Electronic equipment and sensor module

Abstract

The utility model provides electronic equipment and a sensor module. The electronic equipment comprises a complete machine shell and the sensor module arranged in the complete machine shell. Wherein the whole machine shell is provided with a limiting groove for limiting and fixing the sensor module; the sensor module comprises a circuit board and a sensor chip packaged on the circuit board; and the circuit board is mounted on the surface of the complete machine shell, and the sensor chip is accommodated in the limiting groove. According to the utility model, the assembly of the sensor can be simplified, the size of electronic equipment is reduced, and the cost and the assembly difficulty are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, and more specifically, to an electronic device and a sensor module arranged therein. Background Art

[0002] With the progress of society and the development of technology, in recent years, the size of electronic products such as mobile phones, computers, and wearable devices has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which also requires the size of the electronic parts that match them to be continuously reduced, and the performance and consistency to be continuously improved. MEMS (Micro-Electro-Mechanical-System, MEMS for short) electronic products integrated by MEMS technology have begun to be applied to such electronic products in batches. Their packaging volume is smaller than that of traditional products, so they are favored by most manufacturers.

[0003] At present, MEMS sensors have become an important component of mid-to-high-end portable intelligent electronic devices. In order to meet the increasingly high performance requirements of electronic products, products are usually required to have waterproof and dustproof functions, and have high performance, lightweight, and high reliability in harsh environments. However, existing waterproof sensor products have complex structures and high manufacturing costs. When assembled into complete equipment, they need to be equipped with sealing rubber rings to achieve the seal between the sensor housing and the complete housing, which is not only costly, but also leads to a larger product size, which is not conducive to the miniaturization of electronic equipment. Utility Model Content

[0004] In view of the above problems, the purpose of the present invention is to provide an electronic device and a sensor module to solve the problems of existing sensor products such as complex structure, high manufacturing cost, and large size.

[0005] The electronic device provided by the utility model comprises a complete housing and a sensor module arranged in the complete housing; wherein a limiting groove for fixing the sensor module in a limited position is arranged on the complete housing; the sensor module comprises a circuit board and a sensor chip packaged on the circuit board; the circuit board is mounted on the surface of the complete housing, and the sensor chip is accommodated in the limiting groove.

[0006] In addition, an optional structural feature is that the size of the circuit board is larger than the opening size of the limiting groove.

[0007] In addition, an optional structural feature is that the circuit board and the entire housing are fixedly connected by hot air welding, solder paste welding or gluing.

[0008] In addition, an optional structural feature is that the sensor chip includes an ASIC chip mounted on the circuit board and a MEMS chip mounted on a side of the ASIC chip away from the circuit board; the ASIC chip is connected to the circuit board through an electrical connection line, and the MEMS chip is connected to the ASIC chip through an electrical connection line.

[0009] In addition, an optional structural feature is that waterproof glue is arranged between the circuit board and the side wall of the whole machine housing; the waterproof glue is filled in the limiting groove and wraps the sensor chip.

[0010] In addition, an optional structural feature is that the depth of the limiting groove is greater than the thickness of the sensor chip.

[0011] In addition, an optional structural feature is that the sensor module includes an acoustic sensor, a pressure sensor, an acceleration sensor and a temperature sensor.

[0012] In addition, an optional structural feature is that the circuit board is circular, square or rectangular in shape.

[0013] On the other hand, the utility model provides a sensor module, which is a sensor module arranged in the above electronic equipment.

[0014] By utilizing the above-mentioned electronic device and sensor module, the shell structure of the sensor module can be saved, and a sensor module without a shell can be directly arranged in the shell of the whole machine; wherein, the circuit board of the sensor module is directly mounted on the surface of the shell of the whole machine, and the chip of the sensor module is accommodated in the limiting groove formed by the shell of the whole machine, which can not only save the original sensor module shell and achieve the effect of reducing the size of the equipment, but also eliminate the sealing ring structure, directly seal the sensor module and the shell of the whole machine, improve assembly efficiency and sealing effect, and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] By referring to the following description in conjunction with the accompanying drawings, and with a more comprehensive understanding of the present invention, other purposes and results of the present invention will become more clear and easy to understand. In the accompanying drawings:

[0016] Figure 1 Schematic diagram of the structure of an electronic device according to an embodiment of the utility model.

