, we provide a transportation device for processing semiconductor equipment parts. Utility Model Content

[0005] The purpose of the utility model is to provide a transport device for processing semiconductor equipment parts to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a transportation device for processing semiconductor equipment parts, comprising: a clamping mechanism, the clamping mechanism comprising a transportation box, a box cover is arranged on the top of the transportation box, installation bins are opened on both sides of the transportation box, cylinders are arranged inside the two installation bins, telescopic rods are arranged at the output ends of the tops of the two cylinders, a sponge pad is arranged on the bottom side of the interior of the transportation box, a partition is arranged inside the transportation box, four pressure plates are arranged at the bottom of the box cover, multiple movable rods are arranged on the top of the four pressure plates, buffer springs are arranged on the outside of the multiple movable rods, fixed tubes are arranged on the top of the multiple movable rods, and a dehumidification mechanism is arranged on the top of the box cover.

[0007] As a further preferred embodiment of the present technical solution, the dehumidification mechanism includes a hot air blower, and a transmission pipe is connected to the bottom output end of the hot air blower. The other end of the transmission pipe passes through the box cover and is inserted into a slot opened in the center of the partition. A plurality of air holes are opened in a circular array on the outside of the transmission pipe, and a plurality of air grooves are provided through the slot opened in the center of the partition.

[0008] As a further preferred embodiment of the present technical solution, the bottom of the transport box is fixedly connected to the top of the transport base, cylinders are docked inside the two installation bins, and one end of the telescopic rod is docked with the output end of the top of the cylinder.

[0009] As a further preferred embodiment of the present technical solution, the other end of the cylinder passes through a slot provided on one side of the transport box and is fixedly connected to one side of the bottom of the box cover, and three positioning columns are fixedly connected to both sides of the top of the transport box.

[0010] As a further preferred embodiment of the present technical solution, three positioning holes are respectively opened on both sides of the bottom of the box cover, the outside of the positioning column is plugged into the inner wall of the positioning hole, and the bottom of the sponge pad is fixedly connected to the bottom side of the inside of the transport box.

[0011] As a further preferred embodiment of the present technical solution, the four sides of the partition are respectively fixedly connected to the four sides of the inner wall of the transport box, and the top of the pressure plate is fixedly connected to the bottom end of the movable rod.

[0012] As a further preferred embodiment of the present technical solution, the top surface of the movable rod passes through the inner ring of the buffer spring and is slidably connected to the inner wall of the fixed tube. The top of the fixed tube is fixedly connected to the bottom of the box cover. One end of the buffer spring is fixedly connected to the top of the pressure plate, and the other end of the buffer spring is fixedly connected to the bottom of the fixed tube.

[0013] The utility model provides a transport device for processing semiconductor equipment parts, which has the following beneficial effects:

[0014] (1) The utility model starts the cylinder to make the telescopic rod drive the box cover to automatically rise and fall. During the process of the box cover and the pressure plate descending, the bottom of the pressure plate will contact the semiconductor equipment parts piled up in the compartment, thereby achieving the effect of pressing the semiconductor equipment parts in the compartment, avoiding the shaking of the semiconductor equipment parts in the transport box during transportation, and ensuring the quality and safety of the semiconductor equipment parts.

[0015] (2) The utility model can transmit hot air to the transmission pipe by starting the hot air blower, and discharge the hot air into the four compartments through the air holes and the air grooves, thereby ensuring that the environment in the four compartments remains dry and preventing the semiconductor equipment parts in the compartments from being damp. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model is a schematic diagram of the structure of a transport device for processing semiconductor equipment parts.

[0017] Figure 2 The utility model is a schematic structural diagram of the dissected and disassembled side of a pressing mechanism of a transport device for processing semiconductor equipment parts.

[0018] Figure 3 The utility model is a schematic structural diagram of a partially disassembled side surface of a pressing mechanism of a transport device for processing semiconductor equipment parts.

[0019] Figure 4 The utility model is a schematic structural diagram of the disassembled side of a dehumidification mechanism of a transport device for processing semiconductor equipment parts.