[0017] The reference numerals include: circuit board 1, ASIC chip 2, whole machine housing 3, waterproof glue 4, MEMS chip 5, and limiting groove 6.

[0018] The same reference numerals throughout the drawings indicate similar or corresponding features or functions. DETAILED DESCRIPTION

[0019] In the following description, for the purpose of illustration, in order to provide a comprehensive understanding of one or more embodiments, many specific details are set forth. However, it is apparent that these embodiments may also be implemented without these specific details. In other examples, for ease of describing one or more embodiments, known structures and devices are shown in the form of block diagrams.

[0020] In the following description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0021] In order to solve the problems that sealing rings are required for the assembly of existing sensor products and complete machines, resulting in complex assembly structure, high cost, and large overall size of the equipment, the utility model provides an electronic device and a sensor module, wherein the sensor module only includes a circuit board and a chip thereon, thereby saving the original shell structure of the sensor module and directly arranging a sensor module without a shell in the shell of the complete machine; wherein the circuit board of the sensor module is directly mounted on the surface of the shell of the complete machine, and the chip of the sensor module is accommodated in a limiting groove formed by the shell of the complete machine, which not only saves the original sensor module shell and achieves the effect of reducing the size of the equipment, but also eliminates the sealing ring structure, directly seals the sensor module and the shell of the complete machine, thereby improving assembly efficiency and sealing effect and reducing costs.

[0022] In order to describe the electronic device and the sensor module of the present invention in detail, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] Figure 1 The schematic structure of an electronic device according to an embodiment of the utility model is shown.

[0024] like Figure 1As shown, the electronic device (or electronic product) implemented by the utility model includes a whole machine housing 3 and a sensor module arranged in the whole machine housing 3; wherein, the whole machine housing 3 is the shell of the electronic device itself, and in the process of setting the sensor module, it can be directly installed by relying on the whole machine housing 3, and a limiting groove 6 for limiting and fixing the sensor module is set on the whole machine housing 3, and the sensor module omits the original housing structure and only includes a circuit board 1 and a sensor chip packaged on the circuit board 1. During the assembly process, the circuit board 1 is mounted on the surface of the whole machine housing 3, and the sensor chip is accommodated in the limiting groove 6, thereby reducing the complexity and cost of the product, reducing the product size, and saving the space required for assembly.

[0025] Among them, the size of the circuit board 1 needs to be larger than the opening size of the limiting groove 6, so that the circuit board 1 can be attached to the whole machine housing 3, and the sensor chip on the circuit board 1 can be accommodated by the side wall or wall thickness of the whole machine housing 3 to prevent other components from causing damage to the sensor chip. When the product is required to have waterproof performance, a waterproof glue 4 can also be arranged between the circuit board 1 and the whole machine housing 3. The waterproof glue 4 is filled in the limiting groove 6 and completely wraps the sensor chip. It can be seen that due to the small size of the sensor chip, when the thickness of the whole machine housing 3 itself is greater than the thickness of the sensor chip, the limiting groove 6 structure can be directly grooved on the whole machine housing 3, and the circuit board 1 is attached to the outside of the limiting groove 6, so that the sensor chip avoids in the wall thickness of the whole machine housing 3. When the height of the sensor chip is greater than the thickness of the whole machine housing 3 itself, the side wall of the whole machine housing 3 can be used to form a limiting groove 6 between the side walls of the whole machine housing 3, and the sensor chip avoids between the side walls of the whole machine housing 3.

[0026] It can be seen that no matter whether the limiting groove 6 is formed by the wall thickness of the entire housing 3 or the side wall of the entire housing 3, the depth of the limiting groove 6 must be greater than the thickness of the sensor chip, so that a shell structure surrounding the sensor chip is formed by the limiting groove 6, and the sensor chip is protected by the waterproof glue 4 in the limiting groove 6. The shape of the circuit board 1 attached to the side of the entire housing 3 can be circular, square or rectangular, and can be specifically set according to the shape of the limiting groove 6.

[0027] To ensure the overall waterproof or sealing effect of the product, the connection A between the circuit board 1 and the whole machine housing 3 can be fixedly connected by hot air welding, solder paste welding or gluing, etc., to achieve a sealed connection between the circuit board 1 and the whole machine housing 3, which can overcome the disadvantages of the original connection method between the sensor housing and the whole machine housing 3 sealed by a sealing ring, and further combined with the waterproof glue 4 set to wrap the sensor chip, the sealing and positioning of the sensor module can be achieved.