[0020] In the figure: 1, clamping mechanism; 11, transport box; 12, box cover; 13, installation compartment; 14, cylinder; 15, telescopic rod; 16, positioning column; 17, sponge pad; 18, partition; 19, positioning hole; 110, fixing tube; 111, movable rod; 112, buffer spring; 113, pressing plate;

[0021] 2. Dehumidification mechanism; 21. Hot air blower; 22. Transmission pipe; 23. Air vent; 24. Air vent;

[0022] 31. Transport base. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0024] The utility model provides a technical solution: Figure 1-Figure 4As shown, in the present embodiment, a transport device for processing semiconductor equipment parts comprises: a clamping mechanism 1, the clamping mechanism 1 comprises a transport box 11, a box cover 12 is arranged on the top of the transport box 11, installation chambers 13 are provided on both sides of the transport box 11, cylinders 14 are arranged inside the two installation chambers 13, and telescopic rods 15 are arranged on the output ends of the tops of the two cylinders 14, the bottom of the transport box 11 is fixedly connected to the top of the transport base 31, the cylinders 14 are docked inside the two installation chambers 13, one end of the telescopic rod 15 is docked with the output end of the top of the cylinder 14, and the other end of the cylinder 14 passes through the card slot opened on one side of the transport box 11 and is fixedly connected to one side of the bottom of the box cover 12, three positioning columns 16 are fixedly connected to both sides of the top of the transport box 11, a sponge pad 17 is arranged on the bottom side of the transport box 11, and three positioning holes 19 are respectively opened on both sides of the bottom of the box cover 12, and the outer side of the positioning column 16 is connected to the fixed The inner wall of the positioning hole 19 is plugged in, and the bottom of the sponge pad 17 is fixedly connected to the bottom side of the interior of the transport box 11. A partition 18 is arranged in the transport box 11, and four pressing plates 113 are arranged at the bottom of the box cover 12. A plurality of movable rods 111 are arranged on the top of the four pressing plates 113. The four sides of the partition 18 are respectively fixedly connected to the four sides of the inner wall of the transport box 11, and the top of the pressing plate 113 is fixedly connected to the bottom end of the movable rod 111. Buffer springs 112 are arranged on the outside of the plurality of movable rods 111, and fixed tubes 110 are arranged on the top of the plurality of movable rods 111. The top surface of the movable rod 111 passes through the inner circle of the buffer spring 112 and is slidably connected to the inner wall of the fixed tube 110. The top of the fixed tube 110 is fixedly connected to the bottom of the box cover 12, one end of the buffer spring 112 is fixedly connected to the top of the pressing plate 113, and the other end of the buffer spring 112 is fixedly connected to the bottom of the fixed tube 110. A dehumidification mechanism 2 is arranged on the top of the box cover 12.

[0025] In this embodiment, when the staff needs to use the transportation equipment to transport semiconductor equipment parts, the partition 18 can divide the internal space of the transportation box 11 to form four compartments, which is convenient for classifying and storing semiconductor equipment parts. After these semiconductor equipment parts are stored in the compartments respectively, the telescopic rod 15 is driven to retract by starting the cylinder 14, so that the box cover 12 will drop. When it drops to the specified position, the positioning column 16 will be inserted into the positioning hole 19, thereby limiting the box door at the top of the transportation box 11 to prevent the box cover 12 from shaking when the transportation box 11 is bumpy on the road. In addition, when the box cover 12 is lowered, the transmission pipe 22 at the bottom of the hot air blower 21 will be plugged into the card slot opened at the center of the partition 18. However, when the stacking height of the semiconductor parts in each compartment is equal to the height of the partition 18, the box cover 12 will be placed in the storage tank 11. At the same time, since the descent of the cover plate will synchronously drive the four pressure plates 113 to descend, the four pressure plates 113 will respectively squeeze the semiconductor equipment parts stacked in the four compartments. When the bottom of the pressure plate 113 contacts the semiconductor equipment parts, the pressure plate 113 will be squeezed to transmit the squeezing force to the buffer spring 112 and the movable rod 111, and then the movable rod 111 will be recessed into the fixed tube 110, and the buffer spring 112 will shrink and deform. The advantage is that it can avoid damage to the parts caused by excessive pressure when the pressure plate 113 is pressed down. Therefore, the pressure plate 113 after being pressed down will achieve a compacting effect on the semiconductor equipment parts in the compartment, avoid shaking of the semiconductor equipment parts in the transport box 11 during transportation, and ensure the quality and safety of the semiconductor equipment parts. However, the sponge pad 17 can alleviate the weight borne by the parts at the bottom of the compartment.

[0026] like Figure 1-Figure 4 As shown, the dehumidification mechanism 2 includes a hot air blower 21, and a transmission pipe 22 is connected to the bottom output end of the hot air blower 21. The other end of the transmission pipe 22 passes through the box cover 12 and is inserted into a slot opened in the center of the partition 18. A plurality of air holes 23 are opened in a circular array outside the transmission pipe 22, and a plurality of air grooves 24 are inserted through the slot opened in the center of the partition 18.

[0027] In this embodiment, by starting the hot air blower 21, hot air can be transmitted to the transmission pipe 22, and the hot air is discharged into the four compartments through the air holes 23 and the air grooves 24, ensuring that the environment in the four compartments remains dry and preventing the semiconductor equipment parts in the compartments from being damp.