[0028] In the electronic device of the present invention, the sensor chip may include an ASIC chip 2 mounted on a circuit board 1 and a MEMS chip 5 mounted on a side of the ASIC chip 2 away from the circuit board 1, the ASIC chip 2 is connected to the circuit board 1 through an electrical connection line, and the MEMS chip 5 is connected to the ASIC chip 2 through an electrical connection line; in addition, the ASIC chip 2 and the MEMS chip 5 can be arranged side by side on the circuit board 1 according to parameters such as the width and thickness of the entire machine housing 3, that is, the ASIC chip 2 and the MEMS chip 5 can be selectively stacked or arranged side by side according to the actual size of the entire machine housing 3.

[0029] As an example, the above-mentioned sensor module may include an acoustic sensor, a pressure sensor, an acceleration sensor or a temperature sensor, etc. The specific sensor chip can be set according to the type of sensor. Since the waterproof glue 4 has a certain elasticity, the external pressure, temperature and other signals can be transmitted to the sensor chip on the circuit board 1 to achieve functional connection and signal transmission.

[0030] Corresponding to the above electronic device, the utility model also provides a sensor module, which is arranged in the above electronic device. The sensor module only includes a circuit board and a sensor chip arranged on the circuit board, and does not need to be provided with an additional protective housing, and can be directly applied to an electronic device with a complete housing. The embodiment of the sensor can refer to the description in the electronic device embodiment, and will not be repeated here one by one.

[0031] According to the electronic device and sensor module of the utility model described above, the traditional sensor housing structure can be omitted, so that the sensor only includes a circuit board and a chip thereon. In the assembly structure, the circuit board of the sensor module is directly mounted on the surface of the whole machine housing, and the sensor chip is accommodated in the limiting groove formed by the whole machine housing, and sealed and protected by waterproof glue. This can not only save the original sensor module housing and achieve the effect of reducing the size of the equipment, but also eliminate the sealing ring structure, and directly seal the sensor module and the whole machine housing, thereby improving assembly efficiency and sealing effect and reducing costs.

[0032] The electronic device and sensor module according to the present invention are described as examples with reference to the accompanying drawings. However, those skilled in the art should understand that various improvements can be made to the electronic device and sensor module proposed in the present invention without departing from the content of the present invention. Therefore, the protection scope of the present invention should be determined by the content of the attached claims.

Claims

1. An electronic device, characterized in that: It includes a whole machine housing and a sensor module arranged in the whole machine housing; wherein, A limiting groove for fixing the sensor module in a limited position is provided on the whole machine housing; The sensor module includes a circuit board and a sensor chip packaged on the circuit board; The circuit board is mounted on the surface of the whole machine housing, and the sensor chip is accommodated in the limiting groove.

2. The electronic device according to claim 1, characterized in that: The size of the circuit board is larger than the opening size of the limiting groove.

3. The electronic device according to claim 1 or 2, characterized in that: The circuit board and the whole machine housing are fixedly connected by hot air welding, solder paste welding or gluing.

4. The electronic device according to claim 1, characterized in that: The sensor chip includes an ASIC chip mounted on the circuit board and a MEMS chip mounted on a side of the ASIC chip away from the circuit board; The ASIC chip is connected to the circuit board via an electrical connection line, and the MEMS chip is connected to the ASIC chip via an electrical connection line.

5. The electronic device according to claim 1, characterized in that: A waterproof glue is provided between the circuit board and the side wall of the whole machine housing; The waterproof glue is filled in the limiting groove and wraps the sensor chip.

6. The electronic device according to claim 1, characterized in that: The depth of the limiting groove is greater than the thickness of the sensor chip.

7. The electronic device according to claim 1, characterized in that: The sensor module includes an acoustic sensor, a pressure sensor, an acceleration sensor and a temperature sensor.

8. The electronic device according to claim 1, characterized in that: The shape of the circuit board is circular, square or rectangular.

9. A sensor module, characterized in that: The sensor module is a sensor module arranged in the electronic device as described in any one of claims 1 to 8.

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