[0028] The utility model provides a transport device for processing semiconductor equipment parts, and the specific working principle is as follows:

[0029] When the staff needs to use the transport equipment to transport semiconductor equipment parts, since the partition 18 can divide the internal space of the transport box 11 into four compartments, after the semiconductor equipment parts are classified and stored, the cylinder 14 can be started to drive the telescopic rod 15 to retract, and the box cover 12 begins to descend under the action of the telescopic rod 15. When the box cover 12 descends to the specified position, the positioning column 16 will be inserted into the positioning hole 19 to achieve the effect of limiting the box door at the top of the transport box 11. In addition, during the descent of the box cover 12, the transmission pipe 22 at the bottom of the hot air blower 21 will be plugged into the card slot opened at the center position of the partition 18. At the same time, the descent of the cover will synchronously drive the four pressure plates 113 to descend. These four pressure plates 113 The semiconductor equipment parts in the four compartments will be squeezed respectively. When the bottom of the pressure plate 113 contacts the semiconductor equipment parts, the pressure plate 113 will be subjected to squeezing force, and this squeezing force will be transmitted to the buffer spring 112 and the movable rod 111. Due to the elastic characteristics of the buffer spring 112, they will shrink and deform, thereby absorbing part of the squeezing force. At the same time, the movable rod 111 will also be recessed into the fixed tube 110 to further disperse the squeezing force. Therefore, when the pressure plate 113 is pressed down, they will have a pressing effect on the semiconductor equipment parts in the compartment. In addition, by starting the hot air blower 21, the hot air can be transmitted to the transmission tube 22, and the hot air can be discharged into the four compartments through the air holes 23 and the air grooves 24 to ensure that the environment in the four compartments remains dry.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transport device for processing semiconductor equipment parts, characterized in that: include: A clamping mechanism (1), the clamping mechanism (1) comprising a transport box (11), a box cover (12) being arranged on the top of the transport box (11), installation chambers (13) being provided on both sides of the transport box (11), cylinders (14) being arranged inside the two installation chambers (13), telescopic rods (15) being arranged at the output ends of the tops of the two cylinders (14), a sponge pad (17) being arranged on the bottom side of the interior of the transport box (11), a partition (18) being arranged inside the transport box (11), four pressing plates (113) being arranged on the bottom of the box cover (12), a plurality of movable rods (111) being arranged on the tops of the four pressing plates (113), buffer springs (112) being arranged outside the plurality of movable rods (111), fixed tubes (110) being arranged on the tops of the plurality of movable rods (111), and a dehumidification mechanism (2) being arranged on the top of the box cover (12).

2. A transport device for semiconductor equipment parts processing according to claim 1, characterized in that: The dehumidification mechanism (2) comprises a hot air blower (21), the bottom output end of the hot air blower (21) is connected to a transmission pipe (22), the other end of the transmission pipe (22) passes through the box cover (12) and is inserted into a slot provided in the center of the partition (18), a plurality of air holes (23) are provided in a circular array on the outside of the transmission pipe (22), and a plurality of air grooves (24) are provided through the slot provided in the center of the partition (18).

3. The transport device for semiconductor equipment parts processing according to claim 1, characterized in that: The bottom of the transport box (11) is fixedly connected to the top of the transport base (31), the insides of the two installation bins (13) are both connected to a cylinder (14), and one end of the telescopic rod (15) is connected to the output end of the top of the cylinder (14).

4. The transport device for semiconductor equipment parts processing according to claim 1, characterized in that: The other end of the cylinder (14) passes through a slot provided on one side of the transport box (11) and is fixedly connected to one side of the bottom of the box cover (12). Three positioning columns (16) are fixedly connected to both sides of the top of the transport box (11).

5. A transport device for processing semiconductor equipment parts according to claim 4, characterized in that: Three positioning holes (19) are respectively provided on both sides of the bottom of the box cover (12); the outside of the positioning column (16) is plugged into the inner wall of the positioning hole (19); and the bottom of the sponge pad (17) is fixedly connected to the bottom side of the inside of the transport box (11).

6. The transport device for semiconductor equipment parts processing according to claim 1, characterized in that: The four sides of the partition (18) are respectively fixedly connected to the four sides of the inner wall of the transport box (11), and the top of the pressing plate (113) is fixedly connected to the bottom end of the movable rod (111).

7. The transport device for semiconductor equipment parts processing according to claim 1, characterized in that: The top surface of the movable rod (111) passes through the inner circle of the buffer spring (112) and is slidably connected to the inner wall of the fixed tube (110); the top of the fixed tube (110) is fixedly connected to the bottom of the box cover (12); one end of the buffer spring (112) is fixedly connected to the top of the pressure plate (113); and the other end of the buffer spring (112) is fixedly connected to the bottom of the fixed tube (110).

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